Wafer cleaning device and cleaning method

Abstract

The invention discloses a wafer cleaning device and method, and relates to the field of semiconductor equipment, and the wafer cleaning device comprises a first groove body which is used for accommodating a cleaning solution and a wafer; the second tank body is used for containing cleaning liquid; the spraying mechanism is used for spraying cleaning liquid to the wafer; a liquid inlet of the second circulating filtering pipeline can be communicated with the first tank body, the second tank body is arranged in the second circulating filtering pipeline, a liquid outlet of the second circulating filtering pipeline is communicated with the spraying mechanism, and the second circulating filtering pipeline can discharge cleaning liquid in the first tank body into the second tank body; and the water is conveyed to the spraying mechanism from the second tank body. The cleaning liquid in the first tank body can be discharged into the second tank body through the second circulating filtering pipeline, and the wafer is sprayed and cleaned through the second circulating filtering pipeline and the spraying mechanism, so that the cleaning effect of the wafer is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to a wafer cleaning device and a cleaning method. Background Art

[0002] In the semiconductor manufacturing process, the cleaning process is an essential step. The tank cleaning machine has the significant advantages of high output and low cleaning fluid consumption, and has become the mainstream machine for circulating wafer cleaning. A significant difference between tank cleaning and single-wafer cleaning is the repeated use of circulating liquid. In order to ensure the relative cleanliness of the liquid in the tank, it is necessary to continuously circulate and filter the liquid to discharge pollutants such as particles and metal ions generated after the process from the tank.

[0003] Most of the existing tank cleaning process cycles use an inner and outer double tank structure. When the inner tank is full, the liquid overflows to the outer tank by gravity. The cleaning liquid in the outer tank is filtered through the circulating filter pipeline and finally returns to the inner tank. This circulating filtration can remove most of the impurities such as particles. However, of the particles generated in the inner tank process, only those that reach the liquid surface can overflow into the outer tank, and most of the other particles will settle downward under the action of gravity. Therefore, as the number of wafers to be cleaned increases, there are more and more impurities in the tank, resulting in a poor cleaning effect. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the defects of the prior art tank-type cleaning device having many impurities in the tank body and poor cleaning effect, and to provide a wafer cleaning device and a cleaning method.

[0005] The present invention solves the above technical problems through the following technical solutions:

[0006] A wafer cleaning device, comprising:

[0007] A first tank body, the first tank body is used to contain a cleaning solution and a wafer;

[0008] a second tank body, the second tank body being used to contain a cleaning liquid;

[0009] A spray mechanism, the spray mechanism being used to spray a cleaning liquid onto the wafer;

[0010] A second circulation filter pipeline, the liquid inlet of the second circulation filter pipeline can be connected to the first tank body, the second tank body is arranged in the second circulation filter pipeline, the liquid outlet of the second circulation filter pipeline is connected to the spray mechanism, and the second circulation filter pipeline can discharge the cleaning liquid in the first tank body into the second tank body, and transport it from the second tank body to the spray mechanism.

[0011] Preferably, the second circulation filtering pipeline further includes an auxiliary circulation filtering pipeline, and the auxiliary circulation filtering pipeline is connected to the second tank body and is used for circulating and filtering the cleaning liquid in the second tank body.

[0012] Preferably, the second tank body includes a second inner tank and a second outer tank, the auxiliary circulation filtering pipeline connects the second inner tank and the second outer tank, and the cleaning liquid in the second inner tank overflows into the second outer tank and returns to the second inner tank through the auxiliary circulation filtering pipeline.

[0013] Preferably, the second circulation filtering pipeline outputs the cleaning liquid from the middle area or the upper area of ​​the second inner tank.

[0014] Preferably, the second tank body is further provided with a second liquid discharge pipeline and a second liquid replenishment pipeline, the second liquid discharge pipeline is communicated with the second inner tank, and the second liquid replenishment pipeline is communicated with the second outer tank.

