Heat dissipation device and display module

Abstract

The invention discloses a heat dissipation device and a display module, the heat dissipation device comprises a vibration part and a magnetic unit, the magnetic unit comprises a magnetic part and a magnetic core, the vibration part is fixed with a heat dissipation box, one of the magnetic part and the magnetic core is fixed with the vibration part, and the magnetic core is fixed with the vibration part. The other one of the magnetic part and the magnetic core is fixed to the inner wall of the heat dissipation cavity, the magnetic core is arranged corresponding to the magnetic part, and under the condition that alternating current is supplied to a coil of the magnetic core, the magnetic force generated by the magnetic core and attracted or repelled with the magnetic part is used for driving the vibration part to vibrate, so that the vibration part vibrates. According to the display module, air can be pumped into or out of the heat dissipation box under the action of the vibration part, the flowing speed of the air in the heat dissipation box is increased, heat radiated to the heat dissipation cavity by the heat dissipation box making contact with the display panel is rapidly brought to the outside, and the heat dissipation efficiency of the display module is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a heat dissipation device and a display module. Background Art

[0002] The display resolution of Micro-LED display modules continues to improve, and the pixel size of Micro-LED display modules is getting smaller and smaller. The display array of Micro-LED display modules contains a huge number of diode devices. During the operation of the Micro-LED display module, the diode devices generate a lot of heat, which can easily lead to reduced performance and product stability of the Micro-LED display module.

[0003] In order to solve the problem of reduced performance and product stability of Micro-LED display modules, refer to Figure 1 The conventional solution is to glue a metal heat dissipation backplane to the non-display surface of the display panel of the Micro-LED display module through thermal conductive adhesive. However, the heat dissipation efficiency of this heat dissipation solution is low, and it is still difficult to meet the heat dissipation requirements of the Micro-LED display module, resulting in the interior of the Micro-LED display module being continuously in a high-temperature working environment, causing the Micro-LED display module to have poor display and reduced life of semiconductor devices. Summary of the invention

[0004] The embodiments of the present application provide a heat dissipation device and a display module to improve the problems of poor display of the display module and reduced life of semiconductor devices.

[0005] In a first aspect, an embodiment of the present application provides a heat dissipation device, comprising:

[0006] A heat dissipation box, wherein a heat dissipation cavity is provided in the heat dissipation box, and a vent hole is provided on the heat dissipation cavity;

[0007] A vibration member, wherein the vibration member is fixed to the heat dissipation box;

[0008] A magnetic unit, the magnetic unit comprising a magnetic member and a magnetic core, one of the magnetic member and the magnetic core is fixed to the vibration member, the other of the magnetic member and the magnetic core is fixed to the inner wall of the heat dissipation cavity, and the magnetic core is arranged corresponding to the magnetic member;

[0009] When alternating current is passed through the coil of the magnetic core, the magnetic force generated by the magnetic core that attracts or repels the magnetic element is used to drive the vibration element to vibrate.

[0010] Furthermore, in a top view of the heat dissipation device, the magnetic core overlaps with a portion of the magnetic component.

[0011] Furthermore, the heat dissipation device also includes a flexible support member, and the magnetic core is fixed to the top wall of the heat dissipation cavity through the flexible support member.

[0012] Furthermore, a receiving groove is provided in the middle area of ​​the magnetic member, the extending direction of the receiving groove is the same as the moving direction of the magnetic core, and a part of the magnetic core is located in the receiving groove.

[0013] Furthermore, the accommodating groove is cylindrical, and the inner diameter of the accommodating groove is equal to the diameter of the magnetic core.

[0014] Furthermore, the vibration member is located outside the heat dissipation cavity, and an opening is provided at the bottom of the heat dissipation cavity, wherein one end of the magnetic core passes through the opening and is fixed to the vibration member.

[0015] Furthermore, the vibration member is located inside the heat dissipation cavity, wherein one end of the magnetic core is fixed to the vibration member.

[0016] Furthermore, the top wall of the heat dissipation cavity is provided with a plurality of spaced strip-shaped protrusions.

[0017] Furthermore, the vent holes are located on the side walls of the heat dissipation cavity.

[0018] In a second aspect, an embodiment of the present application provides a display module, the display module includes the heat dissipation device, the display module also includes a display panel, and the heat dissipation device is arranged on a non-display surface of the display panel.

[0019] Beneficial effects of this application:

[0020] The present application provides a heat dissipation device and a display module. The heat dissipation device includes a vibration member and a magnetic unit. The magnetic unit includes a magnetic member and a magnetic core. The vibration member is fixed to the heat dissipation box. The magnetic member and one of the magnetic cores are fixed to the vibration member. The magnetic member and the other of the magnetic cores are fixed to the inner wall of the heat dissipation cavity. The magnetic core is arranged corresponding to the magnetic member. When alternating current is passed through the coil of the magnetic core, the magnetic force of attraction or repulsion generated by the magnetic core and the magnetic member is used to drive the vibration member to vibrate, so that air can be pumped into or out of the heat dissipation box under the action of the vibration member, thereby increasing the flow rate of air in the heat dissipation box, thereby quickly bringing the heat radiated from the heat dissipation cavity by the heat dissipation box in contact with the display panel to the outside, thereby improving the heat dissipation efficiency of the display module, thereby avoiding the problem of poor display of the display module and reduced life of semiconductor devices due to the continuous high-temperature working environment inside the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of a traditional display module;

[0022] Figure 2 is a top view of the heat dissipation device in the present application;

[0023] Figure 3 yes Figure 2 A first structural schematic diagram of the heat dissipation device shown;

[0024] Figure 4 yes Figure 2 A second structural schematic diagram of the heat dissipation device shown;

[0025] Figure 5 is a schematic diagram of the first display module in this application;

[0026] Figure 6 is a schematic diagram of the second display module in the present application;

[0027] Figure 7 It is a schematic diagram of the third display module in this application.

