Metal ultra-thin strip with surface microcup array structure and preparation method of metal ultra-thin strip

Abstract

The invention provides a metal ultra-thin strip with a surface microcup array structure and a preparation method of the metal ultra-thin strip, and relates to the technical field of metal ultra-thin strips. The preparation method comprises the following steps: cutting the metal base material, annealing before rolling, cleaning, rolling by using a texturing roller after stacking the metal base material with high-elasticity rubber, and stripping the rubber after rolling to obtain the product. By optimizing the preparation process, continuous preparation of the metal ultra-thin strip with the surface microcup array structure is achieved, the production efficiency of the metal ultra-thin strip is remarkably improved, and the production cost is reduced. The surface of the product provided by the invention has significantly enhanced hydrophobic performance, is suitable for the fields of aerospace, automobile manufacturing and high-end equipment manufacturing, and has significant advantages in large-scale production and economic benefits.

Description

Technical Field

[0001] The invention relates to the technical field of extremely thin metal strips, and in particular to an extremely thin metal strip with a surface microcup array structure and a preparation method thereof. Background Art

[0002] With the rapid development of precision machinery and electronics industries, surface micro-feature structures have been widely and deeply applied in a variety of fields such as aerospace, automobile manufacturing, and high-end equipment. Among them, surface structures with microcup array distribution characteristics are particularly eye-catching. They can give materials unique hydrophobic properties, which are particularly valuable in situations where there are strict requirements for liquid penetration or accumulation. Especially in precision fields such as electronic equipment and sensors, such surface structures play a vital role with their excellent waterproof performance, providing a strong guarantee for the stable operation and performance improvement of equipment.

[0003] Currently, the formation of surface microcup array structures mainly relies on high-precision technologies such as laser stamping, laser engraving and hot embossing. Although these methods can achieve the required structural features, they all require specific templates as the processing basis, which leads to the complexity of the process steps, increases production costs, and reduces production efficiency. Therefore, they are not suitable for large-scale mass production.

[0004] Therefore, in the context of pursuing efficient and low-cost manufacturing, traditional micro-drawing technology provides a potential alternative. However, micro-drawing technology usually requires the use of extremely thin strips with a thickness of 20 to 50 μm when preparing micro-cups. This strict material thickness standard places higher requirements on equipment accuracy and requires precise control of processing parameters and the use of high-quality and high-precision molds. The entire operation process is complex and difficult, and the preparation cycle is long. The micro-cups obtained are independent devices, and it is difficult to directly form an ordered micro-cup array structure on the surface of the metal ultra-thin strip. These problems not only limit the production efficiency of surface micro-cup array structure materials, but also increase the process cost, resulting in limited use of surface micro-cup array structure materials. Summary of the invention

[0005] In view of this, the present invention provides a metal ultra-thin strip with a surface microcup array structure and a preparation method thereof. The present invention can realize the continuous preparation of the metal ultra-thin strip surface microcup array structure, thereby achieving the purpose of reducing costs and significantly improving production efficiency. The present invention overcomes the limitations of the prior art by optimizing the preparation process, and opens up a new way for the large-scale, efficient and low-cost production of microcup arrays.

[0006] The method for preparing the metal ultra-thin strip having a surface microcup array structure of the present invention comprises the following steps:

[0007] S1. Precisely cutting the metal ultra-thin strip and the high-elastic rubber to obtain the metal substrate and the high-elastic rubber strip;

[0008] S2, annealing the metal substrate before rolling;

[0009] S3, cleaning the metal substrate after annealing before rolling;

[0010] S4, stacking the metal sheet and the high elastic rubber together and rolling them with a roughened roller;

[0011] S5. After rolling, the high elastic rubber is peeled off to obtain an extremely thin metal strip with a surface microcup array structure.

[0012] Preferably, the thickness of the ultra-thin metal strip is 5 to 100 μm.

[0013] Preferably, the metal ultra-thin strip is copper foil, titanium foil, aluminum foil or alloy strip. More preferably, the alloy strip is stainless steel strip.

[0014] Preferably, the pre-rolling annealing temperature is 650° C. to 950° C., and the holding time is 5 to 15 minutes.

[0015] Preferably, the high elastic rubber is silicone rubber, polyurethane rubber or fluororubber.

[0016] Preferably, the metal substrate is bonded to a textured roller, and the high-elastic rubber is bonded to a flat roller without a microstructure.

[0017] Preferably, the surface roughness of the texturing roller is 5 to 50 μm.

