Method and device for manufacturing printed circuit board with packaging area

Abstract

The invention relates to a method and device for manufacturing a printed circuit board with a packaging area, and the method and device can control the ink thickness of a BGA area of a PCB within a first preset range, and control the total thickness parameter of a green oil block and a white oil block of the BGA area within a second preset range. The method can be applied to high-density assembly of devices such as BGA, QFN, CSP, FinePitchIC and the like. According to the invention, the copper thickness difference can be reduced, the thickness uniformity of the solder mask layer and the character layer can be ensured, the product performance failure caused by tin connection short circuit during the surface mounting of the PCB can be effectively avoided, and the yield and the service life of the rear-end application of the PCB can be improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of PCB manufacturing, and in particular to a method and device for manufacturing a printed circuit board with a packaging area. Background Art

[0002] With the rapid development of the SMT industry, the assembly density is getting higher and higher (the application of devices such as BGA, QFN, CSP, FinePitchIC), the components are getting smaller and smaller (the application of 1005 and 01005 components is becoming more and more common), and the number of PCB substrate layers is increasing, which poses new challenges to the SMT manufacturing process. The introduction and development of new processes have put forward higher requirements for devices such as BGA, QFN, and CSP. Therefore, it will become particularly important to strictly control the voids (bubbles, interface micro-voids) of BGA, QFN, and CSP devices. Once the void area of ​​these devices exceeds the IPC standard, it will not only affect the mechanical properties of BGA, QFN, and CSP devices, but also the electrical properties. Therefore, the control of voids in such devices becomes particularly important. Among them, BGA stands for Ball Grid Array, which is an integrated circuit packaging technology. In the BGA package, the pins of the chip are connected to the metal grid at the bottom through solder balls, and then connected to the printed circuit board through soldering. QFN stands for Quad Flat No-leads, which is a surface mounting technology. In the QFN package, the pins of the chip are located on the package base at the bottom, with no externally visible pins.

[0003] In the production of products in the BGA&QFN design area, the special design of BGA&QFN causes uneven thickness of solder mask and character layer due to copper thickness difference. At the same time, there is a white oil block design above the plug hole. The green oil thickness + white oil block thickness exceeds 50um. After the client prints the solder paste during SMT, the steel mesh will be lifted up and the tin will be short-circuited, which will lead to product performance failure. Summary of the invention

[0004] In view of the above problems, the embodiments of the present invention provide a method and device for manufacturing a printed circuit board with a packaging area, which is used to solve the problem that in the prior art, when manufacturing products in the BGA&QFN design area, the special design of BGA&QFN causes uneven thickness of the solder mask and the character layer due to the copper thickness drop during the process. At the same time, there is a white oil block design above the plug hole, and the green oil thickness + white oil block thickness exceeds 50um. After the client prints the solder paste, the steel mesh will be lifted up and the tin will be short-circuited during SMT. This will lead to product performance failure.

[0005] According to one aspect of an embodiment of the present invention, a method for manufacturing a printed circuit board having a packaging area is provided, wherein the method comprises: Open oil and make solder resist ink; Solder mask printing: select the first screen according to the copper thickness of the PCB board, and print the solder mask ink on the PCB board through the first screen; Post-baking detection: bake the PCB board after solder mask printing, and perform the first slice detection on the BGA area of ​​the PCB board after baking to confirm the ink thickness. If the ink thickness is within the first preset range, proceed to the next step, otherwise modify the solder mask printing parameters and re-print the solder mask on the PCB board; Text printing: select the second screen according to the thickness of the white oil block of the PCB board, and print the text on the PCB board through the second screen; Curing detection, baking the PCB board after text printing, performing a second slicing test on the green oil block and the white oil block in the BGA area to determine the total thickness parameters of the green oil block and the white oil block; if the total thickness parameter is within the second preset range, proceed to the next step, otherwise modify the text printing parameters and re-print the text on the PCB board.