[0015] Preferably, the second circulation filtration pipeline includes a second circulation filtration segmented pipeline located between the first tank body and the second tank body and a second circulation filtration segmented pipeline located between the second tank body and the spray mechanism, wherein at least one of the pipelines is provided with a circulation pump and a filter.

[0016] Preferably, the second circulation filtration pipeline includes a second circulation filtration segmented pipeline located between the first tank body and the second tank body, a second circulation filtration segmented pipeline located between the second tank body and the spray mechanism, and an auxiliary circulation filtration pipeline, wherein at least one of the pipelines is provided with a circulation pump and a filter.

[0017] Preferably, the second tank body is a single tank body structure, and the auxiliary circulation filtering pipeline and the second circulation filtering pipeline share the circulation pump and the filter.

[0018] Preferably, the wafer cleaning device further comprises a first circulation filtering pipeline, wherein the first circulation filtering pipeline is connected to the first tank body and is used for circulating and filtering the cleaning liquid in the first tank body.

[0019] Preferably, the first tank body includes a first inner tank and a first outer tank, the first circulating filtering pipeline connects the first inner tank and the first outer tank, and the cleaning liquid in the first inner tank overflows into the first outer tank and returns to the first inner tank through the first circulating filtering pipeline.

[0020] Preferably, a first liquid replenishment pipeline and a first liquid discharge pipeline are further provided on the first tank body, the first liquid replenishment pipeline is communicated with the first outer tank, and the first liquid discharge pipeline is communicated with the first inner tank.

[0021] Preferably, the wafer cleaning device further comprises a liquid level sensor, and the liquid level sensor is arranged in the first tank body and is used for detecting the liquid level of the cleaning liquid in the first tank body.

[0022] A wafer cleaning method, which uses the wafer cleaning device as described above, the cleaning method comprising:

[0023] Immersing and cleaning the wafer in the first tank;

[0024] Drain the cleaning liquid in the first tank;

[0025] During the process of emptying the cleaning liquid in the first tank body, at least part of the cleaning liquid in the first tank body is discharged into the second tank body through the second circulation filtration pipeline;

[0026] The wafer is spray cleaned through the second circulation filtering pipeline and the spray mechanism.

[0027] Preferably, during the immersion cleaning of the wafer, the cleaning liquid in the first tank is discharged while the cleaning liquid is replenished into the first tank to replace the cleaning liquid in the first tank.

[0028] Preferably, the method further comprises: performing self-circulating filtration on the cleaning liquid in the first tank body and / or the cleaning liquid in the second tank body.

[0029] Preferably, in the step of draining the cleaning liquid in the first tank, before the wafer is exposed to the cleaning liquid, the wafer is sprayed with water by a spray mechanism to ensure that the wafer can always remain wet.

[0030] A wafer cleaning method, which uses the wafer cleaning device as described above, the cleaning method comprising:

[0031] Immersing and cleaning the wafer in the first tank;

[0032] Drain the cleaning liquid in the first tank;

[0033] After the cleaning liquid in the first tank body is emptied, the second circulation filter pipeline between the first tank body and the second tank body is opened, and the cleaning liquid is supplied to the spray mechanism through the second circulation filter pipeline to spray clean the wafer.

[0034] Preferably, the cleaning method further comprises:

[0035] The cleaning liquid in the first tank body and / or the cleaning liquid in the second tank body is / are subjected to self-circulation filtration.

[0036] Preferably, in the step of draining the cleaning liquid in the first tank, before the wafer is exposed to the cleaning liquid, the wafer is sprayed with water by a spray mechanism to ensure that the wafer can always remain wet.

