Special-shaped perforated optical film cutting method and system

Abstract

The invention relates to the technical field of optical film processing, in particular to a special-shaped perforated optical film cutting method. The method comprises the following specific steps: cutting the appearance of the optical film into a specified shape by using cutting equipment according to a pre-designed shape, and reserving a to-be-ground part with a certain width at the edge of the optical film; a plurality of cut and formed optical films are stacked together, and the upper portion and the lower portion of the optical films are positioned through two edge grinding jigs; the overlapped optical film and the edge grinding jig are put into matched edge grinding equipment together; polishing off the to-be-polished part of the optical film; cutting a hole in a specified position of the optical film; and finishing the processing of the optical film. According to the method, a complete appearance is cut through laser, and a certain width is reserved; the optical film adhesive body and the release film which are dissolved together are polished away through edge grinding equipment, and finally hole cutting is conducted on a reserved hole position of an edge grinding jig; the defects of a traditional cutting die punching one-cutting forming mode are overcome, and the phenomena of adhesive residue and adhesive shortage on the edge of the optical film and the three-hole punching position are avoided; and the problem that the sol and the release film are not easy to tear off due to traditional laser cutting is also solved.

Description

Technical Field

[0001] The invention relates to the technical field of optical film processing, and in particular to a method for cutting a special-shaped optical film with holes. Background Art

[0002] Film systems (AG, AR, AF) have been widely used in automotive covers and automotive OGS products, and an optical film uses a cutting solution, usually with traditional die cutting or laser cutting;

[0003] Due to raw material reasons, when using traditional knife die punching to form, the colloid at the edge of the optical film and the three-hole edge punching position is easy to stick to the tool and be carried away by the tool, resulting in residual glue, lack of glue, etc.; about 20% of the actual products are defective.

[0004] When laser cutting is used, the release film and the adhesive body are dissolved together because the optical film body is easy to melt, which makes the release film very difficult to tear after the final product is attached to the glass. Therefore, how to solve the disadvantages of cutting special-shaped optical films with holes has become a technical problem that needs to be solved urgently. Summary of the invention

[0005] The purpose of the present invention is to address the problems existing in the background technology and propose a method for cutting special-shaped optical films with holes. First, the complete shape is cut by laser and a certain width is reserved; then the optical film glue body and the release film that are dissolved together are polished off using an edge grinding device, and finally holes are cut at the holes reserved by the edge grinding fixture.

[0006] The technical solution of the present invention is a method for cutting a special-shaped optical film with holes, which adopts a special-shaped optical film cutting system for cutting, and comprises the following specific steps:

[0007] S1. Using a cutting device to cut the outer shape of the optical film into a specified shape according to a pre-designed shape, and reserving a certain width of a portion to be polished at the edge of the optical film;

[0008] S2, stacking a number of cut optical films together, and positioning them using two edge grinding jigs at the top and bottom;

[0009] S3, placing the stacked optical film together with the edge grinding fixture into the matching edge grinding equipment;

[0010] S4, grinding away the part to be ground of the optical film;

[0011] S5, cutting holes at designated positions of the optical film;

[0012] S6. Complete the processing of the optical film.

[0013] Preferably, the reserved width of the portion to be ground is positively correlated with the surface area of ​​the optical film, and the width of the portion to be ground is greater than the width of the dissolved portion of the release film.

[0014] Preferably, the reserved width of the portion to be ground is 0.05-0.1 mm.

[0015] Preferably, in step S1, a laser cutting device is used to cut the outer shape of the optical film into a specified shape.

[0016] Preferably, in step S2, 8-20 pieces of cut and formed optical films are stacked together and positioned using an edge grinding jig.

[0017] A cutting system for a special-shaped optical film with holes, which uses the above method to cut the optical film, including a cutting device, an edge grinding jig and an edge grinding device;

[0018] The cutting device is used to cut the optical film into a specified shape;

[0019] The edge grinding jig is used to position the cut optical film;

[0020] The edge grinding device is used to perform edge grinding on a designated position of an optical film.

[0021] Preferably, the edge grinding jig comprises two upper and lower hard transparent acrylic plates of the same shape.

[0022] Preferably, a plurality of holes are reserved on the edge grinding jig; the edge grinding equipment first grinds off the portion to be ground, and then cuts holes along the reserved holes.

[0023] Preferably, the edge grinding equipment is a CNC machine tool.

[0024] Preferably, the edge grinding equipment uses a round-head tool to rotate at high speed to perform grinding operations.

[0025] Compared with the prior art, the present invention has the following beneficial technical effects:

[0026] The present invention avoids the drawbacks of the traditional die-cutting and one-knife forming method, solves the problem of residual glue and glue shortage on the edge of the optical film and the three-hole punching position; after the improvement, laser cutting is used to reserve a certain amount of the grinding part, so that the dissolved glue is completely located in the grinding part; after multiple optical films are stacked together, they are positioned using an edge grinding fixture, and edge grinding and hole cutting are performed uniformly; the problem of traditional laser cutting causing glue dissolution and the release film being difficult to tear is solved. The yield rate of optical film products is improved, the cost is reduced, and the processing efficiency is improved.