[0028] 100-heat dissipation device, 110-heat dissipation box, 111-heat dissipation cavity, 1111-vent, 1112-opening, 1113-strip convex portion, 120-vibrating member, 130-magnetic unit, 131-magnetic member, 1311-accommodating groove, 132-magnetic core, 140-flexible supporting member; 200-display panel; 300-thermal conductive adhesive.

[0029] 10-display panel; 20-thermal conductive adhesive; 30-metal heat dissipation back plate. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. The technical solutions described below are only used to explain and illustrate the ideas of the present application and should not be regarded as limiting the scope of protection of the present application.

[0031] In addition, the terms "first", "second" and similar words do not indicate any order, quantity or importance, but are only used to distinguish different technical features. The term "plurality" and similar words mean two or more, unless otherwise clearly defined.

[0032] In order to solve the problem of reduced performance and product stability of Micro-LED display modules, refer to Figure 1The conventional solution is to adhere a metal heat dissipation back plate 30 to the non-display surface of the display panel 10 of the Micro-LED display module through a thermal conductive adhesive 20. However, the heat dissipation efficiency of this heat dissipation solution is low, and it is still difficult to meet the heat dissipation requirements of the Micro-LED display module, resulting in the interior of the Micro-LED display module being continuously in a high-temperature working environment, causing the Micro-LED display module to have poor display and reduced life of semiconductor devices.

[0033] The first embodiment of the present application provides a first heat dissipation device 100, referring to Figure 2 , Figure 3 , the heat dissipation device 100 includes a heat dissipation box 110, a vibration member 120 and a magnetic unit 130, the magnetic unit 130 includes a magnetic member 131 and a magnetic core 132, a heat dissipation cavity 111 is provided in the heat dissipation box 110, and a vent 1111 is provided on the heat dissipation cavity 111; the vibration member 120 is fixed to the heat dissipation box 110; one of the magnetic member 131 and the magnetic core 132 is fixed to the vibration member 120, and the other of the magnetic member 131 and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111, and the magnetic core 132 is arranged corresponding to the magnetic member 131; magnetic member 131 heat dissipation cavity 111 magnetic core 132 vibration member 120 in the top view of the heat dissipation device 100, the magnetic core 132 overlaps with a part of the magnetic member 131; when alternating current is passed through the coil of the magnetic core 132, the magnetic force generated by the magnetic core 132 that attracts or repels the magnetic member 131 is used to drive the vibration member 120 to vibrate.

[0034] The heat dissipation device 100 includes a vibration member 120 and a magnetic unit 130, wherein the magnetic unit 130 includes a magnetic member 131 and a magnetic core 132, and the vibration member 120 is fixed to the heat dissipation box, one of the magnetic member 131 and the magnetic core 132 is fixed to the vibration member 120, and the other of the magnetic member 131 and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111. In the top view of the heat dissipation device, the magnetic core 132 overlaps with a part of the magnetic member 131, and the vibration member 120, the magnetic member 131, the heat dissipation cavity 111, the magnetic core 132, the vibration member 120, the magnetic core 132, and the heat dissipation cavity 111. When alternating current is passed through the coil of the magnetic core 132 of the magnetic part 131, a magnetic field with constantly changing polarity is generated on the magnetic core 132 according to the magnetic effect of the current. The magnetic force of attraction or repulsion generated by the magnetic core 132 and the magnetic part 131 enables the magnetic core 132 to drive the vibration part 120 to vibrate. As the vibration part 120 vibrates, air can be pumped into or out of the heat dissipation box 110 under the action of the vibration part 120, thereby increasing the flow rate of the air in the heat dissipation box 110, thereby quickly bringing the heat in the heat dissipation cavity 111 to the outside, thereby improving the heat dissipation efficiency of the display module.

[0035] In this embodiment, the vibration member 120 is fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 is fixed to the bottom wall of the heat dissipation cavity 111. By setting the vibration member 120 to be fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 is fixed to the bottom wall of the heat dissipation cavity 111, that is, the vibration member 120, the magnetic core 132, and the vibration member 120 are all located in the heat dissipation box, the volume of the heat dissipation device can be reduced, and the structure of the heat dissipation device can be made more compact.

[0036] In this embodiment, the vibration member 120 is fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the bottom wall of the heat dissipation cavity 111. By setting the vibration member 120 to be fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the bottom wall of the heat dissipation cavity 111, that is, the vibration member 120, the magnetic core 132, and the magnetic member 131 are all located in the heat dissipation box, the volume of the heat dissipation device can be reduced, and the structure of the heat dissipation device can be made more compact.

[0037] In this embodiment, the vibration member 120 is fixed to the bottom of the heat dissipation box 110, the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 is fixed to the top wall of the heat dissipation cavity 111. By fixing the vibration member 120 to the bottom of the heat dissipation box 110, the magnetic core 132 to the vibration member 120, and the magnetic member 131 to the top wall of the heat dissipation cavity 111, it is possible to avoid the magnetic core 132 from colliding with the top wall of the heat dissipation cavity 111 when the heat dissipation device is working, causing the heat dissipation device to produce abnormal noise.

[0038] In this embodiment, the vibration member 120 is fixed to the bottom of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111. By fixing the vibration member 120 to the bottom of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111, it is possible to avoid the magnetic core 132 from colliding with the top wall of the heat dissipation cavity 111 when the heat dissipation device is working, causing the heat dissipation device to produce abnormal noise.

[0039] In this embodiment, reference Figure 3The heat dissipation device 100 further includes a flexible support member 140, through which the magnetic core 132 is fixed to the top wall of the heat dissipation cavity 111. Since the magnetic core 132 is heavy, and the vibration member 120 is generally a thin sheet structure, the magnetic core 132 is fixed to the top wall of the heat dissipation cavity 111 through the flexible support member 140. The flexible support member 140 can provide a part of the pulling force for the magnetic core 132, so as to avoid the magnetic core 132 being supported only by the vibration member 120, causing damage to the vibration member 120, thereby improving the stability of the magnetic core 132 during operation. At the same time, the flexible support member 140 can follow the vibration of the vibration member 120 to ensure that the magnetic core 132 can work normally.