[0037] The positive and progressive effect of the present invention is that: in the present invention, by providing a second tank body and a second circulating filter pipeline, the cleaning liquid in the first tank body can be discharged into the second tank body through the second circulating filter pipeline, and the wafer is spray-cleaned through the second circulating filter pipeline and the spray mechanism. Before the cleaning liquid in the first tank body is supplied to the spray mechanism, it can be filtered again through the second circulating filter pipeline, so that the impurities remaining in the first tank body can be removed, the cleanliness can be improved, and the clean cleaning liquid filtered by the second circulating filter pipeline is sprayed on the wafer through the spray mechanism to spray-clean the wafer, thereby improving the cleaning effect of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 Schematic diagram of the structure of a wafer cleaning device according to Embodiment 1 of the present invention;

[0039] Figure 2 Schematic diagram of the structure of a wafer cleaning device according to Embodiment 2 of the present invention;

[0040] Figure 3 This is a flow chart of a wafer cleaning method according to Embodiment 3 of the present invention;

[0041] Figure 4 This is a flow chart of the wafer cleaning method according to embodiment 4 of the present invention. DETAILED DESCRIPTION

[0042] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0043] Example 1

[0044] With the continuous development of semiconductor manufacturing processes, the use of wafer cleaning equipment is becoming more and more extensive. For different applications and chemicals, such as the application of degumming process, the traditional inner and outer tank self-circulation or single tank self-circulation operation mode can no longer meet the needs. As the number of wafers to be cleaned increases, impurities such as colloids remaining in the tank cannot be discharged, which in turn affects the wafer cleaning effect.

[0045] In view of this situation, this embodiment provides a wafer cleaning device, such as Figure 1As shown, it includes a first tank body 110 and a first circulation filter pipeline 120. The first tank body 110 is used to contain cleaning liquid and wafers, and the first circulation filter pipeline 120 is connected to the first tank body 110, and is used to circulate and filter the cleaning liquid in the first tank body 110. The wafer cleaning device also includes a second tank body 210, a spray mechanism 300, and a second circulation filter pipeline 220. The second tank body 210 is used to contain cleaning liquid, and the spray mechanism 300 is used to spray the cleaning liquid onto the wafer. The liquid inlet of the second circulation filter pipeline 220 can be communicated with the first tank body 110, the second tank body 210 is arranged in the second circulation filter pipeline 220, the liquid outlet of the second circulation filter pipeline 220 is communicated with the spray mechanism 300, and the second circulation filter pipeline 220 can discharge the cleaning liquid in the first tank body 110 into the second tank body 210, and transport it from the second tank body 210 to the spray mechanism 300.

[0046] Specifically, in this embodiment, the first tank body 110 includes a first inner tank 111 and a first outer tank 112, and the first circulation filter pipeline 120 connects the first inner tank 111 and the first outer tank 112. The cleaning liquid in the first inner tank 111 overflows to the first outer tank 112 and returns to the first inner tank 111 through the first circulation filter pipeline 120. A circulation pump 410 and a filter 510 are provided on the first circulation filter pipeline 120. The liquid inlet of the first circulation filter pipeline 120 is connected to the first outer tank 112, and the liquid outlet is connected to the first inner tank 111. Of course, in other embodiments, the first tank body 110 can also be a single tank structure.

[0047] The first tank body 110 can be used to soak and dissolve impurities such as colloids on the wafer. When the impurities floating in the first inner tank 111 reach the overflow position, they will overflow to the first outer tank 112, and will be filtered through the first circulation filter pipeline 120 to remove most of the impurities such as colloids and return to the first inner tank 111. During the wafer cleaning process, the impurities in the first tank body 110 will increase. Some impurities such as residual glue that have not reached the overflow position will sink under the action of gravity and cannot be filtered. They will accumulate at the bottom of the first tank body 110, such as the bottom of the first inner tank 111, resulting in a poor soaking and cleaning effect of the first tank body 110 on the wafer. By setting the second tank body 210 and the second circulation filter pipeline 220, the cleaning liquid in the first tank body 110 can be discharged into the second tank body 210 through the second circulation filter pipeline 220, and the wafers are spray-cleaned through the second circulation filter pipeline 220 and the spray mechanism 300. The cleaning liquid in the first tank body 110 can be filtered again through the second circulation filter pipeline 220 before being supplied to the spray mechanism 300, so as to remove impurities, especially impurities deposited in the first tank body 110, and improve the cleanliness of the cleaning liquid. Then, the clean cleaning liquid filtered by the second circulation filter pipeline 220 is sprayed on the wafer through the spray mechanism 300 to spray clean the wafer, thereby improving the cleaning effect of the wafer.

