Heating device, control method thereof and thin film deposition equipment

Abstract

The invention discloses a heating device, a control method of the heating device and thin film deposition equipment, the heating device comprises a heating disc, a water cooling shaft and a base, the heating disc is installed on the water cooling shaft, the water cooling shaft is installed on the base, and cooling liquid at a first temperature is introduced into the water cooling shaft; wherein the base is provided with a water cooling channel, the water cooling channel is further connected with a valve for controlling the on-off of the water cooling channel, cooling liquid at a second temperature is introduced into the water cooling channel, and the second temperature is lower than the first temperature. The method comprises the steps of judging whether the output power of the heating disc is reduced to a first preset value or not; if the output power of the heating disc is reduced to a first preset value, the valve is controlled to be opened; judging whether the output power of the heating disc is increased to be greater than a second preset value; if it is judged that the output power of the heating disc rises to be larger than the second preset value, the valve is controlled to be closed. The cooling efficiency of the water-cooling shaft is improved through the water-cooling channel, so that the water-cooling shaft effectively keeps the temperature of the heating disc stable, the process interruption caused by over-temperature alarm is avoided, and the process efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a heating device and a control method thereof, and a thin film deposition device. Background Art

[0002] In modern semiconductor manufacturing, chemical vapor deposition (CVD) and atomic layer deposition (ALD) are critical process steps for forming thin films on wafers. These processes require highly accurate temperature control to ensure the quality and uniformity of the thin films. In CVD / ALD equipment, the heating plate is one of the key components and is responsible for providing a stable heat source for the wafers in the reaction chamber. In order to maintain ideal processing conditions, the heating plate is usually mounted on a water-cooled shaft, which circulates a coolant at a specific temperature to effectively dissipate heat from the heating plate, thereby balancing the heat load caused by the heating wire and plasma. However, in high-power plasma applications, this thermal management solution faces severe challenges. When the plasma power is set high, it will generate a lot of heat, which may exceed the cooling capacity of the water cooling system. In this case, the coolant cannot take away all the heat in time, resulting in a prominent problem of heat accumulation. Even when the heating plate electronic control system has turned off the output (that is, the power is set to 0), the temperature sensor (TC) of the heating plate still records a continuous rise in temperature, which triggers the process temperature over-temperature alarm, forcing production to be interrupted, seriously affecting process efficiency and finished product quality. Summary of the invention

[0003] The embodiments of the present invention provide a heating device and a control method thereof, and a thin film deposition device, which are intended to solve the problem that the existing heating disk has poor heat dissipation effect when the plasma power is high, resulting in an over-temperature alarm that affects the process efficiency.

[0004] In a first aspect, the present invention provides a heating device, comprising: a heating plate, a water-cooled shaft and a base, wherein the heating plate is mounted on the water-cooled shaft, the water-cooled shaft is mounted on the base, and a cooling liquid at a first temperature is passed into the water-cooled shaft;

[0005] Wherein, a water cooling channel is provided on the base, and the water cooling channel is also connected to a valve for controlling its on-off. A coolant at a second temperature flows into the water cooling channel, and the second temperature is lower than the first temperature.

[0006] Furthermore, the water cooling channel is a water cooling groove opened on the base.

[0007] Furthermore, the water cooling groove includes a first open-ring groove, a water inlet and a water outlet. An axial hole for installing the water-cooling shaft is provided on the base. The first open-ring groove is provided on the surface of the base around the axial hole. The water inlet is provided on the side wall of the base and passes through to the starting end of the first open-ring groove. The water outlet is provided on the side wall of the base and passes through to the tail end of the first open-ring groove.

[0008] Furthermore, the water-cooling channel includes a mounting groove and a water-cooling pipe, the mounting groove is provided on the base, and the water-cooling pipe is installed on the mounting groove.

[0009] Furthermore, the mounting groove includes a second open-ring groove, an inlet groove and an outlet groove, an axial hole for mounting the water-cooled shaft is opened on the base, the second open-ring groove is opened on the surface of the base around the axial hole, the inlet groove is opened on the side wall of the base and passes through to the starting end of the second open-ring groove, the outlet groove is opened on the side wall of the base and passes through to the tail end of the second open-ring groove, and the water-cooling pipe is buried in the second open-ring groove, the inlet groove and the outlet groove.

[0010] Furthermore, a heat conductor is filled between the water cooling pipe and the mounting groove.