[0027] The edge grinding jig used in the present invention is a transparent acrylic plate. The transparent material makes it easy to observe whether the edge of the jig is aligned, which is conducive to improving the accuracy of the grinding operation. When the upper and lower sheets are pressed together, the clamping is ensured without causing damage to the diaphragm. In addition, the raw material cost of acrylic is low, and different jigs can be easily made according to actual products. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0029] Figure 1 It is a front view of a cutout middle sheet of an optical film in an embodiment of the present invention;

[0030] Figure 2 It is a front view of a single optical film in an embodiment of the present invention;

[0031] Figure 3 is a side view of a single optical film in an embodiment of the present invention;

[0032] Figure 4 A three-dimensional view of a single optical film in an embodiment of the present invention;

[0033] Figure 5 A three-dimensional view of an edge grinding jig in an embodiment of the present invention;

[0034] Figure 6 This is a three-dimensional view of the edge grinding fixture installed after the optical films are stacked in an embodiment of the present invention.

[0035] Figure numerals: 1, optical film; 11, film body; 12, heavy-duty release film; 13, light-duty release film; 2, edge grinding jig; 21, first hole; 22, second hole. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the drawings of the specification. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary persons in the art without creative work should fall within the scope of protection of the present invention.

[0037] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0038] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0039] At the same time, in the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper, lower, inner and outer" are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first, second or third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0040] Example 1

[0041] The present invention provides a method for cutting a special-shaped optical film with holes, which adopts a special-shaped optical film cutting system for cutting, and includes the following specific steps:

[0042] S1. Cut the outer shape of the optical film into a specified shape using a cutting device according to a pre-designed shape, and reserve a certain width of the portion to be ground at the edge of the optical film; the width of the portion to be ground is positively correlated with the surface area of ​​the optical film, and the width of the portion to be ground is greater than the width of the dissolved portion of the release film; preferably, the width of the portion to be ground is 0.05-0.1 mm;

[0043] S2, stacking a number of cut optical films together, and positioning them using two edge grinding jigs at the top and bottom;

[0044] S3, placing the stacked optical film together with the edge grinding fixture into the matching edge grinding equipment;

[0045] S4, grinding away the part to be ground of the optical film;

[0046] S5, cutting holes at designated positions of the optical film;

[0047] S6. Complete the processing of the optical film.

[0048] In this embodiment, a laser cutting device is first used to cut the optical film 1 into the following shapes: Figure 1The shape shown; according to the preset overall size of the optical film 1, a 0.05mm grinding portion is reserved on its periphery; (the width of the grinding portion is determined according to the surface area of ​​the optical film 1, and the larger the surface area, the larger the width of the reserved grinding portion) The width of the grinding portion must be greater than the width of the dissolved portion of the release film at the edge of the optical film 1;

[0049] Then use Figure 5 The edge grinding jig 2 shown in the figure is used to sequentially load the cut optical films 1 (preferably 10 pieces); the upper and lower edge grinding jigs 2 clamp the optical film 1 to form a Figure 6 The state shown; in this embodiment, since the colloid at the edge of the optical film 1 is dissolved when the laser cutting equipment cuts the optical film 1, the dissolved part and the non-dissolved part of the optical film 1 will form a boundary; when the edge grinding jig 2 and the optical film 1 are installed, they can be aligned along the boundary; ensure that the part where the colloid is dissolved is exposed outside the edge grinding jig 2 (that is, the part to be ground is located outside the edge grinding jig 2); then the edge grinding jig 2 is connected to the optical film 1 and sent into the edge grinding equipment together; the edge grinding equipment uses a CNC machine tool with higher precision, and the edge grinding equipment uses a round-head tool to rotate at high speed for grinding operations; the tool head moves one circle along the edge of the edge grinding jig 2, and first grinds the exposed part to be ground; two first holes 21 and one second hole 22 are reserved on the edge grinding jig 2, and then it is aligned with the first hole 21 and the second hole 22 in turn for cutting holes.

[0050] The method of this embodiment can avoid the drawbacks of the traditional die-cutting and one-knife forming method, and solve the problem of residual glue and lack of glue on the edge of the optical film 1 and the three-hole punching position; after improvement, laser cutting is used to reserve a certain amount of the part to be ground, so that the dissolved glue is completely located in the part to be ground; after multiple optical films 1 are stacked together, the edge grinding fixture 2 is used to position them, and the edge grinding and hole cutting are uniformly performed; the problem of traditional laser cutting causing dissolution and the release film being difficult to tear is solved. The yield rate of the optical film 1 product is improved, the cost is reduced, and the processing efficiency is improved.

[0051] Example 2

[0052] This embodiment provides a cutting system for a special-shaped optical film with holes, which uses the method of Embodiment 1 to cut the optical film, including a cutting device, an edge grinding jig, and an edge grinding device;

[0053] The cutting device is used to cut the optical film into a specified shape; the cutting device is a laser cutting device, and the common film laser cutting device on the market can be used; the control program and graphic parameters are input into the device in advance, and the device runs automatically; it can cut out multiple optical films 1 at the same time.

