Preparation method, device and equipment of electronic paper panel and storage medium

Abstract

The invention relates to the technical field of electronic paper, and discloses a preparation method and device of an electronic paper panel, equipment and a storage medium. According to the method, when the electronic paper panel is prepared, the preparation process of an organic insulating layer and a shading layer is improved, development is not carried out after exposure operation is carried out on organic insulating layer photoresist, and film coating and photoresist coating operation is carried out on the organic insulating layer photoresist by adopting shading layer metal; developing the organic insulating layer photoresist and the shading layer metal together to form a reserved region and a removed region; and performing etching and photoresist removing operation subsequently to generate an organic insulating layer and a shading layer. By improving the preparation process of the electronic board panel, the production process is simplified, and the production cost is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic paper, and in particular to a method, device, equipment and storage medium for preparing an electronic paper panel. Background Art

[0002] Display technology has always been one of the important research directions in electronic devices. Among them, electronic paper is an ultra-thin and ultra-light display whose display is very close to the presentation effect of natural paper. Due to its many unique advantages, electronic paper technology has developed rapidly. Electronic paper is extremely thin and light and can be bent at will, breaking away from the shape constraints of traditional displays. It is more durable and not easy to break.

[0003] The backplane of the electronic paper currently used outdoors generally has an 8-layer structure, including a gate layer, a semiconductor layer / insulating layer, a gate insulating layer, a source-drain layer, a second insulating layer, an organic insulating layer, a light shielding layer, and a pixel electrode layer. Each layer of the structure needs to be prepared through the production process of film formation-cleaning-photoresist coating-exposure-development-etching-photoresist removal-inspection. There are many production processes and high costs. Summary of the invention

[0004] The present invention provides a method, device, equipment and storage medium for preparing an electronic paper panel, which simplifies the production process of the electronic paper panel and effectively reduces the production cost.

[0005] In order to solve the above technical problems, the present invention provides a method for preparing an electronic paper panel, comprising:

[0006] According to a preset thin film layer generation method, corresponding materials are used to form a gate layer, a first insulating layer, a gate insulating layer, a source and drain electrode layer, a second insulating layer and a pixel electrode layer respectively;

[0007] Performing exposure operation on the organic insulating layer photoresist;

[0008] Plating a light-shielding layer of metal on the organic insulating layer of photoresist, and applying photoresist to the light-shielding layer of metal;

[0009] Developing the organic insulating layer photoresist with the light shielding layer metal to form a reserved area and a removed area;

[0010] Etching the organic insulating layer photoresist forming the retained area and the removed area to remove the film of the organic insulating layer photoresist in the removed area to form an organic insulating layer;

[0011] Etching the light shielding layer metal forming the reserved area and the removed area to remove the film of the light shielding layer metal in the removed area and remove the photoresist in the reserved area of ​​the light shielding layer metal to form a light shielding layer;

[0012] The gate layer, the first insulating layer, the gate insulating layer, the source-drain electrode layer, the second insulating layer, the organic insulating layer, the light shielding layer and the pixel electrode layer are combined to form an electronic paper panel.

[0013] Furthermore, the preset thin film layer generation method is specifically:

[0014] According to the material requirements of each thin film layer, the corresponding material is selected to form a thin film on the substrate;

[0015] cleaning the film;

[0016] Applying photoresist on the cleaned film;

[0017] Expose and develop the film coated with the photoresist to form a retention area and a removal area on the film;

[0018] Performing an etching operation on the thin film forming the retention area and the removal area to remove the thin film in the removal area;

[0019] The photoresist operation is performed on the film in the reserved area to form a corresponding film layer.

[0020] Furthermore, the material of the first insulating layer is an amorphous silicon film or a SiNx film.

[0021] Furthermore, the light-shielding layer metal is a light-opaque metal.

[0022] Furthermore, the etching operation is performed by wet etching or dry etching.

[0023] Furthermore, the gate insulating layer and the second insulating layer are provided with openings.

