High-performance laser supporting waveform editing function

Abstract

The invention discloses a high-performance laser supporting a waveform editing function. The laser comprises a waveform storage module, an FPGA module and a laser output module, the waveform storage module is used for storing a processing waveform of a complete period edited by a user and generating waveform data information corresponding to the processing waveform, and is also used for sending the waveform data information to the FPGA module; the FPGA module receives the waveform data information, analyzes and executes the waveform data information, and sends a light emitting instruction to the laser output module; the laser output module outputs laser according to the light emitting instruction. By the adoption of the laser, a user can design any machining waveform to control the laser to emit light, the cutting performance of a specific plate is optimized to the greatest extent, a one-key cutting easy-to-use mode is adopted for machining, the usability is good, and the cutting performance is high.

Description

Technical Field

[0001] The invention relates to the field of laser cutting, and in particular to a high-performance laser supporting a waveform editing function. Background Art

[0002] A laser is a device that can produce high-intensity, high-brightness light beams and is widely used in industrial processing, medical treatment, scientific research and other fields. In different application fields and subdivided scenarios, various applications have different requirements for laser light intensity, wavelength, pulse width and other parameters. For example, in the laser marking process, different laser waveforms need to be selected according to the properties of the material and the required level of fineness of the mark; some materials may be more sensitive to lasers of specific wavelengths, or require pulses of specific shapes for precise processing. Therefore, by adjusting the laser's light waveform, the processing effect can be optimized and the processing quality and efficiency can be improved.

[0003] The existing technology uses a waveform control card to change the laser light waveform. The waveform control card stores the waveform parameters edited in advance by the R&D personnel, and then connects and communicates with the laser through a specific interface (such as the SPI interface) to send specific waveform data and control instructions. These data and instructions include parameters such as the waveform type, amplitude, and frequency. By modifying these parameters, light waveforms of different shapes and characteristics can be achieved, thereby meeting different application requirements.

[0004] However, the applicant has found that the traditional waveform control card solution still has the following shortcomings: 1. The waveform control card and the laser are usually connected by plug-in, and the reliability of the laser light wavelength control is low; 2. The waveform data stored in the waveform control card is limited, and can only achieve better processing effects for limited and specific plates, which cannot meet the rapid growth of laser processing demand and higher requirements for processing effects; 3. The waveform editing card controls the output of the laser by adjusting the parameters of the PWM signal. The selection of these parameters will affect the speed and control accuracy of the laser. Summary of the invention

[0005] The embodiments of the present invention aim to provide a high-performance laser that supports waveform editing function, so as to solve the technical problems in the prior art of using a waveform control card to realize the change of the laser light output waveform, such as low reliability of laser light output wavelength control, limited plate materials to be processed, slow laser response speed and low control accuracy.

[0006] In order to solve the above technical problems, the first embodiment of the present invention provides a high-performance laser supporting a waveform editing function, wherein the laser includes a waveform storage module, an FPGA module and a laser output module. The waveform storage module is used to store the complete cycle of the processed waveform edited by the user and generate waveform data information corresponding to the processed waveform, and is also used to send the waveform data information to the FPGA module; The FPGA module receives the waveform data information and parses and executes it, and sends a light output instruction to the laser output module; The laser output module outputs laser according to the light output instruction.

[0007] As a preferred solution, the user can adjust the frequency, energy duty cycle and average power of the output laser by editing the complete cycle processing waveform.

[0008] As a preferred solution, the average power refers to the average value of the power amplitude of the laser output by the laser in the complete cycle according to the processing waveform.

[0009] As a preferred solution, the waveform editing module adds a waveform number to each processed waveform edited by the user, and the waveform data information is indexed by the waveform number.

[0010] As a preferred solution, the FPGA module automatically calls the waveform data information according to the waveform number to complete the continuous light emission of the laser output module.

[0011] As a preferred solution, the FPGA module calls the corresponding waveform data information according to the optimal processing waveform number issued by the cutting equipment to complete the light output control of the laser output module.

[0012] As a preferred solution, the FPGA module sequentially calls the waveform data information according to the received optimal processing waveform number to perform waveform switching and change the light emitting instruction.

[0013] As a preferred solution, the optimal processing waveform process library refers to a number of optimal processing waveform processes indexed by the optimal processing waveform number, and the optimal processing waveform process is composed of various types of plates and their corresponding optimal processing waveform numbers, optimal processing waveforms and processing process parameters.

[0014] As a preferred solution, the laser at least supports the user to design a square wave or a sharp rise and slow fall waveform to control the light output.

[0015] As a preferred solution, when used for cutting, the laser is connected to a cutting device, and the laser light emitted from the laser is shaped by an optical path system in the cutting device to complete the cutting of the workpiece.

