Integrated two-dimensional optical fiber collimation array assembly and processing technology thereof

Abstract

The invention discloses an integrated two-dimensional optical fiber collimation array component and a processing technology thereof, and the integrated two-dimensional optical fiber collimation array component comprises a packaging housing; the two-dimensional coupling module is arranged in the packaging shell, a microlens array is arranged on the first side of the two-dimensional coupling module, and a blind hole array is arranged on the second side of the two-dimensional coupling module; the two-dimensional array plate is borne on the second side of the packaging shell, a through hole array corresponding to the blind hole array is arranged on the two-dimensional array plate, and positioning counter bores are formed in the outer side of the through hole array; and the optical fiber ribbon comprises a ribbon body and a plurality of optical fiber heads, the optical fiber heads penetrate through the through hole array and then are embedded and fixed in the blind hole array, and the front end of the ribbon body is embedded and fixed in the positioning counter bore. The microlens array is compatibly arranged on the two-dimensional coupling module, so that the assembly has an optical fiber collimation function, the processing technology is simplified, the processing cost is reduced, and the overall sealing performance of the device is better.

Description

Technical Field

[0001] The present invention relates to the technical field of optical fiber arrays, and in particular to an integrated two-dimensional optical fiber collimation array component and a processing technology thereof. Background Art

[0002] Optical communication systems, especially those used in telecommunications and data centers (e.g., optical cross-connects, fiber space switching networks), are facing growing demand. With the increasing interconnection of computing devices based on the Internet and the increasing application of cloud storage functions, the demand for optical communication systems with low cost, fast and simple signal switching is gradually increasing.

[0003] The development of two-dimensional fiber arrays provides a feasible solution for outputting light at any point in an M×N array and inputting light at any point in an M×N array, and the cost of such components is relatively low. In this wireless routing mode, the M×N two-dimensional fiber array is collimated by an M×N lens array to form a group of M×N collimated beams on the back focal plane of space, thereby forming the function of spatial routing.

[0004] The existing two-dimensional optical fiber array is limited by the structural design. The optical fiber intervals are large, resulting in a small number of optical fibers that can be arranged in the effective area. In addition, the optical fiber holes are through holes, which need to be filled with glue for sealing. Empty glue or lack of glue is prone to occur, resulting in poor overall sealing of the device. During processing, the optical fiber end face needs to be polished, and the overall process is complicated, resulting in low device production efficiency. Summary of the invention

[0005] In order to overcome the deficiencies of the prior art, the object of the present invention is to provide an integrated two-dimensional optical fiber collimation array component and a processing technology thereof, which has the advantages of high overall sealing of the device, high precision and high production efficiency.

[0006] The purpose of the present invention is achieved by the following technical solutions: According to a first aspect of an embodiment of the present disclosure, there is provided an integrated two-dimensional optical fiber collimation array assembly, comprising: Encapsulation shell; A two-dimensional coupling module is arranged in the packaging shell, wherein a microlens array is arranged on a first side of the two-dimensional coupling module and a blind hole array is arranged on a second side; a two-dimensional array plate carried on the second side of the packaging shell, the two-dimensional array plate being provided with a through hole array corresponding to the blind hole array, and the outer side of the through hole array being provided with positioning countersunk holes; and, The optical fiber ribbon comprises a ribbon body and a plurality of optical fiber heads. The optical fiber heads are embedded and fixed in the blind hole array after passing through the through hole array, and the front end of the ribbon body is embedded and fixed in the positioning countersunk hole.

[0007] To implement the above technical solution, a microlens array is provided on the two-dimensional coupling module so that the component has a fiber collimation function. In the subsequent use process, there is no need to adjust and fix the coupling of the microlens array, which greatly facilitates the use of the two-dimensional coupling module and saves the installation time. There is no need to grind and polish the end face of the two-dimensional coupling module during processing, thereby simplifying the processing technology and reducing the processing cost. A blind hole array is provided on the two-dimensional coupling module to connect and fix the optical fiber head. Compared with the prior art in which a through hole is provided, the overall sealing is better and the weather resistance of the device is enhanced. At the same time, an optical fiber ribbon is used for fiber threading processing. In combination with a densely packed blind hole array and a through hole array, more optical fibers can be arranged in the same effective area to meet the application requirements of more channels, which is conducive to reducing processing and application costs.

