Particle cleaning system and method for wafer workbench

Abstract

The invention provides a particle cleaning system and method for a wafer workbench, and the system comprises a particle cleaning device which comprises a bearing structure and a cleaning layer; the particle cleaning device is stored on the top layer of the storage table; the moving device is used for moving the particle cleaning device from the top layer of the storage table to the position above the wafer workbench, and the cleaning layer adsorbs and cleans the surface particles of the wafer workbench; the moving device is also used for moving the particle cleaning device from the upper part of the wafer workbench to the top layer of the storage table; the equipment automation device is used for receiving particle data of the wafer workbench through a data interaction interface of the photoetching machine; and the program management module is used for controlling the mobile device to work according to the particle data of the wafer workbench. According to the technical scheme, particles on the surface of the wafer workbench are cleaned in a cleaning layer adsorption mode, and irreversible damage to the wafer workbench is not likely to be caused; according to the invention, automatic cleaning of particles can be realized, and no pollution is caused to a gluing and developing machine table of the photoetching machine.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a particle cleaning system and method for a wafer workbench. Background Art

[0002] In the lithography machine, the wafer table is a platform that carries the wafer for exposure. When the wafer is sent to the table for exposure, some particles will be brought in and fall on the surface of the wafer table. These particles will cause the wafer to defocus and affect the quality of the product.

[0003] For these particles, grinding and cleaning is commonly used in the prior art, such as grinding and cleaning with a granite grindstone; there are many support points on the surface of the wafer workbench, and grinding and cleaning is used to grind the particles to the area between the support points to prevent the particles from affecting the wafer exposure. However, the above grinding and cleaning adopts a hard contact method, and long-term use will cause irreversible damage such as dents to the wafer workbench. Summary of the invention

[0004] The present invention provides a particle cleaning system and method for a wafer workbench, so as to solve the problem in the prior art that grinding and cleaning may cause irreversible damage to the wafer workbench.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] According to a first aspect of the present invention, a particle cleaning system for a wafer workbench is provided, wherein the particle cleaning system is used to clean the wafer workbench in the lithography machine, and the particle cleaning system comprises:

[0007] A particle cleaning device, the particle cleaning device comprising a bearing structure and a cleaning layer, the cleaning layer being attached to the back side of the bearing structure;

[0008] A storage table, wherein the particle cleaning device is stored on a top layer of the storage table;

[0009] A moving device, which is used to move the particle cleaning device from the top layer of the storage table to the top of the wafer worktable, and the cleaning layer adsorbs and cleans the surface particles of the wafer worktable; and is also used to move the particle cleaning device from the top of the wafer worktable to the top layer of the storage table;

[0010] An equipment automation device, which is used to receive the particle data of the wafer worktable through the data interaction interface of the lithography machine;

[0011] A program management module is installed in the equipment automation device and is used to control the mobile device to work according to the particle data of the wafer workbench.

[0012] Optionally, the particle cleaning system further includes: an early warning automatic processing module, installed in the equipment automation device, for shutting down the lithography machine where particles exist on the wafer workbench.

[0013] Optionally, the particle cleaning system further includes: after the early warning automatic processing module shuts down the lithography machine where particles exist on the wafer workbench, the program management module controls the mobile device to work.

[0014] Optionally, the particle cleaning system further includes: a scanning sensor, which is installed in the chamber where the wafer workbench is located, and the scanning sensor is used to transmit data to the equipment automation device through the data interaction interface of the lithography machine.

[0015] Optionally, before the moving device moves the particle cleaning device to above the wafer workbench, it also includes:

[0016] The program management module controls the moving device to move the particle cleaning device from the top layer of the storage table to the pre-alignment unit, so that the pre-alignment unit pre-aligns the particle cleaning device;

[0017] After the pre-alignment is completed, the program management module controls the moving device to move the particle cleaning device from the pre-alignment unit to above the wafer workbench.