[0024] Accordingly, the present invention provides a device for preparing an electronic paper panel, comprising: a generation module, an exposure module, a metal coating module, a development module, an etching module, a degumming module and a combination module;

[0025] The generation module is used to form a gate layer, a first insulating layer, a gate insulating layer, a source and drain electrode layer, a second insulating layer and a pixel electrode layer respectively using corresponding materials according to a preset thin film layer generation method;

[0026] The exposure module is used to perform exposure operation on the organic insulating layer photoresist;

[0027] The metal coating module is used to coat the organic insulating layer photoresist with a light shielding layer metal, and to apply photoresist to the light shielding layer metal;

[0028] The developing module is used to develop the organic insulating layer photoresist with the light shielding layer metal to form a reserved area and a removed area;

[0029] The etching module is used to perform an etching operation on the organic insulating layer photoresist forming the reserved area and the removed area, remove the film of the organic insulating layer photoresist in the removed area, and form an organic insulating layer;

[0030] The stripping module is used to perform an etching operation on the light shielding layer metal forming the reserved area and the removal area, remove the film of the light shielding layer metal in the removal area, and remove the photoresist in the reserved area of ​​the light shielding layer metal to form a light shielding layer;

[0031] The combination module is used to combine the gate layer, the first insulating layer, the gate insulating layer, the source and drain electrode layer, the second insulating layer, the organic insulating layer, the light shielding layer and the pixel electrode layer to form an electronic paper panel.

[0032] Furthermore, the generation module includes: a film forming unit, a cleaning unit, a glue coating unit, an exposure and development unit, an etching unit and a glue removal unit;

[0033] The film forming unit is used to select corresponding materials to form a thin film on the substrate according to the material requirements of each thin film layer;

[0034] The cleaning unit is used to clean the film;

[0035] The coating unit is used to coat the photoresist on the cleaned film;

[0036] The exposure and development unit is used to perform exposure and development operations on the film coated with the photoresist, so as to form a reserved area and a removed area on the film;

[0037] The etching unit is used to perform an etching operation on the thin film forming the retaining area and the removal area, and remove the thin film in the removal area;

[0038] The stripping unit is used to strip the photoresist from the thin film in the reserved area to form a corresponding thin film layer.

[0039] An embodiment of the present invention also provides an electronic paper panel preparation device, comprising a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the processor implements the electronic paper panel preparation method as described above when executing the computer program.

[0040] An embodiment of the present invention further provides a computer-readable storage medium, which includes a stored computer program, wherein when the computer program is executed, the device where the computer-readable storage medium is located is controlled to execute the method for preparing the electronic paper panel as described above.

[0041] The present invention provides a method, device, equipment and storage medium for preparing an electronic paper panel, improves the preparation process of an organic insulating layer and a light shielding layer, performs an exposure operation on an organic insulating layer photoresist; uses a light shielding layer metal to perform film coating on the organic insulating layer photoresist, and performs a photoresist coating operation on the light shielding layer metal; performs a development operation on the organic insulating layer photoresist with the light shielding layer metal to form a reserved area and a removal area; performs an etching operation on the organic insulating layer photoresist forming the reserved area and the removal area, removes the film in the removal area of ​​the organic insulating layer photoresist, and forms an organic insulating layer; performs an etching operation on the light shielding layer metal forming the reserved area and the removal area, removes the film in the removal area of ​​the light shielding layer metal, and removes the photoresist in the reserved area of ​​the light shielding layer metal to form a light shielding layer. The present invention simplifies the production process, saves one illumination, and effectively reduces the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 A schematic diagram of a process of an embodiment of a method for preparing an electronic paper panel provided by the present invention;

[0043] Figure 2 A schematic flow chart of an embodiment of a method for forming a thin film layer provided by the present invention;

[0044] Figure 3 A schematic diagram of a cross-sectional structure of an electronic paper panel provided by the present invention;

[0045] Figure 4 A schematic structural diagram of an embodiment of a device for preparing an electronic paper panel provided by the present invention. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0048] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0049] See also Figure 1 , is a flow chart of an embodiment of a method for preparing an electronic paper panel provided by the present invention, the method comprises steps 101 to 107, each step is specifically as follows:

[0050] Step 101: According to a preset thin film layer forming method, corresponding materials are used to form a gate layer, a first insulating layer, a gate insulating layer, a source and drain electrode layer, a second insulating layer and a pixel electrode layer respectively.

[0051] Furthermore, in the embodiment of the present invention, the preset thin film layer generation method is specifically:

[0052] According to the material requirements of each thin film layer, the corresponding material is selected to form a thin film on the substrate;

[0053] cleaning the film;

[0054] Applying photoresist on the cleaned film;

[0055] Expose and develop the film coated with the photoresist to form a retention area and a removal area on the film;

[0056] Performing an etching operation on the thin film forming the retention area and the removal area to remove the thin film in the removal area;

[0057] The photoresist operation is performed on the film in the reserved area to form a corresponding film layer.