[0008] In some exemplary embodiments, a first adhesive layer for adhesively bonding the optical fiber head is disposed in the blind hole array, and a second adhesive layer for adhesively bonding the front end of the belt body is disposed in the positioning counterbore.

[0009] To implement the above technical solution, the optical fiber ribbon is installed and fixed by the first adhesive layer and the second adhesive layer.

[0010] In some exemplary embodiments, the first adhesive layer and the second adhesive layer are formed by dispensing with ultraviolet curing glue, heat curing glue or mixed curing glue.

[0011] Implementing the above technical solution makes it easier to solidify the glue and fix the optical fiber ribbon.

[0012] In some exemplary embodiments, the microlens array, the blind hole array, and the through hole array are formed by semiconductor photolithography.

[0013] In some exemplary embodiments, the microlens array includes a plurality of continuous microlens modules arranged in an array, and each of the optical fiber heads corresponds to a microlens module.

[0014] The implementation of the above technical solution facilitates the realization of the optical fiber alignment function.

[0015] In some exemplary embodiments, the through hole array includes a plurality of through holes arranged in an array, and a trumpet-shaped guide opening is provided on a side of the through holes facing away from the two-dimensional coupling module.

[0016] By implementing the above technical solution, the optical fiber head can be easily guided through the through hole array and the blind hole array through the guide port.

[0017] In some exemplary embodiments, the two-dimensional coupling module and the two-dimensional array plate are fixed by bonding, gluing or snapping.

[0018] In some exemplary embodiments, the thickness of the two-dimensional coupling module is 0.5-2 mm, the thickness of the two-dimensional array plate is 1-3 mm, and the number of channels of the optical fiber ribbon is 4-16 cores.

[0019] According to a second aspect of an embodiment of the present disclosure, a process for processing the integrated two-dimensional optical fiber collimation array assembly as described in the first aspect is provided, comprising: A semiconductor photolithography process is used to form a microlens array and a blind hole array on a first substrate to obtain a two-dimensional coupling module; A through hole array corresponding to the blind hole array is formed on a second substrate by using a semiconductor photolithography process, and positioning countersunk holes are formed on the second substrate outside the through hole array to obtain a two-dimensional array plate; Forming a packaging shell of corresponding size according to process requirements; The two-dimensional coupling module and the two-dimensional array plate are relatively positioned and fixed to form a first intermediate assembly, and the first intermediate assembly is installed and fixed in the packaging shell; Take a pre-cut optical fiber ribbon and cut the outer cladding at one end of the optical fiber ribbon to a predetermined length to form an optical fiber head; Performing glue dispensing in the blind hole array to form a first adhesive layer, and applying glue dispensing on the front end of the optical fiber ribbon to form a second adhesive layer; Passing the optical fiber head through the through hole array and embedding it into the blind hole array to be bonded to the first bonding layer, embedding the front end of the optical fiber head into the positioning counterbore to be bonded to the second bonding layer to obtain a second intermediate assembly; The second intermediate assembly is subjected to a curing treatment so that the first adhesive layer and the second adhesive layer are cured to obtain a finished product.

[0020] In some exemplary embodiments, the two-dimensional coupling module is fixed to the two-dimensional array board by bonding, gluing or snapping, and the first intermediate assembly is fixed to the packaging shell by gluing or snapping.

[0021] In summary, compared with the prior art, the present invention has the following beneficial effects: The embodiment of the present invention provides an integrated two-dimensional fiber collimation array component and a processing technology thereof, wherein the integrated two-dimensional fiber collimation array component includes: a packaging shell; a two-dimensional coupling module arranged in the packaging shell, wherein the first side of the two-dimensional coupling module is provided with a microlens array and the second side is provided with a blind hole array; a two-dimensional array plate carried on the second side of the packaging shell, wherein the two-dimensional array plate is provided with a through hole array corresponding to the blind hole array, and the outer side of the through hole array is provided with a positioning countersunk hole; and an optical fiber ribbon, wherein the optical fiber ribbon includes a ribbon body and a plurality of optical fiber heads, wherein the optical fiber heads pass through the through hole array and are embedded and fixed in the blind hole array, and the front end of the ribbon body is embedded and fixed in the positioning countersunk hole. By compatibly setting a microlens array on the two-dimensional coupling module, the component has a fiber collimation function. In the subsequent use process, there is no need to adjust and fix the coupling of the microlens array, which greatly facilitates the use of the two-dimensional coupling module and saves the installation time. There is no need to grind and polish the end face of the two-dimensional coupling module during processing, thereby simplifying the processing technology and reducing the processing cost. Compared with the prior art in which a through hole is set, a blind hole array is set on the two-dimensional coupling module to connect and fix the optical fiber head. The overall sealing is better and the weather resistance of the device is enhanced. At the same time, the optical fiber ribbon is used for fiber threading processing. In combination with the densely packed blind hole array and through hole array, more optical fibers can be arranged in the same effective area to meet the application requirements of more channels, which is conducive to reducing processing and application costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the structure of a typical optical communication switching system used in the present invention.

