Inverted IC package and manufacturing method thereof

Abstract

The invention discloses a flip IC packaging part and a manufacturing method thereof, and relates to the technical field of flip IC packaging parts, the flip IC packaging part comprises a main body mechanism, the main body mechanism comprises a packaging substrate, a chip main body is arranged above the packaging substrate, the bottom surface of the chip main body is provided with a plurality of same welding salient points, and the welding salient points are arranged on the packaging substrate. The flip IC packaging part comprises a packaging substrate, a chip main body is arranged on the packaging substrate, a chip heat dissipation mechanism is arranged on the outer side of the packaging substrate, the chip heat dissipation mechanism comprises an active heat dissipation unit, the active heat dissipation unit is located above the chip main body, and the active heat dissipation unit is used for active ventilation and heat dissipation of the chip main body. The active heat dissipation unit is arranged above the chip main body and can play a role in active ventilation and heat dissipation on the upper portion of the chip main body, the purpose of active ventilation and heat dissipation on the back face of the flip chip is achieved, cooling can be carried out on the condition that the surface of the flip chip is not contacted, and the heat dissipation capacity is provided for the flip chip on one hand.

Description

Technical Field

[0001] The present invention relates to the technical field of flip-chip IC packages, and in particular to a flip-chip IC package and a manufacturing method thereof. Background Art

[0002] Flip-chip IC packaging is an advanced integrated circuit packaging technology. In flip-chip IC packaging, the active side of the chip faces downward, and the connection points on the chip are directly connected to the substrate or circuit board, shortening the interconnection length between the chip and the substrate, thereby reducing the delay and loss of signal transmission, which is beneficial to improving the performance and speed of the circuit. Flip-chip IC packaging is widely used in high-performance computing, communications, consumer electronics and other fields, providing strong support for the miniaturization and high performance of various electronic devices. In the processor of a smartphone, flip-chip IC packaging helps to integrate more functions in a limited space while ensuring high-speed data processing and transmission.

[0003] In flip chip technology, the flipped chip is in direct contact with the package substrate, which makes heat dissipation difficult. Since the back of the flip chip cannot dissipate heat freely, overheating may occur. In flip chip, heat dissipation is often achieved by changing the thermal interface material, which cannot meet the free heat dissipation requirements of the flip chip. Therefore, we propose a flip chip IC package and a manufacturing method thereof.

[0004] In view of the above problems, it is found that it is difficult to avoid the above problems at the same time when using the existing flip-chip IC packages on the market, and even if they can be solved, they need to be solved with the cooperation of external tools, which makes it impossible to achieve the desired effect. Therefore, we propose a flip-chip IC package and a manufacturing method thereof. Summary of the invention

[0005] The object of the present invention is to provide a flip-chip IC package and a method for manufacturing the same to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions: a flip-chip IC package and a manufacturing method thereof, comprising a main body mechanism, the main body mechanism comprising a packaging substrate, a chip body is arranged above the packaging substrate, a plurality of identical solder bumps are arranged on the bottom surface of the chip body, and a chip heat dissipation mechanism is arranged on the outer side of the packaging substrate;

[0007] The chip heat dissipation mechanism includes an active heat dissipation unit, which is located above the chip body and is used for active ventilation and heat dissipation of the chip body;

[0008] The chip heat dissipation mechanism also includes a passive heat dissipation unit, which is located below the chip body and is used for passive heat absorption of the chip body to achieve the function of cooling the chip body;

[0009] A substrate heat dissipation mechanism is disposed below the passive heat dissipation unit. The substrate heat dissipation mechanism is located inside the packaging substrate and is used to cool the connection point between the chip body and the packaging substrate.

[0010] Preferably, the active heat dissipation unit includes a protective shell, which is located on the outside of the chip body, and the upper surface of the protective shell is provided with a plurality of identical square openings, and each of the upper surfaces of the protective shells is fixedly installed with a plurality of identical mounting plates, and each of the mounting plates is located directly above the square openings, and the upper surface of each of the mounting plates is provided with a plurality of identical heat dissipation openings, and the upper surface of each of the mounting plates is provided with a pipe opening, and the interior of each of the pipe openings is fixedly connected to an air outlet pipe, and two ventilation pipes are arranged above each of the mounting plates, and the interior of each of the ventilation pipes is connected to the interior of the air outlet pipe, and the interior of each of the ventilation pipes is fixedly connected to two air inlet pipes.

