Radiator and lamp

Abstract

The radiator comprises a heat dissipation substrate, a plurality of lamp beads and a heat dissipation component, the heat dissipation component comprises a plurality of heat dissipation units, the heat dissipation units are arranged in the heat dissipation substrate, the lamp beads are arranged on a mounting part, and the heat dissipation units and the lamp beads are arranged in a one-to-one correspondence mode. The projection parts of the lamp beads and the heat dissipation units in the first direction are overlapped, heat generated by the lamp beads can be guided to the heat dissipation substrate, and the situation that the bottoms of the lamp beads are damaged due to local high temperature is avoided; the interval areas are arranged between the lamp beads, the heat dissipation unit is partially arranged in the projection of the interval areas in the first direction, the heat dissipation unit can conduct a large amount of local heat to other positions, where the lamp beads are not arranged, of the heat dissipation substrate, the heat is conducted to the interval areas between the lamp beads in the heat dissipation substrate from the bottoms of the lamp beads, and uniform heat dissipation is achieved; the heat dissipation efficiency and the temperature uniformity of the heat dissipation substrate can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of lamps, and in particular to a heat sink and a lamp. Background Art

[0002] In the field of stage lighting, high-power stage lamps have higher brightness. A large part of the electrical energy of the lamps will be converted into heat energy during use. If the heat inside the stage lamps cannot be dissipated in time, it will seriously affect the service life of the stage lamps, and even the lamps will be damaged due to high temperature. The power of stage lamps is getting higher and higher, and they are increasingly pursuing lightweight and miniaturization. The space inside the lamps is limited, and the current heat dissipation structure cannot meet the heat dissipation needs of high-power stage lamps. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a heat sink that can improve the heat dissipation efficiency and temperature uniformity of the heat dissipation substrate and prevent the bottom of the lamp bead from being damaged by local high temperature.

[0004] The present application also proposes a lamp having the above-mentioned heat sink.

[0005] The heat sink according to the first embodiment of the present application includes:

[0006] a heat dissipation substrate, the substrate comprising a mounting portion;

[0007] A plurality of lamp beads, wherein the lamp beads are arranged on the mounting portion, and a spacing area is arranged between the lamp beads;

[0008] A heat dissipation component, the heat dissipation component includes a plurality of heat dissipation units, the plurality of heat dissipation units are arranged in the heat dissipation substrate, and the heat dissipation units are arranged in a one-to-one correspondence with the lamp beads;

[0009] The lamp bead partially overlaps with a projection of the heat dissipation unit in the first direction, and the heat dissipation unit is partially arranged within the projection of the spacing area in the first direction.

[0010] The heat sink according to the embodiment of the first aspect of the present application has at least the following beneficial effects: the heat sink of the present application includes a heat dissipation substrate, multiple lamp beads and a heat dissipation component, the heat dissipation component includes multiple heat dissipation units, the multiple heat dissipation units are arranged in the heat dissipation substrate, and the multiple lamp beads are arranged on the mounting portion. The heat dissipation units and the lamp beads are arranged one-to-one, and the projections of the lamp beads and the heat dissipation units in the first direction partially overlap, which can guide the heat generated by the lamp beads to the heat dissipation substrate to avoid local high temperature at the bottom of the lamp beads and damage; a spacing area is arranged between the lamp beads, and the heat dissipation unit is partially arranged in the projection of the spacing area in the first direction. The heat dissipation unit can conduct a large amount of local heat to other positions of the heat dissipation substrate where the lamp beads are not arranged, and the heat is conducted from the bottom of the lamp beads to the spacing area between the lamp beads in the heat dissipation substrate to achieve uniform heat dissipation, which can improve the heat dissipation efficiency and temperature uniformity of the heat dissipation substrate.

[0011] According to some embodiments of the present application, a projection of the lamp bead in the first direction overlaps with a middle portion of the heat dissipation unit, and two ends of the heat dissipation unit are arranged within a projection of the spacing area in the first direction.

