Cavity gas environment control device and wafer cleaning equipment

Abstract

The invention discloses a cavity gas environment control device and wafer cleaning equipment, and relates to the field of semiconductor equipment. The cavity gas environment control device comprises a cavity, a fan filtering unit and an exhaust unit, the fan filtering unit and the exhaust unit are arranged on the cavity, and the cavity gas environment control device further comprises an air inlet plate which is arranged at an air inlet of the fan filtering unit and seals the air inlet. The air inlet plate is provided with at least one pipeline air inlet and at least one air inlet; the pipeline system comprises an air inlet pipeline, and the air inlet pipeline is connected to the pipeline air inlet; the air inlet adjusting device is arranged at the air inlet and can open or close the air inlet. The gas environment such as the humidity and the oxygen content of the cavity can be flexibly controlled through the pipeline system and the gas inlet adjusting device, the gas environment of the cavity is controllable, then the parameter requirements of related cleaning processes can be met, and the cleaning quality is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a cavity gas environment control device and wafer cleaning equipment. Background Art

[0002] Wafer cleaning equipment is one of the most important equipment in the semiconductor production process. Its main function is to wash the wafer and remove surface contaminants to improve the quality of semiconductor manufacturing. However, existing wafer cleaning equipment has some problems in regulating the gas environment inside the chamber.

[0003] In the prior art, the gas environment of the chamber of the wafer cleaning equipment is controlled by using a fan filter unit to suck in air. With the introduction of air and the action of the chemical liquid in the chamber, the oxygen content and humidity inside the chamber will increase. At present, the gas environment of the chamber is not easy to adjust. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the defect that the gas environment of the chamber is not easy to adjust in the prior art, and to provide a chamber gas environment control device and a wafer cleaning device.

[0005] The present invention solves the above technical problems through the following technical solutions:

[0006] A cavity gas environment control device comprises a cavity and a fan filter unit and an exhaust unit arranged on the cavity, and the cavity gas environment control device further comprises:

[0007] An air intake plate, the air intake plate is arranged at the air inlet of the fan filter unit and closes the air inlet, the air intake plate is provided with at least one pipeline air inlet and at least one air inlet;

[0008] A pipeline system, the pipeline system comprising an air intake pipeline, the air intake pipeline being connected to the pipeline air inlet;

[0009] An air intake regulating device is arranged at the air intake port and can open or close the air intake port.

[0010] Preferably, the air intake regulating device includes a plurality of fan blades, a plurality of rotating shafts and a driving mechanism, each fan blade being arranged at the air inlet via a rotating shaft, and the driving mechanism being connected to the plurality of rotating shafts for driving the plurality of rotating shafts to rotate, thereby driving the plurality of fan blades to rotate to open or close the air inlet.

[0011] In this solution, the air intake regulating device adopts the cooperation of the fan blades and the driving mechanism. The size of the air inlet can be adjusted by rotating the rotating shaft, thereby realizing the regulation of the air intake flow rate. The air intake regulating device is driven by the driving mechanism, with high control accuracy and no human intervention. It can effectively reduce the operational errors caused by human errors and has stronger stability.

[0012] Preferably, the driving mechanism includes a driving unit, a plurality of connecting rods and two driving rods arranged at intervals, at least one end of each rotating shaft is connected to the middle position of each connecting rod, and the two ends of each connecting rod are respectively rotatably connected to the two driving rods, and the driving unit is connected to any one of the driving rods to drive the driving rod to move along the extension direction of the driving rod.

[0013] In this solution, the driving unit drives the driving rod to move, and the driving rod can be connected to multiple connecting rods, which can simultaneously drive the multiple connecting rods to rotate, thereby driving the rotating shaft to rotate. There is no need to set up a driving unit for each rotating shaft. Only one driving unit is needed to drive multiple rotating shafts to rotate, thereby reducing processing costs.

[0014] Preferably, the air intake regulating device comprises two driving mechanisms, which are arranged at both ends of the plurality of rotating shafts.

[0015] In this solution, both ends of the rotating shaft can be subjected to force at the same time, the force is more balanced, and the operation is more stable.

[0016] Preferably, the fan baffle blade comprises a frame and a buffer portion, the buffer portion wraps the frame, and adjacent fan baffle blades and the fan baffle blade and the air intake plate are interference fit.