[0048] In this embodiment, a circulation pump 420 and a filter 520 are provided on the second circulation filtration pipeline segment 220a between the first tank body 110 and the second tank body 210. The cleaning liquid in the first tank body 110 is filtered by the filter 520 and then discharged into the second tank body 210, so that impurities in the cleaning liquid can be removed and the spray cleaning effect of the wafer can be improved.

[0049] In addition, a circulation pump 430 and a filter 530 are also provided on the second circulation filtering segmented pipeline 220b between the second tank body 210 and the spray mechanism 300. The cleaning liquid in the second tank body 210 is filtered by the filter 530 and then reaches the spray mechanism 300 to clean the wafer, which can further improve the cleanliness of the cleaning liquid supplied to the spray mechanism 300, thereby improving the spray cleaning effect of the wafer.

[0050] In order to further improve the cleanliness of the cleaning liquid supplied to the spray mechanism 300, the second circulation filter pipeline 220 further includes an auxiliary circulation filter pipeline 230. The auxiliary circulation filter pipeline 230 is in communication with the second tank body 210 and is used for circulating and filtering the cleaning liquid in the second tank body 210. The auxiliary circulation filter pipeline 230 can further filter the impurities in the cleaning liquid in the second tank body 210, so that the cleaning liquid supplied to the spray mechanism 300 has better cleanliness. The clean cleaning liquid can better remove impurities on the surface of the wafer, thereby ensuring the cleanliness and quality of the wafer.

[0051] It should be noted that, in other embodiments, the circulation pump and the filter may be provided only on the second circulation filtration pipeline segment 220a located between the first tank body 110 and the second tank body 210; or only on the second circulation filtration segment pipeline 220b located between the second tank body 210 and the spray mechanism 300; or only on the auxiliary circulation filtration pipeline 230. In addition, the circulation pump and the filter may also be provided simultaneously on any two of the second circulation filtration segment pipelines 220a, 220b and the auxiliary circulation filtration pipeline 230, for example, the circulation pump and the filter may be provided simultaneously on the auxiliary circulation filtration pipeline 230 and the second circulation filtration segment pipeline 220a located between the first tank body 110 and the second tank body 210.

[0052] In this embodiment, the second tank body 210 includes a second inner tank 211 and a second outer tank 212, and the auxiliary circulation filter pipeline 230 connects the second inner tank 211 and the second outer tank 212. The cleaning liquid in the second inner tank 211 overflows into the second outer tank 212 and returns to the second inner tank 211 through the auxiliary circulation filter pipeline 230. The cleaning liquid in the second inner tank 211 overflows into the second outer tank 212, which can remove floating impurities in the second inner tank 211. A circulation pump 440 and a filter 540 are provided on the auxiliary circulation filter pipeline 230, and the liquid inlet of the auxiliary circulation filter pipeline 230 is connected to the second outer tank 212, and the liquid outlet is connected to the second inner tank 211. Of course, in other embodiments, the second tank body 210 can also be a single tank body structure. The second tank body 210 adopts a single tank body structure, which occupies a small space.

[0053] Furthermore, the second circulation filtering pipeline 220 outputs the cleaning liquid from the middle area or the upper area of ​​the second inner tank 211. Some impurities in the second inner tank 211 will float upward and overflow into the second outer tank 212, and some impurities will be deposited downward at the bottom of the second inner tank 211 under the action of gravity. Based on this, the cleaning liquid in the middle area or the upper area of ​​the second inner tank 211 has a higher cleanliness. Therefore, outputting the cleaning liquid from the middle area or the upper area of ​​the second inner tank 211 is conducive to further improving the cleaning effect of the wafer.