[0012] According to some embodiments of the present application, a projection of the lamp bead in the first direction overlaps with one end of the heat dissipation unit, and the other end of the heat dissipation unit is arranged within the projection of the spacing area in the first direction.

[0013] According to some embodiments of the present application, the heat dissipation unit is configured as a heat pipe, and the heat pipe is linearly arranged in the heat dissipation substrate.

[0014] According to some embodiments of the present application, the heat dissipation unit is configured as a heat pipe, and the heat pipe is bent and disposed in the heat dissipation substrate.

[0015] According to some embodiments of the present application, the heat dissipation component further includes a plurality of heat dissipation fins, and the heat dissipation fins are arranged on a side of the heat dissipation substrate opposite to the mounting portion.

[0016] According to some embodiments of the present application, the heat dissipation component further includes a fan, which is arranged toward the heat dissipation fins to supply air to the heat dissipation fins.

[0017] According to some embodiments of the present application, a cavity is provided in the heat dissipation substrate, and the heat dissipation unit is provided in the cavity.

[0018] According to some embodiments of the present application, a thermally conductive filler is disposed between the heat dissipation substrate and the heat dissipation unit.

[0019] The lamp according to the second aspect of the present application includes the heat sink of the first aspect.

[0020] The lamp according to the embodiment of the first aspect of the present application has at least the following beneficial effects: a lamp of the present application, by using a heat sink, the heat sink includes a heat dissipation substrate, multiple lamp beads and a heat dissipation component, and the heat generated by the lamp beads is guided to the heat dissipation substrate through multiple heat dissipation units, so as to avoid local high temperature at the bottom of the lamp beads and damage, thereby improving the service life of the lamp beads and the lamp; a spacing area is arranged between the mounting parts, and the heat dissipation unit is partially arranged in the projection of the spacing area in the first direction, and the heat dissipation unit can conduct a large amount of local heat to other positions of the heat dissipation substrate where the lamp beads are not arranged. The heat is conducted from the bottom of the lamp beads to the spacing area between the lamp beads in the heat dissipation substrate, which can improve the heat dissipation efficiency and temperature uniformity of the heat dissipation substrate, and meet the requirements of lightweight and miniaturization of the lamp while also meeting the high-power heat dissipation requirements.

[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 is a structural schematic diagram of a radiator in an embodiment of the present application;

[0024] Figure 2 yes Figure 1 A schematic structural diagram of the heat sink shown in another angle;

[0025] Figure 3 yes Figure 1 The structural schematic diagram of the lamp bead and the mounting part shown;

[0026] Figure 4 is a schematic structural diagram of a heat dissipation unit in an embodiment of the present application;

[0027] Figure 5 is a schematic structural diagram of a heat dissipation unit in another embodiment of the present application;

[0028] Figure 6 yes Figure 1 A cross-sectional view of a heat sink is shown. DETAILED DESCRIPTION

[0029] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0030] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, inside, outside, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0031] In the description of this application, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0032] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, assembling, and matching should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0033] Refer to the following Figures 1 to 6 The heat sink according to the embodiment of the present application is described.

[0034] The heat sink of the embodiment of the present application, such as Figures 1 to 6 As shown, it includes a heat dissipation substrate 100, a lamp bead 200 and a heat dissipation component. The lamp bead 200 is used to provide a light source. The heat dissipation substrate 100 includes a mounting portion 110. A plurality of lamp beads 200 are provided. A plurality of lamp beads 200 are mounted on the mounting portion 110 to complete the installation and fixation of the lamp bead 200.

[0035] The heat dissipation component includes a plurality of heat dissipation units 300, and the plurality of heat dissipation units 300 are arranged in the heat dissipation substrate 100. The heat dissipation units 300 are arranged one-to-one with the lamp beads 200. The projections of the lamp beads 200 and the heat dissipation units 300 in the first direction partially overlap, and the heat generated by the lamp beads 200 can be guided to the heat dissipation substrate 100, thereby avoiding local high temperature at the bottom of the lamp beads 200 and causing damage.