[0054] The edge grinding jig 2 is used to position the cut optical film; the edge grinding jig 2 includes two upper and lower hard transparent acrylic plates of the same shape; the transparent material makes it easy to observe whether the edges of the jig are aligned, which is beneficial to improving the accuracy of the grinding operation; the acrylic plate itself is relatively hard, and when the upper and lower plates are pressed together, clamping is ensured without causing damage to the film; in addition, the raw material cost of acrylic material is low and different jigs can be made according to actual products.

[0055] The edge grinding device is used to perform edge grinding on the designated position of the optical film. A plurality of holes are reserved on the edge grinding fixture; the edge grinding device first grinds off the part to be ground, and then cuts holes along the reserved holes.

[0056] This embodiment processes the optical film 1 in two steps by using a variety of equipment in coordination, thereby solving the drawbacks of the traditional die-cutting and one-knife forming method, and solving the problems of residual glue and lack of glue at the edge of the optical film 1 and the three-hole punching position; it also solves the problem of traditional laser cutting causing sol-gel and the release film being difficult to tear apart.

[0057] Example 3

[0058] This embodiment provides a special-shaped optical film with holes, which is processed and formed using the system in embodiment 2 and the steps in embodiment 1; first, a laser cutting device is used to cut the shape of the optical film 1 into the following shapes: Figure 1 The shape shown; the structure of a single optical film is as Figure 2 , Figure 3 , Figure 4 As shown, the front of the optical film 1 is a heavy-duty release film 12, the back is a light-duty release film 13, and the middle part is a film body 11; when a single piece of optical film 1 is superimposed and installed with an edge grinding jig 2, it is preferred to place the light-duty release film 13 downward and the heavy-duty release film 12 upward; finally, the edge grinding jig 2 is connected to the optical film 1 and sent into the edge grinding equipment together; the edge grinding equipment uses a CNC machine tool with high precision, and the edge grinding equipment uses a round-headed tool to rotate at high speed for grinding operations; the tool head moves along the edge of the edge of the edge grinding jig 2 for one circle, and the exposed part to be ground is first ground; two first holes 21 and a second hole 22 are reserved on the edge grinding jig 2, and then it is aligned with the first hole 21 and the second hole 22 in turn for cutting holes; then the edge grinding jig 2 is removed to form a finished product of a special-shaped optical film with holes; in actual use of the optical film product, the light-duty release film 13 is first torn off, and after the film body 11 is attached to the product, the heavy-duty release film 12 is torn off, so as to facilitate bonding with other products.

[0059] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A method for cutting a special-shaped optical film with holes, using a special-shaped optical film cutting system for cutting, characterized in that: The specific steps include: S1. Using a cutting device to cut the outer shape of the optical film into a specified shape according to a pre-designed shape, and reserving a certain width of a portion to be polished at the edge of the optical film; S2, stacking a number of cut optical films together, and positioning them using two edge grinding jigs at the top and bottom; S3, placing the stacked optical film together with the edge grinding fixture into the matching edge grinding equipment; S4, grinding away the part to be ground of the optical film; S5, cutting holes at designated positions of the optical film; S6. Complete the processing of the optical film.

2. The method for cutting a special-shaped perforated optical film according to claim 1, characterized in that: The reserved width of the portion to be ground is positively correlated with the surface area of ​​the optical film, and the width of the portion to be ground is greater than the width of the dissolved portion of the release film.

3. The method for cutting a special-shaped perforated optical film according to claim 2, characterized in that: The reserved width of the portion to be ground is 0.05-0.1 mm.

4. The method for cutting a special-shaped optical film with holes according to claim 1, characterized in that: In step S1, a laser cutting device is used to cut the outer shape of the optical film into a specified shape.

5. The method for cutting a special-shaped optical film with holes according to claim 1, characterized in that: In step S2, 8 to 20 pieces of cut and formed optical films are stacked together and positioned using an edge grinding jig.

6. A system for cutting special-shaped perforated optical films, using the method according to any one of claims 1 to 5 to cut optical films, characterized in that: Including cutting equipment, edge grinding jigs and edge grinding equipment; The cutting device is used to cut the optical film into a specified shape; The edge grinding jig is used to position the cut optical film; The edge grinding device is used to perform edge grinding on a designated position of an optical film.

7. The cutting system of special-shaped optical film with holes according to claim 6, characterized in that: The edge grinding jig comprises two upper and lower hard transparent acrylic plates of the same shape.

8. The cutting system of special-shaped optical film with holes according to claim 6, characterized in that: A plurality of holes are reserved on the edge grinding jig; the edge grinding equipment first grinds off the part to be ground, and then cuts holes along the reserved holes.

9. The cutting system of special-shaped optical film with holes according to claim 8, characterized in that: The edge grinding equipment is a CNC machine tool.

10. The cutting system of special-shaped optical film with holes according to claim 9, characterized in that: The edge grinding device uses a round-head tool to rotate at high speed to perform grinding operations.

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