[0023] Figure 2 Schematic diagram of the structure of an integrated two-dimensional optical fiber collimation array component in an embodiment of the present invention.

[0024] Figure 3 It is a partially enlarged view of the integrated two-dimensional fiber collimation array component in an embodiment of the present invention.

[0025] Figure 4 Schematic diagram of the structure of a two-dimensional coupling module in an embodiment of the present invention.

[0026] Figure 5 Schematic diagram of the structure of a two-dimensional array board in an embodiment of the present invention.

[0027] Figure 6 Schematic diagram of the process flow of the integrated two-dimensional optical fiber collimation array component manufacturing process in an embodiment of the present invention.

[0028] The numbers and letters in the figure represent the corresponding component names: 110. Two-dimensional coupling module; 111. Microlens array; 112. Blind hole array; 113. First adhesive layer; 120. Two-dimensional array plate; 121. Through hole array; 122. Guide port; 123. Positioning countersunk hole; 124. Second adhesive layer; 130. Optical fiber ribbon; 131. Ribbon body; 132. Optical fiber head; 140. Packaging shell. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] As mentioned above, Figure 1 A typical optical communication switching system that can be applied using the integrated two-dimensional fiber collimation array assembly of the present invention is shown. Figure 1 As shown, the optical communication switching system realizes "fiber-free space" conversion between the two-dimensional fiber collimation array assembly 100 and the two-dimensional fiber collimation array assembly 400 by combining the two-dimensional fiber collimation array assembly 100, 400 and the MEMS array 200, 300. Each two-dimensional fiber collimation array assembly includes a plurality of optical fibers, and adjacent optical fibers are spaced a certain distance apart, and each optical fiber extends out of the two-dimensional fiber collimation array assembly and outputs a light beam in a direction perpendicular to the surface of the two-dimensional fiber collimation array assembly.

[0031] like Figure 1 As shown, the light beam array output from the optical fiber of the one-dimensional optical fiber collimation array assembly 100 is collimated and then emitted to the MEMS array 200, and then continuously reflected by the MEMS arrays 200 and 300, and finally received by another two-dimensional optical fiber collimation array assembly 400. The process of this optical signal passing back and forth in the switching system is common knowledge in the art and is not the innovation to be elaborated in the present invention. As described above, what the present invention is intended to protect is an improved structure and processing technology of an integrated two-dimensional optical fiber collimation array assembly, which can improve the overall sealing of the device on the basis of achieving light beam collimation, and has high processing accuracy and high production efficiency.

[0032] like Figures 2 to 5As shown, the first aspect of the present invention provides an integrated two-dimensional fiber collimation array assembly, comprising: a packaging shell 140; a two-dimensional coupling module 110 arranged in the packaging shell 140, the first side of the two-dimensional coupling module 110 is provided with a microlens array 111, and the second side is provided with a blind hole array 112; a two-dimensional array plate 120 carried on the second side of the packaging shell 140, the two-dimensional array plate 120 is provided with a through hole array 121 corresponding to the blind hole array 112, and the outer side of the through hole array 121 is provided with a positioning countersunk hole 123; and an optical fiber ribbon 130.