[0006] In some optional embodiments, the oil opening step specifically includes: Adding curing agent and diluent to the main agent to form ink; The mixture was stirred for the first time by manual stirring for 5 minutes, and the mixture was stirred for the second time by machine stirring for 15 minutes; After the second stirring, let it stand for 15 minutes and test the ink viscosity. If the ink viscosity is 150±30dps, the ink meets the requirements and proceed to the next step. Otherwise, readjust the amount of curing agent and diluent added to the ink.

[0007] In some optional embodiments, the solder mask printing specifically includes: The first screen is selected as 43T screen, and the scraper speed is 20 mm / min -80 mm / min, the ink return knife speed is 20 mm / min -80 mm / min, and the printing pressure is 3 kg / cm 2 -5kg / cm 2 , the scraper angle is required to be 5°-15° when printing ink on the PCB board.

[0008] In some optional embodiments, after the solder mask printing and before the post-bake inspection, it also includes: detecting the solder mask wet film thickness of the PCB board by a wet film wheel, if the solder mask wet film thickness is within 40um, the solder mask printing is qualified, otherwise the solder mask printing parameters are modified and the solder mask is re-printed on the PCB board.

[0009] In some optional embodiments, the first preset range is 15um-30um.

[0010] In some optional embodiments, the text printing specifically includes: The second screen was selected as 140T screen, and text printing was carried out according to the requirements of scraper speed of 100 mm / s-300mm / s, ink return knife speed of 200mm / min-400mm / min, printing pressure of 0.4MPa-0.6MPa, and scraper angle of 5°-20°.

[0011] In some optional embodiments, the second preset range is 20um-45um.

[0012] In some optional embodiments, before the oiling, PCB board pre-processing is also included, and the PCB board pre-processing includes: inner layer production, inner layer AOI, lamination, drilling, and outer layer production.

[0013] In some optional embodiments, after the curing test, PCB board front and back processes are also included, and the PCB board post-processes include: surface treatment, molding, testing, and packaging.

[0014] According to another aspect of an embodiment of the present invention, a device for manufacturing a printed circuit board with a packaging area is provided, wherein the device is used to execute the above-mentioned method for manufacturing a printed circuit board with a packaging area to manufacture a printed circuit board.

[0015] The method and device for manufacturing a printed circuit board with a packaging area of ​​the present invention have the following beneficial effects: the present invention prepares solder resist ink by opening oil through the following steps: solder resist printing, selecting a first screen according to the copper thickness of the PCB board, and printing solder resist ink on the PCB board through the first screen; post-baking detection, baking the PCB board after solder resist printing, and slicing and detecting the BGA area of ​​the PCB board after baking to confirm the ink thickness, if the ink thickness is within a first preset range, proceeding to the next step, otherwise modifying the solder resist printing parameters and re-printing solder resist on the PCB board; text printing, selecting a second screen according to the thickness of the white oil block of the PCB board, and printing text on the PCB board through the second screen; curing detection, baking the PCB board after text printing, and performing a second slicing detection on the green oil block and the white oil block in the BGA area to determine the total thickness parameter of the green oil block and the white oil block; if the total thickness parameter is within a second preset range, proceeding to the next step, otherwise modifying the text printing parameters and re-printing text on the PCB board.

[0016] The solution of the present invention can control the ink thickness of the BGA area of ​​the PCB board within a first preset range, and control the total thickness parameters of the green oil block and the white oil block in the BGA area within a second preset range. It can be applied to high-density assembly of devices such as BGA, QFN, CSP, FinePitchIC, etc. The present invention can reduce the copper thickness drop, ensure the uniformity of the thickness of the solder mask and the character layer, effectively avoid the PCB board from short-circuiting the tin during patching, resulting in product performance failure, and improve the yield rate and service life of the back-end application of the PCB board.

