Quantitative temperature control type electrostatic chuck

Abstract

The invention relates to the technical field of electrostatic chucks, in particular to a quantitative temperature control type electrostatic chuck which comprises a base plate and a ceramic substrate, the ceramic substrate is bonded to the upper end of the base plate, an electrostatic electrode is arranged in the ceramic substrate, cooling flow channels which are communicated with one another and are distributed in a circulating zigzag structure are arranged in the base plate, and the cooling flow channels are communicated with the ceramic substrate. Cooling flow channels are formed in the base plate, heating electrode inserting grooves are further formed in the base plate, the heating electrode inserting grooves are distributed between the cooling flow channels in an inserted mode, heating electrodes are inserted into the heating electrode inserting grooves, the cooling flow channels and the heating electrodes work independently, and movable grooves are formed in the base plate. The movable groove is distributed above the cooling flow channel and the heating electrode, the upper end position in the movable groove is provided with temperature conducting plates which transversely move along the movable groove, the number of the temperature conducting plates is consistent with that of main flow channels of the cooling flow channel, and the temperature conducting plates are alternately distributed above the cooling flow channel and the heating electrode when transversely moving.

Description

Technical Field

[0001] The invention relates to the technical field of electrostatic chucks, and in particular to a quantitative temperature-controlled electrostatic chuck. Background Art

[0002] An electrostatic chuck is a tool that uses the principle of static electricity to achieve object adsorption. It is usually composed of a disk made of conductive material. When a voltage is applied to the conductive disk, an electrostatic field is generated on its surface. This electrostatic field can attract light and small objects and make them adsorbed on the chuck. Electrostatic chucks are widely used in industrial production, such as paper processing, electronic components, and semiconductor component handling. In these applications, electrostatic chucks can improve production efficiency, reduce manual operations, and accurately control the position of objects.

[0003] At present, a Chinese patent with publication number CN117099194A discloses an electrostatic suction cup, which includes a ceramic substrate, a base plate, and an embedded component. The ceramic substrate has: a first surface for carrying a processed object, a second surface located on the opposite side of the first surface, and a first flow path penetrating the first surface and the second surface. The base plate is joined to the second surface of the ceramic substrate and has a through hole at least at a position corresponding to the first flow path. The embedded component is located in the through hole and has a porous body opposite to the first flow path and a second flow path connected to the first flow path via the porous body. The first flow path and the second flow path are separated and arranged in a top perspective view.

[0004] Although this electrostatic chuck can effectively suppress the intrusion of plasma into the flow path by embedding the porous body component, this electrostatic chuck cannot effectively control the temperature of the base plate and the ceramic substrate to be in a stable state. Summary of the invention

[0005] In view of the above situation, in order to overcome the defects of the prior art, the purpose of the present invention is to provide a quantitative temperature-controlled electrostatic chuck, and the above technical purpose is achieved through the following technical solutions: A quantitative temperature-controlled electrostatic suction cup comprises a base plate and a ceramic substrate, wherein the ceramic substrate is bonded to the upper end of the base plate, an electrostatic electrode is arranged in the ceramic substrate, cooling channels which are interconnected and distributed in a cyclic zigzag structure are arranged inside the base plate, heating electrode slots are arranged inside the base plate, the heating electrode slots are interspersed and distributed between the cooling channels, heating electrodes are inserted into the heating electrode slots, the cooling channels and the heating electrodes work independently of each other, an active groove is arranged inside the base plate, the active grooves are distributed above the cooling channels and the heating electrodes, a heat conduction plate which moves laterally along the active groove is arranged at the upper end position of the active groove, the number of the heat conduction plates is consistent with the number of main channels of the cooling channels, and the heat conduction plates are alternately distributed above the cooling channels and the heating electrodes when moving laterally.

