Preparation method of special diamond micro-powder for semiconductor

Abstract

The invention belongs to the technical field of diamond micro-powder, and particularly relates to a preparation method of special diamond micro-powder for semiconductors, which comprises the following steps: inspecting the appearance of diamond, detecting the structure and purity of diamond crystal, and then taking a certain amount of sample for hardness test and density test; injecting the detected diamond raw material into alkali liquor for stirring, and heating the alkali liquor and the diamond raw material. The invention has the following beneficial effects; according to the treatment method for crushing the diamond micro-powder by adopting the jet mill, when a worker prepares the diamond micro-powder, the worker only needs to put a diamond micro-powder raw material into the jet mill, so that the diamond micro-powder has the characteristics of uniform fineness, high efficiency and the like; the diamond micro-powder has the characteristics of narrow particle size distribution, smooth particle surface, regular particle shape, no impurity pollution and no human factor interference, so that the quality of the diamond micro-powder is improved, and the processing material requirements of precision devices can be met.

Description

Technical Field

[0001] The invention belongs to the technical field of diamond micropowder, and in particular relates to a method for preparing diamond micropowder special for semiconductors. Background Art

[0002] Diamond powder is a new type of superhard and ultrafine abrasive formed by special processing of artificial diamond single crystal. It is an ideal raw material for grinding and polishing high-hardness materials such as cemented carbide, ceramics, gemstones, optical glass, etc. Diamond products are tools and components made from diamond materials and are widely used. Diamond powder and its products are widely used in automobiles, machinery, electronics, aviation, aerospace, optical instruments, glass, ceramics, petroleum, geology and other departments. The currently prepared diamond powder cannot meet the processing material requirements of precision devices, and the prepared diamond powder cannot be effectively purified. Summary of the invention

[0003] In order to solve the problems raised in the above background technology, the present invention provides a method for preparing diamond micropowder for semiconductors, which has the characteristics of being able to meet the material requirements for processing precision devices and being able to effectively purify the prepared diamond micropowder.

[0004] To achieve the above object, the present invention provides the following technical solution: a method for preparing diamond micropowder for semiconductor, the method comprising the following steps:

[0005] Step 1: Perform an appearance inspection on the diamond, and test the structure and purity of the diamond crystal, and then take a certain amount of samples for hardness and density tests;

[0006] Step 2: injecting the tested diamond raw material into the alkali solution for stirring, and heating the alkali solution and the diamond raw material;

[0007] Step 3: flushing the heated diamond raw material with pure water to remove the alkali solution and impurities remaining on the surface of the diamond raw material;

[0008] Step 4: Dry the processed diamond raw material, and then inject the diamond raw material into the air flow mill for crushing;

[0009] Step 5: Put the crushed diamond powder into the acid solution for stirring, and heat the acid solution and the diamond raw material;

[0010] Step 6: flushing the heated diamond raw material with pure water to purify the produced diamond micropowder;

[0011] Step 7: Stir the purified diamond powder and pure water evenly, and inject the mixed solution into the overflow bucket for treatment;

[0012] Step 8: injecting the water flow with diamond powder flowing out of the overflow bucket into the interior of multiple sedimentation buckets for sedimentation;

[0013] Step nine: Dry the diamond micropowder after sedimentation, and take a certain amount of sample to test the particle size of the diamond micropowder through a particle size analyzer to obtain the finished diamond micropowder.

[0014] As a further solution of the present invention: the crushing pressure of the air flow mill is 0.5-0.6MPa, the D50 value of the air flow mill output is 20-30um, and the crushing time is 60-90min.

[0015] As a further solution of the present invention: the alkali solution is a mixture of sodium hydroxide and potassium hydroxide, the concentration of sodium hydroxide is 0.5-1 mol / L, the concentration of potassium hydroxide is 1.2-2 mol / L, and the mass ratio of the diamond micropowder to the alkali solution volume is 1g:5ml.

[0016] As a further solution of the present invention: the acid solution is a mixture of hydrochloric acid, nitric acid and hydrofluoric acid, the concentration of hydrochloric acid is 1.5-3 mol / L, the concentration of nitric acid is 0.5-1.5 mol / L, the concentration of hydrofluoric acid is 2-3.5 mol / L, and the mass ratio of the diamond micropowder to the volume of the acid solution is 1g:4ml.