[0033] Specifically, the packaging shell 140 is usually a metal shell, for example, made of aluminum alloy, stainless steel and other materials, the two-dimensional coupling module 110 can be made of silicon, silicon dioxide and other materials, the two-dimensional array plate 120 can be made of silicon dioxide or other materials with a thermal expansion coefficient close to that of the two-dimensional coupling module 110, wherein the thickness of the two-dimensional coupling module 110 is 0.5-2mm, and the thickness of the two-dimensional array plate 120 is 1-3mm. The specific size can be selected according to actual application requirements. The microlens array 111, the blind hole array 112 and the through hole array 121 are processed and formed by semiconductor photolithography technology.

[0034] The two-dimensional coupling module 110 and the two-dimensional array plate 120 are fixed by bonding, gluing or snapping. Preferably, the two-dimensional coupling module 110 and the two-dimensional array plate 120 are fixed by gluing, and after the two-dimensional coupling module 110 and the two-dimensional array plate 120 are fixed, they can also be fixed in the packaging shell 140 by gluing or snapping.

[0035] The optical fiber ribbon 130 includes a ribbon body 131 and a plurality of optical fiber heads 132. The optical fiber heads 132 pass through the through hole array 121 and are embedded and fixed in the blind hole array 112. The front end of the ribbon body 131 is embedded and fixed in the positioning countersunk hole 123. The number of channels of the optical fiber ribbon 130 is 4-16 cores, that is, one optical fiber ribbon 130 has 4-16 optical fiber heads 132. The diameter of the cladding of the optical fiber ribbon 130 can be 80-160μm, and the pigtail of the optical fiber ribbon 130 can be a bare fiber or a jump fiber form.

[0036] A first adhesive layer 113 for adhering the optical fiber head 132 is provided in the blind hole array 112, and a second adhesive layer 124 for adhering the front end of the tape body 131 is provided in the positioning countersunk hole 123. The optical fiber ribbon 130 is installed and fixed by the first adhesive layer 113 and the second adhesive layer 124. The first adhesive layer 113 and the second adhesive layer 124 are formed by dispensing ultraviolet curing glue, heat curing glue or mixed curing glue to facilitate curing of the glue to fix the optical fiber ribbon 130. For example, if the first adhesive layer 113 and the second adhesive layer 124 are formed by ultraviolet curing glue, they can be cured by irradiation with ultraviolet light. If the first adhesive layer 113 and the second adhesive layer 124 are formed by heat curing glue, they can be cured by heating the device to a suitable temperature.

[0037] Furthermore, the microlens array 111 includes a plurality of continuous microlens modules arranged in an array, and each optical fiber head 132 corresponds to a microlens module, respectively, so as to realize the optical fiber alignment function; and the through hole array 121 includes a plurality of through holes arranged in an array, and the through holes are located on the side away from the two-dimensional coupling module 110 and are provided with a trumpet-shaped guide opening 122, and the guide opening 122 is used to facilitate guiding the optical fiber head 132 to pass through the through hole array 121 and the blind hole array 112.

[0038] By compatibly setting the microlens array 111 on the two-dimensional coupling module 110, the component has the function of optical fiber alignment. In the subsequent use process, there is no need to adjust and fix the coupling of the microlens array 111, which greatly facilitates the use of the two-dimensional coupling module 110 and saves the installation time. In addition, there is no need to grind and polish the end face of the two-dimensional coupling module 110 during processing, thereby simplifying the processing technology and reducing the processing cost. The blind hole array 112 is set on the two-dimensional coupling module 110 to connect and fix the optical fiber head 132. Compared with the prior art in which a through hole is set, the overall sealing is better and the weather resistance of the device is enhanced. At the same time, the optical fiber ribbon 130 is used for fiber threading processing. In combination with the densely packed blind hole array 112 and the through hole array 121, more optical fibers can be arranged in the same effective area to meet the application requirements of more channels, which is conducive to reducing processing and application costs.

[0039] like Figure 6 As shown, the second aspect of the present invention provides a process for processing an integrated two-dimensional optical fiber collimation array component as in the first aspect, comprising: S100 , forming a microlens array 111 and a blind hole array 112 on a first substrate by using a semiconductor photolithography process to obtain a two-dimensional coupling module 110 .

[0040] The first substrate is made of pre-cut silicon or silicon dioxide sheets, the microlens array 111 is arranged on the first side of the first substrate, including a plurality of microlens modules arranged in a continuous array, and the blind hole array 112 is arranged on the second side opposite to the first side, and its depth can be set according to processing requirements.