[0040] In this embodiment, two flexible support members 140 are provided, and the two flexible support members 140 are located on both sides of the magnetic core 132, one end of one of the flexible support members 140 is fixed to the side wall of the first side of the magnetic core 132, and the other end of one of the flexible support members 140 is fixed to the top wall of the heat dissipation cavity 111, one end of the other flexible support member 140 is fixed to the side wall of the second side of the magnetic core 132, and the other end of the other flexible support member 140 is fixed to the top wall of the heat dissipation cavity 111, and the first side of the magnetic core 132 is opposite to the second side. By setting two flexible support members 140, the two flexible support members 140 are located on both sides of the magnetic core 132, one end of one of the flexible support members 140 is fixed to the side wall of the first side of the magnetic core 132, and the other end of one of the flexible support members 140 is fixed to the top wall of the heat dissipation cavity 111, one end of the other flexible support member 140 is fixed to the side wall of the second side of the magnetic core 132, and the other end of the other flexible support member 140 is fixed to the top wall of the heat dissipation cavity 111, the first side of the magnetic core 132 is opposite to the second side, the two flexible support members 140 can provide pulling force for both sides of the magnetic core 132 at the same time, to ensure that the magnetic core 132 can move up and down more stably in the vertical direction, to avoid the position of the magnetic core 132 being offset and causing abnormal operation of the heat dissipation device 100.

[0041] In this embodiment, reference Figure 3 The vibration member 120 is located outside the heat dissipation cavity 111, and an opening 1112 is provided at the bottom of the heat dissipation cavity 111, wherein one end of the magnetic core 132 passes through the opening 1112 and is fixed to the vibration member 120. By arranging the vibration member 120 outside the heat dissipation cavity 111, and an opening 1112 is provided at the bottom of the heat dissipation cavity 111, and one end of the magnetic core 132 passes through the opening 1112 and is fixed to the vibration member 120, the vibration member 120 has a larger vibration amplitude in the vertical direction, thereby further improving the heat dissipation efficiency of the heat dissipation device 100.

[0042] In this embodiment, the vibration member 120 is located inside the heat dissipation cavity 111, wherein one end of the magnetic core 132 is fixed to the vibration member 120. By locating the vibration member 120 inside the heat dissipation cavity 111, wherein one end of the magnetic core 132 is fixed to the vibration member 120, the volume of the heat dissipation device 100 can be reduced, making the heat dissipation device 100 more compact as a whole.

[0043] In this embodiment, the top wall of the heat dissipation cavity 111 is provided with a plurality of spaced strip-shaped protrusions 1113. By providing the top wall of the heat dissipation cavity 111 with a plurality of spaced strip-shaped protrusions 1113, the strip-shaped protrusions 1113 can increase the contact area between the heat dissipation box 110 and the air inside the heat dissipation cavity 111, thereby further improving the heat dissipation efficiency of the heat dissipation device 100.

[0044] In this embodiment, the vent hole 1111 is located on the side wall of the heat dissipation cavity 111 .

[0045] In this embodiment, the vent holes 1111 are located on the side walls of both sides of the heat dissipation cavity 111 .

[0046] In this embodiment, the vent holes 1111 are located on the four side walls of the heat dissipation cavity 111 .

[0047] In this embodiment, the ratio of the distance from the vent hole 1111 to the top wall of the heat dissipation cavity 111 to the distance from the vent hole 1111 to the bottom wall of the heat dissipation cavity 111 is not greater than 1 / 3.

[0048] In this embodiment, the vibration member 120 is an air blowing skin.

[0049] In this embodiment, the heat dissipation box 110 is made of metal. Specifically, the material of the heat dissipation box 110 includes at least one of copper, aluminum, and molybdenum.

[0050] In this embodiment, the material of the magnetic core 132 includes at least one of iron, cobalt, and nickel.

[0051] In this embodiment, the material of the magnetic core 132 is a metal oxide of iron, cobalt or nickel.

[0052] In this embodiment, the material of the coil of the magnetic core 132 includes copper, aluminum, gold or silver.

[0053] In this embodiment, the material of the magnetic member 131 is magnet or aluminum nickel cobalt alloy.

[0054] The second embodiment of the present application provides a second heat dissipation device 100, referring to Figure 2 , Figure 4The heat dissipation device 100 includes a heat dissipation box 110, a vibration member 120 and a magnetic unit 130. The magnetic unit 130 includes a magnetic member 131 and a magnetic core 132. A heat dissipation cavity 111 is provided in the heat dissipation box 110. The heat dissipation cavity 111 is provided with a vent hole 1111. The vibration member 120 is fixed to the heat dissipation box 110. One of the magnetic member 131 and the magnetic core 132 is fixed to the vibration member 120, and the other of the magnetic member 131 and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111. And the magnetic core 132 is arranged corresponding to the magnetic part 131; the heat dissipation cavity 111 of the magnetic part 131, the magnetic core 132, the vibration part 120, and the middle area of ​​the magnetic part 131 are provided with a accommodating groove 1311, the extension direction of the accommodating groove 1311 is the same as the moving direction of the magnetic core 132, and a part of the magnetic core 132 is located in the accommodating groove 1311; when alternating current is passed through the coil of the magnetic core 132, the magnetic force generated by the magnetic core 132 that attracts or repels the magnetic part 131 is used to drive the vibration part 120 to vibrate.