[0017] In this solution, the interference fit can improve the sealing of the fan shield blade to the air inlet. When the fan shield blade closes the air inlet, the sealing effect is better. In addition, by providing a buffer portion on the outside of the frame, rigid contact between adjacent fan shield blades and between the fan shield blade and the air intake plate can be avoided, thereby improving the service life of the fan shield blade.

[0018] Preferably, the air intake regulating device includes a wind shield and a driving mechanism, the output end of the driving mechanism is connected to the wind shield, the end face size of the wind shield close to the air inlet is greater than or equal to the size of the air inlet, and the driving mechanism is used to drive the wind shield to approach or move away from the air inlet.

[0019] In this solution, the driving mechanism adjusts the amount of air intake by adjusting the distance between the wind shield and the air inlet, and the air intake amount is more controllable.

[0020] Preferably, the size of the end surface of the wind shield plate close to the air inlet is larger than the size of the air inlet, and the end surface is provided with a sealing gasket.

[0021] In this solution, when the wind shield closes the air inlet, the use of a sealing gasket can prevent external air from entering the cavity, and the sealing performance is further improved.

[0022] Preferably, the pipeline system further comprises a pressure regulating valve and a manual valve, and the pressure regulating valve and the manual valve are respectively arranged on the air intake pipeline.

[0023] Preferably, the pipeline system further comprises a mass flow controller and / or a pneumatic valve, and the mass flow controller and / or the pneumatic valve are arranged on the air intake pipeline.

[0024] In this solution, the pipeline system is more controllable and can accurately adjust the flow and pressure parameters of the intake air.

[0025] A wafer cleaning device comprises the chamber gas environment control device as described above.

[0026] In this solution, the gas environment of the chamber in the wafer cleaning equipment is easy to adjust and has a high degree of controllability. Different gas environments can be set according to the requirements of different processes, which is beneficial to improving the cleaning quality.

[0027] The positive and progressive effect of the present invention is that: in the present invention, by setting an air intake plate at the air inlet of the fan filter unit, and by the synergistic effect of the fan filter unit and the exhaust unit, the entry and discharge of gas can be controlled, and thus the gas environment of the cavity can be controlled. Here, the entry of gas is controlled by a pipeline system and an air intake regulating device. At least one pipeline air inlet and at least one air air inlet are provided on the air intake plate. The air intake pipeline is connected to the pipeline air inlet. Different gases can be introduced into the cavity as needed through the pipeline system, and the air inlet can be conveniently opened or closed through the air intake regulating device. Therefore, the gas environment of the cavity, such as humidity and oxygen content, can be flexibly controlled through the pipeline system and the air intake regulating device, so that the gas environment of the cavity is controllable, and thus the parameter requirements of the relevant cleaning process can be met, and the quality of cleaning can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic structural diagram of a chamber gas environment control device according to Embodiment 1 of the present invention;

[0029] Figure 2 This is a schematic structural diagram of the air intake plate and the air intake regulating device in the first state according to Embodiment 1 of the present invention;

[0030] Figure 3It is a schematic diagram of the second state structure of the air intake plate and the air intake regulating device of Example 1 of the present invention;

[0031] Figure 4 for Figure 3 A schematic diagram of the cross-sectional structure at 1-1;

[0032] Figure 5 for Figure 4 An enlarged schematic diagram of a portion of the structure at the cross section;

[0033] Figure 6 This is a schematic diagram of the structure of the air intake plate and the pipeline system of Example 1 of the present invention;

[0034] Figure 7 This is a schematic diagram of the structure of the air intake plate and the air intake regulating device of Example 2 of the present invention. DETAILED DESCRIPTION

[0035] The present invention is further described below by means of specific examples, but the present invention is not limited to the scope of the examples.

[0036] As one of the core components of wafer cleaning equipment, the chamber plays an important role in the wafer cleaning process, and the wafer cleaning process is usually carried out in the chamber. The existing wafer cleaning process has low requirements for the gas environment in the chamber. It only needs to inhale the air outside the chamber through the fan filter unit (FFU) set at the top of the chamber, and then send the filtered clean air into the chamber, and exhaust it through the exhaust unit connected to the chamber to meet the requirements. Therefore, the gas environment in the existing chamber cannot be adjusted.