[0018] Preferably, the rolling force of the rolling is 5 to 15 kN, and the rolling speed is 0.1 to 0.5 m / min.

[0019] The present invention also provides an extremely thin metal strip having a surface microcup array structure prepared according to the above method.

[0020] The metal ultra-thin strip with a surface microcup array structure of the present invention is used in the fields of aerospace, automobile manufacturing and high-end equipment manufacturing.

[0021] Compared with the prior art, the present invention successfully prepares a regular microcup array structure on the surface of the rolled piece, forming a unique pit lattice morphology. Compared with the surface produced by the traditional flat rolling process, the structure significantly improves the contact angle and greatly enhances the hydrophobic performance. This feature enables the rolled piece to show unique advantages in high-end application fields such as aerospace and medical equipment, and is particularly suitable for occasions with strict requirements on surface properties. The present invention also cleverly utilizes the reversible deformation characteristics of high-elastic rubber. During the rolling process, the high-elastic rubber undergoes elastic deformation under the action of a small external force, providing sufficient expansion space for the metal ultra-thin strip. It is worth mentioning that no compounding occurs between the high-elastic rubber and the metal ultra-thin strip during the rolling process, ensuring that the rubber can be easily peeled off from the surface of the metal thin strip after the rolling is completed, thereby ensuring the high precision and high quality of the microcup array structure. This feature not only improves the product quality, but also simplifies the production process. In addition, the present invention realizes the continuous rolling process of the microcup array on the surface of the metal ultra-thin strip, greatly improves the production efficiency, makes large-scale production possible, and significantly reduces the production cost. Compared with traditional intermittent or batch production methods, the present invention shows significant advantages in economic benefits and industrial application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below in conjunction with the accompanying drawings.

[0023] Figure 1 It is a schematic diagram of the rolling process;

[0024] Figure 2 Schematic diagram of high elastic rubber peeling;

[0025] Figure 3 It is a schematic diagram of the surface structure of the roughened roller;

[0026] Figure 4 This is the morphology of the microcup array on the surface of the rolled piece;

[0027] Figure 5 The textured roller (bottom) and the conventional flat roller (top) used in the present invention;

[0028] Figure 6 This is a three-dimensional contour image of the bottom surface of the microcup of the ultra-thin strip of Example 1;

[0029] Figure 7 This is a three-dimensional profile image of the front side of the microcup of the ultra-thin strip of Example 1;

[0030] Explanation of the reference numerals: 1. conventional flat roller; 2. high elastic rubber; 3. metal substrate; 4. texturing roller. DETAILED DESCRIPTION

[0031] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] The present invention provides a method for preparing an extremely thin metal strip having a surface microcup array structure, comprising the following steps:

[0033] S1. Precisely cutting the metal ultra-thin strip and the high-elastic rubber to obtain the metal substrate and the high-elastic rubber strip;

[0034] S2, annealing the metal substrate before rolling;

[0035] S3, cleaning the metal substrate after annealing before rolling;

[0036] S4, stacking the metal sheet and the high elastic rubber together and rolling them with a roughened roller;

[0037] S5. After rolling, the high elastic rubber is peeled off to obtain an extremely thin metal strip with a surface microcup array structure.

[0038] The first step of the present invention is to precisely cut the metal ultra-thin strip and the highly elastic rubber to obtain the metal substrate and the highly elastic rubber strip, specifically: select the metal ultra-thin strip as the composite substrate, and precisely cut the metal ultra-thin strip and the highly elastic rubber strip to ensure that the size of each substrate meets the preset standard. In some specific embodiments of the present invention, the thickness of the metal ultra-thin strip is 5 to 100 μm. In some specific embodiments of the present invention, the metal ultra-thin strip is copper foil, titanium foil, aluminum foil or alloy strip. In some preferred embodiments of the present invention, the alloy strip is a stainless steel strip. In some specific embodiments of the present invention, the highly elastic rubber is preferably silicone rubber, polyurethane rubber or fluororubber. The highly elastic rubber material selected in the present invention has good elasticity and wear resistance, can maintain a stable shape and size during the rolling process, and is easy to separate from the metal strip without causing pollution to the finished product. In some preferred embodiments of the present invention, the length, width and thickness of the highly elastic rubber strip are greater than or equal to the metal substrate.