[0018] Optionally, the program management module controls the moving device to move the particle cleaning device from above the wafer workbench to the top layer of the storage table, specifically:

[0019] The program management module controls the moving device to move the particle cleaning device from above the wafer workbench to the transfer unit;

[0020] The moving device is controlled to move the particle cleaning device from the transfer unit to the top layer of the storage table.

[0021] Optionally, the supporting structure is a wafer;

[0022] The size of the cleaning layer is consistent with the size of the wafer;

[0023] The size of the cleaning layer is consistent with the surface size of the wafer workbench.

[0024] Optionally, the cleaning layer is a silica gel structure.

[0025] Optionally, the silicone structure and the bearing structure are connected via a silicone adhesive.

[0026] According to a second aspect of the present invention, a particle cleaning method for a wafer workbench is provided, comprising: using any of the particle cleaning systems described above to clean the wafer workbench.

[0027] The particle cleaning system and method for a wafer workbench provided by the present invention adsorb and clean the surface particles of the wafer workbench through a cleaning layer, and utilize the van der Waals force (also known as molecular force) between the cleaning layer and the particle molecules for adsorption. Compared with the hard contact method of grinding and cleaning with a grindstone in the prior art, the silicone structure adsorption method of the present invention is not easy to cause irreversible damage such as dents to the surface of the wafer workbench.

[0028] In addition, the particle cleaning system and method for the wafer workbench provided by the present invention, the particle cleaning device is stored on the storage table in the lithography machine, and the automatic cleaning of particles can be achieved through the equipment automation device and the program management module; and the particle cleaning device is stored on the top layer of the storage table, and normal wafers will not pass through here when entering and exiting the lithography machine. Therefore, the particle cleaning device will not cause contamination to normal wafers and the coating and developing machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0030] Figure 1 A schematic diagram of a particle cleaning system for a wafer workbench according to an embodiment of the present invention;

[0031] Figure 2 A schematic diagram of a particle cleaning device according to an embodiment of the present invention;

[0032] Figure 3 A schematic diagram of a storage table according to an embodiment of the present invention;

[0033] Figure 4 A schematic diagram of a normal wafer transportation path according to an embodiment of the present invention;

[0034] Figure 5 A schematic diagram of a particle cleaning device and a wafer workbench according to a preferred embodiment of the present invention;

[0035] Figure 6 A schematic diagram of a particle cleaning system for a wafer workbench according to a preferred embodiment of the present invention;

[0036] Figure 7A schematic diagram of a path of a particle cleaning device according to a preferred embodiment of the present invention;

[0037] Figure 8 A schematic diagram of a path of a particle cleaning device according to a preferred embodiment of the present invention;

[0038] Fig. 9 A schematic diagram of a particle cleaning device according to a preferred embodiment of the present invention;

[0039] Fig.10 A flow chart of a particle cleaning method for a wafer workbench according to an embodiment of the present invention;

[0040] Description of reference numerals:

[0041] 11- Particle cleaning device;

[0042] 111- load-bearing structure;

[0043] 112-cleaning layer;

[0044] 113-Silicone adhesive;

[0045] 12- Storage table;

[0046] 121-top floor;

[0047] 122-middle level;

[0048] 123- bottom floor;

[0049] 13- Mobile device;

[0050] 14- Equipment automation device;

[0051] 15- Program management module;

[0052] 16- Scanning sensor;

[0053] 17- Early warning automatic processing module;

[0054] 18-pre-alignment unit;

[0055] 19-Transit unit;

[0056] 21- wafer workbench;

[0057] 201-granules. DETAILED DESCRIPTION

[0058] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0059] In the description of the specification of the present invention, it is necessary to understand that the orientation or position relationship indicated by the terms "upper part", "lower part", "upper end", "lower end", "lower surface", "upper surface", etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0060] In the description of the present specification, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0061] In the description of the present invention, "plurality" means a plurality, such as two, three, four, etc., unless otherwise clearly and specifically defined.