[0058] As an example of an embodiment of the present invention, see Figure 2 , is a flow diagram of an embodiment of the method for generating a thin film layer provided by the present invention. The present invention adopts an electronic paper TFT backplane to prepare an electronic paper panel, and the backplane includes an 8-layer structure, namely M1 (gate layer), ASI / SINX (semiconductor layer / insulating layer), GI (gate insulating layer via), M2 (source and drain layer), PV (second insulating layer and opening), OC (organic insulating layer), M3 (light shielding layer) and ITO (pixel electrode layer). The present invention combines the production process of the organic insulating layer and the light shielding layer, and the production process of other structures includes film formation-cleaning-photoresist coating-exposure-development-etching-photoresist removal-inspection.

[0059] Further, in the embodiment of the present invention, the material of the first insulating layer is an amorphous silicon film or a SiNx film.

[0060] In the embodiment of the present invention, the second layer of the electronic paper panel of the present invention is a first insulating layer, which may be a semiconductor layer formed of an amorphous silicon film or an insulating layer formed of a SiNx film.

[0061] Further, in the embodiment of the present invention, the etching operation is performed by a wet etching method or a dry etching method.

[0062] In the embodiment of the present invention, when performing the etching operation, the thin film in the area marked as the removal area may be removed by using a wet etching method or a dry etching method.

[0063] Furthermore, in an embodiment of the present invention, the gate insulating layer and the second insulating layer are provided with openings.

[0064] In the embodiment of the present invention, the openings provided in the gate insulating layer are used to connect the first insulating layer and the source-drain electrode layer, and the openings provided in the second insulating layer are used to connect the source-drain electrode layer and the organic insulating layer.

[0065] Step 102: Expose the organic insulating layer photoresist.

[0066] Step 103: coating the organic insulating layer photoresist with a light-shielding layer metal, and applying a photoresist to the light-shielding layer metal.

[0067] Step 104: Developing the organic insulating layer photoresist with the light shielding layer metal to form a reserved area and a removed area.

[0068] Step 105: etching the organic insulating layer photoresist forming the retained area and the removed area to remove the film of the organic insulating layer photoresist in the removed area to form an organic insulating layer.

[0069] Step 106: Etching the light shielding layer metal forming the reserved area and the removed area to remove the film of the light shielding layer metal in the removed area and remove the photoresist in the reserved area of ​​the light shielding layer metal to form a light shielding layer.

[0070] Furthermore, in an embodiment of the present invention, the material used for the organic insulating layer is photoresist, and the material used for the light-shielding layer is opaque metal, which is used to cover all TFT transistors to prevent the transistors from leaking due to strong outdoor light. The present invention simplifies and merges the production processes of the organic insulating layer and the light-shielding layer by utilizing the material properties of the organic insulating layer. The photoresist of the organic insulating layer is exposed, and no development operation is performed after the exposure. The metal coating of the light-shielding layer is directly performed on the photoresist of the exposed organic insulating layer, and then the photoresist of the organic insulating layer and the metal of the light-shielding layer are developed as a whole. Therefore, after passing through the developer, not only the exposed organic insulating layer photoresist is marked with the retained area and the removed area, but the unexposed light-shielding layer metal can also be marked with the retained area and the removed area, thereby reducing the exposure operation when producing the light-shielding layer and saving the production process.

[0071] Step 107: combining the gate layer, the first insulating layer, the gate insulating layer, the source-drain electrode layer, the second insulating layer, the organic insulating layer, the light shielding layer and the pixel electrode layer to form an electronic paper panel.

[0072] In the embodiments of the present invention, see Figure 3 , is a schematic diagram of a cross-sectional structure of an electronic paper panel provided by the present invention. When the organic insulating layer photoresist and the light-shielding layer metal complete subsequent etching operations and photoresist removal operations after development, the formed organic insulating layer and the light-shielding layer have the same pattern, and the pattern only covers the places where light shielding is required and the places where pixel ITO exists. When the organic insulating layer and the light-shielding layer are produced separately, the pattern of the organic insulating layer is generally a whole surface material, and holes are only opened where it is necessary to connect up and down. After the present invention improves the production process of the organic insulating layer and the light-shielding layer, the pattern of the organic insulating layer is changed to only cover the places where light shielding is required and the places where pixel ITO exists, and the effect of the organic insulating layer does not change. Therefore, the present invention simplifies the production process, saves one illumination, and effectively reduces the production cost without affecting the functions of the organic insulating layer and the light-shielding layer.