[0039] The second step of the present invention is to perform pre-rolling annealing on the cut metal substrate, and the pre-rolling annealing is performed in an inert gas atmosphere, and the pre-rolling annealing temperature is preferably 650°C to 950°C, and the holding time is preferably 5 to 15 minutes. In some preferred embodiments of the present invention, the inert gas is argon; when the metal substrate is stainless steel, the pre-rolling annealing temperature is preferably 950°C, and the holding time is preferably 5 minutes; when the metal substrate is titanium foil, the pre-rolling annealing temperature is preferably 600°C, and the holding time is preferably 10 minutes.

[0040] The present invention ensures that the microstructure inside the material is optimized through annealing before rolling, thereby improving the plasticity and rolling performance of the material, and prevents oxidation of the material during the annealing process by controlling the atmosphere.

[0041] The third step of the present invention is to clean the metal substrate after annealing before rolling. In some specific embodiments of the present invention, the cleaning is performed using anhydrous ethanol and dust-free paper, specifically: spraying anhydrous ethanol on the surface of the thin strip, and gently wiping the surface of the metal thin strip with dust-free paper. The present invention removes impurities, oil stains and other pollutants on the surface of the metal substrate through cleaning treatment, ensuring good contact between the metal thin strip and the roller during the rolling process.

[0042] The fourth step of the present invention is to stack the cleaned metal substrate and the high elastic rubber and then roll them. In some specific embodiments of the present invention, the metal substrate is bonded to a textured roller, and the high elastic rubber is bonded to a flat roller without a microstructure. The two substrates are then sent to a flat roller mill for rolling and compounding. The roughness of the textured roller is preferably 5 to 50 μm, but the present invention does not strictly limit the roughness of the textured roller. Different specifications of textured rollers can be customized according to specific needs for rolling, ultimately ensuring the uniformity and consistency of the microstructure on the surface of the metal ultra-thin strip. Generally speaking, the thicker the thin strip, the greater the roughness of the corresponding textured roller should be, so as to form an ideal microcup array structure.

[0043] In some specific embodiments of the present invention, the rolling force is 5-15 kN, and the rolling speed is 0.1-0.5 m / min.

[0044] The fifth step of the present invention is to peel the high elastic rubber from the surface of the metal strip. Since the present invention uses a high elastic rubber material with good elasticity and wear resistance, it can be easily peeled without destroying the microstructure of the surface of the metal strip, and the high elastic rubber and the metal strip will not be rolled and compounded during the rolling process, and are easy to separate.

[0045] The present invention also provides an extremely thin metal strip having a surface microcup array structure prepared according to the above method.

[0046] The metal ultra-thin strip with a surface microcup array structure of the present invention is used in the fields of aerospace, automobile manufacturing and high-end equipment manufacturing.

[0047] The metal ultra-thin tape of the present invention has a surface microcup array structure and can be widely used in surface coating materials of aircraft (such as airplanes, rockets, satellites, etc.). Its regular surface microcup array structure can effectively reduce air resistance, thereby improving flight efficiency. In addition, the structure also significantly improves the hydrophobicity of the material, helps prevent the fuselage from icing, and improves flight safety. In the field of aerospace, the metal ultra-thin tape of the present invention can be used as an important part of a thermal protection system, such as a thermal insulation layer or a heat-resistant tile, and its regular structure and superior hydrophobicity can effectively reduce heat transfer and protect the internal structure from high temperature. In the automotive industry, the metal ultra-thin tape of the present invention can be used for body surface coatings to reduce air resistance and improve fuel efficiency. At the same time, its excellent hydrophobicity helps prevent water accumulation in the body, thereby reducing the risk of corrosion and wear. In addition, in radar and communication systems, the metal ultra-thin tape of the present invention can be used for antenna cover materials, and its surface microcup array structure can reduce the reflection and scattering of electromagnetic waves, thereby improving signal transmission quality and enhancing system performance.

[0048] To further illustrate the present invention, the following examples are provided for detailed description. The raw materials used in the following examples of the present invention are all commercially available. Unless otherwise specified, all tests were repeated 3 times, and the results are expressed as average values.