[0037] Researchers have found that the quality of wafer cleaning can be improved under certain specific gas environments. In order to easily adjust the gas environment in the chamber, an embodiment of the present invention provides a chamber gas environment control device.

[0038] Example 1

[0039] like Figures 1 to 6 As shown, according to one embodiment of the present invention, the cavity gas environment control device includes a cavity 200 and a fan filter unit 100 and an exhaust unit 300 disposed on the cavity 200. The cavity gas environment control device also includes an air intake plate 500, a pipeline system 400 and an air intake adjustment device 600.

[0040] The air inlet plate 500 is disposed at the air inlet of the fan filter unit 100 and closes the air inlet. Figure 2 and Figure 3 As shown, the air intake plate 500 is provided with a pipeline air intake port 510 and a plurality of air intake ports 520. Figure 3 and Figure 6As shown, the pipeline system 400 includes an air intake pipeline 410, and the air intake pipeline 410 is connected to the pipeline air intake port 510 through a pipeline joint 420. The air intake adjustment device 600 is arranged at the air intake port 520, and can open or close the air intake port 520 by rotating.

[0041] By setting an air intake plate 500 at the air inlet of the fan filter unit 100, and by the synergistic effect of the fan filter unit 100 and the exhaust unit 300, the entry and discharge of gas can be controlled, and then the gas environment of the cavity 200 can be controlled. Here, the entry of gas is controlled by the pipeline system 400 and the air intake regulating device 600. A pipeline air inlet 510 and a plurality of air inlets 520 are arranged on the air intake plate 500, and the air intake pipeline 410 is connected to the pipeline air inlet 510. Different gases can be introduced into the cavity 200 as needed through the pipeline system 400, and the air inlet 520 can be conveniently opened or closed through the air intake regulating device 600. Therefore, the gas environment of the cavity 200, such as humidity and oxygen content, can be flexibly controlled through the pipeline system 400 and the air intake regulating device 600, so that the gas environment of the cavity 200 is controllable, and then the parameter requirements of the relevant cleaning process can be met, and the cleaning quality can be improved. For example, when the chamber 200 is working, chemical liquids are usually introduced to clean the wafers. With the introduction of chemical liquids, the humidity in the chamber 200 will be higher. In some processes, a lower humidity and an oxygen-free environment are required. At this time, the air inlet 520 can be closed, and a dry and oxygen-free inert gas, such as nitrogen, can be introduced into the chamber 200 through the pipeline system 400 to adjust the gas environment. Nitrogen enters the chamber 200 through the fan filter unit 100 and is discharged through the exhaust unit 300. High-flow nitrogen can take away the water vapor mixture originally in the chamber 200 to reduce humidity and create an oxygen-free environment to meet the needs of the cleaning process. In addition, in a cleaning process that requires oxygen, the pipeline system 400 can be closed to stop the supply of nitrogen, and the air inlet 520 can be opened through the air intake regulating device 600 to achieve the supply of oxygen.

[0042] like Figure 2 As shown, the air inlet plate 500 in the embodiment of the present invention is provided with only one pipeline air inlet 510. In other embodiments, more pipeline air inlets 510 can be flexibly provided as required to facilitate the simultaneous introduction of different gases.

[0043] like Figure 2 As shown, the air intake plate 500 in the embodiment of the present invention is provided with four air intake ports 520. In other embodiments, the number of the air intake ports 520 may also be set to one or other numbers to meet different usage requirements.

[0044] like Figure 2 and Figure 3 As shown, the air intake regulating device 600 includes a plurality of fan blades 610, a plurality of rotating shafts 620 and a driving mechanism. The fan blades 610 are arranged at the air inlet 520 through the rotating shaft 620. The driving mechanism is connected to the rotating shaft 620, and is used to drive the rotating shaft 620 to rotate, thereby driving the plurality of fan blades 610 to rotate to open or close the air inlet 520. The air intake regulating device 600 uses the fan blades 610 and the driving mechanism to cooperate, and the size of the air inlet 520 can be adjusted by rotating the rotating shaft 620, thereby realizing the regulation of the air intake flow rate. The air intake regulating device 600 is driven by the driving mechanism, with high control accuracy, without manual intervention, and can effectively reduce the problem of operational errors caused by human errors, and has stronger stability.