[0011] Preferably, two groups of support plates are fixedly mounted on the upper surface of the packaging substrate, and the inner side of each group of support plates is in contact with the outer surface of the chip body.

[0012] Preferably, a slot is formed on the upper surface of each group of the support plates, and the interior of each slot is snap-connected with the outer surface of the protective shell.

[0013] Preferably, the passive heat dissipation unit includes a plurality of identical slots, each of which is opened on the packaging substrate, a heat sink is slidably connected to the interior of each slot, the upper surface of each heat sink is in contact with the bottom surface of the chip body, and a spaced heat dissipation port is opened on the front of each heat sink. A groove is opened on the upper surface of the packaging substrate, and the grooves are connected to the slots. Two guide rods are fixedly installed on the inner side walls of the grooves, and a push plate is slidably connected to the outer surfaces of the two guide rods. A plurality of identical fixed push rods are fixedly installed on the right side of the push plate, and a positioning hole is opened on the left side of each heat sink, and the outer surface of each fixed push rod is snap-fitted with the interior of the positioning hole.

[0014] Preferably, a closing cover is clamped inside the groove, and an inner top wall of the closing cover is in contact with the upper surface of the push plate.

[0015] Preferably, the substrate heat dissipation mechanism includes a plurality of identical mounting ports, and each of the mounting ports is opened on the packaging substrate, and a plurality of identical cooling pipe holes are opened on the upper surface of the packaging substrate, and the interior of each of the cooling pipe holes is connected with the interior of the mounting port, and a cooling water pipe is fixedly installed on the inner wall of each of the mounting ports, and a cooling contact plate is fixedly installed inside each of the cooling water pipes, and each of the cooling contact plates is located inside the cooling pipe hole, and the interior of each of the cooling water pipes is fixedly connected with a water inlet pipe, and the interior of each of the mounting ports is provided with an inlet and outlet pipe.

[0016] Preferably, the interior of each of the inlet and outlet pipes is fixedly connected to a first control valve, and each of the first control valves is located at the front end of the inlet and outlet pipes.

[0017] Preferably, the interior of each of the inlet and outlet pipes is fixedly connected to a second control valve, and each of the second control valves is located at the rear end of the inlet and outlet pipes.

[0018] A method for manufacturing a flip-chip IC package comprises the following steps:

[0019] S1: When the chip body is cooled, active cooling can be performed. A cooling airflow is introduced into the ventilation pipe through the air inlet pipe, and then airflow is introduced into different positions above the chip body through the air outlet pipe to provide active ventilation and cooling for the chip body. Airflow circulates in the gap between the protective shell and the chip body to achieve the effect of active cooling of the chip body.

[0020] S2: When the chip body is in use, the heat sink contacts the chip body and performs passive heat dissipation on the chip body, relying on heat conduction and heat radiation to dissipate heat. The heat sink increases the surface area in contact with the air to enhance heat conduction and dissipate heat to the surrounding environment. Different numbers of heat sinks are installed in the slot according to usage requirements.

[0021] S3: Both the chip body and the packaging substrate will generate heat, and the packaging substrate is cooled by water. The inlet and outlet pipes are controlled by the first control valve and the second control valve to control the water inlet or outlet of the cooling water pipe to achieve a circulating cooling effect. The cooling contact sheet cools the connection between the chip body and the packaging substrate, and the cooling water pipe cools the packaging substrate.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The present invention is provided with an active heat dissipation unit, which is located above the chip body and can play a role in actively ventilating and dissipating the upper part of the chip body, thereby achieving the purpose of actively ventilating and dissipating the back side of the flip chip, which is beneficial for cooling the chip without contacting the surface of the flip chip, thereby providing a heat dissipation capability.