[0036] A spacing area is arranged between the lamp beads 200, and the heat dissipation unit 300 is partially arranged within the projection of the spacing area in the first direction. The high temperature generated by the lamp beads 200 is conducted to the heat dissipation unit 300 through the overlapping parts. The heat dissipation unit 300 can conduct a large amount of local heat to other positions of the heat dissipation substrate 100 where the lamp beads 200 are not arranged, thereby achieving uniform heat dissipation, and can improve the heat dissipation efficiency and temperature uniformity of the heat dissipation substrate 100.

[0037] In some embodiments, the first direction is a vertical downward direction ( Figure 1The vertical downward projection of the lamp bead 200 partially overlaps with the heat dissipation unit 300 in the heat dissipation substrate 100, and the high temperature generated by the lamp bead 200 accumulates at the bottom, and the high temperature is vertically conducted downward to the overlapping part of the heat dissipation unit 300. The other parts of the heat dissipation unit 300 are arranged in the projection of the interval area in the first direction. The heat dissipation unit 300 conducts the high temperature to other parts, and can conduct a large amount of local heat to other positions of the heat dissipation substrate 100 where the lamp bead 200 is not arranged, so as to achieve uniform heat dissipation and improve the heat dissipation efficiency.

[0038] In some embodiments, a plurality of lamp beads 200 are evenly distributed on the heat dissipation substrate 100. Specifically, a plurality of lamp beads 200 are arranged to form concentric circles, and the positions of the plurality of mounting portions 110 and the plurality of heat dissipation units 300 correspond to the positions of the lamp beads 200. In some other embodiments, a plurality of lamp beads 200 are arranged in a rectangular array on the heat dissipation substrate 100. It is understood that the number and arrangement of the lamp beads 200 can be adaptively adjusted according to actual needs, and the heat dissipation units 300 are arranged one-to-one with the lamp beads 200, which does not affect the heat dissipation effect.

[0039] In some embodiments, the mounting portion 110 is configured as a mounting plate, and the mounting plate is provided with a plurality of mounting holes for mounting the lamp beads 200 . The lamp beads 200 are installed in the mounting holes one by one, thereby completing the fixed installation of the plurality of lamp beads 200 .

[0040] It should be noted that the thermal conductivity coefficient of the heat dissipation unit 300 is greater than that of the heat dissipation substrate 100. The high temperature generated by the lamp beads 200 accumulates on the heat dissipation substrate 100. The heat dissipation unit 300 corresponding to the lamp beads 200 can take away a large amount of local heat from the heat dissipation substrate 100. The heat dissipation unit 300 conducts the heat to the part within the projection of the interval area in the first direction, thereby conducting a large amount of local heat to the position of the heat dissipation substrate 100 where the lamp beads 200 are not set, thereby making full use of the heat dissipation substrate 100 and improving the heat dissipation efficiency.

[0041] It is understandable that the cost of the heat dissipation unit 300 is higher than that of the heat dissipation substrate 100, and using all the heat dissipation units 300 to dissipate heat from the lamp beads 200 will increase the cost several times. In the present application, the heat dissipation unit 300 corresponds to the lamp beads 200 one by one, and the heat dissipation unit 300 is arranged in the heat dissipation substrate 100, which can save costs and greatly improve the heat dissipation efficiency.