[0017] As a further solution of the present invention: the diamond powder is placed in the alkaline solution and the acid solution with a stirring speed of 30 to 50 rpm, the heating temperature is controlled at 40 to 80° C., and the heating time is 1.5 to 2 hours.

[0018] As a further solution of the present invention: the drying process adopts a microwave dryer, the drying temperature is 60° C.-150° C., and the drying time is 15 min-30 min.

[0019] As a further solution of the present invention: there are 4 or more sedimentation barrels, and the sedimentation time exceeds 2 hours, and the moisture content of the finished diamond micropowder is not more than 0.05%.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The present invention adopts a method for crushing diamond micropowder by using an air flow pulverizer. When the staff prepares the diamond micropowder, they only need to put the diamond micropowder raw material into the air flow pulverizer. The diamond micropowder has the characteristics of uniform fineness, narrow particle size distribution, smooth particle surface, regular particle shape, no impurity pollution, and no interference from human factors, thereby improving the quality of the diamond micropowder and being able to meet the processing material requirements of precision devices.

[0022] 2. The present invention adopts a method of placing diamond micropowder in alkaline solution and acid solution for treatment. When the staff prepares the diamond micropowder, the various impurities adsorbed on the surface of the diamond micropowder can be dissolved with the cooperation of alkaline solution and acid solution, and the various impurities dissolved by chemical treatment can be removed by washing with pure water, thereby achieving the effect of purifying the prepared diamond micropowder. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] Example

[0025] The present invention provides the following technical solution: a method for preparing diamond micropowder for semiconductors, the method comprising the following steps:

[0026] Step 1: Perform an appearance inspection on the diamond, and test the structure and purity of the diamond crystal, and then take a certain amount of samples for hardness and density tests;

[0027] Step 2: injecting the tested diamond raw material into the alkali solution for stirring, and heating the alkali solution and the diamond raw material;

[0028] Step 3: flushing the heated diamond raw material with pure water to remove the alkali solution and impurities remaining on the surface of the diamond raw material;

[0029] Step 4: Dry the processed diamond raw material, and then inject the diamond raw material into the air flow mill for crushing;

[0030] Step 5: Put the crushed diamond powder into the acid solution for stirring, and heat the acid solution and the diamond raw material;

[0031] Step 6: flushing the heated diamond raw material with pure water to purify the produced diamond micropowder;

[0032] Step 7: Stir the purified diamond powder and pure water evenly, and inject the mixed solution into the overflow bucket for treatment;

[0033] Step 8: injecting the water flow with diamond powder flowing out of the overflow bucket into the interior of multiple sedimentation buckets for sedimentation;

[0034] Step nine: Dry the diamond micropowder after sedimentation, and take a certain amount of sample to test the particle size of the diamond micropowder through a particle size analyzer to obtain the finished diamond micropowder.

[0035] Specifically, the pulverizing pressure of the jet mill is 0.5-0.6 MPa, the D50 value of the jet mill output is 20-30 um, and the pulverizing time is 60-90 min.

[0036] Specifically, the alkali solution is a mixture of sodium hydroxide and potassium hydroxide, the concentration of sodium hydroxide is 0.5-1 mol / L, the concentration of potassium hydroxide is 1.2-2 mol / L, and the mass ratio of diamond micropowder to the volume of the alkali solution is 1g:5ml.

[0037] Specifically, the acid solution is a mixture of hydrochloric acid, nitric acid and hydrofluoric acid, the concentration of hydrochloric acid is 1.5-3 mol / L, the concentration of nitric acid is 0.5-1.5 mol / L, the concentration of hydrofluoric acid is 2-3.5 mol / L, and the mass ratio of diamond micropowder to the volume of acid solution is 1g:4ml.

[0038] Specifically, the diamond powder is placed in the alkaline solution and the acid solution with a stirring speed of 30 to 50 rpm, the heating temperature is controlled at 40 to 80° C., and the heating time is 1.5 to 2 hours.

[0039] Specifically, the drying process uses a microwave dryer, the drying temperature is 60° C.-150° C., and the drying time is 15 min-30 min.

[0040] Specifically, there are 4 or more sedimentation barrels, and the sedimentation time exceeds 2 hours, and the moisture content of the finished diamond micropowder is not more than 0.05%.