[0055] The heat dissipation device 100 includes a vibration member 120 and a magnetic unit 130, wherein the magnetic unit 130 includes a magnetic member 131 and a magnetic core 132, and the vibration member 120 is fixed to the heat dissipation box, one of the magnetic member 131 and the magnetic core 132 is fixed to the vibration member 120, and the other of the magnetic member 131 and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111. A receiving groove 1311 is provided in the middle area of ​​the vibration member 120, the magnetic member 131, the heat dissipation cavity 111, the magnetic core 132, the vibration member 120, and the magnetic member 131. The extending direction of the receiving groove 1311 is the same as the moving direction of the magnetic core 132, and a part of the magnetic core 132 is located in the receiving groove 1311. When alternating current is passed through the coil of the magnetic core 132, a magnetic field with continuously changing polarity is generated on the magnetic core 132 according to the magnetic effect of the current, and the magnetic core 132 generates a magnetic field that is attracted to the magnetic member 131. Or repulsive magnetic force, the magnetic core 132 can drive the vibration member 120 to vibrate. As the vibration member 120 vibrates, air can be pumped into or out of the heat dissipation box 110 under the action of the vibration member 120, thereby increasing the flow rate of the air in the heat dissipation box 110 and quickly bringing the heat in the heat dissipation cavity 111 to the outside, thereby improving the heat dissipation efficiency of the heat dissipation device 100; at the same time, since a part of the magnetic core 132 is located in the accommodating groove 1311, the side wall of the magnetic member 131 can limit the magnetic core 132 in the horizontal direction. On the one hand, the flexible support member 140 is omitted, reducing the complexity of the structure of the heat dissipation device 100; on the other hand, the magnetic core 132 can always face the accommodating groove 1311 of the magnetic member 131, avoiding the relative position of the magnetic core 132 and the magnetic member 131 from shifting, thereby ensuring the working stability of the heat dissipation device 100.

[0056] In this embodiment, the vibration member 120 is fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 is fixed to the bottom wall of the heat dissipation cavity 111. By setting the vibration member 120 to be fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 is fixed to the bottom wall of the heat dissipation cavity 111, that is, the vibration member 120, the magnetic core 132, and the vibration member 120 are all located in the heat dissipation box, the volume of the heat dissipation device can be reduced, and the structure of the heat dissipation device can be made more compact.

[0057] In this embodiment, the vibration member 120 is fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the bottom wall of the heat dissipation cavity 111. By setting the vibration member 120 to be fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the bottom wall of the heat dissipation cavity 111, that is, the vibration member 120, the magnetic core 132, and the magnetic member 131 are all located in the heat dissipation box, the volume of the heat dissipation device can be reduced, and the structure of the heat dissipation device can be made more compact.

[0058] In this embodiment, the vibration member 120 is fixed to the bottom of the heat dissipation box 110, the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 is fixed to the top wall of the heat dissipation cavity 111. By fixing the vibration member 120 to the bottom of the heat dissipation box 110, the magnetic core 132 to the vibration member 120, and the magnetic member 131 to the top wall of the heat dissipation cavity 111, it is possible to avoid the magnetic core 132 from colliding with the top wall of the heat dissipation cavity 111 when the heat dissipation device is working, causing the heat dissipation device to produce abnormal noise.

[0059] In this embodiment, the vibration member 120 is fixed to the bottom of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111. By fixing the vibration member 120 to the bottom of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111, it is possible to avoid the magnetic core 132 from colliding with the top wall of the heat dissipation cavity 111 when the heat dissipation device is working, causing the heat dissipation device to produce abnormal noise.

[0060] In this embodiment, reference Figure 4 The receiving groove 1311 is cylindrical, and the inner diameter of the receiving groove 1311 is equal to the diameter of the magnetic core 132 .

[0061] In this embodiment, reference Figure 4The vibration member 120 is located outside the heat dissipation cavity 111, and an opening 1112 is provided at the bottom of the heat dissipation cavity 111, wherein one end of the magnetic core 132 passes through the opening 1112 and is fixed to the vibration member 120. By arranging the vibration member 120 outside the heat dissipation cavity 111, and an opening 1112 is provided at the bottom of the heat dissipation cavity 111, and one end of the magnetic core 132 passes through the opening 1112 and is fixed to the vibration member 120, the vibration member 120 has a larger vibration amplitude in the vertical direction, thereby further improving the heat dissipation efficiency of the heat dissipation device 100.

[0062] In this embodiment, the vibration member 120 is located inside the heat dissipation cavity 111, wherein one end of the magnetic core 132 is fixed to the vibration member 120. By locating the vibration member 120 inside the heat dissipation cavity 111, wherein one end of the magnetic core 132 is fixed to the vibration member 120, the volume of the heat dissipation device 100 can be reduced, making the heat dissipation device 100 more compact as a whole.

[0063] In this embodiment, the top wall of the heat dissipation cavity 111 is provided with a plurality of spaced strip-shaped protrusions 1113. By providing the top wall of the heat dissipation cavity 111 with a plurality of spaced strip-shaped protrusions 1113, the strip-shaped protrusions 1113 can increase the contact area between the heat dissipation box 110 and the air inside the heat dissipation cavity 111, thereby further improving the heat dissipation efficiency of the heat dissipation device 100.

[0064] In this embodiment, the vent hole 1111 is located on the side wall of the heat dissipation cavity 111 .

[0065] In this embodiment, the vent holes 1111 are located on the side walls of both sides of the heat dissipation cavity 111 .

[0066] In this embodiment, the vent holes 1111 are located on the four side walls of the heat dissipation cavity 111 .

[0067] In this embodiment, the ratio of the distance from the vent hole 1111 to the top wall of the heat dissipation cavity 111 to the distance from the vent hole 1111 to the bottom wall of the heat dissipation cavity 111 is not greater than 1 / 3.

[0068] In this embodiment, the vibration member 120 is an air blowing skin.

[0069] In this embodiment, the heat dissipation box 110 is made of metal. Specifically, the material of the heat dissipation box 110 includes at least one of copper, aluminum, and molybdenum.

[0070] In this embodiment, the material of the magnetic core 132 includes at least one of iron, cobalt, and nickel.

[0071] In this embodiment, the material of the magnetic core 132 is a metal oxide of iron, cobalt or nickel.

[0072] In this embodiment, the material of the coil of the magnetic core 132 includes copper, aluminum, gold or silver.

[0073] In this embodiment, the material of the magnetic member 131 is magnet or aluminum nickel cobalt alloy.

