Corrosion-resistant high-thermal-conductivity dissimilar metal solid-phase forming back plate and manufacturing method thereof

Abstract

The invention discloses a corrosion-resistant high-thermal-conductivity dissimilar metal solid-phase forming back plate and a manufacturing method thereof.The corrosion-resistant high-thermal-conductivity dissimilar metal solid-phase forming back plate comprises a base plate, a finish machining groove is formed in the base plate, the inner wall of the finish machining groove is machined into a uniform-temperature layer, and the outer surface of the base plate is machined into a corrosion-resistant layer; two symmetrically-arranged cover plates are embedded in the finish machining groove in a solid-phase friction stir welding mode, the outer surfaces of the cover plates are machined into uniform-temperature layers, and cooling liquid cavities are formed between the cover plates and the finish machining groove. Through anti-corrosion treatment and uniform temperature treatment, the dissimilar material solid-phase forming back plate is uniform in temperature distribution, excellent in corrosion resistance and long in service life, a solid-phase friction stir welding mode is adopted between the base plate and the cover plate, the two materials are in a solid-phase state all the time and are fully fused with each other, the internal stress after welding is lowest, and deformation is not prone to occurring.

Description

Technical Field

[0001] The present invention relates to the technical field of backplanes, and in particular to a corrosion-resistant and highly thermally conductive dissimilar metal solid-phase formed backplane and a manufacturing method thereof. Background Art

[0002] In the production of large-scale semiconductors, photovoltaic products, multi-layer thin films and other products, it is often necessary to put the workpiece into a vacuum chamber, and then control the temperature of the entire vacuum chamber through the backplane, and try to make the temperature distribution of the backplane uniform, so that the workpiece has a uniform temperature distribution in the chamber and obtain good processing quality. At the same time, the production of workpieces often involves various types of corrosion-resistant gases and liquids, and corrosion-resistant backplanes will have a longer service life.

[0003] However, the existing backplane structure is not reasonable enough, resulting in uneven temperature distribution; the manufacturing method is not very reasonable, resulting in low backplane manufacturing efficiency, large internal stress, easy deformation during use, and low yield rate; when using the same material, it is impossible to take into account both thermal conductivity and corrosion resistance. Summary of the invention

[0004] The object of the present invention is to provide a corrosion-resistant and highly thermally conductive dissimilar metal solid phase formed backplane and a manufacturing method thereof, so as to solve the above-mentioned deficiencies in the prior art.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a corrosion-resistant and highly thermally conductive dissimilar metal solid phase formed back plate, comprising: a substrate, a finishing groove is opened in the substrate, the inner wall of the finishing groove is processed into a uniform temperature layer, the outer surface of the substrate is processed into a corrosion-resistant layer, two symmetrically arranged cover plates are embedded in the finishing groove by solid phase stir friction welding, the outer surface of the cover plate is processed into a uniform temperature layer, and a cooling liquid cavity is formed between the cover plate and the finishing groove.

[0006] Furthermore, the depth of the cooling liquid cavity is 5 to 8 mm.

[0007] Furthermore, the thickness of the substrate is 16-20 mm, and the thickness of the cover plate is 4.5-5.5 mm.

[0008] Furthermore, the cover plate is disc-shaped and is made of a material with high thermal conductivity.

[0009] Furthermore, the substrate is made of corrosion-resistant material.

[0010] Furthermore, a method for manufacturing a corrosion-resistant and highly thermally conductive dissimilar metal solid phase forming backplane comprises the following steps:

[0011] Step 1: After the surface of the substrate is processed into a corrosion-resistant layer, a finishing groove is opened on the substrate, and the inner wall of the finishing groove is processed into a uniform temperature layer;

[0012] Step 2: Processing the cover plate into the shape of a finishing groove and processing the surface of the cover plate into a uniform temperature layer;

[0013] Step 3: Fix the substrate and inject coolant into the finishing groove, then overlap the substrate and the cover plate, and embed the cover plate into the finishing groove by solid phase friction stir welding;

[0014] Step 4: Re-finish the corrosion-resistant layer and the temperature-averaging layer on the side where the base plate and the cover plate are welded.

[0015] In the above technical solution, the corrosion-resistant and highly thermally conductive dissimilar metal solid phase formed backplane and its manufacturing method provided by the present invention have the following beneficial effects:

[0016] The heterogeneous material solid phase formed back plate provided by the present invention has uniform temperature distribution, excellent corrosion resistance and long service life, and the solid phase manufacturing method has high efficiency, low internal stress and is not easy to deform.