[0006] Furthermore, a connecting rod for connecting all the heat conduction plates is provided between the heat conduction plates, the connecting rod is arranged in a movable groove, a control rod is fixedly provided on one side of the connecting rod, a movable plate is fixedly provided on one side of the control rod, a mounting groove is provided inside the base plate, the movable plate is arranged in the mounting groove, a controlled block is fixedly provided on one side of the lower end of the movable plate, a row of racks is provided on the upper surface of the controlled block, an embedded servo motor and a driving shaft connected to the embedded servo motor are provided inside the base plate, a control spur gear that rotates synchronously with the driving shaft is provided on the outside of the driving shaft, the control spur gear cooperates with the rack above the controlled block, a track fixed to the bottom of the mounting groove is provided at the lower end of the controlled block, and the controlled block is slidably assembled above the track.

[0007] Furthermore, a back-helium flow channel is provided inside the ceramic substrate and is distributed around the electrostatic electrode, and an air inlet groove is provided at one end of the back-helium flow channel.

[0008] Furthermore, a helium filling port is provided at the bottom of the mounting groove, the helium filling port is connected to the mounting groove, the upper end of the mounting groove is connected to the air inlet groove, and the helium gas used for cooling enters the mounting groove from the helium filling port and enters the air inlet groove through the mounting groove.

[0009] Furthermore, a base plate cooling channel connected to the movable groove is provided below the movable groove, and the base plate cooling channel and one end of the movable groove are connected to the inside of the air inlet groove.

[0010] Furthermore, a micro flow controller for controlling the amount of helium entering is provided at the inlet side of the back-helium flow channel.

[0011] In summary, the present invention has the following beneficial effects: The present invention provides a transversely movable heat conducting plate structure and uses the transversely movable characteristics of the heat conducting plate to cut off the passage of cooling gas entering the cooling channel of the base plate. When the heat conducting plate is located above the cooling channel for operation, the cooling effect is enhanced. When the heat conducting plate is located above the heating electrode for operation, the auxiliary cooling is stopped. Through the mechanical structure design, the two functional areas are linked, and the working effect is excellent. The present invention helps to control the temperature of the base plate and the ceramic substrate within a certain value range by setting a heating and cooling alternate working mode, compared with a simple cooling function; The present invention helps to improve the stability of the suction cup by setting a controllable helium intake amount. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application, but do not constitute an improper limitation of the present invention. In the drawings: Figure 1It is a structural schematic diagram of the present invention.

[0013] In the figure, 1, base plate; 2, ceramic substrate; 3, electrostatic electrode; 4, cooling channel; 5, heating electrode slot; 6, movable slot; 7, temperature conduction plate; 8, connecting rod; 9, control rod; 10, movable plate; 11, mounting slot; 12, controlled block; 13, driving shaft; 14, control spur gear; 15, track; 16, back helium channel; 17, air inlet slot; 18, helium filling port; 19, base plate cooling channel; 20, micro flow controller. DETAILED DESCRIPTION

[0014] The above and other technical contents, features and effects of the present invention are described in detail below with reference to the attached Figure 1 The detailed description of the embodiments will clearly show that the structural contents mentioned in the following embodiments are all based on the drawings in the specification.

[0015] Exemplary embodiments of the present invention will be described below with reference to the accompanying drawings. Example

[0016] A quantitative temperature-controlled electrostatic chuck comprises a base plate 1 and a ceramic substrate 2. The ceramic substrate 2 is bonded to the upper end of the base plate. An electrostatic electrode 3 is arranged in the ceramic substrate 2. The base plate 1 is provided with cooling channels 4 which are interconnected and distributed in a cyclic zigzag structure. The cooling channels 4 are used to pass a cooling liquid. The cooling liquid circulates along the cooling channels 4 to take away the heat inside the base plate 1 and reduce the heat of the ceramic substrate 2. The base plate 1 is also provided with a heating electrode slot 5. The heating electrode slot 5 is interspersed and distributed between the cooling channels 4. A heating electrode is inserted into the heating electrode slot 5. The cooling channels 4 and the heating electrode work independently of each other. The heating electrode generates heat when working to assist the base plate 1 in heating up. If the base plate 1 is only provided with the cooling channel 4 for cooling, the temperature of the base plate 1 and the ceramic substrate 2 is uncontrollable. However, if a heating electrode is provided, the heating electrode heats up while the cooling channel 4 cools down. Then, the temperature of the ceramic substrate 2 and the base plate 1 can be within a certain controllable range.