[0045] The driving mechanism includes a first cylinder 650, a plurality of connecting rods 630 and a driving rod 640. A connecting rod 630 is respectively arranged at both ends of each rotating shaft 620, and the rotating shaft 620 is connected to the middle position of the connecting rod 630. Two driving rods 640 are arranged at intervals at both ends of the rotating shaft 620. The two ends of the connecting rod 630 are rotatably connected to the driving rods 640 arranged at intervals, and a first cylinder 650 is respectively arranged at both ends of the rotating shaft 620. The first cylinder 650 is connected to any one of the driving rods 640 located at the same end of the rotating shaft 620, and is used to drive the driving rod 640 to move along the extension direction of the driving rod 640.

[0046] The end of the first cylinder 650 is fixed by a fixing device (not shown in the figure), and the first cylinder 650 can perform telescopic movement along a straight line, thereby driving the driving rod 640 to move. The driving rod 640 can be connected to multiple connecting rods 630, and can drive multiple connecting rods 630 to rotate at the same time, thereby driving the rotating shaft 620 to rotate. There is no need to set a driving unit for each rotating shaft 620 to drive, and the first cylinder 650 can drive multiple rotating shafts 620 to rotate, thereby reducing the processing cost. A connecting rod 630 is respectively set at both ends of the rotating shaft 620, and the two ends of the rotating shaft 620 can be subjected to force at the same time, the force is more balanced, and the operation is more stable.

[0047] Of course, in other embodiments, the first cylinder 650 may also be replaced with other drive units with a linear drive function, such as an electric push rod.

[0048] In addition, in other embodiments, for cost and space considerations, the driving mechanism may be provided only at one end of the rotating shaft 620. That is, the connecting rod 630, the driving rod 640 and the cylinder 650 are provided only at one end of the rotating shaft 620, and the other end of the rotating shaft 620 is rotatably connected to the air intake plate 500. Specifically, the other end of the rotating shaft 620 may be fixed to the air intake plate 500 via a bearing.

[0049] like Figure 3-Figure 5 As shown, the fan blade 610 closes the air inlet 520 by rotating. In order to improve the sealing performance, the fan blade 610 in the embodiment of the present invention includes a frame 6101 and a buffer portion 6102. The buffer portion 6102 wraps the frame 6101, and the adjacent fan blades 610 and the fan blades 610 and the air inlet plate 500 are interference fit. Specifically, the buffer portion 6102 is an elastic material, such as rubber, and the interference fit can improve the sealing performance of the fan blade 610 to the air inlet 520. When the fan blade 610 closes the air inlet 520, the sealing effect is better. By arranging the buffer portion 6102 outside the frame 6101, on the one hand, the buffer portion 6102 is elastic, and in the state of interference fit, it will deform and then squeeze each other, which can further improve the sealing performance; on the other hand, it can avoid rigid contact between adjacent fan blades 610 and the fan blade 610 and the air inlet plate 500, thereby improving the service life of the fan blade 610.

[0050] like Figure 6 As shown, the pipeline system 400 also includes a pressure regulating valve 440, a manual valve 430, a mass flow controller 460 and a pneumatic valve 450. The pressure regulating valve 440, the manual valve 430, the mass flow controller 460 and the pneumatic valve 450 are respectively arranged on the air intake pipeline 410. The pipeline system 400 has a higher controllability and can accurately adjust the flow and pressure parameters of the intake air.

[0051] Of course, in other embodiments, the pipeline system 400 may be provided with only the pressure regulating valve 440 and the manual valve 430 according to actual needs, or a mass flow controller 460 or a pneumatic valve 450 may be flexibly added thereto.

[0052] In addition, an embodiment of the present invention further provides a wafer cleaning device, including the above chamber gas environment control device. The gas environment in the chamber 200 of the wafer cleaning device is easy to adjust and has a high degree of controllability. Different gas environments can be set according to the requirements of different processes, which is conducive to improving the cleaning quality.

[0053] Example 2

[0054] The structure of this embodiment is basically the same as that of the first embodiment, except that the air intake adjustment device 600 is different. Figure 7As shown, in this embodiment, the air intake regulating device 600 includes a windshield 660 and a second cylinder 680, and the output end of the second cylinder 680 is connected to the windshield 660. The end surface size of the windshield 660 close to the air inlet 520 is larger than the size of the air inlet 520. The second cylinder 680 is used to drive the windshield 660 to approach or move away from the air inlet 520. The second cylinder 680 adjusts the size of the intake volume by adjusting the distance between the windshield 660 and the air inlet 520, and the intake volume is highly controllable.