[0024] 2. The present invention is provided with a passive heat dissipation unit, which is in contact with the bottom surface of the chip body, and can play a role in passively dissipating the heat of the chip body, thereby achieving the purpose of passively dissipating the heat and cooling the front side of the flip chip, and is conducive to cooperating with the active heat dissipation unit to perform double-sided heat dissipation on the chip body.

[0025] 3. The present invention is provided with a substrate heat dissipation mechanism, which can dissipate heat at the contact point between the chip body and the packaging substrate and the packaging substrate, thereby achieving the purpose of dissipating heat for the chip body and the packaging substrate as a whole, achieving the effect of multi-faceted heat dissipation of the flip chip, and satisfying the free heat dissipation function of the flip chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 It is a schematic diagram of the structure of the protective housing of the present invention;

[0028] Figure 3 It is a schematic structural diagram of the chip body of the present invention;

[0029] Figure 4 It is a structural schematic diagram of the mounting plate of the present invention;

[0030] Figure 5 It is a structural schematic diagram of the slot of the present invention;

[0031] Figure 6 It is a structural schematic diagram of the packaging substrate of the present invention;

[0032] Figure 7 It is a schematic diagram of the structure of the heat sink of the present invention;

[0033] Figure 8 It is a structural schematic diagram of the push plate of the present invention;

[0034] Fig. 9 It is a schematic diagram of the structure of the inlet and outlet pipes of the present invention.

[0035] In the figure: 1. Main body; 11. Package substrate; 12. Chip body; 13. Welding bumps; 2. Chip heat dissipation mechanism; 21. Active heat dissipation unit; 2101. Protective housing; 2102. Support plate; 2103. Card slot; 2104. Square opening; 2105. Air inlet pipe; 2106. Air outlet pipe; 2107. Ventilation pipe; 2108. Mounting plate; 2109. Pipe opening; 2110. Heat dissipation port; 22. Passive heat dissipation unit; 2201. Slot; 2202, groove; 2203, closing cover; 2204, heat sink; 2205, spaced heat exhaust port; 2206, positioning hole; 2207, guide rod; 2208, push plate; 2209, fixed push rod; 3, substrate heat dissipation mechanism; 301, installation port; 302, cooling pipe hole; 303, cooling water pipe; 304, water inlet pipe; 305, first control valve; 306, inlet and outlet pipe; 307, cooling contact plate; 308, second control valve. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] Embodiment 1

[0038] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 The present invention provides a technical solution: a flip-chip IC package and a manufacturing method thereof. The present invention makes corresponding improvements to the technical problems mentioned in the background technology, including a main body mechanism 1, the main body mechanism 1 includes a packaging substrate 11, a chip body 12 is arranged above the packaging substrate 11, a plurality of identical solder bumps 13 are arranged on the bottom surface of the chip body 12, and a chip heat dissipation mechanism 2 is arranged on the outer side of the packaging substrate 11;

[0039] The chip heat dissipation mechanism 2 includes an active heat dissipation unit 21 . The active heat dissipation unit 21 is located above the chip body 12 . The active heat dissipation unit 21 is used for active ventilation and heat dissipation of the chip body 12 .

[0040] As a further limitation of the chip heat dissipation mechanism 2 of the present invention, the active heat dissipation unit 21 includes a protective shell 2101, which is located on the outside of the chip body 12. The upper surface of the protective shell 2101 is provided with several identical square openings 2104, and the upper surface of each protective shell 2101 is fixedly installed with several identical mounting plates 2108, and each mounting plate 2108 is located directly above the square opening 2104. The upper surface of each mounting plate 2108 is provided with several identical heat dissipation ports 2110, and the upper surface of each mounting plate 2108 is provided with a pipe opening 2109, and the interior of each pipe opening 2109 is fixedly connected to an air outlet pipe 2106, and two ventilation pipes 2107 are arranged above each mounting plate 2108, and the interior of each ventilation pipe 2107 is connected to the interior of the air outlet pipe 2106, and the interior of each ventilation pipe 2107 is fixedly connected to two air inlet pipes 2105. By providing an active heat dissipation unit 21, the active heat dissipation unit 21 is above the chip body 12, which can play a role in active ventilation and heat dissipation above the chip body 12, thereby achieving the purpose of active ventilation and heat dissipation on the back of the flip chip, which is beneficial to cooling without contacting the surface of the flip chip, thereby providing it with heat dissipation capability.