[0017] A movable groove 6 is provided inside the base plate 1. The movable groove 6 is distributed above the cooling channel 4 and the heating electrode. A heat conduction plate 7 which moves laterally along the movable groove 6 is provided at the upper end position of the movable groove 6. The number of the heat conduction plates 7 is consistent with the number of the main channels of the cooling channel 4. The heat conduction plates 7 are alternately distributed above the cooling channel 4 and the heating electrode when they move laterally. The heat conduction plates 7 are used to transfer heat. Connecting rods 8 for connecting all the heat conduction plates 7 are provided between the heat conduction plates 7. The connecting rods 8 are provided in the movable groove 6. A control rod 9 is fixedly provided on one side of the connecting rod 8. Due to the distribution characteristics of the heat conduction plates 7, all the heat conduction plates 7 are either all distributed above the cooling channel 4 or all distributed above the heating electrode slots 5.

[0018] A movable plate 10 is fixedly provided on one side of the control rod 9, a mounting groove 11 is provided inside the base plate 1, the movable plate 10 is arranged in the mounting groove 11, a controlled block 12 is fixedly provided on one side of the lower end of the movable plate 10, a row of racks are provided on the upper surface of the controlled block 12, an embedded servo motor and a drive shaft 13 connected to the embedded servo motor are provided inside the base plate 1, a control spur gear 14 which rotates synchronously with the drive shaft 13 is provided on the outside of the drive shaft 13, the control spur gear 14 cooperates with the rack above the controlled block 12, a track 15 fixed to the bottom of the mounting groove 11 is provided at the lower end of the controlled block 12, the controlled block 12 is slidably assembled above the track 15, and the embedded servo motor is used to control the movement of the heat conduction plate 7 through the combined transmission member of the control spur gear 14 and the controlled block 12.

[0019] The ceramic substrate 2 is provided with a back-helium flow channel 16 which is distributed around the electrostatic electrode 3. An air inlet groove 17 is provided at one end of the back-helium flow channel 16. The back-helium flow channel 16 is filled around the bottom of the electrostatic electrode 3 to play a cooling function.

[0020] A helium filling port 18 is provided at the bottom of the mounting groove 11 , and the helium filling port 18 is connected to the mounting groove 11 . The upper end of the mounting groove 11 is connected to the air inlet groove 17 . Helium gas for cooling enters the mounting groove 11 from the helium filling port 18 , and enters the air inlet groove 17 through the mounting groove 11 .

[0021] A base plate cooling channel 19 communicating with the movable groove 6 is provided below the movable groove 6 . The base plate cooling channel 19 and one end of the movable groove 6 are communicated to the inside of the air inlet groove 17 .

[0022] In the above-mentioned combined structure, when the heat conduction plate 7 is arranged above the cooling channel 4, the heat conduction plate 7 on the far right will not block the connection channel between the air inlet groove 17 and the movable groove 6. At this time, when the helium enters the mounting groove 11 through the helium filling port 18, the helium naturally enters the base cooling channel 4 from the air inlet groove 17, and the helium cools the base plate 1 as a whole; and when the heat conduction plate 7 is arranged above the heating electrode slot 5, the heat conduction plate 7 on the far right blocks the connection channel between the air inlet groove 17 and the movable groove 6 by lateral movement. At this time, the helium cannot enter the base cooling channel 4 through the channel normally, and will not affect the heating effect of the heating electrode.