[0041] The working principle and use process of the present invention are as follows: when preparing the diamond, the appearance of the diamond is first inspected, and the structure and purity of the diamond crystal are tested, and then a certain amount of samples are taken for hardness test and density test, and the tested diamond raw material is injected into the alkali solution for stirring, and the alkali solution and the diamond raw material are heated, and then the heated diamond raw material is washed with pure water to remove the alkali solution and impurities remaining on the surface of the diamond raw material, and then the treated diamond raw material is dried, and then the diamond raw material is injected into the air flow mill for crushing, and then the crushed diamond raw material is crushed. The obtained diamond micro-powder is put into the acid solution for stirring, and the acid solution and the diamond raw material are heated, and then the heated diamond raw material is flushed with pure water to purify the prepared diamond micro-powder, and the heated diamond raw material is flushed with pure water to purify the prepared diamond micro-powder, and then the water flow with diamond micro-powder flowing out of the overflow barrel is respectively injected into the interior of multiple sedimentation barrels for sedimentation, and the settled diamond micro-powder is dried at the same time, and a certain amount of samples are taken to test the particle size of the diamond micro-powder through a particle size analyzer, so as to obtain the finished diamond micro-powder.

[0042] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for preparing diamond micropowder for semiconductor, characterized in that: The method comprises the following steps: Step 1: Perform an appearance inspection on the diamond, and test the structure and purity of the diamond crystal, and then take a certain amount of samples for hardness and density tests; Step 2: injecting the tested diamond raw material into the alkali solution for stirring, and heating the alkali solution and the diamond raw material; Step 3: flushing the heated diamond raw material with pure water to remove the alkali solution and impurities remaining on the surface of the diamond raw material; Step 4: Dry the processed diamond raw material, and then inject the diamond raw material into the air flow mill for crushing; Step 5: Put the crushed diamond powder into the acid solution for stirring, and heat the acid solution and the diamond raw material; Step 6: flushing the heated diamond raw material with pure water to purify the produced diamond micropowder; Step 7: flushing the heated diamond raw material with pure water to purify the produced diamond micropowder; Step 8: injecting the water flow with diamond powder flowing out of the overflow bucket into the interior of multiple sedimentation buckets for sedimentation; Step nine: Dry the diamond micropowder after sedimentation, and take a certain amount of sample to test the particle size of the diamond micropowder through a particle size analyzer to obtain the finished diamond micropowder.

2. The method for preparing semiconductor-specific diamond micropowder according to claim 1, characterized in that: The pulverizing pressure of the jet mill is 0.5-0.6 MPa, the D50 value of the jet mill output is 20-30 um, and the pulverizing time is 60-90 min.

3. The method for preparing semiconductor-specific diamond micropowder according to claim 1, characterized in that: The alkali solution is a mixture of sodium hydroxide and potassium hydroxide, the concentration of sodium hydroxide is 0.5-1 mol / L, the concentration of potassium hydroxide is 1.2-2 mol / L, and the mass ratio of the diamond micropowder to the alkali solution volume is 1g:5ml.

4. The method for preparing semiconductor-specific diamond micropowder according to claim 1, characterized in that: The acid solution is a mixture of hydrochloric acid, nitric acid and hydrofluoric acid, the concentration of hydrochloric acid is 1.5-3 mol / L, the concentration of nitric acid is 0.5-1.5 mol / L, the concentration of hydrofluoric acid is 2-3.5 mol / L, and the mass ratio of the diamond micropowder to the volume of the acid solution is 1g:4ml.

5. The method for preparing semiconductor-specific diamond micropowder according to claim 1, characterized in that: The diamond micro powder is placed in the alkaline solution and the acid solution, and the stirring speed is 30-50 rpm, the heating temperature is controlled at 40-80° C., and the heating time is 1.5-2 hours.

6. The method for preparing semiconductor-specific diamond micropowder according to claim 1, characterized in that: The drying process uses a microwave dryer, the drying temperature is 60° C.-150° C., and the drying time is 15 min-30 min.

7. The method for preparing semiconductor-specific diamond micropowder according to claim 1, characterized in that: There are 4 or more sedimentation barrels, and the sedimentation time exceeds 2 hours, and the moisture content of the finished diamond micropowder is not more than 0.05%.