[0041] See also Figure 3 Two groups of support plates 2102 are fixedly installed on the upper surface of the packaging substrate 11, and the inner side of each group of support plates 2102 is in contact with the outer surface of the chip body 12. By providing the support plates 2102, the chip body 12 can be supported to ensure the overall stability of the chip body 12.

[0042] See also Figure 3 A card slot 2103 is provided on the upper surface of each group of support plates 2102, and the interior of each card slot 2103 is snap-connected with the outer surface of the protective shell 2101. The card slot 2103 is used to install the protective shell 2101, ensuring that the protective shell 2101 is installed outside the chip body 12 to protect the chip body 12.

[0043] The specific implementation method of this embodiment is as follows: the heat dissipation of the chip body 12 is an important part of the flip chip, and an active heat dissipation unit 21 is used for active heat dissipation. When in use, the air inlet pipe 2105 is connected to the external air supply pipe. After the air flow is introduced, the air flow is discharged into the ventilation pipe 2107 through the air inlet pipe 2105, and then the air flow is sent into the air outlet pipe 2106 from the ventilation pipe 2107. The air outlet pipe 2106 blows out air flow at different positions of the chip body 12 to actively dissipate the heat of the chip body 12. The hot air flow can also be discharged through the heat dissipation port 2110 to cover the chip body 12. There is a certain gap between the protective shell 2101 and the chip body 12, and the air flow circulates between the gap to completely dissipate the heat of the chip body 12.

[0044] Embodiment 2

[0045] See also Figure 1 , Figure 5 , Figure 6 , Figure 7 and Figure 8 The present invention provides a technical solution: a flip-chip IC package and a manufacturing method thereof. The present invention makes corresponding improvements to the technical problems mentioned in the background technology. The chip heat dissipation mechanism 2 also includes a passive heat dissipation unit 22. The passive heat dissipation unit 22 is located below the chip body 12. The passive heat dissipation unit 22 is used for passive heat absorption of the chip body 12 to achieve the function of cooling the chip body 12.

[0046] As a further limitation of the chip heat dissipation mechanism 2 of the present invention, the passive heat dissipation unit 22 includes a plurality of identical slots 2201, each slot 2201 is provided on the packaging substrate 11, a heat sink 2204 is slidably connected to the interior of each slot 2201, the upper surface of each heat sink 2204 is in contact with the bottom surface of the chip body 12, and a spaced heat dissipation port 2205 is provided on the front of each heat sink 2204. A groove 2202 is provided on the upper surface of the packaging substrate 11, and the grooves 2202 are connected to the slots 2201. Two guide rods 2207 are fixedly installed on the inner side wall of the groove 2202. The two guide rods 2207 are fixedly installed on the inner side wall of the groove 2202. The outer surface of 207 is slidably connected with a push plate 2208, and a number of identical fixed push rods 2209 are fixedly installed on the right side of the push plate 2208. A positioning hole 2206 is opened on the left side of each heat sink 2204, and the outer surface of each fixed push rod 2209 is snap-fitted with the inside of the positioning hole 2206. By providing a passive heat dissipation unit 22, the passive heat dissipation unit 22 contacts the bottom surface of the chip body 12, which can play a role in passively dissipating the heat of the chip body 12, thereby achieving the purpose of passively dissipating the heat and cooling the front side of the flip chip, which is beneficial to cooperate with the active heat dissipation unit 21 to perform double-sided heat dissipation on the chip body 12.

[0047] See also Figure 6 A closing cover 2203 is clamped inside the groove 2202, and the inner top wall of the closing cover 2203 is in contact with the upper surface of the push plate 2208. By providing the closing cover 2203, the groove 2202 is closed, and the push plate 2208, the guide rod 2207 and other structures are protected.