[0073] Accordingly, see Figure 4 , is a schematic structural diagram of an embodiment of a device for preparing an electronic paper panel provided by the present invention, the device comprising a generating module 201, an exposure module 202, a metal coating module 203, a developing module 204, an etching module 205, a degumming module 206 and a combining module 207;

[0074] The generation module 201 is used to form a gate layer, a first insulating layer, a gate insulating layer, a source and drain electrode layer, a second insulating layer and a pixel electrode layer respectively using corresponding materials according to a preset thin film layer generation method;

[0075] The exposure module 202 is used to perform exposure operation on the organic insulating layer photoresist;

[0076] The metal coating module 203 is used to coat the light-shielding layer metal on the organic insulating layer photoresist and apply photoresist to the light-shielding layer metal;

[0077] The developing module 204 is used to develop the organic insulating layer photoresist with the light shielding layer metal to form a reserved area and a removed area;

[0078] The etching module 205 is used to perform an etching operation on the organic insulating layer photoresist forming the reserved area and the removed area, remove the film of the organic insulating layer photoresist in the removed area, and form an organic insulating layer;

[0079] The photoresist stripping module 206 is used to perform an etching operation on the light shielding layer metal forming the reserved area and the removed area, remove the film of the light shielding layer metal in the removed area, and remove the photoresist of the light shielding layer metal in the reserved area to form a light shielding layer;

[0080] The combining module 207 is used to combine the gate layer, the first insulating layer, the gate insulating layer, the source and drain electrode layer, the second insulating layer, the organic insulating layer, the light shielding layer and the pixel electrode layer to form an electronic paper panel.

[0081] Further, in the second embodiment of the present invention, the generation module 201 includes: a film forming unit, a cleaning unit, a glue coating unit, an exposure and development unit, an etching unit and a glue removal unit;

[0082] The film forming unit is used to select corresponding materials to form a thin film on the substrate according to the material requirements of each thin film layer;

[0083] The cleaning unit is used to clean the film;

[0084] The glue coating unit is used to coat photoresist on the cleaned film;

[0085] The exposure and development unit is used to perform exposure and development operations on the film coated with photoresist to form a reserved area and a removed area on the film;

[0086] The etching unit is used to perform an etching operation on the thin film forming the retaining area and the removal area, and remove the thin film in the removal area;

[0087] The stripping unit is used to strip the photoresist from the film in the reserved area to form a corresponding film layer.

[0088] Further, in the embodiment of the present invention, the material of the first insulating layer is an amorphous silicon film or a SiNx film.

[0089] Furthermore, in the embodiment of the present invention, the light shielding layer metal is a light-proof metal.

[0090] Further, in the embodiment of the present invention, the etching operation is performed by a wet etching method or a dry etching method.

[0091] Furthermore, in an embodiment of the present invention, the gate insulating layer and the second insulating layer are provided with openings.

[0092] An embodiment of the present invention also provides a device for preparing an electronic paper panel, comprising a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein when the processor executes the computer program, the method for preparing the electronic paper panel described in any of the above embodiments is implemented.

[0093] An embodiment of the present invention also provides a computer-readable storage medium, including a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, and when the processor executes the computer program, the method for preparing the electronic paper panel described in any of the above embodiments is implemented.

[0094] In summary, the embodiments of the present invention provide a method, device, equipment and storage medium for preparing an electronic paper panel, improve the preparation process of the organic insulating layer and the light-shielding layer, perform an exposure operation on the organic insulating layer photoresist; use a light-shielding layer metal to plate the organic insulating layer photoresist, and perform a photoresist coating operation on the light-shielding layer metal; perform a development operation on the organic insulating layer photoresist with the light-shielding layer metal to form a reserved area and a removal area; perform an etching operation on the organic insulating layer photoresist forming the reserved area and the removal area, remove the film of the organic insulating layer photoresist in the removal area, and form an organic insulating layer; perform an etching operation on the light-shielding layer metal forming the reserved area and the removal area, remove the film of the light-shielding layer metal in the removal area, and remove the photoresist in the reserved area of ​​the light-shielding layer metal to form a light-shielding layer. The present invention simplifies the production process, saves one illumination, and effectively reduces the production cost.