[0054] In order to prevent some impurities from being unable to be filtered in the second tank body 210, the second tank body 210 is further provided with a second drain pipe 250 and a second liquid replenishing pipe 240, the second drain pipe 250 is communicated with the second inner tank 211, and the second liquid replenishing pipe 240 is communicated with the second outer tank 212. By providing the second drain pipe 250 and the second liquid replenishing pipe 240, the cleaning liquid in the second tank body 210 can be discharged while the cleaning liquid is replenished in the second tank body 210, thereby completing the replacement of the cleaning liquid in the second tank body 210, and further improving the cleanliness of the cleaning liquid in the second tank body 210. In addition, the second liquid replenishing pipeline 240 is connected to the second outer tank 212, which can not only replenish the cleaning liquid in the second tank body 210 in real time, but also allow the fresh cleaning liquid replenished by the second liquid replenishing pipeline 240 to be buffered by the second outer tank 212 and then flow into the second inner tank 211 through the auxiliary circulation filtering pipeline 230, thereby not easily causing changes in the concentration and temperature of the cleaning liquid in the second inner tank 211. A valve 650 is provided on the second liquid discharge pipeline 250.

[0055] In order to reduce impurities in the cleaning liquid reaching the second tank body 210, the first tank body 110 is further provided with a first liquid replenishment pipeline 130 and a first liquid discharge pipeline 140, wherein the first liquid replenishment pipeline 130 is in communication with the first outer tank 112, and the first liquid discharge pipeline 140 is in communication with the first inner tank 111. When the wafer is immersed and cleaned in the first tank body 110, the first liquid discharge pipeline 140 and the first liquid replenishment pipeline 130 can be provided to discharge the cleaning liquid in the first tank body 110 while replenishing the cleaning liquid in the first tank body 110, thereby replacing the cleaning liquid in the first tank body 110 while the wafer is immersed and cleaned, thereby reducing impurities in the cleaning liquid reaching the second tank body 210. In addition, the first liquid replenishment pipeline 130 is connected to the first outer tank 112, which can not only replenish the cleaning fluid in the first tank body 110 in real time, but also allow the fresh cleaning fluid replenished by the first liquid replenishment pipeline 130 to be buffered by the first outer tank 112, and then flow into the first inner tank 111 through the first circulation filtration pipeline 120, thereby not easily causing changes in the concentration and temperature of the cleaning fluid in the first inner tank 111.

[0056] The first liquid discharge pipeline 140 and the first circulating filtering pipeline 120 share a circulating pump 410 , and the liquid discharge can be completed by opening valves 610 and 620 , and closing valves 630 and 640 .

[0057] In this embodiment, the above-mentioned filters are all arranged on the output side of the circulation pump, and the output pressure of the circulation pump is higher, which is conducive to improving the filtering effect. Of course, in other embodiments, the filter can also be arranged on the input side of the circulation pump, so as to reduce the impurities entering the circulation pump and improve the service life of the circulation pump.

[0058] In this embodiment, the wafer cleaning device further includes a liquid level sensor (not shown in the figure), which is arranged in the first tank body 110 and is used to detect the liquid level of the cleaning liquid in the first tank body 110. The liquid level of the cleaning liquid in the first tank body 110 can be obtained by the liquid level sensor. On the one hand, during the process of immersion cleaning of the wafer in the first tank body 110, it is convenient to replenish the cleaning liquid in real time according to the liquid level; on the other hand, when the valve 640 is opened to pass the cleaning liquid in the first tank body 110 into the second tank body 210, when the wafer is spray-cleaned, it can be judged whether the cleaning liquid in the first tank body 110 is drained.