[0074] The third embodiment of the present application provides a first display module, referring to Figure 5 The display module includes a heat dissipation device 100, and the display module also includes a display panel 200. The heat dissipation device 100 is arranged on the non-display surface of the display panel 200. The heat dissipation device 100 includes a heat dissipation box 110, a vibration member 120 and a magnetic unit 130. The magnetic unit 130 includes a magnetic member 131 and a magnetic core 132. A heat dissipation cavity 111 is provided in the heat dissipation box 110, and a vent hole 1111 is provided on the heat dissipation cavity 111; the vibration member 120 is fixed to the heat dissipation box 110; the magnetic member 131 and the magnetic core 132 are fixed to each other. One is fixed to the vibration member 120, and the other of the magnetic member 131 and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111, and the magnetic core 132 is arranged corresponding to the magnetic member 131; in the top view of the magnetic member 131 heat dissipation cavity 111 magnetic core 132 vibration member 120, the magnetic core 132 overlaps with a part of the magnetic member 131; when alternating current is passed through the coil of the magnetic core 132, the magnetic force generated by the magnetic core 132 that attracts or repels the magnetic member 131 is used to drive the vibration member 120 to vibrate.

[0075] The heat dissipation device 100 includes a vibration member 120 and a magnetic unit 130, wherein the magnetic unit 130 includes a magnetic member 131 and a magnetic core 132, and the vibration member 120 is fixed to the heat dissipation box, one of the magnetic member 131 and the magnetic core 132 is fixed to the vibration member 120, and the other of the magnetic member 131 and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111. In the top view of the heat dissipation device, a part of the magnetic core 132 overlaps with the magnetic member 131, and when alternating current is passed through the coil of the magnetic core 132, according to the magnetic effect of the current, The magnetic core 132 generates a magnetic field with constantly changing polarity. The magnetic force generated by the magnetic core 132 and the magnetic member 131 attracts or repels each other, so that the magnetic attraction can drive the vibration member 120 to vibrate. As the vibration member 120 vibrates, air can be pumped into or out of the heat dissipation box 110 under the action of the vibration member 120, thereby increasing the flow rate of air in the heat dissipation box 110, thereby quickly bringing the heat radiated from the heat dissipation box 110 in contact with the display panel 200 to the heat dissipation cavity 111 to the outside, thereby improving the heat dissipation efficiency of the display module, thereby avoiding the problem of poor display of the display module and reduced life of semiconductor devices due to the internal high-temperature working environment of the display module.

[0076] In this embodiment, the vibration member 120 is fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 is fixed to the bottom wall of the heat dissipation cavity 111. By setting the vibration member 120 to be fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 is fixed to the bottom wall of the heat dissipation cavity 111, that is, the vibration member 120, the magnetic core 132, and the vibration member 120 are all located in the heat dissipation box, the volume of the display module can be reduced, and the structure of the display module is made more compact.

[0077] In this embodiment, the vibration member 120 is fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the bottom wall of the heat dissipation cavity 111. By setting the vibration member 120 to be fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic member 131 to be fixed to the vibration member 120, and the magnetic core 132 to be fixed to the bottom wall of the heat dissipation cavity 111, that is, the vibration member 120, the magnetic core 132, and the magnetic member 131 are all located in the heat dissipation box, the volume of the display module can be reduced, and the structure of the display module can be more compact.

[0078] In the present embodiment, the vibration member 120 is fixed to the bottom of the heat dissipation box 110, the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 is fixed to the top wall of the heat dissipation cavity 111. In order to avoid an increase in the thickness of the display module, the thickness of the heat dissipation device needs to be set to be smaller. However, when the thickness of the heat dissipation device is smaller, the vibration member 120 is fixed to the top wall of the heat dissipation box. When the heat dissipation device is working, the magnetic core 132 is easy to collide with the top wall of the heat dissipation cavity 111, causing the display module to produce abnormal noise. Therefore, by setting the vibration member 120 to be fixed to the bottom of the heat dissipation box 110, the magnetic core 132 to be fixed to the vibration member 120, and the magnetic member 131 to be fixed to the top wall of the heat dissipation cavity 111, it is possible to avoid the collision of the magnetic core 132 with the top wall of the heat dissipation cavity 111 when the heat dissipation device is working, causing the display module to produce abnormal noise.

[0079] In this embodiment, the vibration member 120 is fixed to the bottom of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111. In order to avoid an increase in the thickness of the display module, the thickness of the heat dissipation device needs to be set to be smaller. However, when the thickness of the heat dissipation device is smaller, the vibration member 120 is fixed to the top wall of the heat dissipation box. When the heat dissipation device is working, the magnetic member 131 is easy to collide with the top wall of the heat dissipation cavity 111, causing the display module to produce abnormal noise. Therefore, by setting the vibration member 120 to be fixed to the bottom of the heat dissipation box 110, the magnetic member 131 to be fixed to the vibration member 120, and the magnetic core 132 to be fixed to the inner wall of the heat dissipation cavity 111, it is possible to avoid the collision of the magnetic core 132 with the top wall of the heat dissipation cavity 111 when the heat dissipation device is working, causing the display module to produce abnormal noise.

[0080] In this embodiment, the heat dissipation device 100 is fixed to the non-display surface of the display panel 200 by means of the thermal conductive adhesive 300. Specifically, the heat dissipation box 110 is fixed to the non-display surface of the display panel 200 by means of the thermal conductive adhesive 300.

[0081] In this embodiment, the display panel 200 is a Micro-LED display panel 200 .

[0082] In this embodiment, reference Figure 5 The heat dissipation device 100 further includes a flexible support member 140, through which the magnetic core 132 is fixed to the top wall of the heat dissipation cavity 111. Since the magnetic core 132 is heavy, and the vibration member 120 is generally a thin sheet structure, the magnetic core 132 is fixed to the top wall of the heat dissipation cavity 111 through the flexible support member 140. The flexible support member 140 can provide a part of the pulling force for the magnetic core 132, so as to avoid the magnetic core 132 being supported only by the vibration member 120, causing damage to the vibration member 120, thereby improving the stability of the magnetic core 132 during operation. At the same time, the flexible support member 140 can follow the vibration of the vibration member 120 to ensure that the magnetic core 132 can work normally.