[0055] The end surface of the wind shield 660 close to the air inlet 520 is provided with a sealing gasket 670. When the wind shield 660 closes the air inlet 520, the use of the sealing gasket 670 can prevent external air from entering the cavity 200, and the sealing performance is further improved.

[0056] In this embodiment, each windshield 660 is provided with a second cylinder 680, and each air inlet 520 can be individually adjusted. Of course, in other embodiments, each windshield 660 can also be connected through a linkage device and driven by a second cylinder 680, which is conducive to reducing costs.

[0057] In this embodiment, the second cylinder 680 drives the wind shield 660 in the vertical direction. In other embodiments, the second cylinder 680 can also drive the wind shield 660 in the horizontal direction, and the air inlet can also be adjusted.

[0058] In other embodiments, the second cylinder 680 may also be replaced with other driving mechanisms with a linear driving function, such as an electric push rod.

[0059] In other embodiments, the size of the end surface of the wind shield 660 close to the air inlet 520 may also be equal to the size of the air inlet 520 , and can also play the function of closing the air inlet 520 .

[0060] Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only for illustration and the protection scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. A cavity gas environment control device, characterized in that: The device comprises a cavity, a fan filter unit and an exhaust unit arranged on the cavity, and the cavity gas environment control device further comprises: An air intake plate, the air intake plate is arranged at the air inlet of the fan filter unit and closes the air inlet, the air intake plate is provided with at least one pipeline air inlet and at least one air inlet; A pipeline system, the pipeline system comprising an air intake pipeline, the air intake pipeline being connected to the pipeline air inlet; An air intake regulating device is arranged at the air intake port and can open or close the air intake port.

2. The chamber gas environment control device according to claim 1, characterized in that: The air intake regulating device includes a plurality of fan blades, a plurality of rotating shafts and a driving mechanism. Each fan blade is arranged at the air inlet through a rotating shaft. The driving mechanism is connected to the plurality of rotating shafts for driving the plurality of rotating shafts to rotate, thereby driving the plurality of fan blades to rotate to open or close the air inlet.

3. The chamber gas environment control device according to claim 2, characterized in that: The driving mechanism includes a driving unit, a plurality of connecting rods and two driving rods arranged at intervals. At least one end of each rotating shaft is connected to the middle position of each connecting rod. The two ends of each connecting rod are respectively rotatably connected to the two driving rods. The driving unit is connected to any one of the driving rods to drive the driving rod to move along the extension direction of the driving rod.

4. The chamber gas environment control device according to claim 2, characterized in that: The air intake regulating device comprises two driving mechanisms, which are arranged at two ends of the plurality of rotating shafts.

5. The chamber gas environment control device according to claim 2, characterized in that: The fan baffle blade comprises a frame and a buffer portion, wherein the buffer portion wraps the frame, and adjacent fan baffle blades and the fan baffle blade and the air intake plate are interference fit.

6. The chamber gas environment control device according to claim 1, characterized in that: The air intake regulating device includes a wind shield and a driving mechanism, wherein the output end of the driving mechanism is connected to the wind shield, the end face size of the wind shield close to the air inlet is greater than or equal to the size of the air inlet, and the driving mechanism is used to drive the wind shield to approach or move away from the air inlet.

7. The chamber gas environment control device according to claim 6, characterized in that: The size of the end surface of the wind shield plate close to the air inlet is larger than the size of the air inlet, and a sealing gasket is provided on the end surface.

8. The chamber gas environment control device according to any one of claims 1 to 7, characterized in that: The pipeline system also includes a pressure regulating valve and a manual valve, and the pressure regulating valve and the manual valve are respectively arranged on the air intake pipeline.

9. The chamber gas environment control device according to claim 8, characterized in that: The pipeline system further comprises a mass flow controller and / or a pneumatic valve, and the mass flow controller and / or the pneumatic valve are arranged on the air intake pipeline.

10. A wafer cleaning device, characterized in that: It comprises the cavity gas environment control device as described in any one of claims 1 to 9.

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