[0011] Furthermore, it also includes a bellows, which is sleeved on the outer circumference of the water-cooled shaft.

[0012] In a second aspect, the present invention further provides a control method for a heating device, which is applied to the heating device in the first aspect, and the method comprises:

[0013] Determining whether the output power of the heating plate is reduced to a first preset value;

[0014] If the output power of the heating plate decreases to a first preset value, the valve is controlled to open;

[0015] Determining whether the output power of the heating plate increases to be greater than a second preset value;

[0016] If it is determined that the output power of the heating disk increases to be greater than a second preset value, the valve is controlled to be closed.

[0017] Furthermore, after the step of determining whether the output power of the heating plate increases to a value greater than a second preset value, the method further includes:

[0018] Reduce the flow rate of the water flow channel according to a preset flow rate value;

[0019] Determining whether the output power of the heating plate is stable at the second preset value;

[0020] If not, return to the step of reducing the flow rate of the water flow channel according to the preset flow rate value;

[0021] If yes, determine whether the plasma source is turned off;

[0022] If the plasma source is turned off, the step of controlling the valve to close is performed.

[0023] In a third aspect, the present invention further provides a thin film deposition device, comprising a heating device, wherein the heating device is the heating device of the first aspect, and the heating device executes the control method of the heating device of the second aspect.

[0024] The present invention provides a heating device and a control method thereof, and a thin film deposition device. The heating device includes: a heating disk, a water-cooling shaft and a base, wherein the heating disk is mounted on the water-cooling shaft, and the water-cooling shaft is mounted on the base; wherein a water-cooling channel is provided on the base, and the water-cooling channel is also connected to a valve for controlling its on-off, and there is a temperature difference between the coolant of the water-cooling shaft and the coolant of the water-cooling channel, and the coolant temperature of the water-cooling channel is relatively low. When the output power of the heating disk is reduced to a first preset value, the control valve is opened, and the coolant flows through the water-cooling channel, and the heat of the water-cooling shaft is taken away through the water-cooling channel with a lower temperature, thereby improving the cooling efficiency of the water-cooling shaft, improving the heat dissipation effect of the water-cooling shaft on the heating disk, stabilizing the temperature of the heating disk, avoiding the interruption of the process due to an over-temperature alarm caused by the continuous heating of the heating disk, and improving the process efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0026] Figure 1 A schematic diagram of a heating device according to an embodiment of the present invention is shown;

[0027] Figure 2 A schematic diagram showing a base of a heating device according to an embodiment of the present invention;

[0028] Figure 3 A schematic diagram showing a base of a heating device according to another embodiment of the present invention;

[0029] Figure 4 A schematic flow chart showing the steps of a method for controlling a heating device according to an embodiment of the present invention is shown;

[0030] Figure 5 A schematic flow chart showing the steps of a method for controlling a heating device according to another embodiment of the present invention is shown;

[0031] Reference numerals:

[0032] 1. Heating plate; 2. Water-cooled shaft; 3. Base; 31. Shaft hole; 4. Water-cooled channel; 41a. Water-cooled groove; 411a. First open-loop groove; 412a. Water inlet; 413a. Water outlet; 41b. Mounting groove; 411b. Second open-loop groove; 412b. Inlet groove; 413b. Outlet groove; 42b. Water-cooled pipe; 5. Bellows; 6. Cavity; 7. Spray plate. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but are not used to limit the present invention. In addition, in the drawings, structures with similar or identical structures are represented by the same reference numerals.

[0035] At present, the heating plate is cooled by a water-cooled shaft, which cools the heating plate by continuously circulating 75°C coolant to balance the heat brought to the heating plate by the heating wire and plasma, thereby keeping the temperature of the heating plate stable. However, when the plasma power is high, it exceeds the upper limit of the cooling capacity of the water-cooled shaft, and the water-cooled shaft is difficult to take away the generated heat in time, resulting in the continuous heating of the heating plate. In order to ensure the temperature stability of the heating plate, the electric control of the heating plate will maintain the temperature stability by reducing the output power. As the heat continues to accumulate, the output power of the heating plate continues to decrease, but even if the output power of the heating plate drops to zero, heat is still generated. The method of reducing the output power of the heating plate can no longer maintain the temperature, and the temperature of the heating plate continues to rise. In this way, the data read by the temperature sensor of the heating plate continues to rise, causing the process temperature to be over-temperature alarm, resulting in shutdown and inability to perform the process, which seriously affects the process efficiency.