[0017] The above description is only an overview of the technical solution of the embodiment of the present invention. In order to more clearly understand the technical means of the embodiment of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiment of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings. In the accompanying drawings: Figure 1 A schematic flow chart of a method for manufacturing a printed circuit board with a packaging area according to Embodiment 1 of the present invention is shown; Figure 2 The schematic diagram of the oil opening process of Example 2 provided by the present invention is shown; Figure 3 A schematic diagram of ink thickness detected by the first slice of Example 1 provided by the present invention is shown; Figure 4 A schematic diagram of total thickness parameters of the second slice detection according to the first embodiment of the present invention is shown. DETAILED DESCRIPTION

[0019] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0020] Embodiment 1, See also Figure 1 According to one aspect of an embodiment of the present invention, there is provided a method for manufacturing a printed circuit board having a packaging area, the method comprising: 110, preparing the solder resist ink; in step 110, the preparation step of preparing the solder resist ink specifically includes: adding a curing agent and a diluent to a main agent to form the ink; stirring the mixture for the first time by manual stirring for 5 minutes, and stirring the mixture for the second time by machine stirring for 15 minutes; after the second stirring, the mixture is allowed to stand for 15 minutes, and the viscosity of the ink is tested. If the viscosity of the ink is 150±30dps, the ink meets the requirements and proceeds to the next step, otherwise, the amount of the curing agent and the diluent added to the ink is readjusted.

[0021] 120, solder mask printing, selecting a first screen according to the copper thickness of the PCB board, and printing solder mask ink on the PCB board through the first screen; in step 120, the solder mask printing specifically includes: selecting the first screen as a 43T screen, and setting the scraper speed to 20 mm / min-80 mm / min, the ink return knife speed to 20 mm / min-80 mm / min, and the printing pressure to 3 kg / cm 2 -5kg / cm 2 , the scraper angle is required to be 5°-15° when printing ink on the PCB board.

[0022] 130, post-baking detection, baking the PCB board after solder mask printing, and performing a first slice detection on the BGA area of ​​the PCB board after baking to confirm the ink thickness. If the ink thickness is within the first preset range, proceed to the next step, otherwise modify the solder mask printing parameters and re-print the solder mask on the PCB board; in step 130, refer to Figure 3 , L1 is the ink thickness. The first preset range is 15um-30um. Through this step, the ink thickness of the BGA area of ​​the PCB board can be controlled within the first preset range, thereby improving the stability of the PCB board.

[0023] 140, text printing, select the second screen according to the thickness of the white oil block of the PCB board, and print the text on the PCB board through the second screen; the text printing specifically includes: selecting the second screen as the 140T screen, and printing the text according to the requirements of the scraper speed of 100 mm / s-300mm / s, the ink return knife speed of 200 mm / min-400mm / min, the printing pressure of 0.4MPa-0.6MPa, and the scraper angle of 5°-20°.

[0024] 150, curing test, bake the PCB board after text printing, perform a second slicing test on the green oil block and the white oil block in the BGA area to determine the total thickness parameter of the green oil block and the white oil block; if the total thickness parameter is within the second preset range, proceed to the next step, otherwise modify the text printing parameters and reprint the text on the PCB board. Figure 3, L2 is the total thickness parameter. This step can ensure that the total thickness parameter of the green oil block and the white oil block in the BGA area of ​​the PCB board is controlled within the second preset range, thereby improving the stability of the PCB board.

[0025] The solution of the present invention can control the ink thickness of the BGA area of ​​the PCB board within a first preset range, and control the total thickness parameters of the green oil block and the white oil block in the BGA area within a second preset range. It can be applied to high-density assembly of devices such as BGA, QFN, CSP, FinePitchIC, etc. The present invention can reduce the copper thickness drop, ensure the uniformity of the thickness of the solder mask and the character layer, effectively avoid the PCB board from short-circuiting the tin during patching, resulting in product performance failure, and improve the yield rate and service life of the back-end application of the PCB board.

[0026] Embodiment 2: This application is based on Example 1, and further defines Example 1. The present invention opens oil through the following steps to make solder resist ink; solder resist printing, select the first screen according to the copper thickness of the PCB board, and print the solder resist ink on the PCB board through the first screen; post-baking detection, bake the PCB board after solder resist printing, and slice the BGA area of ​​the PCB board after baking to confirm the ink thickness. If the ink thickness is within the first preset range, proceed to the next step, otherwise modify the solder resist printing parameters and re-print the solder resist on the PCB board; text printing, select the second screen according to the thickness of the white oil block of the PCB board, and print the text on the PCB board through the second screen; curing detection, bake the PCB board after text printing, and perform a second slice detection on the green oil block and the white oil block in the BGA area to determine the total thickness parameter of the green oil block and the white oil block; if the total thickness parameter is within the second preset range, proceed to the next step, otherwise modify the text printing parameters and re-print the text on the PCB board. The detailed steps of PCB board processing are as follows.