[0048] The specific implementation of this embodiment is as follows: since the chip body 12 will be used for a long time, during heat dissipation, the heat sink 2204 can perform passive heat dissipation on the chip body 12 to absorb the heat on the chip body 12, and cooperate with the active heat dissipation unit 21 to achieve the effect of forced air flow and improved heat dissipation efficiency. The heat sink 2204 can be selected in different quantities according to needs. The heat sink 2204 is installed in the slot 2201, and the push plate 2208 is installed on the guide rod 2207. The fixed push rod 2209 is aligned with the positioning hole 2206, and the push plate 2208 is pushed to push the heat sink 2204 into the slot 2201 to complete the installation of the heat sink 2204. When removing the heat sink 2204, the heat sink 2204 can be taken out by utilizing the snap-fit ​​between the fixed push rod 2209 and the positioning hole 2206.

[0049] Embodiment 3

[0050] See also Figure 1 , Figure 5 and Fig. 9 The present invention provides a technical solution: a flip-chip IC package and a manufacturing method thereof. The present invention makes corresponding improvements to the technical problems mentioned in the background technology. A substrate heat dissipation mechanism 3 is arranged below the passive heat dissipation unit 22. The substrate heat dissipation mechanism 3 is located inside the packaging substrate 11. The substrate heat dissipation mechanism 3 is used to cool the connection point between the chip body 12 and the packaging substrate 11.

[0051] As a further limitation of the substrate heat dissipation mechanism 3 of the present invention, the substrate heat dissipation mechanism 3 includes a plurality of identical mounting ports 301, and each mounting port 301 is opened on the packaging substrate 11, and a plurality of identical cooling pipe holes 302 are opened on the upper surface of the packaging substrate 11, and the interior of each cooling pipe hole 302 is connected with the interior of the mounting port 301, and a cooling water pipe 303 is fixedly installed on the inner wall of each mounting port 301, and a cooling contact plate 307 is fixedly installed inside each cooling water pipe 303, and each cooling contact plate 307 is located inside the cooling pipe hole 302, and the interior of each cooling water pipe 303 is fixedly connected with a water inlet pipe 304, and the interior of each mounting port 301 is provided with an inlet and outlet pipe 306. By providing the substrate heat dissipation mechanism 3, the substrate heat dissipation mechanism 3 can dissipate the heat at the contact point between the chip body 12 and the packaging substrate 11 and the packaging substrate 11, so as to achieve the purpose of dissipating the heat of the chip body 12 and the packaging substrate 11 as a whole, and achieve the effect of multi-faceted heat dissipation of the flip chip, satisfying the free heat dissipation function of the flip chip.

[0052] See also Fig. 9Each inlet and outlet pipe 306 is fixedly connected to the inside with a first control valve 305, and each first control valve 305 is located at the front end of the inlet and outlet pipe 306. By providing the first control valve 305, the front end of the inlet and outlet pipe 306 is the water inlet part, and the first control valve 305 controls the water inlet, and the front end of the inlet and outlet pipe 306 is connected to an external water supply pipe.

[0053] See also Fig. 9 Each inlet and outlet pipe 306 is fixedly connected to the inside with a second control valve 308, and each second control valve 308 is located at the rear end of the inlet and outlet pipe 306. The second control valve 308 is provided to control the drainage part at the rear end of the inlet and outlet pipe 306, and then cooperate with the first control valve 305 to complete the water inlet and drainage of the inlet and outlet pipe 306.

[0054] The specific implementation of this embodiment is as follows: the packaging substrate 11 also needs to dissipate heat during use, and cooling liquid can be introduced into the inlet and outlet pipes 306. The cooling liquid enters at the front end of the inlet and outlet pipes 306, and is introduced into the cooling water pipe 303 through the water inlet pipe 304. The heat is dissipated through the cooling water pipe 303 and the cooling contact sheet 307. The cooling contact sheet 307 mainly dissipates heat at the connection between the chip body 12 and the packaging substrate 11, and the cooling water pipe 303 dissipates heat for the packaging substrate 11. The first control valve 305 and the second control valve 308 are used to control the on and off of the inlet and outlet pipes 306, so as to control the circulation of the cooling liquid in the cooling water pipe 303 and the inlet and outlet pipes 306, and dissipate heat and cool the packaging substrate 11 in a water-cooled manner.