[0036] To this end, the embodiments of the present invention provide a heating device and a control method thereof, and a thin film deposition device, which solve the problem that the existing heating disk has poor heat dissipation effect when the Plasma power is high, resulting in an over-temperature alarm that affects the process efficiency. A water cooling channel is set on the base to improve the cooling efficiency, improve the heat dissipation effect, and avoid over-temperature alarms.

[0037] The embodiments of the present invention are to solve the above-mentioned problem of poor heat dissipation effect, and the specific ideas are as follows:

[0038] By opening a water cooling channel on the base where the water cooling shaft is installed, the water cooling channel is connected to a valve, and the valve can control the on and off of the water cooling channel. When the valve is opened, the coolant flows in the water cooling channel to take away the heat in time, improve the cooling efficiency, and improve the heat dissipation effect. Specifically, under normal working conditions, the heating plate still uses the water cooling shaft to balance the heat brought to the heating plate by the heating wire and the plasma, so that the temperature of the heating plate remains stable. When the power of the plasma is high and the output power of the heating plate cannot maintain the temperature even if it is reduced to zero, the valve is opened, and the coolant flows in the water cooling channel of the base. Since the water cooling shaft is installed on the base, the water cooling channel can take away the heat of the water cooling shaft, improve the cooling efficiency of the water cooling shaft, and enable the water cooling shaft to cool the heating plate more efficiently, improve the heat dissipation effect, maintain the temperature of the heating plate, avoid further temperature rise, eliminate the risk of interrupting the process due to over-temperature alarm, and improve process efficiency.

[0039] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0040] See also Figure 1-Figure 3 An embodiment of the present invention shows a heating device, comprising: a heating plate 1, a water-cooling shaft 2 and a base 3, wherein the heating plate 1 is mounted on the water-cooling shaft 2, the water-cooling shaft 2 is mounted on the base 3, and a coolant at a first temperature is passed through the water-cooling shaft; wherein a water-cooling channel 4 is provided on the base 3, and the water-cooling channel 4 is also connected to a valve for controlling its on-off, and a coolant at a second temperature is passed through the water-cooling channel, and the second temperature is lower than the first temperature.

[0041] Reference Figure 1Specifically, the heating plate 1 is installed in the cavity 6 of the reaction chamber. The heating plate 1 includes a plate body and a plate handle. The plate body is located below the spray plate 7 in the cavity 6. One end of the plate handle is connected to the center of the plate body. The other end of the plate handle passes through the heating plate 1 hole at the bottom of the cavity 6 to the outside of the cavity 6 and is connected to the water-cooled shaft 2, so that the heating plate 1 is located on the water-cooled shaft 2. The water-cooled shaft 2 cools the heating plate 1 by continuously circulating 75°C coolant to balance the heat brought to the heating plate 1 by the heating wire and Plasma. A cooling water channel is arranged inside the water-cooled shaft 2. The cooling water channel includes an inlet pipe, an internal pipe and an outlet pipe connected in sequence. The inlet pipe and the outlet pipe are arranged at the axial bottom of the water-cooled shaft 2. The first temperature can be 75°C, for example. The 75°C coolant enters the water-cooled shaft 2 from the inlet pipe, flows in the internal pipe to take away the heat, and then flows out from the outlet pipe. The water-cooled shaft 2 is installed on the base 3. The center of the base 3 is provided with an axial hole 31, and the water-cooled shaft 2 is installed in the axial hole 31. A water cooling channel 4 is provided on the base 3, and a coolant of a second temperature is passed into the water cooling channel 4. The second temperature may be, for example, 25°C. The coolant flowing in the water cooling channel 4 can take away heat. The water cooling channel 4 is connected to a valve (not shown in the figure), which is arranged outside the base 3, specifically before the water inlet of the water cooling channel 4. When the valve is opened, the coolant flows in the water cooling channel 4, entering from one end and exiting from the other end, and circulates. When the valve is closed, no coolant flows in the water cooling channel 4. A flow meter (not shown in the figure) may also be provided after the water outlet 413a of the water cooling channel 4, and the flow meter is used to detect the flow of the coolant in the water cooling channel 4. Since the water-cooled shaft 2 is mounted on the base 3, a water cooling channel 4 of 25°C is provided on the base 3, and a coolant of 75°C is passed into the water cooling shaft 2, there is a high temperature difference between the two. Therefore, the water-cooling channel 4 on the base 3 can be used to cool the water-cooled shaft 2, take away the heat of the water-cooled shaft 2, and improve the cooling efficiency of the water-cooled shaft 2, so that the water-cooled shaft 2 can cool the heating plate 1 more efficiently, improve the heat dissipation effect, maintain the temperature of the heating plate 1, and avoid its continuous temperature rise and over-temperature alarm leading to process interruption, thereby improving process efficiency. It should be noted that the coolant temperature of the above-mentioned water-cooled shaft 2 and water-cooling channel 4 can also be other temperature values. The coolant temperature of the water-cooling channel 4 is lower than the coolant temperature in the water-cooled shaft 2. Those skilled in the art can set it according to actual needs, which is not limited here. Similarly, the structure of the water-cooling channel 4 on the base 3 can also be various forms. No matter what kind of structure it is, as long as the coolant can flow in the base 3 to take away the heat of the water-cooled shaft 2, it is not limited here.