[0083] In this embodiment, two flexible support members 140 are provided, and the two flexible support members 140 are located on both sides of the magnetic core 132, one end of one of the flexible support members 140 is fixed to the side wall of the first side of the magnetic core 132, and the other end of one of the flexible support members 140 is fixed to the top wall of the heat dissipation cavity 111, one end of the other flexible support member 140 is fixed to the side wall of the second side of the magnetic core 132, and the other end of the other flexible support member 140 is fixed to the top wall of the heat dissipation cavity 111, and the first side of the magnetic core 132 is opposite to the second side. By setting two flexible support members 140, the two flexible support members 140 are located on both sides of the magnetic core 132, one end of one of the flexible support members 140 is fixed to the side wall of the first side of the magnetic core 132, and the other end of one of the flexible support members 140 is fixed to the top wall of the heat dissipation cavity 111, one end of the other flexible support member 140 is fixed to the side wall of the second side of the magnetic core 132, and the other end of the other flexible support member 140 is fixed to the top wall of the heat dissipation cavity 111, the first side of the magnetic core 132 is opposite to the second side, the two flexible support members 140 can provide pulling force for both sides of the magnetic core 132 at the same time, to ensure that the magnetic core 132 can move up and down more stably in the vertical direction, to avoid the position of the magnetic core 132 being offset and causing abnormal operation of the heat dissipation device 100.

[0084] In this embodiment, reference Figure 5The vibration member 120 is located outside the heat dissipation cavity 111, and an opening 1112 is provided at the bottom of the heat dissipation cavity 111, wherein one end of the magnetic core 132 passes through the opening 1112 and is fixed to the vibration member 120. By arranging the vibration member 120 outside the heat dissipation cavity 111, and an opening 1112 is provided at the bottom of the heat dissipation cavity 111, wherein one end of the magnetic core 132 passes through the opening 1112 and is fixed to the vibration member 120, the vibration member 120 has a larger vibration amplitude in the vertical direction, thereby further improving the heat dissipation efficiency of the heat dissipation device 100.

[0085] In this embodiment, the vibration member 120 is located inside the heat dissipation cavity 111, wherein one end of the magnetic core 132 is fixed to the vibration member 120. By locating the vibration member 120 inside the heat dissipation cavity 111, wherein one end of the magnetic core 132 is fixed to the vibration member 120, the volume of the heat dissipation device 100 can be reduced, thereby saving the space of the display module occupied by the heat dissipation device 100.

[0086] In this embodiment, the top wall of the heat dissipation cavity 111 is provided with a plurality of spaced strip-shaped protrusions 1113. By providing the top wall of the heat dissipation cavity 111 with a plurality of spaced strip-shaped protrusions 1113, the strip-shaped protrusions 1113 can increase the contact area between the heat dissipation box 110 and the air inside the heat dissipation cavity 111, thereby further improving the heat dissipation efficiency of the display module.

[0087] In this embodiment, the vent hole 1111 is located on the side wall of the heat dissipation cavity 111 .

[0088] In this embodiment, the vent holes 1111 are located on the side walls of both sides of the heat dissipation cavity 111 .

[0089] In this embodiment, the vent holes 1111 are located on the four side walls of the heat dissipation cavity 111 .

[0090] In this embodiment, the ratio of the distance from the vent 1111 to the top wall of the heat dissipation cavity 111 to the distance from the vent 1111 to the bottom wall of the heat dissipation cavity 111 is not greater than 1 / 3. Since the heat of the display module is conducted to the inside of the heat dissipation cavity 111 through the top wall of the heat dissipation device, the temperature of the side of the heat dissipation device close to the display device is greater than the temperature of the side of the heat dissipation device away from the display device, so the temperature of the side of the heat dissipation cavity 111 close to the display device will be greater than the temperature of the side of the heat dissipation cavity 111 away from the display device. By setting the ratio of the distance from the vent 1111 to the top wall of the heat dissipation cavity 111 to the distance from the vent 1111 to the bottom wall of the heat dissipation cavity 111 to be not greater than 1 / 3, the part of the heat dissipation cavity 111 with a higher temperature close to the display device can preferentially achieve gas exchange through the vent, thereby further improving the heat dissipation efficiency of the display module.

[0091] In this embodiment, the vibration member 120 is an air blowing skin.

[0092] In this embodiment, the heat dissipation box 110 is made of metal. Specifically, the material of the heat dissipation box 110 includes at least one of copper, aluminum, and molybdenum.

[0093] In this embodiment, the material of the magnetic core 132 includes at least one of iron, cobalt, and nickel.

[0094] In this embodiment, the material of the magnetic core 132 is a metal oxide of iron, cobalt or nickel.

[0095] In this embodiment, the material of the coil of the magnetic core 132 includes copper, aluminum, gold or silver.

[0096] In this embodiment, the material of the magnetic member 131 is magnet or aluminum nickel cobalt alloy.

[0097] The fourth embodiment of the present application provides a second display module, referring to Figure 6 The display module includes a heat dissipation device 100, and the display module also includes a display panel 200. The heat dissipation device 100 is arranged on the non-display surface of the display panel 200. The heat dissipation device 100 includes a heat dissipation box 110, a vibration member 120 and a magnetic unit 130. The magnetic unit 130 includes a magnetic member 131 and a magnetic core 132. A heat dissipation cavity 111 is provided in the heat dissipation box 110, and a vent hole 1111 is provided on the heat dissipation cavity 111; the vibration member 120 is fixed to the heat dissipation box 110; one of the magnetic member 131 and the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 The other one of the magnetic cores 132 is fixed to the inner wall of the heat dissipation cavity 111, and the magnetic core 132 is arranged corresponding to the magnetic part 131; the magnetic part 131 heat dissipation cavity 111 magnetic core 132 vibration part 120 and the middle area of ​​the magnetic part 131 are provided with a receiving groove 1311, the extension direction of the receiving groove 1311 is the same as the moving direction of the magnetic core 132, and a part of the magnetic core 132 is located in the receiving groove 1311; when the coil of the magnetic core 132 is supplied with alternating current, the magnetic force generated by the magnetic core 132 that attracts or repels the magnetic part 131 is used to drive the vibration part 120 to vibrate.