[0017] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

[0018] This application document provides an overview of various implementations or examples of the technology described in the present disclosure, and is not a comprehensive disclosure of the entire scope or all features of the disclosed technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0020] Figure 1 A schematic diagram of the structure provided by an embodiment of the present invention;

[0021] Figure 2 A schematic diagram of a substrate structure provided by an embodiment of the present invention;

[0022] Figure 3 A schematic diagram of a cover plate structure provided by an embodiment of the present invention;

[0023] Figure 4 The embodiment of the present invention provides Figure 2 A magnified image;

[0024] Figure 5 A flow chart of a backplane manufacturing method provided in an embodiment of the present invention.

[0025] Description of reference numerals:

[0026] 1. Base plate; 11. Finishing groove; 2. Cover plate. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0028] Embodiment 1:

[0029] See also Figures 1 to 4 A corrosion-resistant and highly thermally conductive dissimilar metal solid phase forming backplane comprises: a substrate 1, a finishing groove 11 is provided in the substrate 1, the inner wall of the finishing groove 11 is processed into a uniform temperature layer, the outer surface of the substrate 1 is processed into a corrosion-resistant layer, two symmetrically arranged cover plates 2 are embedded in the finishing groove 11 by solid phase friction stir welding, the outer surface of the cover plate 2 is processed into a uniform temperature layer, a cooling liquid cavity is formed between the cover plate 2 and the finishing groove 11, the depth of the cooling liquid cavity is 5 to 8 mm, the thickness of the substrate 1 is 16 to 20 mm, the thickness of the cover plate 2 is 4.5 to 5.5 mm, the cover plate 2 is disc-shaped and is made of a high thermal conductivity material, and the substrate 1 is a corrosion-resistant material.

[0030] Specifically, the substrate 1 is corrosion-resistant stainless steel, the cover plate 2 is oxygen-free copper with high thermal conductivity, the thickness of the substrate 1 is 18 mm, the thickness of the cover plate 2 is 5 mm, the groove width L of the finishing groove 11 is 40 mm, and the cooling liquid cavity is a cavity formed by the inner side surface of the finishing groove 11 in which the cover plate 2 is embedded and the groove wall of the finishing groove 11. The cooling liquid cavity is 7 mm deep and 16 mm wide.

[0031] By injecting coolant into the coolant cavity formed by embedding the cover plate 2 in the finishing groove 11, the temperature in the substrate is evenly distributed to avoid local heating. Through anti-corrosion treatment and temperature equalization treatment, the temperature distribution of the solid phase molded backplane of heterogeneous materials is evenly distributed to extend the service life.

[0032] The heterogeneous material solid phase formed back plate provided by the present invention has uniform temperature distribution, excellent corrosion resistance and long service life, and the solid phase manufacturing method has high efficiency, low internal stress and is not easy to deform.

[0033] Furthermore, a method for manufacturing a corrosion-resistant and highly thermally conductive dissimilar metal solid phase forming backplane comprises the following steps:

[0034] Step 1: After the surface of the substrate 1 is processed into a corrosion-resistant layer, a finishing groove 11 is opened on the substrate 1, and the inner wall of the finishing groove 11 is processed into a uniform temperature layer;

[0035] Step 2: Processing the cover plate 2 into the shape of the finishing groove 11, and processing the surface of the cover plate 2 into a uniform temperature layer;

[0036] Step 3: fix the substrate 1 and inject coolant into the finishing groove 11, then overlap the substrate 1 and the cover plate 2, and embed the cover plate 2 into the finishing groove 11 by solid phase friction stir welding;

[0037] Step 4: Re-finish the corrosion-resistant layer and the temperature-averaging layer on the welding side of the substrate 1 and the cover plate 2.

[0038] In the present invention, solid phase manufacturing means that the material remains in a solid state throughout the manufacturing process; Figure 5 First, the substrate 1 and the cover plate 2 are completed separately. The processing of the substrate 1 includes the following steps:

[0039] The first step is to determine the initial shape of the substrate 1;

[0040] The second step is to perform corrosion resistance treatment on the surface of the substrate 1, such as spraying corrosion-resistant and high-temperature-resistant coatings;

[0041] The third step is to open a finishing groove 11 on the base plate 1 for embedding the cover plate 2 to form a cooling liquid cavity;

[0042] In the fourth step, the interior of the finishing groove 11 is subjected to a uniform temperature treatment, such as coating treatment or heat diffusion treatment on the inner wall of the finishing groove 11 .