[0062] In the description of the present invention, unless otherwise clearly specified and limited, the term "connection" and other terms should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0063] The technical solution of the present invention is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0064] In one embodiment, a particle cleaning system for a wafer workbench is provided, which is used to clean the wafer workbench in a photolithography machine. Figure 1 The particle cleaning system includes: a particle cleaning device 11, a storage table 12, a moving device 13, an equipment automation device 14, and a program management module 15.

[0065] It should be noted that Figure 1The figure only schematically shows the structures included in the particle cleaning system and the interaction between the structures; it does not represent their setting locations.

[0066] The particle cleaning device 11 includes: a supporting structure 111 and a cleaning layer 112, the cleaning layer 112 is attached to the back of the supporting structure 111, please refer to Figure 2 .

[0067] The top layer of the storage table 12 is used to store the particle cleaning device 11;

[0068] The moving device 13 is used to move the particle cleaning device 11 from the top layer of the storage table 12 to the top of the wafer worktable 21, so that the cleaning layer 112 can adsorb and clean the surface particles of the wafer worktable 21; it is also used to move the particle cleaning device 11 from the top of the wafer worktable 21 to the top layer of the storage table 12;

[0069] The equipment automation device 14 is used to receive the particle data of the wafer worktable through the data interaction interface of the lithography machine;

[0070] A program management module, installed in the equipment automation device 14, is used to control the mobile device to work according to the particle data of the wafer workbench 21;

[0071] Specifically: the moving device is controlled to move the particle cleaning device from the top layer of the storage table to above the wafer workbench, so that the cleaning layer adsorbs the particles on the wafer workbench; then the moving device is controlled to move the particle cleaning device from above the wafer workbench to the top layer of the storage table.

[0072] Practically, the storage platform 12 may include a top layer 121, a middle layer 122, and a bottom layer 123. Figure 3 As shown. The particle cleaning device is stored on the top layer, and normal wafers only pass through the middle and bottom layers when entering and exiting the lithography machine. The transportation path of the wafer in the lithography machine is from the glue coating and developing machine to the bottom layer 123 of the storage table. The mobile device transports the wafer on the bottom layer 123 to the pre-alignment unit 17 for pre-alignment, and then the mobile device moves the wafer from the pre-alignment unit 17 to the wafer workbench 21. After the process is completed, the mobile device transports the wafer to the middle layer 122 of the storage table, and the wafer enters the glue coating and developing machine from the middle layer 122. Please refer to Figure 4 Therefore, the particle cleaning device is stored on the top layer 121 of the storage table, and does not enter the coating and developing machine according to the normal wafer transportation path, so that the particles on the particle cleaning device will not pollute the coating and developing machine.

[0073] When there are particles 201 on the surface of the wafer workbench 21, the equipment automation device 14 (EAP, Equipment Automation Programming) receives the particle data of the wafer workbench through the data interaction interface, and the recipe management module (RMS, Recipe Management System) in the equipment automation device 14 issues instructions to control the mobile device to move the particle cleaning device 11 to the wafer workbench 21, and utilizes the van der Waals force between the cleaning layer and the particle molecules to adsorb and clean the surface particles of the wafer workbench through the bottom surface of the cleaning layer. Please refer to Figure 5 .

[0074] The particle cleaning device of the above-mentioned embodiment cleans the surface of the wafer workbench by adsorbing the cleaning layer, and is not likely to cause irreversible damage such as dents on the surface of the wafer workbench; in addition, the particle cleaning device is stored on the top layer of the storage table in the lithography machine, and the automatic cleaning of particles can be achieved through the equipment automation device and the program management module, thereby saving labor costs; at the same time, because the particle cleaning device is stored on the top layer of the storage table, it will not enter the glue coating and developing machine according to the transportation path of the wafer, and will not cause pollution to the glue coating and developing machine of the lithography machine.

[0075] In one embodiment, the particle cleaning system further includes: a scanning sensor 16, see Figure 1 The scanning sensor is installed in the chamber where the wafer worktable is located. It is used to scan the surface of the wafer worktable in real time, obtain particle data, and transmit the particle data to the equipment automation device through the data interaction interface of the lithography machine.