[0098] The heat dissipation device 100 includes a vibration member 120 and a magnetic unit 130, wherein the magnetic unit 130 includes a magnetic member 131 and a magnetic core 132, and the vibration member 120 is fixed to the heat dissipation box, one of the magnetic member 131 and the magnetic core 132 is fixed to the vibration member 120, and the other of the magnetic member 131 and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111, and the vibration member 120, the magnetic member 131, the heat dissipation cavity 111, the magnetic core 132, the vibration member 120, and the magnetic member 131 are fixed to the inner wall of the heat dissipation cavity 111. A receiving groove 1311 is provided in the region. The extending direction of the receiving groove 1311 is the same as the moving direction of the magnetic core 132. A part of the magnetic core 132 is located in the receiving groove 1311. When an alternating current is passed through the coil of the magnetic core 132, a magnetic field with a continuously changing polarity is generated on the magnetic core 132 according to the magnetic effect of the current. The magnetic force generated by the magnetic core 132 that attracts or repels the magnetic member 131 enables the magnetic core 132 to drive the vibration member 120 to vibrate. As the vibration member 120 vibrates, the air energy Under the action of the vibration member 120, the air can be pumped into or out of the heat dissipation box 110, thereby increasing the flow rate of the air in the heat dissipation box 110, thereby quickly bringing the heat radiated from the heat dissipation box 110 in contact with the display panel 200 to the heat dissipation cavity 111 to the outside, thereby improving the heat dissipation efficiency of the display module, thereby avoiding the problem of poor display of the display module and reduced life of the semiconductor device due to the continuous high-temperature working environment inside the display module; at the same time, since a part of the magnetic core 132 is located in the accommodating groove 1311, the side wall of the magnetic member 131 can limit the magnetic core 132 in the horizontal direction. On the one hand, the flexible support member 140 is omitted, thereby reducing the complexity of the structure of the heat dissipation module, and then reducing the complexity of the structure of the display module; on the other hand, the magnetic core 132 can always face the accommodating groove 1311 of the magnetic member 131, thereby avoiding the relative position of the magnetic core 132 and the magnetic member 131 from shifting, thereby ensuring the working stability of the heat dissipation device 100.

[0099] In this embodiment, the vibration member 120 is fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 is fixed to the bottom wall of the heat dissipation cavity 111. By setting the vibration member 120 to be fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 is fixed to the bottom wall of the heat dissipation cavity 111, that is, the vibration member 120, the magnetic core 132, and the vibration member 120 are all located in the heat dissipation box, the volume of the display module can be reduced, and the structure of the display module is made more compact.

[0100] In this embodiment, the vibration member 120 is fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the bottom wall of the heat dissipation cavity 111. By setting the vibration member 120 to be fixed to the top wall of the heat dissipation cavity 111 of the heat dissipation box 110, the magnetic member 131 to be fixed to the vibration member 120, and the magnetic core 132 to be fixed to the bottom wall of the heat dissipation cavity 111, that is, the vibration member 120, the magnetic core 132, and the magnetic member 131 are all located in the heat dissipation box, the volume of the display module can be reduced, and the structure of the display module can be more compact.

[0101] In the present embodiment, the vibration member 120 is fixed to the bottom of the heat dissipation box 110, the magnetic core 132 is fixed to the vibration member 120, and the magnetic member 131 is fixed to the top wall of the heat dissipation cavity 111. In order to avoid an increase in the thickness of the display module, the thickness of the heat dissipation device needs to be set to be smaller. However, when the thickness of the heat dissipation device is smaller, the vibration member 120 is fixed to the top wall of the heat dissipation box. When the heat dissipation device is working, the magnetic core 132 is easy to collide with the top wall of the heat dissipation cavity 111, causing the display module to produce abnormal noise. Therefore, by setting the vibration member 120 to be fixed to the bottom of the heat dissipation box 110, the magnetic core 132 to be fixed to the vibration member 120, and the magnetic member 131 to be fixed to the top wall of the heat dissipation cavity 111, it is possible to avoid the collision of the magnetic core 132 with the top wall of the heat dissipation cavity 111 when the heat dissipation device is working, causing the display module to produce abnormal noise.

[0102] In this embodiment, the vibration member 120 is fixed to the bottom of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111. In order to avoid the thickness of the display module from increasing, the thickness of the heat dissipation device needs to be set to be smaller. However, when the thickness of the heat dissipation device is smaller, the vibration member 120 is fixed to the top wall of the heat dissipation box. When the heat dissipation device is working, the magnetic member 131 is easy to collide with the top wall of the heat dissipation cavity 111, causing the display module to produce abnormal noise. Therefore, by setting the vibration member 120 to be fixed to the bottom of the heat dissipation box 110, the magnetic member 131 is fixed to the vibration member 120, and the magnetic core 132 is fixed to the inner wall of the heat dissipation cavity 111, it is possible to avoid the collision of the magnetic core 132 with the top wall of the heat dissipation cavity 111 when the heat dissipation device is working, causing the display module to produce abnormal noise. In this embodiment, the heat dissipation device 100 is fixed to the non-display surface of the display panel 200 by the thermal conductive glue 300. Specifically, the heat dissipation box 110 is fixed to the non-display surface of the display panel 200 by means of a thermal conductive adhesive 300 .

[0103] In this embodiment, the display panel 200 is a Micro-LED display panel 200 .

[0104] In this embodiment, reference Figure 6 The receiving groove 1311 is cylindrical, and the inner diameter of the receiving groove 1311 is equal to the diameter of the magnetic core 132 .