[0095] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. It is particularly pointed out that for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for preparing an electronic paper panel, characterized in that: include: According to a preset thin film layer generation method, corresponding materials are used to form a gate layer, a first insulating layer, a gate insulating layer, a source and drain electrode layer, a second insulating layer and a pixel electrode layer respectively; Performing exposure operation on the organic insulating layer photoresist; Plating a light-shielding layer of metal on the organic insulating layer of photoresist, and applying photoresist to the light-shielding layer of metal; Developing the organic insulating layer photoresist with the light shielding layer metal to form a reserved area and a removed area; Etching the organic insulating layer photoresist forming the retained area and the removed area to remove the film of the organic insulating layer photoresist in the removed area to form an organic insulating layer; Etching the light shielding layer metal forming the reserved area and the removed area to remove the film of the light shielding layer metal in the removed area and remove the photoresist in the reserved area of ​​the light shielding layer metal to form a light shielding layer; The gate layer, the first insulating layer, the gate insulating layer, the source-drain electrode layer, the second insulating layer, the organic insulating layer, the light shielding layer and the pixel electrode layer are combined to form an electronic paper panel.

2. The method for preparing an electronic paper panel according to claim 1, characterized in that: The preset thin film layer generation method is specifically: According to the material requirements of each thin film layer, the corresponding material is selected to form a thin film on the substrate; cleaning the film; Applying photoresist on the cleaned film; Expose and develop the film coated with the photoresist to form a retention area and a removal area on the film; Performing an etching operation on the thin film forming the retention area and the removal area to remove the thin film in the removal area; The photoresist operation is performed on the film in the reserved area to form a corresponding film layer.

3. The method for preparing an electronic paper panel according to claim 1, characterized in that: The material of the first insulating layer is an amorphous silicon film or a SiNx film.

4. The method for preparing an electronic paper panel according to claim 1, characterized in that: The light-shielding layer metal is a light-proof metal.

5. The method for preparing an electronic paper panel according to claim 1, characterized in that: The etching operation is performed by a wet etching method or a dry etching method.

6. The method for preparing an electronic paper panel according to claim 1, characterized in that: The gate insulating layer and the second insulating layer are provided with openings.

7. A device for preparing an electronic paper panel, characterized in that: include: Generation module, exposure module, metal coating module, development module, etching module, degumming module and combination module; The generation module is used to form a gate layer, a first insulating layer, a gate insulating layer, a source and drain electrode layer, a second insulating layer and a pixel electrode layer respectively using corresponding materials according to a preset thin film layer generation method; The exposure module is used to perform exposure operation on the organic insulating layer photoresist; The metal coating module is used to coat the organic insulating layer photoresist with a light shielding layer metal, and to apply photoresist to the light shielding layer metal; The developing module is used to develop the organic insulating layer photoresist with the light shielding layer metal to form a reserved area and a removed area; The etching module is used to perform an etching operation on the organic insulating layer photoresist forming the reserved area and the removed area, remove the film of the organic insulating layer photoresist in the removed area, and form an organic insulating layer; The stripping module is used to perform an etching operation on the light shielding layer metal forming the reserved area and the removal area, remove the film of the light shielding layer metal in the removal area, and remove the photoresist in the reserved area of ​​the light shielding layer metal to form a light shielding layer; The combination module is used to combine the gate layer, the first insulating layer, the gate insulating layer, the source and drain electrode layer, the second insulating layer, the organic insulating layer, the light shielding layer and the pixel electrode layer to form an electronic paper panel.

8. The device for preparing an electronic paper panel according to claim 7, characterized in that: The generation module includes: a film forming unit, a cleaning unit, a glue coating unit, an exposure and development unit, an etching unit and a glue removal unit; The film forming unit is used to select corresponding materials to form a thin film on the substrate according to the material requirements of each thin film layer; The cleaning unit is used to clean the film; The coating unit is used to coat the photoresist on the cleaned film; The exposure and development unit is used to perform exposure and development operations on the film coated with the photoresist, so as to form a reserved area and a removed area on the film; The etching unit is used to perform an etching operation on the thin film forming the retaining area and the removal area, and remove the thin film in the removal area; The stripping unit is used to strip the photoresist from the thin film in the reserved area to form a corresponding thin film layer.

9. A device for preparing an electronic paper panel, characterized in that: The invention comprises a processor, a memory and a computer program stored in the memory and configured to be executed by the processor, wherein when the processor executes the computer program, the method for preparing the electronic paper panel according to any one of claims 1 to 6 is implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium includes a stored computer program, wherein when the computer program is executed, the device where the computer-readable storage medium is located is controlled to execute the method for preparing the electronic paper panel according to any one of claims 1 to 6.

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