[0043] Next, the cover plate 2 is processed, and the steps are as follows:

[0044] The first step is to determine the reference surface and process the cover plate 2 into the same shape as the cross section of the finishing groove 11;

[0045] In the second step, the surface of the cover plate 2 is subjected to a uniform temperature treatment, such as coating treatment, heat diffusion treatment, etc. on the outer surface of the cover plate 2.

[0046] Finally, the substrate 1 is fixed, and coolant is injected into the finishing groove 11. After the two cover plates 2 are embedded in the substrate 1 by solid-phase friction stir welding, the welded sides of the substrate 1 and the cover plate 2 are further processed for corrosion resistance and temperature equalization. Specifically, (1) the surface is subjected to corrosion resistance treatment, and (2) the side exposed outside (1) is subjected to temperature equalization treatment, so as to achieve uniform temperature distribution of the solid-phase formed back plate of heterogeneous materials, excellent corrosion resistance and long service life. When welding, welding is performed along the outer shape of the cover plate 2, and appropriate welding parameters should be selected so that the two materials are always in a solid phase state, fully integrated with each other, and the internal stress after welding is minimized. The rotation speed of the friction stir welding stirring head is 500 rpm.

[0047] Embodiment 2:

[0048] See also Figures 1 to 4 A corrosion-resistant and highly thermally conductive dissimilar metal solid phase forming backplane comprises: a substrate 1, a finishing groove 11 is provided in the substrate 1, the inner wall of the finishing groove 11 is processed into a uniform temperature layer, the outer surface of the substrate 1 is processed into a corrosion-resistant layer, two symmetrically arranged cover plates 2 are embedded in the finishing groove 11 by solid phase friction stir welding, the outer surface of the cover plate 2 is processed into a uniform temperature layer, a cooling liquid cavity is formed between the cover plate 2 and the finishing groove 11, the depth of the cooling liquid cavity is 5 to 8 mm, the thickness of the substrate 1 is 16 to 20 mm, the thickness of the cover plate 2 is 4.5 to 5.5 mm, the cover plate 2 is disc-shaped and is made of a high thermal conductivity material, and the substrate 1 is a corrosion-resistant material.

[0049] Specifically, the substrate 1 is corrosion-resistant stainless steel, the cover plate 2 is oxygen-free copper with high thermal conductivity, the thickness of the substrate 1 is 18 mm, the thickness of the cover plate 2 is 5 mm, the groove width L of the finishing groove 11 is 40 mm, and the cooling liquid cavity is a cavity formed by the inner side surface of the finishing groove 11 in which the cover plate 2 is embedded and the groove wall of the finishing groove 11. The cooling liquid cavity is 7 mm deep and 16 mm wide.

[0050] By injecting coolant into the coolant cavity formed by embedding the cover plate 2 in the finishing groove 11, the temperature in the substrate is evenly distributed to avoid local heating. Through anti-corrosion treatment and temperature equalization treatment, the temperature distribution of the solid phase molded backplane of heterogeneous materials is evenly distributed to extend the service life.

[0051] The heterogeneous material solid phase formed back plate provided by the present invention has uniform temperature distribution, excellent corrosion resistance and long service life, and the solid phase manufacturing method has high efficiency, low internal stress and is not easy to deform.

[0052] Furthermore, a method for manufacturing a corrosion-resistant and highly thermally conductive dissimilar metal solid phase forming backplane comprises the following steps:

[0053] Step 1: After the surface of the substrate 1 is processed into a corrosion-resistant layer, a finishing groove 11 is opened on the substrate 1, and the inner wall of the finishing groove 11 is processed into a uniform temperature layer;

[0054] Step 2: Processing the cover plate 2 into the shape of the finishing groove 11, and processing the surface of the cover plate 2 into a uniform temperature layer;

[0055] Step 3: fix the substrate 1 and inject coolant into the finishing groove 11, then overlap the substrate 1 and the cover plate 2, and embed the cover plate 2 into the finishing groove 11 by solid phase friction stir welding;

[0056] Step 4: Re-finish the corrosion-resistant layer and the temperature-averaging layer on the welding side of the substrate 1 and the cover plate 2.