[0027] In some optional embodiments, the oil opening step, see Figure 2 , specifically including: 210, adding a curing agent and a diluent to the main agent to form ink; in step 210, a barrel of ink weighs 4 kg, and 150 ml of diluent is added; wherein, the curing agent can be mixed with the main agent to form the ink.

[0028] 220, the mixture is stirred for the first time by manual stirring for 5 minutes, and the mixture is stirred for the second time by machine stirring for 15 minutes; in step 220, the curing agent, the diluent, and the main agent are preliminarily mixed and activated by the first stirring. The ink is fully stirred and uniformly mixed by the second stirring to have a specific ink viscosity.

[0029] 230, after the second stirring, let it stand for 15 minutes and test the ink viscosity. If the ink viscosity is 150±30dps, the ink meets the requirements and proceeds to the next step. Otherwise, readjust the amount of curing agent and diluent added to the ink. In step 230, the ink viscosity is tested to ensure the normal use of the ink in subsequent steps. The ink viscosity is required to be 150±30dps. In a specific example, the ink is measured to be 157dps. If the ink viscosity does not meet the requirements, the amount of diluent needs to be adjusted and fully stirred.

[0030] In some optional embodiments, solder mask printing specifically includes: selecting a first screen plate as a 43T screen plate, and setting a scraper speed of 20 mm / min-80 mm / min, a return ink blade speed of 20 mm / min-80 mm / min, and a printing pressure of 3 kg / cm 2 -5kg / cm 2 , the scraper angle is 5°-15°, and the ink is printed on the PCB board. In a specific example, the scraper speed is 60 mm / min, the ink return knife speed is 55 mm / min, and the printing pressure is 3.6kg / cm 2 , scraper angle 12°. Through the above solder mask parameters, it can be ensured that the printing ink is uniform, without oil accumulation and line redness and other defects.

[0031] Among them, after solder mask printing and before post-baking inspection, it also includes: detecting the solder mask wet film thickness of the PCB board through a wet film wheel. If the solder mask wet film thickness is within 40um, the solder mask printing is qualified, otherwise the solder mask printing parameters are modified and the solder mask printing is performed again on the PCB board. In a specific example, the wet film thickness is 30um. After solder mask printing, by detecting the solder mask wet film thickness of the PCB board through a wet film wheel, the thickness of the wet film can be checked in time, and the solder mask printing parameters can be adjusted in time to avoid the ink of the PCB board being unable to be processed during baking and curing.

[0032] In some optional embodiments, text printing specifically includes: selecting the second screen plate as a 140T screen plate, and printing text according to the requirements of a scraper speed of 100 mm / s-300 mm / s, an ink return knife speed of 200 mm / min-400 mm / min, a printing pressure of 0.4 MPa-0.6 MPa, and a scraper angle of 5°-20°. In this embodiment, the text is printed with a scraper speed of 150 mm / s, an ink return knife speed of 400 mm / min, a printing pressure of 0.58 MPa, and a scraper angle of 16°. At the same time, the scraper is also checked before text printing to ensure that the scraper is flat and has no gaps. Through the above text parameters, it is ensured that the characters are clear and the white oil block is flat and has no marks.