[0041] S200, using semiconductor photolithography to form a through hole array 121 corresponding to the blind hole array 112 on a second substrate, and forming positioning countersunk holes 123 on the outside of the through hole array 121 on the second substrate to obtain a two-dimensional array plate 120.

[0042] Among them, the second substrate is a sheet pre-cut from silicon dioxide or other materials with a thermal expansion coefficient close to that of the two-dimensional coupling module 110, and is usually provided with a trumpet-shaped guide port 122 on the side away from the two-dimensional coupling module 110. The guide port 122 and the positioning countersunk hole 123 are usually formed by CNC machine tools.

[0043] S300. Form a packaging shell 140 of corresponding size according to the process requirements. The packaging shell 140 is usually also formed by a CNC machine tool. The packaging shell 140 can be made of metal materials such as aluminum alloy and stainless steel. After the two-dimensional coupling module 110, the two-dimensional array plate 120 and the packaging shell 140 are processed, they usually need to be inspected for appearance, size and performance. After passing the inspection, subsequent processing is carried out.

[0044] S400, the two-dimensional coupling module 110 and the two-dimensional array plate 120 are relatively positioned and fixed to form a first intermediate assembly, and the first intermediate assembly is installed and fixed in the packaging shell 140. The two-dimensional coupling module 110 and the two-dimensional array plate 120 are fixed by bonding, gluing or snapping. Preferably, the two-dimensional coupling module 110 and the two-dimensional array plate 120 are fixed by gluing, and the first intermediate assembly can also be fixed in the packaging shell 140 by gluing or snapping.

[0045] S500, take a pre-cut optical fiber ribbon 130 and cut the outer cladding at one end thereof to a predetermined length to form an optical fiber head 132. The cutting length of the optical fiber ribbon 130 needs to match the size of the blind hole array 112 and the through hole array 121, and the width of the optical fiber ribbon 130 is adapted to the depth of the countersunk hole.

[0046] S600, glue is applied in the blind hole array 112 to form a first adhesive layer 113, and glue is applied at the front end of the optical fiber ribbon 130 to form a second adhesive layer 124. Specifically, the first adhesive layer 113 and the second adhesive layer 124 are formed by glue application with UV curing glue, heat curing glue or mixed curing glue.

[0047] S700, pass the optical fiber head 132 through the through hole array 121 and embed it into the blind hole array 112 and adhere it to the first adhesive layer 113, embed the front end of the optical fiber head 132 into the positioning countersunk hole 123 and adhere it to the second adhesive layer 124, and obtain a second intermediate assembly. The fiber threading process can be assisted by setting specific tooling. At the same time, due to the setting of the guide port 122, the optical fiber head 132 can be more conveniently inserted into the through hole array 121 and the blind hole array 112.

[0048] S800, curing the second intermediate assembly so that the first adhesive layer 113 and the second adhesive layer 124 are cured to obtain a finished product. The curing method is determined according to the materials of the first adhesive layer 113 and the second adhesive layer 124. For example, if the first adhesive layer 113 and the second adhesive layer 124 are formed by ultraviolet curing glue, the curing treatment can be carried out by irradiating with ultraviolet light. If the first adhesive layer 113 and the second adhesive layer 124 are formed by thermal curing glue, the curing treatment can be carried out by heating the device to a suitable temperature.

[0049] Usually, after curing is completed, the pigtail of the optical fiber ribbon 130 can be protected and other accessories can be assembled. After assembly is completed, the installed finished product is subjected to a performance test and can be used after passing the test.

[0050] By compatibly setting the microlens array 111 on the two-dimensional coupling module 110, the component has the function of optical fiber alignment. In the subsequent use process, there is no need to adjust and fix the coupling of the microlens array 111, which greatly facilitates the use of the two-dimensional coupling module 110 and saves the installation time. In addition, there is no need to grind and polish the end face of the two-dimensional coupling module 110 during processing, thereby simplifying the processing technology and reducing the processing cost. The blind hole array 112 is set on the two-dimensional coupling module 110 to connect and fix the optical fiber head 132. Compared with the prior art in which a through hole is set, the overall sealing is better and the weather resistance of the device is enhanced. At the same time, the optical fiber ribbon 130 is used for fiber threading processing. In combination with the densely packed blind hole array 112 and the through hole array 121, more optical fibers can be arranged in the same effective area to meet the application requirements of more channels, which is conducive to reducing processing and application costs.