[0049] Example 1 A method for preparing a 304 stainless steel ultra-thin strip having a surface microcup array structure, the steps are as follows:

[0050] S1. Precisely cut a 20 μm thick 304 stainless steel ultra-thin strip as a metal substrate, the specification of the metal substrate is 130 mm×15 mm; precisely cut a 50 μm thick silicone rubber to obtain a silicone rubber strip, the specification of the silicone rubber strip is 140 mm×16 mm;

[0051] S2, placing the metal substrate in an annealing furnace, heating it to 950° C. for annealing in a strictly controlled argon protective atmosphere and keeping the temperature for 5 minutes;

[0052] S3. Spray anhydrous ethanol on the surface of the thin strip, and gently wipe the surface of the metal thin strip with dust-free paper to remove residual oil and impurities;

[0053] S4, stacking the cleaned metal substrate and the silicone rubber strip, wherein one side of the metal substrate is closely attached to a roughened roller with a roughness of 20 μm, and the other side of the silicone rubber strip is attached to a smooth flat roller, and then rolling is performed at a rolling force of 14 kN and a rolling speed of 0.1 m / min;

[0054] S5. After rolling, the high elastic rubber is peeled off from the surface of the metal substrate to obtain a 304 stainless steel ultra-thin strip with a surface microcup array structure.

[0055] After testing, the contact angle of the 304 stainless steel ultra-thin strip prepared in this embodiment is 80°.

[0056] Example 2 A method for preparing a 304 stainless steel ultra-thin strip having a surface microcup array structure, the steps are as follows:

[0057] S1. Precisely cut a 304 stainless steel ultra-thin strip with a thickness of 10 μm as a metal substrate, and the specification of the metal substrate is 130 mm×15 mm; accurately cut a silicone rubber with a thickness of 50 μm to obtain a silicone rubber strip, and the specification of the silicone rubber strip is 140 mm×16 mm;

[0058] S2, placing the metal substrate in an annealing furnace, heating it to 950° C. for annealing in a strictly controlled argon protective atmosphere and keeping the temperature for 5 minutes;

[0059] S3. Spray anhydrous ethanol on the surface of the thin strip, and gently wipe the surface of the metal thin strip with dust-free paper to remove residual oil and impurities;

[0060] S4, stacking the cleaned metal substrate and the silicone rubber strip, wherein one side of the metal substrate is closely attached to a roughened roller with a roughness of 10 μm, and the other side of the silicone rubber strip is attached to a smooth flat roller, and then rolling is performed at a rolling force of 12 kN and a rolling speed of 0.1 m / min;

[0061] S5. After rolling, the high elastic rubber is peeled off from the surface of the metal substrate to obtain a 304 stainless steel ultra-thin strip with a surface microcup array structure.

[0062] After testing, the contact angle of the 304 stainless steel ultra-thin strip prepared in this embodiment is 65°.

[0063] Example 3 A method for preparing a 304 stainless steel ultra-thin strip having a surface microcup array structure, the steps are as follows:

[0064] S1. Precisely cut a 50 μm thick 304 stainless steel ultra-thin strip as a metal substrate, the specification of the metal substrate is 130 mm×15 mm; precisely cut a 100 μm thick silicone rubber to obtain a silicone rubber strip, the specification of the silicone rubber strip is 140 mm×16 mm;

[0065] S2, placing the metal substrate in an annealing furnace, heating it to 950° C. for annealing in a strictly controlled argon protective atmosphere and keeping the temperature for 5 minutes;

[0066] S3. Spray anhydrous ethanol on the surface of the thin strip, and gently wipe the surface of the metal thin strip with dust-free paper to remove residual oil and impurities;

[0067] S4, stacking the cleaned metal substrate and the silicone rubber strip, wherein one side of the metal substrate is closely attached to a roughened roller with a roughness of 50 μm, and the other side of the silicone rubber strip is attached to a smooth flat roller, and then rolling is performed at a rolling force of 16 kN and a rolling speed of 0.1 m / min;

[0068] S5. After rolling, the high elastic rubber is peeled off from the surface of the metal substrate to obtain a 304 stainless steel ultra-thin strip with a surface microcup array structure.

[0069] After testing, the contact angle of the 304 stainless steel ultra-thin strip prepared in this embodiment is 85°.

[0070] Example 4 A method for preparing a titanium ultra-thin strip having a surface microcup array structure, the steps are as follows:

[0071] S1. Precisely cut a 20 μm thick titanium foil ultra-thin strip as a metal substrate, the specification of the metal substrate is 130 mm×15 mm; precisely cut a 50 μm thick silicone rubber to obtain a silicone rubber strip, the specification of the silicone rubber strip is 140 mm×16 mm;

[0072] S2, placing the metal substrate in an annealing furnace, heating it to 650° C. for annealing in a strictly controlled argon protective atmosphere and keeping the temperature for 10 minutes;

[0073] S3. Spray anhydrous ethanol on the surface of the thin strip, and gently wipe the surface of the metal thin strip with dust-free paper to remove residual oil and impurities;

[0074] S4, stacking the cleaned metal substrate and the silicone rubber strip, wherein one side of the metal substrate is closely attached to a roughened roller with a roughness of 20 μm, and the other side of the silicone rubber strip is attached to a smooth flat roller, and then rolling is performed at a rolling force of 10 kN and a rolling speed of 0.1 m / min;

[0075] S5. After rolling, the high elastic rubber is peeled off from the surface of the metal substrate to obtain an ultra-thin strip of titanium foil with a surface microcup array structure.