[0059] Example 2

[0060] like Figure 2 As shown, the structure of this embodiment is basically the same as that of embodiment 1, and the similarities are not repeated here. The differences are as follows:

[0061] The circulation pump and the filter are only arranged on the second circulation filtering segmented pipeline 220b between the second tank body 210 and the spray mechanism 300. In addition, the second tank body 210 is a single tank body structure, and the auxiliary circulation filtering pipeline 230 and the second circulation filtering segmented pipeline 220b share the circulation pump 530 and the filter 430, which is conducive to reducing costs.

[0062] Example 3

[0063] This embodiment also provides a wafer cleaning method, which uses the wafer cleaning device of embodiment 1 or embodiment 2, such as Figure 3 As shown, the cleaning method comprises the following steps:

[0064] S11, soaking and cleaning the wafer in the first tank.

[0065] S12, draining the cleaning liquid in the first tank.

[0066] S13. During the process of draining the cleaning liquid in the first tank body, at least a portion of the cleaning liquid in the first tank body is discharged into the second tank body through the second circulation filtration pipeline.

[0067] S14, spray cleaning the wafer through the second circulation filtering pipeline and the spray mechanism.

[0068] In the process of draining the cleaning liquid in the first tank, before the wafer is exposed to the cleaning liquid, the wafer is soaked and sprayed by the spray mechanism to ensure that the wafer can always remain moist.

[0069] In some embodiments, after the cleaning liquid in the first tank is drained, the spray mechanism continues to spray the wafer for a predetermined time to ensure that impurities and residues on the surface of the wafer are effectively rinsed away.

[0070] By circulating and filtering the cleaning liquid through the second circulation filter pipeline, impurities and pollutants in the cleaning liquid can be removed, the cleanliness of the cleaning liquid can be maintained, and the service life of the cleaning liquid can be extended, which not only saves the cost of the cleaning liquid, but is also more environmentally friendly. By soaking and cleaning the wafer in the first tank body, most of the dirt and impurities on the surface of the wafer can be effectively removed. Soaking cleaning can make the cleaning liquid fully contact with the wafer, thoroughly clean the dirt and impurities remaining on the surface of the wafer, and improve the cleaning effect. The cleaning liquid is discharged into the second tank body through the second circulation filter pipeline, and the cleaning liquid can be further filtered and recycled, which is conducive to saving cleaning liquid. The filtered cleaning liquid is sprayed on the wafer through the spray mechanism. Spray cleaning can effectively rinse away impurities and residues on the surface of the wafer, thereby further improving the cleaning effect of the wafer.

[0071] During the execution of step S11, old cleaning liquid in the first tank may be discharged while new cleaning liquid is added to the first tank to replace the old cleaning liquid in the first tank and improve the cleanliness of the cleaning liquid in the first tank.

[0072] In addition, the cleaning method further includes: performing self-circulation filtration on the cleaning liquid in the second tank. Of course, in some embodiments, the cleaning liquid in the first tank can also be self-circulated and filtered through the first circulation pipeline, or both the cleaning liquid in the first tank and the cleaning liquid in the second tank can be self-circulated and filtered. The above self-circulation filtration operations are conducive to further improving the cleanliness of the cleaning liquid.

[0073] Example 4

[0074] This embodiment provides a wafer cleaning method different from that of embodiment 3, which uses a wafer cleaning device such as that of embodiment 1 or embodiment 2. Figure 4 As shown, the cleaning method comprises:

[0075] S21, soaking and cleaning the wafer in the first tank.

[0076] S22, draining the cleaning liquid in the first tank.

[0077] S23, after the cleaning liquid in the first tank body is emptied, the second circulation filter pipeline between the first tank body and the second tank body is opened, and the cleaning liquid is supplied to the spray mechanism through the second circulation filter pipeline to spray clean the wafer.