[0042] Through this embodiment, a water-cooling channel 4 is added to the base 3. When the temperature of the heating plate 1 cannot be maintained stable, the valve of the water-cooling channel 4 is opened to allow the coolant to flow through the water-cooling channel 4 to take away the heat of the water-cooled shaft 2, thereby improving the cooling efficiency of the water-cooled shaft 2, so that the water-cooled shaft 2 can promptly take away the heat generated by the plasma, achieving a balance between heat dissipation and heat generated by the plasma, ensuring the temperature of the heating plate 1 to be stable, avoiding the continuous heating of the heating plate 1 resulting in an over-temperature alarm and interruption of the process, and improving the process efficiency.

[0043] In one embodiment, the valve is configured to open when the output power of the heating disk 1 is reduced to its lower limit, so that the water-cooling channel 4 allows the coolant of the second temperature to cool the water-cooled shaft 2. Specifically, when the power of the plasma is high and the cooling capacity of the water-cooled shaft is difficult to maintain the temperature of the heating disk, the heating disk stabilizes the temperature of the heating disk by reducing its output power. Until the output power of the heating disk is reduced to its lower limit, the temperature of the heating disk cannot be maintained. At this time, the second water cooling is turned on, that is, the valve is opened to open the water-cooling channel 4, so that the low-temperature coolant is passed into the water-cooling channel 4 to cool the water-cooled shaft 2, and the cooling capacity of the water-cooled shaft 2 is improved, so that the water-cooled shaft 2 can take away the heat generated by the plasma in time, that is, the water-cooling channel 4 indirectly takes away the heat of the heating disk 1, thereby ensuring the temperature of the heating disk 1 is stable. Through the double water cooling method, it is ensured that the heating disk will not shut down due to overtemperature, the process is ensured to be stable, and the process efficiency is improved.

[0044] In one embodiment, the water-cooling channel 4 is a water-cooling groove 41a provided on the base 3. Specifically, in a preferred embodiment, the water-cooling channel 4 is a water-cooling groove 41a structure provided on the base 3. The water-cooling groove 41a structure has the following advantages. The first aspect is that the design of the water-cooling groove 41a can increase the contact area between the coolant and the base 3, thereby improving the heat exchange efficiency. This means that the coolant can more effectively absorb and take away the heat transferred from the water-cooling shaft 2, especially when the plasma power is high, it can respond to temperature changes more quickly and keep the temperature of the heating plate 1 stable. The second aspect is that compared with the closed water-cooling pipe 42b, the water-cooling groove 41a structure is generally easier to clean and maintain. When inspection or cleaning is required, the inside of the water-cooling groove 41a can be cleaned directly to facilitate the removal of impurities or sediments that may accumulate, reduce the risk of blockage, and extend the service life of the equipment. The third aspect is that the structure of the water-cooling tank 41a allows for more flexible adjustment of the flow rate and direction of the coolant. By changing the design of the channel (such as width, depth, shape, etc.), the cooling effect can be optimized to meet the requirements for temperature control under different process conditions. Moreover, the water-cooling tank 41a can be customized according to actual needs to adapt to bases 3 of different sizes and shapes, as well as different cooling requirements. For example, the cooling performance can be enhanced by increasing the number of channels or changing the layout of the channels, which is suitable for a variety of process environments. The fourth aspect is that compared with complex piping systems, the manufacturing and installation process of the water-cooling tank 41a is relatively simple and low cost.