[0033] In some optional embodiments, before the oiling, PCB board pre-treatment is also included, and the PCB board pre-treatment includes: inner layer production, inner layer AOI, lamination, drilling, and outer layer production in sequence. In this embodiment, the pre-treatment specifically includes: cutting: cutting the PCB substrate into production size. Cleaning: cleaning the surface of the PCB substrate and removing surface contaminants. Laminating: sticking the dry film on the surface of the PCB substrate to prepare for subsequent image transfer. Exposure: using exposure equipment to expose the film-coated substrate with ultraviolet light to transfer the image of the substrate to the dry film. Developing, etching, and film removal: removing the uncured photosensitive film, etching away the unnecessary copper foil with a strong alkaline solvent, and completing the production of the inner layer board. AOI optical scanning: comparing the image of the PCB board with the data of the good board to find bad phenomena (such as notches, depressions, etc.). VRS detection and maintenance: processing the bad image data detected by AOI, and relevant personnel will perform maintenance. Wire filling: soldering the gold wire on the notch or depression to prevent poor electrical properties. Browning: Increase the adhesion between the board and the resin, and increase the wettability of the copper surface. Riveting: Cut the PP into small sheets and normal sizes, so that the inner layer board can be combined with the corresponding PP. Overlay and pressing: Press multiple inner layer boards into one board. Targeting, edging, and grinding: Process the edges of the board to meet the design requirements. Positioning and drilling: Use a drilling machine to drill holes of different diameters and sizes on the board for subsequent processing of plug-ins and heat dissipation. Graphic processing: Graphically process the outer layer of the PCB, remove excess copper foil by etching, and form the final PCB wire pattern. Electroplating: Plate a layer of copper on the hole wall to ensure reliable conductivity between the layers.

[0034] In some optional embodiments, after the curing test, the PCB board front and back processes are also included, and the PCB board post-processes include: surface treatment, molding, testing, and packaging in sequence. In this embodiment, OSP treatment: the side of the bare copper plate to be welded is coated to form an organic film to prevent rust and oxidation. Shape making: The board shape required by the customer is made to facilitate the customer to perform SMT patching and assembly. Flying probe test: Test the board circuit to avoid short-circuit boards from flowing out. FQC final inspection: After completing all processes, a full sampling inspection is carried out to ensure the quality of the PCB board. Vacuum packaging: The finished PCB board is vacuum packed to prevent moisture, dust and shock.

[0035] The solution of the present invention can control the ink thickness of the BGA area of ​​the PCB board within a first preset range, and control the total thickness parameters of the green oil block and the white oil block in the BGA area within a second preset range. It can be applied to high-density assembly of devices such as BGA, QFN, CSP, FinePitchIC, etc. The present invention can reduce the copper thickness drop, ensure the uniformity of the thickness of the solder mask and the character layer, effectively avoid the PCB board from short-circuiting the tin during patching, resulting in product performance failure, and improve the yield rate and service life of the back-end application of the PCB board.

[0036] Embodiment 3: According to another aspect of an embodiment of the present invention, a device for manufacturing a printed circuit board with a packaging area is provided, wherein the device is used to execute the above-mentioned method for manufacturing a printed circuit board with a packaging area to manufacture a printed circuit board.

[0037] The invention prepares solder resist ink by the following steps: solder resist printing, selecting a first screen according to the copper thickness of a PCB board, and printing solder resist ink on the PCB board through the first screen; post-baking detection, baking the PCB board after solder resist printing, and slicing and detecting the BGA area of ​​the PCB board after baking to confirm the ink thickness, if the ink thickness is within a first preset range, proceeding to the next step, otherwise modifying the solder resist printing parameters and re-printing the solder resist on the PCB board; text printing, selecting a second screen according to the thickness of a white oil block of the PCB board, and printing text on the PCB board through the second screen; curing detection, baking the PCB board after text printing, and performing a second slicing detection on the green oil block and the white oil block in the BGA area to determine the total thickness parameter of the green oil block and the white oil block; if the total thickness parameter is within a second preset range, proceeding to the next step, otherwise modifying the text printing parameters and re-printing the text on the PCB board.

[0038] The solution of the present invention can control the ink thickness of the BGA area of ​​the PCB board within a first preset range, and control the total thickness parameters of the green oil block and the white oil block in the BGA area within a second preset range. It can be applied to high-density assembly of devices such as BGA, QFN, CSP, FinePitchIC, etc. The present invention can reduce the copper thickness drop, ensure the uniformity of the thickness of the solder mask and the character layer, effectively avoid the PCB board from short-circuiting the tin during patching, resulting in product performance failure, and improve the yield rate and service life of the back-end application of the PCB board.

[0039] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. Similarly, in order to simplify the present invention and help understand one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, the various features of the embodiments of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. Wherein, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, wherein each claim itself is a separate embodiment of the present invention.