[0076] In one embodiment, the particle cleaning system further includes: an automatic warning processing module 17 (AMS, Alarm Management System), which is installed in the equipment automation device, please refer to Figure 6 , which is used to shut down the photolithography machine with particles on the wafer workbench. When the particle data received by the equipment automation device exceeds the preset value, the corresponding photolithography machine is shut down through the early warning automatic processing module.

[0077] In practice, the preset value of the particle data may be zero, that is, as long as there are particles, they are cleaned up. In different embodiments, the preset value of the particle data may also be greater than zero, that is, when the particles reach a certain value, they are processed collectively.

[0078] Preferably, when the lithography machine is in a shutdown state and when the particle data received by the equipment automation device is lower than a preset value, the lithography machine is switched to an operating state through the early warning automatic processing module.

[0079] Pragmatically, when the lithography machine is shut down, the program management module controls the mobile device to work.

[0080] In one embodiment, the lithography machine includes a pre-alignment unit 18. Figure 7 The path diagram also includes: before the mobile device moves the particle cleaning device to the top of the wafer workbench, the program management module controls the mobile device to move the particle cleaning device from the top layer of the storage table 12 to the pre-alignment unit 17, so that the pre-alignment unit pre-aligns the particle cleaning device; after the pre-alignment is completed, the program management module controls the mobile device to move the particle cleaning device 11 from the pre-alignment unit 17 to the top of the wafer workbench 21.

[0081] Practically, the pre-alignment of the pre-alignment unit may include: pre-aligning the center and direction of the particle cleaning device to make its position more precise during movement, thereby making its alignment with the wafer worktable more precise when it moves above the wafer worktable.

[0082] In one embodiment, the lithography machine includes a transfer unit 19, which may be the middle layer of the storage table in the above embodiment. Figure 8 According to the path diagram, the program management module controls the mobile device to move the particle cleaning device from above the wafer worktable to the top layer of the storage table, specifically: the program management module controls the mobile device to move the particle cleaning device from above the wafer worktable 21 to the transfer unit 19; and then controls the mobile device to move the particle cleaning device from the transfer unit 19 to the top layer of the storage table 12. By transferring through the transfer unit, the movement of the mobile device is more convenient and simple, and the efficiency is improved.

[0083] In one embodiment, the moving device may include: a loading robot arm and an unloading and loading and unloading arm, each arm is responsible for movement within its corresponding area, the moving distance is small, and the setting is more convenient. Specifically, the movement of the particle cleaning device from the top layer of the storage table to the top of the wafer worktable can be achieved by the loading robot arm, the movement from the top of the wafer worktable to the transfer unit can be achieved by the unloading robot arm, and the movement from the transfer unit to the top layer of the storage table can be achieved by the loading robot arm.

[0084] In the above embodiment, the transfer unit is only used for transfer, and the particle cleaning device passes through quickly and does not stay for a long time. Therefore, the probability of contamination to the transfer unit is relatively small.

[0085] Preferably, the transfer unit may be a convex structure with a relatively small top surface area, and the contact area between the particle cleaning device and the transfer unit is small, so the probability of contamination of the transfer unit is smaller.

[0086] In one embodiment, the bearing structure 111 can be a wafer. Because the machine transmission structure of the lithography machine is designed for wafers, the wafer is used as the bearing structure. First, its shape and size are more suitable and do not need to be changed. In addition, there is no need to consider the influence of material strength, toughness and ductility, metal ion pollution and other factors on the bearing structure.

[0087] In one embodiment, the size of the cleaning layer is consistent with the size of the wafer; the size of the cleaning layer is consistent with the surface size of the wafer workbench 21, please refer to Figure 2 In this way, the cleaning layer can completely cover the surface of the wafer workbench, and the adsorption and cleaning of particles on its surface can be completed without parallel movement on the wafer workbench.

[0088] In one embodiment, the cleaning layer may be made of a silicone structure, which is relatively soft and less likely to cause damage to the surface of the wafer workbench.