[0042] According to some embodiments of the present application, the projection of the lamp bead 200 in the first direction overlaps with the middle of the heat dissipation unit 300, and the two ends of the heat dissipation unit 300 are arranged in the projection of the interval area in the first direction. There are multiple lamp beads 200, and the number and position of the heat dissipation unit 300 correspond to the number and position of the lamp beads 200. The projection of the lamp bead 200 in the first direction overlaps with the middle of the heat dissipation unit 300. The high temperature generated by the lamp bead 200 accumulates on the heat dissipation substrate 100. Since the position of the heat dissipation unit 300 corresponds to the position of the lamp bead 200, the high temperature on the heat dissipation substrate 100 will be conducted to the middle part where the heat dissipation unit 300 overlaps with the projection of the lamp bead 200. The heat dissipation unit 300 conducts the high temperature from the middle to the two ends. The two ends of the heat dissipation unit 300 are arranged in the projection of the interval area in the first direction, which can distribute the local large amount of heat accumulated under the lamp bead 200 to other positions of the heat dissipation substrate 100, which can not only avoid the local high temperature at the bottom of the lamp bead 200 from being damaged, but also achieve uniform heat dissipation and improve the heat dissipation efficiency.

[0043] According to some embodiments of the present application, the projection of the lamp bead 200 in the first direction overlaps with one end of the heat dissipation unit 300, and the other end of the heat dissipation unit 300 is arranged within the projection of the interval area in the first direction. One end of the heat dissipation unit 300 is arranged toward the lamp bead 200, overlapping with the projection of the lamp bead 200 in the first direction, and the other end of the heat dissipation unit 300 is arranged within the projection of the interval area in the first direction. The high temperature generated by the lamp bead 200 accumulates on the heat dissipation substrate 100, and the high temperature on the heat dissipation substrate 100 will be conducted to the end where the heat dissipation unit 300 overlaps with the projection of the lamp bead 200. The heat dissipation unit 300 conducts the high temperature from one end to the other end, and conducts the high temperature from the heat dissipation unit 300 to the position where the other end is located. The large amount of local heat accumulated under the lamp bead 200 is distributed to other positions of the heat dissipation substrate 100, which can not only avoid the local high temperature at the bottom of the lamp bead 200 from being damaged, but also achieve uniform heat dissipation and improve heat dissipation efficiency.

[0044] According to some embodiments of the present application, the heat dissipation unit 300 is configured as a heat pipe, and the heat pipe is linearly arranged in the heat dissipation substrate 100. The heat pipe is linearly arranged in the heat dissipation substrate 100. Specifically, in some embodiments, the middle of the linearly arranged heat pipe coincides with the projection of the lamp bead 200 in the first direction, and the two ends of the heat pipe are arranged in the projection of the spacing area in the first direction. Heat can be linearly transported from the middle of the heat pipe to the two ends of the heat pipe, and then conducted from the two ends to the projection of the spacing area in the first direction, so that the heat is evenly distributed in the heat dissipation substrate 100, and uniform heat dissipation is achieved. In some other embodiments, one end of the linearly arranged heat pipe coincides with the projection of the lamp bead 200 in the first direction, and the other end of the heat pipe is linearly arranged in the projection of the spacing area in the first direction. Heat can be linearly transported from one end of the heat pipe to the other end of the heat pipe, which can also achieve uniform heat dissipation and ensure heat dissipation efficiency.

[0045] According to some embodiments of the present application, the heat dissipation unit 300 is configured as a heat pipe, and the heat pipe is bent and arranged in the heat dissipation substrate 100. The heat pipe is bent and arranged in the heat dissipation substrate 100, and the bent heat pipe can fully contact the heat dissipation substrate 100, conduct heat to various positions of the heat dissipation substrate 100, and improve the heat dissipation efficiency. Specifically, in some embodiments, the middle of the bent heat pipe coincides with the projection of the lamp bead 200 in the first direction, and the two ends of the heat pipe are arranged in the projection of the interval area in the first direction. Heat can be transported from the middle of the heat pipe to the two ends of the heat pipe, and then conducted from the two ends to the projection of the interval area in the first direction, and the heat is evenly distributed in the heat dissipation substrate 100 to achieve uniform heat dissipation. In some other embodiments, one end of the bent heat pipe coincides with the projection of the lamp bead 200 in the first direction, and the other end of the heat pipe is bent and arranged in the projection of the interval area in the first direction. Heat can be bent and transported from one end of the heat pipe to the other end of the heat pipe, which can also achieve uniform heat dissipation and ensure heat dissipation efficiency.