[0040] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and further may be divided into a plurality of submodules or subunits or subcomponents. Except that at least some of such features and / or processes or units are mutually exclusive.

[0041] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of multiple such elements. The present invention may be implemented with the aid of hardware comprising several different elements and with the aid of appropriately programmed computers. In a unit claim that lists several systems, several of these systems may be embodied by the same hardware item. The use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be understood as limitations on the order of execution.

Claims

1. A method for manufacturing a printed circuit board having a packaging area, characterized in that: The method comprises: Open oil and make solder resist ink; Solder mask printing: select the first screen according to the copper thickness of the PCB board, and print the solder mask ink on the PCB board through the first screen; Post-baking detection: bake the PCB board after solder mask printing, and perform the first slice detection on the BGA area of ​​the PCB board after baking to confirm the ink thickness. If the ink thickness is within the first preset range, proceed to the next step, otherwise modify the solder mask printing parameters and re-print the solder mask on the PCB board; Text printing: select the second screen according to the thickness of the white oil block of the PCB board, and print the text on the PCB board through the second screen; Curing detection, baking the PCB board after text printing, performing a second slicing test on the green oil block and the white oil block in the BGA area to determine the total thickness parameters of the green oil block and the white oil block; if the total thickness parameter is within the second preset range, proceed to the next step, otherwise modify the text printing parameters and re-print the text on the PCB board.

2. A method for manufacturing a printed circuit board having a packaging area according to claim 1, characterized in that: The oil opening step specifically includes: Adding curing agent and diluent to the main agent to form ink; The mixture was stirred for the first time by manual stirring for 5 minutes, and the mixture was stirred for the second time by machine stirring for 15 minutes; After the second stirring, let it stand for 15 minutes and test the ink viscosity. If the ink viscosity is 150±30dps, the ink meets the requirements and proceed to the next step. Otherwise, readjust the amount of curing agent and diluent added to the ink.

3. The method for manufacturing a printed circuit board having a packaging area according to claim 1, characterized in that: The solder mask printing specifically includes: The first screen is selected as 43T screen, and the scraper speed is 20 mm / min-80 mm / min, the ink return knife speed is 20 mm / min-80 mm / min, and the printing pressure is 3 kg / cm 2 -5kg / cm 2 , the scraper angle is required to be 5°-15° when printing ink on the PCB board.

4. A method for manufacturing a printed circuit board having a packaging area according to claim 3, characterized in that: After solder mask printing and before post-bake inspection, it also includes: detecting the solder mask wet film thickness of the PCB board through a wet film wheel. If the solder mask wet film thickness is within 40um, the solder mask printing is qualified. Otherwise, modify the solder mask printing parameters and re-print the solder mask on the PCB board.

5. The method for manufacturing a printed circuit board having a packaging area according to claim 1, characterized in that: The first preset range is 15um-30um.

6. The method for manufacturing a printed circuit board having a packaging area according to claim 1, characterized in that: The text printing specifically includes: The second screen was selected as 140T screen, and text printing was carried out according to the requirements of scraper speed of 100 mm / s-300mm / s, ink return knife speed of 200 mm / min-400mm / min, printing pressure of 0.4MPa-0.6MPa, and scraper angle of 5°-20°.

7. The method for manufacturing a printed circuit board having a packaging area according to claim 1, characterized in that: The second preset range is 20um-45um.

8. The method for manufacturing a printed circuit board with a packaging area according to claim 1, characterized in that: Before the oiling, the PCB board pre-processing is also included, and the PCB board pre-processing includes: inner layer production, inner layer AOI, pressing, drilling, and outer layer production.

9. The method for manufacturing a printed circuit board having a packaging area according to claim 1, characterized in that: After the curing test, the method further includes PCB board front-end and back-end processes, wherein the PCB board back-end processes sequentially include: surface treatment, molding, testing, and packaging.

10. A printed circuit board manufacturing device having a packaging area, characterized in that: The device is used to execute the method for manufacturing a printed circuit board with a packaging area as described in any one of claims 1 to 9 to manufacture a printed circuit board.

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