[0076] After testing, the contact angle of the ultra-thin titanium foil strip prepared in this embodiment is 80°.

[0077] Example 5 A method for preparing a titanium ultra-thin strip having a surface microcup array structure, the steps are as follows:

[0078] S1. Precisely cut a 10 μm thick titanium foil ultra-thin strip as a metal substrate, the specification of the metal substrate is 130 mm×15 mm; precisely cut a 50 μm thick silicone rubber to obtain a silicone rubber strip, the specification of the silicone rubber strip is 140 mm×16 mm;

[0079] S2, placing the metal substrate in an annealing furnace, heating it to 650° C. for annealing in a strictly controlled argon protective atmosphere and keeping the temperature for 10 minutes;

[0080] S3. Spray anhydrous ethanol on the surface of the thin strip, and gently wipe the surface of the metal thin strip with dust-free paper to remove residual oil and impurities;

[0081] S4, stacking the cleaned metal substrate and the silicone rubber strip, wherein one side of the metal substrate is closely attached to a roughened roller with a roughness of 10 μm, and the other side of the silicone rubber strip is attached to a smooth flat roller, and then rolling is performed at a rolling force of 8 kN and a rolling speed of 0.1 m / min;

[0082] S5. After rolling, the high elastic rubber is peeled off from the surface of the metal substrate to obtain an ultra-thin strip of titanium foil with a surface microcup array structure.

[0083] After testing, the contact angle of the ultra-thin titanium foil strip prepared in this embodiment is 70°.

[0084] Example 6 A method for preparing an ultra-thin copper strip having a surface microcup array structure, the steps are as follows:

[0085] S1. Precisely cut a copper foil with a thickness of 50 μm as a metal substrate, the specification of the metal substrate is 130 mm×15 mm; precisely cut a silicone rubber with a thickness of 100 μm to obtain a silicone rubber strip, the specification of the silicone rubber strip is 140 mm×16 mm;

[0086] S2, placing the metal substrate in an annealing furnace, heating it to 500° C. for annealing in a strictly controlled argon protective atmosphere and keeping the temperature for 5 minutes;

[0087] S3. Spray anhydrous ethanol on the surface of the thin strip, and gently wipe the surface of the metal thin strip with dust-free paper to remove residual oil and impurities;

[0088] S4, stacking the cleaned metal substrate and the silicone rubber strip, wherein one side of the metal substrate is closely attached to a roughened roller with a roughness of 50 μm, and the other side of the silicone rubber strip is attached to a smooth flat roller, and then rolling is performed at a rolling force of 6 kN and a rolling speed of 0.1 m / min;

[0089] S5. After rolling, the high elastic rubber is peeled off from the surface of the metal substrate to obtain an ultra-thin copper strip with a surface microcup array structure.

[0090] After testing, the contact angle of the ultra-thin copper strip prepared in this embodiment is 85°.

[0091] Example 7 A method for preparing an ultra-thin aluminum strip having a surface microcup array structure, the steps are as follows:

[0092] S1. Precisely cut aluminum foil with a thickness of 50 μm as a metal substrate, the specification of the metal substrate is 130 mm×15 mm; precisely cut silicone rubber with a thickness of 100 μm to obtain a silicone rubber strip, the specification of the silicone rubber strip is 140 mm×16 mm;

[0093] S2, placing the metal substrate in an annealing furnace, heating it to 300° C. for annealing in a strictly controlled argon protective atmosphere and keeping the temperature for 5 minutes;

[0094] S3. Spray anhydrous ethanol on the surface of the thin strip, and gently wipe the surface of the metal thin strip with dust-free paper to remove residual oil and impurities;

[0095] S4, stacking the cleaned metal substrate and the silicone rubber strip, wherein one side of the metal substrate is closely attached to a roughened roller with a roughness of 50 μm, and the other side of the silicone rubber strip is attached to a smooth flat roller, and then rolling is performed at a rolling force of 5 kN and a rolling speed of 0.1 m / min;

[0096] S5. After rolling, the high elastic rubber is peeled off from the surface of the metal substrate to obtain a copper foil with a surface microcup array structure.