[0046] It should be noted that, in some other embodiments, each heat pipe does not interfere with each other, the shape of the heat pipe is not unique, and a plurality of heat dissipation units 300 are provided. The plurality of heat dissipation units 300 include both heat pipes arranged in a straight line and heat pipes arranged in a curved line, and both can conduct heat to the projection of the interval area in the first direction to achieve uniform heat dissipation.

[0047] According to some embodiments of the present application, the heat dissipation component further includes a plurality of heat dissipation fins 410, which are arranged on a side of the heat dissipation substrate 100 opposite to the mounting portion 110. The heat dissipation component further includes heat dissipation fins 410, and the heat dissipation fins 410 and the mounting portion 110 are respectively arranged on both sides of the heat dissipation substrate 100. Specifically, the mounting portion 110 is arranged on one side of the heat dissipation substrate 100, and the heat dissipation fins 410 are arranged on the other side of the heat dissipation substrate 100. The lamp beads 200 are arranged on the mounting portion 110, and the heat of the lamp beads 200 is conducted to the heat dissipation substrate 100. The heat dissipation unit 300 in the heat dissipation substrate 100 evenly distributes the heat to the entire heat dissipation substrate 100. The arrangement of the heat dissipation fins 410 can increase the heat dissipation area and improve the heat dissipation effect. It can be understood that in some embodiments, a plurality of heat sink fins 410 are provided, and the plurality of heat sink fins 410 are arranged in parallel on one side of the heat sink substrate 100, and gaps are provided between the plurality of heat sink fins 410. While increasing the heat sink area, the gaps between the heat sink fins 410 can also be used for ventilation to improve the heat sink effect.

[0048] According to some embodiments of the present application, the heat dissipation component further includes a fan 420, which is disposed toward the heat dissipation fins 410 to supply air and dissipate heat to the heat dissipation fins 410. Specifically, a fan 420 is disposed below the heat dissipation fins 410, and the fan 420 is disposed toward the heat dissipation fins 410. The fan 420 blows air toward the heat dissipation fins 410, which can further improve the heat dissipation efficiency.

[0049] According to some embodiments of the present application, a cavity is provided in the heat dissipation substrate 100, and the heat dissipation unit 300 is provided in the cavity. The mounting portion 110 is provided on the surface of the heat dissipation substrate 100, and the lamp beads 200 are installed on the surface of the heat dissipation substrate 100 through the mounting portion 110. A cavity is provided inside the heat dissipation substrate 100, and the heat dissipation unit 300 is provided in the cavity. The position of the heat dissipation unit 300 in the cavity corresponds to the position of the lamp beads 200 on the surface of the heat dissipation substrate 100. The heat of the lamp beads 200 is transferred to the heat dissipation substrate 100, and the heat dissipation substrate 100 transfers the heat to the heat dissipation unit 300 in the cavity. The heat dissipation unit 300 can transfer a large amount of local heat to the interval area of ​​the heat dissipation substrate 100 where the lamp beads 200 are not provided, and the heat is transferred from the bottom of the lamp beads 200 to between the lamp beads 200, so as to achieve uniform heat dissipation, and improve the heat dissipation efficiency and temperature uniformity of the heat dissipation substrate 100. It should be noted that, in some embodiments, the heat dissipation unit 300 is closely attached to the heat dissipation substrate 100 in the cavity to ensure good thermal conductivity between the heat dissipation unit 300 and the heat dissipation substrate 100 .