[0045] Reference Figure 2In this embodiment, the water-cooling groove 41a includes a first open-ring groove 411a, a water inlet 412a and a water outlet 413a. The base 3 is provided with an axial hole 31 for mounting the water-cooling shaft 2. The first open-ring groove 411a is provided on the surface of the base 3 around the axial hole 31. The water inlet 412a is provided on the side wall of the base 3 and passes through to the beginning of the first open-ring groove 411a. The water outlet 413a is provided on the side wall of the base 3 and passes through to the end of the first open-ring groove 411a. Specifically, the base 3 includes a triangular block and a hollow cylinder. The hollow cylinder is provided at the center below the triangular block. The center of the triangular block is provided with an axial hole 31. The axial hole 31 is connected to the interior of the hollow cylinder. The water-cooling shaft 2 passes through the axial hole 31 and enters the hollow cylinder. The water-cooling groove 41a includes a first open-ring groove 411a, a water inlet 412a and a water outlet 413a. The first open-ring groove 411a is a "C"-shaped structure. The first open-ring groove 411a is provided on the upper surface of the triangular block and is provided around the edge of the shaft hole 31, so that it can be close to the water-cooled shaft 2 and has a good cooling effect. The water inlet 412a is provided on the side wall of one side of the triangular block. The water inlet 412a can be a hole structure or a notch structure that penetrates the upper surface of the triangular block. The water inlet 412a penetrates the radial direction of the triangular block to the beginning of the first open-ring groove 411a, that is, one end of the "C" shape. Similarly, the water outlet 413a is provided on the side wall of the other side of the triangular block. The water outlet 413a can be a hole structure or a notch structure that penetrates the upper surface of the triangular block. The water outlet 413a penetrates the radial direction of the triangular block to the tail end of the first open-ring groove 411a, that is, the other end of the "C" shape. The water inlet 412a is connected to the supply element of the coolant, and the coolant enters from the water inlet 412a, flows from the beginning of the first open-ring groove 411a around the water-cooled shaft 2 to take away its heat, flows to the end of the first open-ring groove 411a, and finally flows out from the water outlet 413a. Through the first open-ring groove 411a structure of this embodiment, which is arranged around the water-cooled shaft 2, the coolant flows along the circumference of the water-cooled shaft 2, and the thermal contact area between the coolant and the water-cooled shaft 2 is large, which can fully take away the heat, has high cooling efficiency, and improves the heat dissipation effect.

[0046] In one embodiment, the water-cooling channel 4 includes a mounting groove 41b and a water-cooling pipe 42b, wherein the mounting groove 41b is provided on the base 3, and the water-cooling pipe 42b is installed on the mounting groove 41b. Specifically, in another preferred embodiment, the water-cooling channel 4 includes a mounting groove 41b and a water-cooling pipe 42b, wherein the mounting groove 41b is used to install the water-cooling pipe 42b, and the mounting groove 41b is provided on the base 3 according to the shape of the pipe, and the water-cooling pipe 42b is buried in the mounting groove 41b along the path of the mounting groove 41b. The coolant flows in the water-cooling pipe 42b, rather than flowing directly in the water-cooling groove 41a provided on the base 3. The structural design of the buried groove of the water-cooling pipe 42b has the following advantages. On the one hand, the water-cooling pipe 42b is buried in the mounting groove 41b of the base 3, which can reduce the interference and influence of the external environment on the water-cooling channel 4, and improve stability and reliability. On the other hand, the buried pipe structure can better seal the coolant and reduce the risk of leakage, which is particularly important for semiconductor equipment that needs to run for a long time, and can avoid equipment failure and production interruption caused by coolant leakage. And although the buried pipe structure is not easy to replace after installation, under normal circumstances, due to its good sealing and low maintenance frequency, the workload of daily maintenance is reduced. On the other hand, by changing the layout and diameter of the water-cooling pipe 42b, the cooling effect can be flexibly adjusted to meet the needs under different process conditions. If the cooling capacity needs to be improved, it can be achieved by increasing the number of water-cooling pipes 42b or changing the pipe path without significantly changing the entire base 3 structure.