[0016] The present invention provides a high-performance laser supporting waveform editing function, which includes a waveform storage module, an FPGA module and a laser output module. The waveform storage module is used to store the processing waveform of the complete cycle edited by the user and generate waveform data information corresponding to the processing waveform, and is also used to send the waveform data information to the FPGA module; the FPGA module receives the waveform data information and parses and executes it, and sends a light output instruction to the laser output module; the laser output module outputs laser according to the light output instruction. Compared with the prior art, the high-performance laser supporting waveform editing function proposed by the present invention has at least the following advantages: 1. It avoids the use of an external waveform editing card to control the output of the laser, reduces the error in the data transmission process, and the laser of the present application can support users to edit any processing waveform directly on the laser, which is beneficial to improve the accuracy of the final output laser pulse and flexibly meet the laser processing requirements of the workpiece; 2. The FPGA module is used to analyze and execute the waveform data information provided by the user, and the laser responds quickly; 3. The processing waveforms edited by the user are numbered and can be called with one key during the actual processing process, which is conducive to improving the work efficiency during laser processing, reducing the staff's dependence on professional skills, and optimizing the cutting speed and cutting effect of the laser. 4. An optimal processing waveform process library is formed by combining several optimal processing waveforms and their corresponding optimal processing waveform numbers, so that the laser can automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the FPGA module. The FPGA module selects the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform process library according to the sent optimal processing waveform number to control the light output, so that the operator can complete the plate cutting and unloading task through a simple one-button operation, and can automatically select the optimal processing waveform when the optimal cutting performance of plates of specific materials and specific thicknesses is met.

[0017] With the laser of this application, users can design any processing waveform to control the laser light, optimize the cutting performance of specific plates, and use the easy-to-use mode of one-key cutting for processing. It has good usability and high cutting performance, and will have obvious competitive advantages in the market. The technical solution of this application solves the technical problems in the prior art that the reliability of laser light wavelength control caused by the use of waveform control cards to change the laser light waveform is low, the plates to be processed are limited, and the laser response speed is slow and the control accuracy is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0019] Figure 1 This is a schematic diagram of a pulse width modulated square wave signal with a frequency of 1 Hz and a duty cycle of 50% used by a traditional laser; Figure 2 This is a schematic diagram of a square pulse width modulation wave signal with a frequency of 2Hz and a duty cycle of 70% used by a traditional laser; Figure 3 It is a structural schematic diagram of a laser provided by the present invention; Figure 4 It is a schematic diagram of a processing waveform within a cycle that can be edited by a user provided by the present invention; Figure 5 It is a schematic diagram of the FPGA module of the laser provided by the present invention automatically completing continuous light emission; Figure 6 It is a flow chart of an embodiment of the laser application method provided by the present invention.

[0020] Description of main component symbols: 11. Laser; 12. Waveform storage module; 13. FPGA module; 14. Laser output module. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present invention, the present invention is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element or there can be one or more centered elements therebetween. When an element is described as "connected" to another element, it can be directly connected to another element or there can be one or more centered elements therebetween. The orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "bottom" etc. used in this specification is based on the orientation or positional relationship shown in the accompanying drawings, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0022] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification and in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0023] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0024] The present invention provides a high-performance laser supporting waveform editing function. The laser includes a waveform storage module, an FPGA module and a laser output module. The waveform storage module is used to store a complete cycle of processing waveforms edited by a user and generate waveform data information corresponding to the processing waveform, and is also used to send the waveform data information to the FPGA module; the FPGA module receives the waveform data information and parses and executes it, and sends a light output instruction to the laser output module; the laser output module outputs laser according to the light output instruction.

[0025] The solution of the present invention avoids the use of an external waveform editing card to control the output of the laser, reduces the error in the data transmission process, and the laser can support the user to directly implement the editing of any processing waveform on the laser, which is conducive to improving the accuracy of the final output laser pulse and flexibly meeting the laser processing requirements of the workpiece; the FPGA module is used to parse and execute the waveform data information provided by the user, and the laser has a fast response speed; the processing waveforms edited by the user are numbered, and one-key call can be realized in the actual processing process, which is conducive to improving the work efficiency during laser processing, reducing the dependence of the staff on professional skills, and making the laser extremely optimized in terms of cutting speed and cutting effect; the optimal processing waveform process library formed by a number of optimal processing waveforms and their corresponding optimal processing waveform numbers enables the laser to automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the FPGA module, and the FPGA module selects the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform process library according to the sent optimal processing waveform number to control the light, so that the operator can complete the plate cutting and blanking task through a simple one-key operation, and can automatically select the optimal processing waveform when the optimal cutting performance of a plate of a specific material and a specific thickness is met. With the laser of this application, users can design any processing waveform to control the laser light, optimize the cutting performance of specific plates, and use the easy-to-use mode of one-key cutting for processing. It has good usability and high cutting performance, and will have obvious competitive advantages in the market. The technical solution of this application solves the technical problems in the prior art that the reliability of laser light wavelength control caused by the use of waveform control cards to change the laser light waveform is low, the plates to be processed are limited, and the laser response speed is slow and the control accuracy is low.