[0105] In this embodiment, reference Figure 6 The vibration member 120 is located outside the heat dissipation cavity 111, and an opening 1112 is provided at the bottom of the heat dissipation cavity 111, wherein one end of the magnetic core 132 passes through the opening 1112 and is fixed to the vibration member 120. By arranging the vibration member 120 outside the heat dissipation cavity 111, and an opening 1112 is provided at the bottom of the heat dissipation cavity 111, wherein one end of the magnetic core 132 passes through the opening 1112 and is fixed to the vibration member 120, the vibration member 120 has a larger vibration amplitude in the vertical direction, thereby further improving the heat dissipation efficiency of the heat dissipation device 100.

[0106] In this embodiment, the vibration member 120 is located inside the heat dissipation cavity 111, wherein one end of the magnetic core 132 is fixed to the vibration member 120. By locating the vibration member 120 inside the heat dissipation cavity 111, wherein one end of the magnetic core 132 is fixed to the vibration member 120, the volume of the heat dissipation device 100 can be reduced, thereby saving the space occupied by the display module.

[0107] In this embodiment, reference Figure 7 The top wall of the heat dissipation cavity 111 is provided with a plurality of spaced strip-shaped protrusions 1113. By providing the top wall of the heat dissipation cavity 111 with a plurality of spaced strip-shaped protrusions 1113, the strip-shaped protrusions 1113 can increase the contact area between the heat dissipation box 110 and the air inside the heat dissipation cavity 111, thereby further improving the heat dissipation efficiency of the display module.

[0108] In this embodiment, the vent hole 1111 is located on the side wall of the heat dissipation cavity 111 .

[0109] In this embodiment, the vent holes 1111 are located on the side walls of both sides of the heat dissipation cavity 111 .

[0110] In this embodiment, the vent holes 1111 are located on the four side walls of the heat dissipation cavity 111 .

[0111] In this embodiment, the ratio of the distance from the vent 1111 to the top wall of the heat dissipation cavity 111 to the distance from the vent 1111 to the bottom wall of the heat dissipation cavity 111 is not greater than 1 / 3. Since the heat of the display module is conducted to the inside of the heat dissipation cavity 111 through the top wall of the heat dissipation device, the temperature of the side of the heat dissipation device close to the display device is greater than the temperature of the side of the heat dissipation device away from the display device, so the temperature of the side of the heat dissipation cavity 111 close to the display device will be greater than the temperature of the side of the heat dissipation cavity 111 away from the display device. By setting the ratio of the distance from the vent 1111 to the top wall of the heat dissipation cavity 111 to the distance from the vent 1111 to the bottom wall of the heat dissipation cavity 111 to be not greater than 1 / 3, the part of the heat dissipation cavity 111 with a higher temperature close to the display device can preferentially achieve gas exchange through the vent, thereby further improving the heat dissipation efficiency of the display module.

[0112] In this embodiment, the vibration member 120 is an air blowing skin.

[0113] In this embodiment, the heat dissipation box 110 is made of metal. Specifically, the material of the heat dissipation box 110 includes at least one of copper, aluminum, and molybdenum.

[0114] In this embodiment, the material of the magnetic core 132 includes at least one of iron, cobalt, and nickel.

[0115] In this embodiment, the material of the magnetic core 132 is a metal oxide of iron, cobalt or nickel.

[0116] In this embodiment, the material of the coil of the magnetic core 132 includes copper, aluminum, gold or silver.

[0117] In this embodiment, the material of the magnetic member 131 is magnet or aluminum nickel cobalt alloy.

[0118] The above is a detailed description of the specific implementation of the present application. The above implementation disclosed in the present application is only the preferred implementation of the present application. For ordinary technicians in this field, many modifications and improvements can be made without departing from the concept of the present application. These modifications and improvements all fall within the scope of protection defined by the claims of the present application.

Claims

1. A heat dissipation device, characterized in that: include: A heat dissipation box, wherein a heat dissipation cavity is provided in the heat dissipation box, and a vent hole is provided on the heat dissipation cavity; A vibration member, wherein the vibration member is fixed to the heat dissipation box; A magnetic unit, the magnetic unit comprising a magnetic member and a magnetic core, one of the magnetic member and the magnetic core is fixed to the vibration member, the other of the magnetic member and the magnetic core is fixed to the inner wall of the heat dissipation cavity, and the magnetic core is arranged corresponding to the magnetic member; When alternating current is passed through the coil of the magnetic core, the magnetic force of attraction or repulsion generated by the magnetic core and the magnetic member is used to drive the vibration member to vibrate.

2. The heat dissipation device according to claim 1, characterized in that: In a top view of the heat dissipation device, the magnetic core overlaps with a portion of the magnetic component.

3. The heat dissipation device according to claim 2, characterized in that: The heat dissipation device further comprises a flexible support member, and the magnetic core is fixed to the top wall of the heat dissipation cavity through the flexible support member.

4. The heat dissipation device according to claim 1, characterized in that: A receiving groove is provided in the middle area of ​​the magnetic member, the extending direction of the receiving groove is the same as the moving direction of the magnetic core, and a part of the magnetic core is located in the receiving groove.

5. The heat dissipation device according to claim 4, characterized in that: The containing groove is cylindrical, and the inner diameter of the containing groove is equal to the diameter of the magnetic core.

6. The heat dissipation device according to claim 1, characterized in that: The vibration member is located outside the heat dissipation cavity, and an opening is provided at the bottom of the heat dissipation cavity, wherein one end of the magnetic core passes through the opening and is fixed to the vibration member.

7. The heat dissipation device according to claim 1, characterized in that: The vibration member is located inside the heat dissipation cavity, wherein one end of the magnetic core is fixed to the vibration member.

8. The heat dissipation device according to claim 1, characterized in that: The top wall of the heat dissipation cavity is provided with a plurality of spaced strip-shaped protrusions.

9. The heat dissipation device according to claim 1, characterized in that: The vent holes are located on the side walls of the heat dissipation cavity.

10. A display module, characterized in that: The heat dissipation device comprises the heat dissipation device according to any one of claims 1 to 9, wherein the display module further comprises a display panel, and the heat dissipation device is arranged on the non-display surface of the display panel.

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