[0089] Preferably, the silicone structure and the bearing structure are bonded by a silicone adhesive 13, such as HY-128 glue, see Fig. 9 The silicone adhesive 13 has a fast curing speed, is resistant to high and low temperatures, is anti-aging, and is UV-resistant. Even when there is a lot of UV light in the lithography machine, the bonding effect is still very good.

[0090] In one embodiment, a particle cleaning system may correspond to multiple wafer workstations, and the particle cleaning system may achieve adsorption and cleaning of surface particles on multiple wafer workstations.

[0091] In one embodiment, a particle cleaning method for a wafer workbench is also provided, wherein the particle cleaning system described in any of the above embodiments is used for cleaning. Fig.10 , the particle cleaning method comprises:

[0092] S11: receiving the particle data of the wafer workbench in real time, and when the particle data exceeds a preset value, proceeding to the next step.

[0093] Practically, the equipment automation device can be used to receive the particle data of the wafer worktable through the data interaction interface of the lithography machine.

[0094] Practically, the particle data of the wafer worktable can be realized by a scanning sensor. By scanning the surface of the wafer worktable with the scanning sensor and analyzing the scanned image, it can be determined whether there are particles on the surface of the wafer worktable and how many particles there are.

[0095] In practice, the preset value of the particle data may be zero, that is, as long as there are particles, they are cleaned up. In different embodiments, the preset value of the particle data may also be greater than zero, that is, when the particles reach a certain value, they are processed collectively.

[0096] S12: Move the particle cleaning device from the top layer of the storage table to above the wafer workbench to adsorb and clean the surface particles of the wafer workbench through the cleaning layer.

[0097] Practically, a program command may be issued through the program management module to control the moving device to move the particle cleaning device from the top layer of the storage table to above the wafer workbench.

[0098] S13: Move the particle cleaning device from above the wafer workbench to the top layer of the storage table for storage.

[0099] Practically, the program management module can be used to control the moving device to move the particle cleaning device from above the wafer workbench to the top layer of the storage table.

[0100] The particle cleaning method of the above-mentioned embodiment automatically monitors the surface particles of the wafer workbench, generates an automatic cleaning path for the particle cleaning device, and uses the particle cleaning device to achieve adsorption and cleaning of particles on the surface of the wafer workbench, thereby realizing automatic monitoring and automatic cleaning of particles and not easily causing irreversible damage to the surface of the wafer workbench.

[0101] In one embodiment, please refer to Fig.10 , S11 and later also include:

[0102] S21: When the received particle data exceeds a preset value, the corresponding lithography machine is shut down, that is, switched from the running state to the shutdown state.

[0103] Practically, the corresponding lithography machine can be shut down through the early warning automatic processing module.

[0104] Correspondingly, after S13, it also includes:

[0105] S22: Receive the particle data of the wafer workbench in real time. When the particle data is lower than the preset value, the adsorption cleaning is completed and the corresponding lithography machine is switched back to the running state. If the particle data is still higher than the preset value, return to S12, that is, repeat the cleaning until the cleaning is completed.

[0106] In one embodiment, between S11 and S12, the following is also included:

[0107] S31: Move the particle cleaning device from the top layer of the storage table to the pre-alignment unit so that the pre-alignment unit pre-aligns the particle cleaning device, including: pre-aligning the center and direction of the particle cleaning device to make its position more precise during movement, so that when it moves to the top of the wafer workbench, its alignment with the wafer workbench is more precise.

[0108] In practice, the moving device may be controlled by the program management module to move the particle cleaning device from the top layer of the storage table to the pre-alignment unit.

[0109] S32: After the pre-alignment is completed, the particle cleaning device is controlled to move from the pre-alignment unit to above the wafer workbench.

[0110] In practice, the program management module may be used to control the moving device to move the particle cleaning device from the pre-alignment unit to above the wafer workbench.

[0111] In one embodiment, S13 is completed in two steps, specifically including:

[0112] S131: Move the particle cleaning device from above the wafer workbench to the transfer unit.

[0113] Practically, the program management module may be used to control the moving device to move the particle cleaning device from above the wafer workbench to the transfer unit.