[0055] A method for manufacturing a flip-chip IC package comprises the following steps:

[0056] S1: When the chip body 12 is cooled, active cooling can be performed. A cooling airflow is introduced into the ventilation pipe 2107 through the air inlet pipe 2105, and then airflow is introduced into different positions above the chip body 12 through the air outlet pipe 2106 to provide active ventilation and cooling for the chip body 12. Airflow circulates in the gap between the protective housing 2101 and the chip body 12 to achieve the effect of active cooling of the chip body 12.

[0057] S2: During the use of the chip body 12, the heat sink 2204 contacts the chip body 12, and the chip body 12 is passively cooled, relying on heat conduction and heat radiation to dissipate heat. The heat sink 2204 increases the surface area in contact with the air to enhance heat conduction and dissipate heat to the surrounding environment. Different numbers of heat sinks 2204 are installed in the slot 2201 according to usage requirements;

[0058] S3: Both the chip body 12 and the packaging substrate 11 will generate heat, and the packaging substrate 11 uses water cooling to dissipate heat. The inlet and outlet pipes 306 are controlled by the first control valve 305 and the second control valve 308 to control the water inlet or outlet of the cooling water pipe 303 to achieve a circulating cooling effect. The cooling contact plate 307 cools down the connection between the chip body 12 and the packaging substrate 11, and the cooling water pipe 303 cools down the packaging substrate 11.

[0059] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0060] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A flip-chip IC package, comprising a main body (1), characterized in that: The main body mechanism (1) comprises a packaging substrate (11), a chip body (12) is arranged above the packaging substrate (11), a plurality of identical welding bumps (13) are arranged on the bottom surface of the chip body (12), and a chip heat dissipation mechanism (2) is arranged on the outside of the packaging substrate (11); The chip heat dissipation mechanism (2) comprises an active heat dissipation unit (21), the active heat dissipation unit (21) is located above the chip body (12), and the active heat dissipation unit (21) is used for active ventilation and heat dissipation of the chip body (12); The chip heat dissipation mechanism (2) further comprises a passive heat dissipation unit (22), the passive heat dissipation unit (22) being located below the chip body (12), and the passive heat dissipation unit (22) being used for passively absorbing heat from the chip body (12) to achieve the function of cooling the chip body (12); A substrate heat dissipation mechanism (3) is provided below the passive heat dissipation unit (22); the substrate heat dissipation mechanism (3) is located inside the packaging substrate (11); the substrate heat dissipation mechanism (3) is used to cool the connection point between the chip body (12) and the packaging substrate (11).

2. The flip-chip IC package according to claim 1, characterized in that: The active heat dissipation unit (21) comprises a protective shell (2101), the protective shell (2101) is located outside the chip body (12), the upper surface of the protective shell (2101) is provided with a plurality of identical square openings (2104), the upper surface of each of the protective shells (2101) is fixedly provided with a plurality of identical mounting plates (2108), and each of the mounting plates (2108) is located directly above the square opening (2104), and the upper surface of each of the mounting plates (2108) is provided with A plurality of identical heat dissipation ports (2110), each of the mounting plates (2108) having a pipe port (2109) on its upper surface, each of the pipe ports (2109) being fixedly connected to an air outlet pipe (2106) inside, two ventilation pipes (2107) being arranged above each of the mounting plates (2108), each of the ventilation pipes (2107) being connected to the inside of the air outlet pipe (2106), and each of the ventilation pipes (2107) being fixedly connected to two air inlet pipes (2105) inside.

3. The flip-chip IC package according to claim 2, characterized in that: Two groups of support plates (2102) are fixedly mounted on the upper surface of the packaging substrate (11), and the inner side of each group of support plates (2102) is in contact with the outer surface of the chip body (12).