[0051] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which are equivalent modifications and improvements made to the above embodiments based on the essential technology of the present invention, and all of them belong to the protection scope of the present invention.

Claims

1. An integrated two-dimensional optical fiber collimation array assembly, characterized in that: include: Encapsulation shell; A two-dimensional coupling module is arranged in the packaging shell, wherein a microlens array is arranged on a first side of the two-dimensional coupling module and a blind hole array is arranged on a second side; a two-dimensional array plate carried on the second side of the packaging shell, the two-dimensional array plate being provided with a through hole array corresponding to the blind hole array, and the outer side of the through hole array being provided with positioning countersunk holes; and, The optical fiber ribbon comprises a ribbon body and a plurality of optical fiber heads. The optical fiber heads are embedded and fixed in the blind hole array after passing through the through hole array, and the front end of the ribbon body is embedded and fixed in the positioning countersunk hole.

2. The integrated two-dimensional optical fiber collimation array assembly according to claim 1, characterized in that: A first adhesive layer for adhesively fixing the optical fiber head is arranged in the blind hole array, and a second adhesive layer for adhesively fixing the front end of the belt body is arranged in the positioning counterbore.

3. The integrated two-dimensional optical fiber collimation array assembly according to claim 2, characterized in that: The first adhesive layer and the second adhesive layer are formed by dispensing ultraviolet curing glue, heat curing glue or mixed curing glue.

4. The integrated two-dimensional optical fiber collimation array assembly according to claim 1, characterized in that: The microlens array, blind hole array and through hole array are processed and formed by semiconductor photolithography technology.

5. The integrated two-dimensional optical fiber collimation array assembly according to claim 1, characterized in that: The microlens array includes a plurality of continuous microlens modules arranged in an array, and each of the optical fiber heads corresponds to a microlens module.

6. The integrated two-dimensional optical fiber collimation array assembly according to claim 1, characterized in that: The through hole array comprises a plurality of through holes arranged in an array, and a trumpet-shaped guide opening is provided on a side of the through holes away from the two-dimensional coupling module.

7. The integrated two-dimensional optical fiber collimation array assembly according to claim 1, characterized in that: The two-dimensional coupling module is fixed to the two-dimensional array plate by bonding, gluing or clamping.

8. The integrated two-dimensional optical fiber collimation array assembly according to claim 1, characterized in that: The thickness of the two-dimensional coupling module is 0.5-2 mm, the thickness of the two-dimensional array plate is 1-3 mm, and the number of channels of the optical fiber ribbon is 4-16 cores.

9. A process for manufacturing an integrated two-dimensional optical fiber collimation array assembly as claimed in any one of claims 1 to 8, characterized in that: include: A semiconductor photolithography process is used to form a microlens array and a blind hole array on a first substrate to obtain a two-dimensional coupling module; A through hole array corresponding to the blind hole array is formed on a second substrate by using a semiconductor photolithography process, and positioning countersunk holes are formed on the second substrate outside the through hole array to obtain a two-dimensional array plate; Forming a packaging shell of corresponding size according to process requirements; The two-dimensional coupling module and the two-dimensional array plate are relatively positioned and fixed to form a first intermediate assembly, and the first intermediate assembly is installed and fixed in the packaging shell; Take a pre-cut optical fiber ribbon and cut the outer cladding at one end of the optical fiber ribbon to a predetermined length to form an optical fiber head; Performing glue dispensing in the blind hole array to form a first adhesive layer, and applying glue dispensing on the front end of the optical fiber ribbon to form a second adhesive layer; Passing the optical fiber head through the through hole array and embedding it into the blind hole array to be bonded to the first bonding layer, embedding the front end of the optical fiber head into the positioning counterbore to be bonded to the second bonding layer to obtain a second intermediate assembly; The second intermediate assembly is subjected to a curing treatment so that the first adhesive layer and the second adhesive layer are cured to obtain a finished product.

10. The processing technology according to claim 9, characterized in that: The two-dimensional coupling module is fixed to the two-dimensional array board by bonding, gluing or snapping, and the first intermediate assembly is fixed to the packaging shell by gluing or snapping.

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