[0078] In the process of draining the cleaning liquid in the first tank, before the wafer is exposed to the cleaning liquid, the wafer is sprayed and immersed by the spray mechanism.

[0079] By circulating and filtering the cleaning liquid through the second circulation filter pipeline, impurities and pollutants in the cleaning liquid can be removed, the cleanliness of the cleaning liquid can be maintained, and the service life of the cleaning liquid can be extended, which not only saves the cost of the cleaning liquid, but is also more environmentally friendly. Before the cleaning liquid in the first tank body is emptied, by closing the second circulation filter pipeline between the first tank body and the second tank body, it is possible to prevent the cleaning liquid used for soaking wafers in the first tank body (the cleaning liquid has a high content of impurities and pollutants) from being discharged into the second tank body, thereby preventing the cleaning liquid used for spraying wafers in the second tank body (the cleaning liquid is a fresh and clean cleaning liquid, or a cleaning liquid that is circulated after spraying the wafer, and its impurity and pollutant content is relatively low) from being contaminated. Before the cleaning liquid in the first tank body is emptied, the wafer is sprayed with immersion water to keep the wafer wet at all times. After the cleaning liquid in the first tank body is emptied, the second circulation filtering pipeline between the first tank body and the second tank body is opened. The cleaning liquid (with high impurity content) after soaking the wafer in the first tank body will not be mixed with the cleaning liquid (without impurities or with low impurity content) used for spraying the wafer in the second tank body, so that the cleaning liquid of the wafer in the spray cleaning process is cleaner. In addition, after opening the second circulation filtering pipeline between the first tank body and the second tank body, the cleaning liquid can circulate between the first tank body and the second tank body, which is beneficial to saving cleaning liquid.

[0080] In addition, the cleaning method further includes: performing self-circulation filtration on the cleaning liquid in the second tank body. Of course, in some embodiments, the cleaning liquid in the first tank body may also be subjected to self-circulation filtration, or the cleaning liquid in the first tank body and the cleaning liquid in the second tank body may also be subjected to self-circulation filtration. The above self-circulation filtration operations are conducive to further improving the cleanliness of the cleaning liquid.

[0081] Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only for illustration and the protection scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. A wafer cleaning device, characterized in that: It includes: A first tank body, the first tank body is used to contain a cleaning solution and a wafer; a second tank body, the second tank body being used to contain a cleaning liquid; A spray mechanism, the spray mechanism being used to spray a cleaning liquid onto the wafer; A second circulation filter pipeline, the liquid inlet of the second circulation filter pipeline can be connected to the first tank body, the second tank body is arranged in the second circulation filter pipeline, the liquid outlet of the second circulation filter pipeline is connected to the spray mechanism, and the second circulation filter pipeline can discharge the cleaning liquid in the first tank body into the second tank body, and transport it from the second tank body to the spray mechanism.

2. The wafer cleaning device according to claim 1, characterized in that: The second circulation filtering pipeline also includes an auxiliary circulation filtering pipeline, which is connected to the second tank body and is used for circulating and filtering the cleaning liquid in the second tank body.

3. The wafer cleaning device according to claim 2, characterized in that: The second tank body includes a second inner tank and a second outer tank, the auxiliary circulation filtering pipeline connects the second inner tank and the second outer tank, and the cleaning liquid in the second inner tank overflows to the second outer tank and returns to the second inner tank through the auxiliary circulation filtering pipeline.

4. The wafer cleaning device according to claim 3, characterized in that: The second circulation filtering pipeline outputs the cleaning liquid from the middle area or the upper area of ​​the second inner tank.

5. The wafer cleaning device according to claim 3, characterized in that: The second tank body is further provided with a second liquid discharge pipeline and a second liquid replenishment pipeline, wherein the second liquid discharge pipeline is communicated with the second inner tank, and the second liquid replenishment pipeline is communicated with the second outer tank.