[0047] Reference Figure 3In this embodiment, the mounting groove 41b includes a second open-loop groove 411b, an inlet groove 412b and an outlet groove 413b. The base 3 is provided with an axial hole 31 for installing the water-cooling shaft 2. The second open-loop groove 411b is provided on the surface of the base 3 around the axial hole 31. The inlet groove 412b is provided on the side wall of the base 3 and passes through to the beginning of the second open-loop groove 411b. The outlet groove 413b is provided on the side wall of the base 3 and passes through to the end of the second open-loop groove 411b. The water-cooling pipe 42b is buried in the second open-loop groove 411b, the inlet groove 412b and the outlet groove 413b. Specifically, the base 3 includes a triangular block and a hollow cylinder. The hollow cylinder is arranged at the center below the triangular block. The center of the triangular block is provided with an axial hole 31. The axial hole 31 is connected to the inside of the hollow cylinder. The water-cooling shaft 2 passes through the axial hole 31 and enters the hollow cylinder. The mounting groove 41b includes a second open-ring groove 411b, an inlet groove 412b and an outlet groove 413b. The second open-ring groove 411b is a "C"-shaped structure. The second open-ring groove 411b is provided on the upper surface of the triangular block and is provided around the edge of the shaft hole 31, so that it can be close to the water-cooled shaft 2 and has a good cooling effect. The inlet groove 412b is provided on the side wall on one side of the triangular block. The inlet groove 412b penetrates the upper surface of the triangular block and penetrates to the beginning of the second open-ring groove 411b along the radial direction of the triangular block, that is, one end of the "C" shape. Similarly, the outlet groove 413b is provided on the side wall on the other side of the triangular block. The outlet groove 413b penetrates the upper surface of the triangular block and penetrates to the tail end of the second open-ring groove 411b along the radial direction of the triangular block, that is, the other end of the "C" shape. The entire mounting groove 41b is open on the upper surface of the triangular block, and the overall structure is "Ω". The water cooling pipe 42b can be directly embedded in the second open-loop groove 411b, the inlet groove 412b and the outlet groove 413b from the upper surface of the triangular block. The two ends of the water cooling pipe 42b extend out of the inlet groove 412b and the outlet groove 413b, which is convenient for connecting with the external coolant supply element. The coolant enters from the inlet of one end of the water cooling pipe 42b. Since the water cooling pipe 42b is placed along the path of the mounting groove 41b, the coolant flows from one end of the water cooling pipe 42b around the water cooling shaft 2 to take away its heat and flow to the other end of the water cooling pipe 42b, and finally flows out from the outlet of the water cooling pipe 42b. Through the second open-ring groove 411b structure of this embodiment, which is arranged around the water-cooled shaft 2, the coolant flows circumferentially along the water-cooled shaft 2 in the water-cooled pipe 42b. The thermal contact area between the coolant and the water-cooled shaft 2 is large, which can fully take away the heat, has high cooling efficiency, and improves the heat dissipation effect.

[0048] In this embodiment, a heat conductor is filled between the water-cooling pipe 42b and the mounting groove 41b. Specifically, the heat conductor can be made of heat-conducting materials such as thermal grease, thermal gel, and thermal paste, which are not limited here. The heat conductor is filled into the mounting groove 41b, so that the water-cooling pipe 42b in the mounting groove 41b is in full contact with the base 3, thereby increasing the contact area between the water-cooling pipe 42b and the base 3 and improving the heat dissipation efficiency. Moreover, the heat conductor usually has a high thermal conductivity, which can effectively reduce the thermal resistance between the water-cooling pipe 42b and the base 3. This means that heat can be transferred from the water-cooled shaft 2 to the base 3 faster, and then transferred to the coolant in the water-cooling pipe 42b through the heat conductor, thereby improving the overall heat conduction efficiency. In addition, the heat conductor can also fill tiny gaps, improve the sealing between the water-cooling pipe 42b and the mounting groove 41b, reduce the risk of coolant leakage, and improve reliability.

[0049] In one embodiment, the heating device further comprises a bellows 5, which is sleeved on the outer periphery of the water-cooled shaft 2. Specifically, the bellows 5 is sleeved on the outer periphery of the water-cooled shaft 2, the upper flange of the bellows 5 is fixed to the bottom of the cavity 6, and the lower flange of the bellows 5 is fixed to the upper surface of the triangular block of the base 3. The bellows 5 can provide a sealed barrier to prevent the coolant from leaking from the gap between the water-cooled shaft 2 and the surrounding structure, thereby improving the sealing performance; and the bellows 5 has good elasticity, which can compensate for the thermal expansion and contraction of the water-cooled shaft 2 caused by temperature changes, reduce the stress caused by thermal expansion and contraction, and prevent the equipment from being deformed or damaged.