[0097] After testing, the ultra-thin aluminum strip prepared in this embodiment has a tentacles angle of 80°.

[0098] Comparative Example 1 A method for preparing an ultra-thin strip of 304 stainless steel, the steps are as follows:

[0099] S1. Precisely cut a 20 μm thick 304 stainless steel ultra-thin strip as a metal substrate, the specification of the metal substrate is 130 mm×15 mm; precisely cut a 50 μm thick silicone rubber to obtain a silicone rubber strip, the specification of the silicone rubber strip is 140 mm×16 mm;

[0100] S2, placing the metal substrate in an annealing furnace, heating it to 950° C. for annealing in a strictly controlled argon protective atmosphere and keeping the temperature for 5 minutes;

[0101] S3. Spray anhydrous ethanol on the surface of the thin strip, and gently wipe the surface of the metal thin strip with dust-free paper to remove residual oil and impurities;

[0102] S4, stacking the cleaned metal substrate and the silicone rubber strip, both the metal substrate and the silicone rubber strip are attached to a smooth flat roller, and then rolling at a rolling force of 14 kN and a rolling speed of 0.1 m / min;

[0103] S5. After rolling, the high elastic rubber is peeled off from the surface of the metal substrate to obtain a 304 stainless steel ultra-thin strip with a surface microcup array structure.

[0104] After testing, the contact angle of the 304 stainless steel ultra-thin strip prepared in this comparative example is 30°.

[0105] Comparative Example 2 A method for preparing a titanium ultra-thin strip having a surface microcup array structure, the steps are as follows:

[0106] S1. Precisely cut a 20 μm thick titanium foil ultra-thin strip as a metal substrate, the specification of the metal substrate is 130 mm×15 mm; precisely cut a 50 μm thick silicone rubber to obtain a silicone rubber strip, the specification of the silicone rubber strip is 140 mm×16 mm;

[0107] S2, placing the metal substrate in an annealing furnace, heating it to 650° C. for annealing in a strictly controlled argon protective atmosphere and keeping the temperature for 5 minutes;

[0108] S3. Spray anhydrous ethanol on the surface of the thin strip, and gently wipe the surface of the metal thin strip with dust-free paper to remove residual oil and impurities;

[0109] S4, stacking the cleaned metal substrate and the silicone rubber strip, both the metal substrate and the silicone rubber strip are attached to a smooth flat roller, and then rolling at a rolling force of 10 kN and a rolling speed of 0.1 m / min;

[0110] S5. After rolling, the high elastic rubber is peeled off from the surface of the metal substrate to obtain an ultra-thin strip of titanium foil with a surface microcup array structure.

[0111] After testing, the contact angle of the ultra-thin strip of titanium foil prepared in this comparative example is 30°.

[0112] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for preparing an ultra-thin metal strip having a surface microcup array structure, characterized in that: The following steps are involved: S1. Precisely cutting the metal ultra-thin strip and the high-elastic rubber to obtain the metal substrate and the high-elastic rubber strip; S2, annealing the metal substrate before rolling; S3, cleaning the metal substrate after annealing before rolling; S4, stacking the metal sheet and the high elastic rubber together and rolling them with a roughened roller; S5. After rolling, the high elastic rubber is peeled off to obtain an extremely thin metal strip with a surface microcup array structure.

2. The preparation method according to claim 1, characterized in that: The thickness of the ultra-thin metal strip is 5 to 100 μm.

3. The preparation method according to claim 1, characterized in that: The extremely thin metal strip is copper foil, titanium foil, aluminum foil or alloy strip.

4. The preparation method according to claim 4, characterized in that: The alloy belt is a stainless steel belt.

5. The preparation method according to claim 1, characterized in that: The pre-rolling annealing temperature is 650° C. to 950° C., and the holding time is 5 to 15 minutes.

6. The preparation method according to claim 1, characterized in that: The high elastic rubber is silicone rubber, polyurethane rubber or fluororubber.

7. The preparation method according to claim 1, characterized in that: The metal substrate is bonded to a textured roller, and the high-elastic rubber is bonded to a flat roller without a microstructure.

8. The preparation method according to claim 1, characterized in that: The rolling force of the rolling is 5 to 15 kN, and the rolling speed is 0.1 to 0.5 m / min.

9. The preparation method according to claim 1, characterized in that: The surface roughness of the texturing roller is 5 to 50 μm.

10. A metal ultra-thin strip having a surface microcup array structure, characterized in that: Prepared by the method according to any one of claims 1 to 9.

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