4. The flip-chip IC package according to claim 3, characterized in that: A slot (2103) is provided on the upper surface of each group of the support plates (2102), and the interior of each slot (2103) is snap-connected with the outer surface of the protective shell (2101).

5. The flip-chip IC package according to claim 2, characterized in that: The passive heat dissipation unit (22) comprises a plurality of identical slots (2201), each of the slots (2201) being provided on the packaging substrate (11), a heat sink (2204) being slidably connected to the interior of each slot (2201), the upper surface of each heat sink (2204) being in contact with the bottom surface of the chip body (12), a spaced heat dissipation port (2205) being provided on the front surface of each heat sink (2204), and a groove (2202) being provided on the upper surface of the packaging substrate (11), the groove (2204) being provided with a heat dissipation port (2205) disposed on the upper surface of the packaging substrate (11). 2202) are connected to the slot (2201), the inner wall of the groove (2202) is fixedly installed with two guide rods (2207), the outer surfaces of the two guide rods (2207) are slidably connected with a push plate (2208), and the right side of the push plate (2208) is fixedly installed with a plurality of identical fixed push rods (2209), and the left side of each heat sink (2204) is provided with a positioning hole (2206), and the outer surface of each fixed push rod (2209) is snap-fitted with the inside of the positioning hole (2206).

6. The flip-chip IC package according to claim 5, characterized in that: A closing cover (2203) is clamped inside the groove (2202), and the inner top wall of the closing cover (2203) is in contact with the upper surface of the push plate (2208).

7. The flip-chip IC package according to claim 5, characterized in that: The substrate heat dissipation mechanism (3) comprises a plurality of identical mounting ports (301), and each mounting port (301) is provided on the packaging substrate (11); a plurality of identical cooling pipe holes (302) are provided on the upper surface of the packaging substrate (11); the interior of each cooling pipe hole (302) is connected to the interior of the mounting port (301); a cooling water pipe (303) is fixedly installed on the inner wall of each mounting port (301); a cooling contact plate (307) is fixedly installed inside each cooling water pipe (303); each cooling contact plate (307) is located inside the cooling pipe hole (302); the interior of each cooling water pipe (303) is fixedly connected to a water inlet pipe (304); and the interior of each mounting port (301) is provided with an inlet and outlet pipe (306).

8. The flip-chip IC package according to claim 7, characterized in that: The interior of each inlet and outlet pipe (306) is fixedly connected to a first control valve (305), and each first control valve (305) is located at the front end of the inlet and outlet pipe (306).

9. The flip-chip IC package according to claim 8, characterized in that: The interior of each of the inlet and outlet pipes (306) is fixedly connected to a second control valve (308), and each of the second control valves (308) is located at the rear end of the inlet and outlet pipe (306).

10. The method for manufacturing a flip-chip IC package according to claim 9, characterized in that: The specific steps include: S1: When the chip body (12) is cooled, active cooling can be performed. A cooling airflow is introduced into the ventilation pipe (2107) through the air inlet pipe (2105), and then airflow is introduced into different positions above the chip body (12) through the air outlet pipe (2106), thereby providing active ventilation and cooling for the chip body (12). Airflow is circulated in the gap between the protective housing (2101) and the chip body (12), thereby achieving the effect of active cooling of the chip body (12); S2: During the use of the chip body (12), the heat sink (2204) contacts the chip body (12) and performs passive heat dissipation on the chip body (12). The heat is dissipated by heat conduction and heat radiation. The heat sink (2204) increases the surface area in contact with the air to enhance heat conduction and dissipate the heat to the surrounding environment. Different numbers of heat sinks (2204) are installed in the slot (2201) according to the use requirements. S3: Both the chip body (12) and the packaging substrate (11) generate heat. The packaging substrate (11) uses water cooling to dissipate heat. The inlet and outlet pipes 306 are controlled by the first control valve (305) and the second control valve (308) to control the water inlet or outlet of the cooling water pipe (303) to achieve a circulating cooling effect. The cooling contact plate (307) cools the connection between the chip body (12) and the packaging substrate (11), and the cooling water pipe (303) cools the packaging substrate (11).

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