[0050] Reference Figure 4 The present invention also provides a control method for a heating device, which is applied to the heating device in the above embodiment. The heating device has been described in detail in the above embodiment, and for the sake of brevity, it will not be described here. The method includes steps: S101-S104.

[0051] S101, determining whether the output power of the heating plate 1 is reduced to a first preset value;

[0052] S102, if the output power of the heating plate 1 is reduced to a first preset value, the valve is controlled to open;

[0053] S103, determining whether the output power of the heating plate 1 increases to be greater than a second preset value;

[0054] S104: If it is determined that the output power of the heating plate 1 increases to be greater than a second preset value, the valve is controlled to be closed.

[0055] In this embodiment, the first preset value is zero, and the second preset value is 5%. Of course, it can be understood that it can also be other values, and the second preset value is greater than the first preset value. When the plasma power is high, the temperature of the heating disk 1 is maintained stable by reducing the output power of the heating disk 1. The output power of the heating disk 1 continues to decrease until it is reduced to the first preset value, that is, the output power of the heating disk 1 is reduced to zero. At this time, it means that even if the output power of the heating disk 1 is reduced to zero, it cannot maintain the temperature, and the temperature of the heating disk 1 will rise. In order to avoid the temperature rise of the heating disk 1 and stabilize the temperature of the heating disk 1, the valve of the water cooling channel 4 is opened, and the coolant is introduced. The cooling efficiency of the water cooling shaft 2 is improved by the coolant, the temperature of the heating disk 1 is stabilized, the temperature rise of the heating disk 1 is avoided, and the heat generated by the plasma is balanced. In order to maintain the temperature of the heating disk 1, the output power of the heating disk 1 is restored. When the output power of the heating disk 1 increases to 5%, the water cooling channel 4 is no longer needed to stabilize the temperature of the heating disk 1, and only the water cooling shaft 2 is relied on for cooling, so the valve is closed and the water cooling channel 4 is disconnected.

[0056] In one embodiment, referring to Figure 5 , the control method of the heating device includes steps: S201-S207.

[0057] S201, determining whether the output power of the heating plate 1 is reduced to a first preset value;

[0058] S202, if the output power of the heating plate 1 is reduced to a first preset value, the valve is controlled to open;

[0059] S203, determining whether the output power of the heating plate 1 increases to be greater than a second preset value;

[0060] S204, reducing the flow rate of the water flow channel according to a preset flow rate value;

[0061] S205, determining whether the output power of the heating plate 1 is stable at the second preset value; if not, returning to S204;

[0062] S206: If yes, determine whether the plasma source is turned off;

[0063] S207: If the plasma source is turned off, control the valve to close.

[0064] In this embodiment, steps S201-S203 are the same as steps S101-S103, and will not be repeated here. After the water-cooling channel 4 is opened, the coolant flows through the water-cooling channel 4, improving the cooling efficiency, balancing the heat generated by the plasma, and stabilizing the temperature of the heating plate 1. After a period of time, the heat taken away by the water-cooling channel 4 is greater than the heat generated by the plasma. At this time, the temperature of the heating plate 1 will drop, so the output power of the heating plate 1 will recover and increase to maintain the temperature stability, and the output power of the heating plate 1 will increase to more than 5%. If the water-cooling channel 4 is directly cut off at this time, the water-cooling channel 4 loses all the coolant and only relies on the water-cooling shaft 2 for cooling, and the temperature of the heating plate 1 will rise for a short time. In order to avoid this situation, after step S203, the flow rate of the coolant in the water flow channel begins to be gradually reduced, which can be achieved by adjusting the opening of the valve. The first preset value can be, for example, 1% of the flow rate. The water-cooling channel 4 is gradually closed by gradually reducing the coolant flow rate by 1%, avoiding the situation where the direct cut-off causes a short-term temperature rise. Specifically, first reduce the coolant flow rate by 1%, and then determine whether the output power of the heating disk 1 is maintained at 5%. If not, it means that the output power of the heating disk 1 continues to increase, which may be 6% or 7%. Continue to reduce the coolant flow rate by 1%, the cooling efficiency decreases, and the output power of the heating disk 1 is reduced. Determine again whether the output power of the heating disk 1 is maintained at 5%. If it is still not, continue to reduce the coolant flow rate by 1% until the output power of the heating disk 1 stabilizes at 5%. When the output power of the heating disk 1 stabilizes at 5%, it means that the heat taken away by the coolant is balanced with the heat generated by the Plasma, and the temperature of the heating disk 1 is stable. At this time, determine whether the Plasma is turned off. If the Plasma is turned off, the heat source disappears. At this time, there is no need for cooling by the water-cooling channel 4, and only the water-cooling shaft 2 is required. Therefore, close the valve and disconnect the water-cooling channel 4.