[0114] S132: Move the particle cleaning device from the transfer unit to the top layer of the storage table for storage.

[0115] In practice, the program management module may be used to control the moving device to move the particle cleaning device from the transfer unit to the top layer of the storage table.

[0116] In one embodiment, the particle cleaning method further comprises:

[0117] S41: The particle cleaning device is taken out from the top layer of the storage table regularly to clean it, so that the bottom surface of the cleaning layer is kept clean and a better adsorption effect is maintained.

[0118] In summary, the present invention automatically monitors the surface particles of the wafer workbench through the particle cleaning system, generates an automatic cleaning path for the particle cleaning device, and utilizes the particle cleaning device to realize adsorption and cleaning of particles on the surface of the wafer workbench, thereby realizing automatic monitoring and automatic cleaning of particles, and is not prone to causing irreversible damage to the surface of the wafer workbench.

[0119] The above describes specific embodiments of the present invention. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0120] In the description of this specification, the description with reference to the terms "an implementation", "an example", "a specific implementation process", "an example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0121] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A particle cleaning system for a wafer workbench, characterized in that: The particle cleaning system is used to clean the wafer workbench in the photolithography machine, and the particle cleaning system includes: A particle cleaning device, the particle cleaning device comprising a bearing structure and a cleaning layer, the cleaning layer being attached to the back side of the bearing structure; A storage table, wherein the particle cleaning device is stored on a top layer of the storage table; A moving device, which is used to move the particle cleaning device from the top layer of the storage table to the top of the wafer worktable, and the cleaning layer adsorbs and cleans the surface particles of the wafer worktable; and is also used to move the particle cleaning device from the top of the wafer worktable to the top layer of the storage table; An equipment automation device, which is used to receive the particle data of the wafer worktable through the data interaction interface of the lithography machine; A program management module is installed in the equipment automation device and is used to control the mobile device to work according to the particle data of the wafer workbench.

2. The particle cleaning system according to claim 1, characterized in that: The particle cleaning system also includes: an early warning automatic processing module, which is installed in the equipment automation device and is used to shut down the photolithography machine where particles exist on the wafer workbench.

3. The particle cleaning system according to claim 2, characterized in that: The particle cleaning system further includes: after the early warning automatic processing module shuts down the lithography machine where particles exist on the wafer workbench, the program management module controls the mobile device to work.

4. The particle cleaning system according to claim 1, characterized in that: The particle cleaning system also includes: a scanning sensor, which is installed in the chamber where the wafer workbench is located, and the scanning sensor is used to transmit data to the equipment automation device through the data interaction interface of the lithography machine.

5. The particle cleaning system according to claim 1, characterized in that: Before the moving device moves the particle cleaning device to above the wafer workbench, it also includes: The program management module controls the moving device to move the particle cleaning device from the top layer of the storage table to the pre-alignment unit, so that the pre-alignment unit pre-aligns the particle cleaning device; After the pre-alignment is completed, the program management module controls the moving device to move the particle cleaning device from the pre-alignment unit to above the wafer workbench.

6. The particle cleaning system according to claim 5, characterized in that: The program management module controls the moving device to move the particle cleaning device from above the wafer workbench to the top layer of the storage table, specifically: The program management module controls the moving device to move the particle cleaning device from above the wafer workbench to the transfer unit; The moving device is controlled to move the particle cleaning device from the transfer unit to the top layer of the storage table.

7. The particle cleaning system according to claim 1, characterized in that: The supporting structure is a wafer; The size of the cleaning layer is consistent with the size of the wafer; The size of the cleaning layer is consistent with the surface size of the wafer workbench.

8. The wafer worktable particle cleaning system according to claim 1, characterized in that: The cleaning layer is a silica gel structure.

9. The particle cleaning system according to claim 8, characterized in that: The silicone structure and the bearing structure are connected via a silicone adhesive.

10. A particle cleaning method for a wafer workbench, characterized in that: The wafer workbench is cleaned using the particle cleaning system described in any one of claims 1 to 9.

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