[0023] A micro flow controller 20 for controlling the amount of helium entering is provided at the inlet side of the back-helium flow channel 16 , and can be used to control the amount of gas entering the back-helium flow channel 16 .

[0024] The above is a further detailed description of the present invention in combination with a specific implementation method, and it cannot be determined that the specific implementation of the present invention is limited to this; for technical personnel in the technical field to which the present invention belongs and related technical fields, based on the technical solution of the present invention, the expansion and replacement of operating methods and data should all fall within the protection scope of the present invention.

Claims

1. A quantitative temperature-controlled electrostatic chuck, characterized in that: The invention comprises a base plate (1) and a ceramic substrate (2), wherein the ceramic substrate (2) is bonded to the upper end of the base plate, an electrostatic electrode (3) is arranged in the ceramic substrate (2), the base plate (1) is provided with cooling channels (4) which are interconnected and distributed in a cyclic zigzag structure, the base plate (1) is also provided with heating electrode slots (5), the heating electrode slots (5) are interspersed between the cooling channels (4), the heating electrodes are inserted into the heating electrode slots (5), the cooling channels (4) and the heating electrodes work independently of each other, the base plate (1) is provided with a movable groove (6), the movable groove (6) is distributed above the cooling channels (4) and the heating electrodes, a heat conduction plate (7) which moves laterally along the movable groove (6) is arranged at the upper end of the movable groove (6), the number of the heat conduction plates (7) is consistent with the number of the main channels of the cooling channels (4), and the heat conduction plates (7) are alternately distributed above the cooling channels (4) and the heating electrodes when moving laterally.

2. A quantitative temperature-controlled electrostatic chuck according to claim 1, characterized in that: A connecting rod (8) for connecting all the heat conducting plates (7) is provided between the heat conducting plates (7); the connecting rod (8) is arranged in the movable groove (6); a control rod (9) is fixedly provided on one side of the connecting rod (8); a movable plate (10) is fixedly provided on one side of the control rod (9); a mounting groove (11) is provided inside the base plate (1); the movable plate (10) is arranged in the mounting groove (11); a controlled block (12) is fixedly provided on one side of the lower end of the movable plate (10); and the upper end of the controlled block (12) is fixedly provided with a control rod (9). A row of racks is provided on the surface; an embedded servo motor and a drive shaft (13) connected to the embedded servo motor are provided inside the base plate (1); a control spur gear (14) which rotates synchronously with the drive shaft (13) is provided outside the drive shaft (13); the control spur gear (14) cooperates with the rack above the controlled block (12); a track (15) fixed to the bottom of the mounting groove (11) is provided at the lower end of the controlled block (12); and the controlled block (12) is slidably assembled above the track (15).

3. A quantitative temperature-controlled electrostatic chuck according to claim 2, characterized in that: A back-helium flow channel (16) is provided inside the ceramic substrate (2) and is distributed around the electrostatic electrode (3), and an air inlet groove (17) is provided at one end of the back-helium flow channel (16).

4. A quantitative temperature-controlled electrostatic chuck according to claim 3, characterized in that: A helium filling port (18) is provided at the bottom of the mounting groove (11), the helium filling port (18) is connected to the mounting groove (11), and the upper end of the mounting groove (11) is connected to the air inlet groove (17), and helium gas for cooling enters the mounting groove (11) through the helium filling port (18) and enters the air inlet groove (17) through the mounting groove (11).

5. A quantitative temperature-controlled electrostatic chuck according to claim 3, characterized in that: A base plate cooling channel (19) connected to the movable groove (6) is provided below the movable groove (6); the base plate cooling channel (19) and one end of the movable groove (6) are connected to the interior of the air inlet groove (17).

6. A quantitative temperature-controlled electrostatic chuck according to claim 3, characterized in that: A micro flow controller (20) for controlling the amount of helium inflow is provided on the inlet side of the back-helium flow channel (16).

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