[0065] The embodiment of the present invention further provides a thin film deposition device, comprising a heating device, wherein the heating device is the heating device of the above embodiment, and the heating device executes the control method of the heating device of the above embodiment. The heating device and the control method thereof have been described in detail in the above embodiment, and for the sake of brevity of the specification, they will not be repeated here.

[0066] Through this embodiment, the heating device and control method of the above-mentioned embodiment are adopted. When the output power of the heating plate 1 is reduced to the first preset value, the control valve is opened, and the coolant flows through the water cooling channel 4 to take away the heat, thereby improving the cooling efficiency and the heat dissipation effect, stabilizing the temperature of the heating plate 1, avoiding the continuous heating of the heating plate 1 causing an over-temperature alarm and interrupting the process, thereby improving the process efficiency.

[0067] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A heating device, characterized in that: include: A heating plate, a water-cooled shaft and a base, wherein the heating plate is mounted on the water-cooled shaft, the water-cooled shaft is mounted on the base, and a cooling liquid at a first temperature is passed into the water-cooled shaft; Wherein, a water cooling channel is provided on the base, and the water cooling channel is also connected to a valve for controlling its on-off. A coolant at a second temperature flows into the water cooling channel, and the second temperature is lower than the first temperature.

2. The heating device according to claim 1, characterized in that The water cooling channel is a water cooling groove opened on the base.

3. The heating device according to claim 2, characterized in that: The water cooling groove includes a first open-ring groove, a water inlet and a water outlet. An axial hole for installing the water-cooling shaft is provided on the base. The first open-ring groove is provided on the surface of the base around the axial hole. The water inlet is provided on the side wall of the base and passes through to the starting end of the first open-ring groove. The water outlet is provided on the side wall of the base and passes through to the tail end of the first open-ring groove.

4. The heating device according to claim 1, characterized in that The water cooling channel comprises a mounting groove and a water cooling pipe. The mounting groove is arranged on the base, and the water cooling pipe is installed on the mounting groove.

5. The heating device according to claim 4, characterized in that: The mounting groove includes a second open-ring groove, an inlet groove and an outlet groove. An axial hole for mounting the water-cooled shaft is provided on the base. The second open-ring groove is provided on the surface of the base around the axial hole. The inlet groove is provided on the side wall of the base and passes through to the starting end of the second open-ring groove. The outlet groove is provided on the side wall of the base and passes through to the tail end of the second open-ring groove. The water-cooling pipe is buried in the second open-ring groove, the inlet groove and the outlet groove.

6. The heating device according to claim 4, characterized in that: A heat conductor is filled between the water cooling pipe and the mounting groove.

7. The heating device according to claim 1, characterized in that: It also includes a bellows, which is sleeved on the outer circumference of the water-cooled shaft.

8. The heating device according to claim 1, characterized in that The valve is configured to open when the output power of the heating disk decreases to its lower limit, so that the coolant at the second temperature flows into the water-cooling channel to cool the water-cooling shaft.

9. A method for controlling a heating device, characterized in that: Applied to the heating device according to any one of claims 1 to 8, the method comprises: Determining whether the output power of the heating plate is reduced to a first preset value; If the output power of the heating plate decreases to a first preset value, the valve is controlled to open; Determining whether the output power of the heating plate increases to be greater than a second preset value; If it is determined that the output power of the heating disk increases to be greater than a second preset value, the valve is controlled to be closed.

10. The method according to claim 9, characterized in that After the step of determining whether the output power of the heating plate increases to a value greater than a second preset value, the method further includes: Reduce the flow rate of the water flow channel according to a preset flow rate value; Determining whether the output power of the heating plate is stable at the second preset value; If not, return to the step of reducing the flow rate of the water flow channel according to the preset flow rate value; If yes, determine whether the plasma source is turned off; If the plasma source is turned off, the step of controlling the valve to close is performed.

11. A thin film deposition device, characterized in that it comprises a heating device, wherein the heating device is the heating device according to any one of claims 1 to 8, and the heating device executes the control method of the heating device according to any one of claims 9 to 10.

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