[0057] In the present invention, solid phase manufacturing means that the material remains in a solid state throughout the manufacturing process; Figure 5First, the substrate 1 and the cover plate 2 are completed separately. The processing of the substrate 1 includes the following steps:

[0058] The first step is to determine the initial shape of the substrate 1;

[0059] The second step is to perform corrosion resistance treatment on the surface of the substrate 1, such as spraying corrosion-resistant and high-temperature-resistant coatings;

[0060] The third step is to open a finishing groove 11 on the base plate 1 for embedding the cover plate 2 to form a cooling liquid cavity;

[0061] In the fourth step, the interior of the finishing groove 11 is subjected to a uniform temperature treatment, such as coating treatment or heat diffusion treatment on the inner wall of the finishing groove 11 .

[0062] Next, the cover plate 2 is processed, and the steps are as follows:

[0063] The first step is to determine the reference surface and process the cover plate 2 into the same shape as the cross section of the finishing groove 11;

[0064] In the second step, the surface of the cover plate 2 is subjected to a uniform temperature treatment, such as coating treatment, heat diffusion treatment, etc. on the outer surface of the cover plate 2.

[0065] Finally, the substrate 1 is fixed, and coolant is injected into the finishing groove 11. After the two cover plates 2 are embedded in the substrate 1 by solid-phase friction stir welding, the welded sides of the substrate 1 and the cover plate 2 are further processed for corrosion resistance and temperature equalization. Specifically, (1) the surface is subjected to corrosion resistance treatment, and (2) the side exposed outside (1) is also subjected to corrosion resistance treatment, so as to further enhance the corrosion resistance of the solid-phase formed backplane of dissimilar materials. During welding, welding is performed along the outer shape of the cover plate 2, and appropriate welding parameters should be selected so that the two materials are always in a solid phase state, fully integrated with each other, and the internal stress after welding is minimized. The rotation speed of the friction stir welding stirring head is 500 rpm.

[0066] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0067] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and utility model concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A corrosion-resistant and highly thermally conductive dissimilar metal solid phase forming backplane, comprising: A substrate (1), characterized in that: a finishing groove (11) is provided in the substrate (1), the inner wall of the finishing groove (11) is processed into a uniform temperature layer, the outer surface of the substrate (1) is processed into a corrosion-resistant layer, two symmetrically arranged cover plates (2) are embedded in the finishing groove (11) by solid phase friction stir welding, the outer surface of the cover plate (2) is processed into a uniform temperature layer, and a cooling liquid cavity is formed between the cover plate (2) and the finishing groove (11).

2. The corrosion-resistant and highly thermally conductive dissimilar metal solid phase formed backplane according to claim 1, characterized in that: The depth of the cooling liquid cavity is 5 to 8 mm.

3. The corrosion-resistant and highly thermally conductive dissimilar metal solid phase formed backplane according to claim 1, characterized in that: The thickness of the substrate (1) is 16 to 20 mm, and the thickness of the cover plate (2) is 4.5 to 5.5 mm.

4. The corrosion-resistant and highly thermally conductive dissimilar metal solid phase formed backplane according to claim 1, characterized in that: The cover plate (2) is disc-shaped and is made of a material with high thermal conductivity.

5. The corrosion-resistant and highly thermally conductive dissimilar metal solid phase formed backplane according to claim 1, characterized in that: The substrate (1) is made of corrosion-resistant material.

6. A method for manufacturing a corrosion-resistant and highly thermally conductive dissimilar metal solid phase forming backplane, characterized in that: It is used to manufacture the corrosion-resistant, high-thermal-conductivity, temperature-averaging-performance dissimilar metal material solid-phase formed backplane as described in any one of claims 1 to 5, and the method comprises the following steps: Step 1: After processing the surface of the substrate (1) into a corrosion-resistant layer, a finishing groove (11) is opened on the substrate (1), and the inner wall of the finishing groove (11) is processed into a uniform temperature layer; Step 2: Processing the cover plate (2) into the shape of the finishing groove (11), and processing the surface of the cover plate (2) into a uniform temperature layer; Step 3: fix the substrate (1) and inject coolant into the finishing groove (11), then overlap the substrate (1) and the cover plate (2), and embed the cover plate (2) into the finishing groove (11) by solid phase friction stir welding; Step 4: Re-process the corrosion-resistant layer and the temperature-averaging layer on the side where the base plate (1) and the cover plate (2) are welded.

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