[0050] According to some embodiments of the present application, a thermally conductive filler is provided between the heat dissipation substrate 100 and the heat dissipation unit 300. The heat dissipation unit 300 is provided in the heat dissipation substrate 100, and the heat dissipation substrate 100 and the heat dissipation unit 300 are filled with the thermally conductive filler, which can ensure that the heat dissipation substrate 100 and the heat dissipation unit 300 are in full contact, which is beneficial to the uniform conduction of heat. Specifically, in some embodiments, the thermally conductive filler is set as solder, and the heat dissipation substrate 100 and the heat dissipation unit 300 are filled with solder, which is not only beneficial to the uniform conduction of heat, but also can fix the heat dissipation unit 300 in the heat dissipation substrate 100, and ensure the stability of the heat dissipation unit 300 in the heat dissipation substrate 100.

[0051] The lamp of the embodiment of the present application includes a heat sink. By using the heat sink, the heat sink includes a heat sink substrate 100, a plurality of lamp beads 200 and a heat sink component. The heat generated by the lamp beads 200 is guided to the heat sink substrate 100 through a plurality of heat sink units 300, so as to avoid local high temperature at the bottom of the lamp beads 200 and damage, thereby improving the service life of the lamp beads 200 and the lamp. A spacing area is provided between the mounting parts 110, and the heat sink unit 300 is partially provided within the projection of the spacing area in the first direction. The heat sink unit 300 can conduct a large amount of local heat to other positions of the heat sink substrate 100 where the lamp beads 200 are not provided. The heat is conducted from the bottom of the lamp beads 200 to the projection of the spacing area between the lamp beads 200 in the first direction, so as to improve the heat dissipation efficiency and temperature uniformity of the heat sink substrate 100, meet the requirements of lightweight and miniaturization of the lamp, and also meet the requirements of high-power heat dissipation.

[0052] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present application.

Claims

1. A radiator, characterized in that: include: a heat dissipation substrate, the substrate comprising a mounting portion; A plurality of lamp beads, wherein the lamp beads are arranged on the mounting portion, and a spacing area is arranged between the lamp beads; A heat dissipation component, the heat dissipation component includes a plurality of heat dissipation units, the plurality of heat dissipation units are arranged in the heat dissipation substrate, and the heat dissipation units are arranged in a one-to-one correspondence with the lamp beads; The lamp bead partially overlaps with a projection of the heat dissipation unit in the first direction, and the heat dissipation unit is partially arranged within the projection of the spacing area in the first direction.

2. The heat sink according to claim 1, characterized in that: The projection of the lamp bead in the first direction overlaps with the middle of the heat dissipation unit, and two ends of the heat dissipation unit are arranged within the projection of the spacing area in the first direction.

3. The heat sink according to claim 1, characterized in that: The projection of the lamp bead in the first direction overlaps with one end of the heat dissipation unit, and the other end of the heat dissipation unit is arranged within the projection of the spacing area in the first direction.

4. The radiator according to claim 2 or 3, characterized in that: The heat dissipation unit is configured as a heat pipe, and the heat pipe is linearly arranged in the heat dissipation substrate.

5. The radiator according to claim 2 or 3, characterized in that: The heat dissipation unit is configured as a heat pipe, and the heat pipe is bent and disposed in the heat dissipation substrate.

6. The heat sink according to claim 1, characterized in that The heat dissipation component further includes a plurality of heat dissipation fins, and the heat dissipation fins are arranged on a side of the heat dissipation substrate opposite to the mounting portion.

7. The heat sink according to claim 6, characterized in that The heat dissipation component also includes a fan, which is arranged toward the heat dissipation fins to supply air to the heat dissipation fins for heat dissipation.

8. The heat sink according to claim 1, characterized in that A cavity is arranged in the heat dissipation substrate, and the heat dissipation unit is arranged in the cavity.

9. The heat sink according to claim 1, characterized in that: A heat-conducting filler is arranged between the heat dissipation substrate and the heat dissipation unit.

10. A lamp, characterized in that A radiator comprising any one of claims 1 to 9.

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