6. The wafer cleaning device according to claim 1, characterized in that: The second circulation filtering pipeline includes a second circulation filtering segmented pipeline located between the first tank body and the second tank body and a second circulation filtering segmented pipeline located between the second tank body and the spray mechanism, wherein at least one pipeline is provided with a circulation pump and a filter.

7. The wafer cleaning device according to claim 2, characterized in that: The second circulation filtration pipeline includes a second circulation filtration segmented pipeline located between the first tank body and the second tank body, a second circulation filtration segmented pipeline located between the second tank body and the spray mechanism, and an auxiliary circulation filtration pipeline, at least one of which is provided with a circulation pump and a filter.

8. The wafer cleaning device according to claim 7, characterized in that: The second tank body is a single tank body structure, and the auxiliary circulation filtering pipeline and the second circulation filtering pipeline share the circulation pump and the filter.

9. The wafer cleaning device according to claim 1, characterized in that: The wafer cleaning device also includes a first circulation filtering pipeline, which is connected to the first tank body and is used for circulating and filtering the cleaning liquid in the first tank body.

10. The wafer cleaning device according to claim 9, characterized in that: The first tank body includes a first inner tank and a first outer tank, the first circulating filtering pipeline connects the first inner tank and the first outer tank, and the cleaning liquid in the first inner tank overflows into the first outer tank and returns to the first inner tank through the first circulating filtering pipeline.

11. The wafer cleaning device according to claim 10, characterized in that: The first tank body is also provided with a first liquid replenishing pipeline and a first liquid discharging pipeline. The first liquid replenishing pipeline is communicated with the first outer tank, and the first liquid discharging pipeline is communicated with the first inner tank.

12. The wafer cleaning device according to claim 1, characterized in that: The wafer cleaning device further includes a liquid level sensor, which is disposed in the first tank body and is used to detect the liquid level of the cleaning liquid in the first tank body.

13. A wafer cleaning method, characterized in that: It adopts the wafer cleaning device according to any one of claims 1 to 12, and the cleaning method comprises: Immersing and cleaning the wafer in the first tank; Drain the cleaning liquid in the first tank; During the process of draining the cleaning liquid in the first tank body, at least a portion of the cleaning liquid in the first tank body is discharged into the second tank body through the second circulation filtration pipeline; The wafer is spray cleaned through the second circulation filtering pipeline and the spray mechanism.

14. The wafer cleaning method according to claim 13, characterized in that: During the immersion cleaning of the wafer, the cleaning liquid in the first tank is discharged while the cleaning liquid is replenished into the first tank to replace the cleaning liquid in the first tank.

15. The wafer cleaning method according to claim 13, wherein: The method further comprises: The cleaning liquid in the first tank body and / or the cleaning liquid in the second tank body is / are subjected to self-circulation filtration.

16. The wafer cleaning method according to claim 13, characterized in that: In the step of draining the cleaning liquid in the first tank, before the wafer is exposed to the cleaning liquid, the wafer is sprayed and soaked by the spray mechanism to ensure that the wafer can always remain wet.

17. A wafer cleaning method, characterized in that: It adopts the wafer cleaning device according to any one of claims 1 to 12, and the cleaning method comprises: Immersing and cleaning the wafer in the first tank; Drain the cleaning liquid in the first tank; After the cleaning liquid in the first tank body is emptied, the second circulation filter pipeline between the first tank body and the second tank body is opened, and the cleaning liquid is supplied to the spray mechanism through the second circulation filter pipeline to spray clean the wafer.

18. The wafer cleaning method according to claim 17, characterized in that: The cleaning method further comprises: The cleaning liquid in the first tank body and / or the cleaning liquid in the second tank body is / are subjected to self-circulation filtration.

19. The wafer cleaning method according to claim 17, wherein: In the step of draining the cleaning liquid in the first tank, before the wafer is exposed to the cleaning liquid, the wafer is sprayed and soaked by the spray mechanism to ensure that the wafer can always remain wet.

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