[0026] In order to facilitate understanding of the above inventive concept of the present invention, the above inventive concept of the present invention is described in more detail below in conjunction with the accompanying drawings and specific embodiments.

[0027] In one embodiment, Figure 3 As shown, the present invention provides a laser 11, which is used to control light emission according to any processing waveform edited by the user. In some embodiments, a waveform library indexed by the waveform number is established according to the processing waveform edited by the user and its corresponding waveform number, and the waveform library is stored; the laser 11 is also used to call the processing waveform corresponding to the waveform number from the waveform library according to the waveform number issued to control light emission, so as to complete the workpiece processing.

[0028] Specifically, the laser includes a waveform storage module 12 , a FPGA (Field Programmable Gate Array) module 13 and a laser output module 14 .

[0029] The waveform storage module 12 is used to store the processed waveforms edited by the user. It can be understood that the waveform storage module 12 of the embodiment of the present invention can be a volatile memory or a non-volatile memory, and can also include both volatile and non-volatile memories.Among them, the non-volatile memory can be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), a magnetic random access memory (FRAM), a flash memory or other memory technology, a compact disk read-only memory (CD-ROM), a digital versatile disk (DVD) or other optical disk storage, a magnetic cassette, a magnetic tape, a magnetic disk storage or other magnetic storage device; the volatile memory can be a random access memory (RAM), and by way of example but not limitation, many forms of RAM are available, such as static random access memory (SRAM), synchronous static random access memory (SSRAM) Memory), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDRSDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), direct memory bus random access memory (DRRAM). The storage module 22 described in the embodiment of the present invention is intended to include but is not limited to these and any other suitable types of memory.

[0030] In the technical solution of the present application, the waveform storage module 12 is also used to generate waveform data information corresponding to the processed waveform, and send the waveform data information to the FPGA module 13. Specifically, the waveform storage module 12 calculates the frequency, energy duty cycle, average power and other information of the pre-light according to the edited processed waveform, and sends the above information to the FPGA module 13.

[0031] The FPGA module 13 receives the waveform data information and parses and executes it, and sends a light output instruction to the laser output module 14. The present application uses FPGA to control the light output, and the response speed is fast, usually at the microsecond level, which can meet the response speed requirements of plate processing.

[0032] The laser output module 15 outputs laser according to the processing waveform based on the light output instruction.

[0033] It can be understood that the solution of the present invention avoids the use of an external waveform editing card to control the output of the laser, reduces the error in the data transmission process, and the laser can support users to directly edit any processing waveform on the laser, which is conducive to improving the accuracy of the final output laser pulse and flexibly meeting the laser processing requirements of the workpiece; the FPGA module is used to parse and execute the waveform data information provided by the user, and the laser has a fast response speed; the processing waveforms edited by the user are numbered, and one-key call can be realized in the actual processing process, which is conducive to improving the work efficiency during laser processing, reducing the staff's dependence on professional skills, and enabling the laser to optimize the cutting speed and cutting effect to the extreme performance; the optimal processing waveform process library formed by a number of optimal processing waveforms and their corresponding optimal processing waveform numbers enables the laser to automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the FPGA module. The FPGA module selects the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform process library according to the sent optimal processing waveform number to control the light, so that the operator can complete the plate cutting and blanking task through a simple one-key operation, and can automatically select the optimal processing waveform when the optimal cutting performance of a specific material and a specific thickness plate is met. With the laser of this application, users can design any processing waveform to control the laser light, optimize the cutting performance of specific plates, and use the easy-to-use mode of one-key cutting for processing. It has good usability and high cutting performance, and will have obvious competitive advantages in the market. The technical solution of this application solves the technical problems in the prior art that the reliability of laser light wavelength control caused by the use of waveform control cards to change the laser light waveform is low, the plates to be processed are limited, and the laser response speed is slow and the control accuracy is low.

[0034] In one embodiment, the user adjusts the frequency, energy duty cycle and average power of the output laser by editing the processing waveform of the complete cycle. The average power refers to the average value of the power amplitude of the laser output by the laser in the complete cycle according to the processing waveform. Specifically, the waveform storage module 12 calculates the frequency, energy duty cycle and average power of the pre-light according to the edited processing waveform, and sends the above information to the FPGA module 13.

[0035] Optionally, the laser is connected to a host computer for communication, and the user can edit any processing waveform through the host computer software; and / or configure the plate parameters. In the actual use of the laser, the user uses the host computer software to edit at least one complete cycle of processing waveform, and the laser can automatically emit light according to the processing waveform.

[0036] In other embodiments, the action of editing the processing waveform can also be implemented directly on the laser end or the processing equipment end, and is not limited to the host computer.

[0037] like Figure 4 As shown in the figure, it is a schematic diagram of a user using the host computer software to edit a complete cycle of processing waveform, which is displayed as a rapid rise and slow fall waveform. Figure 4 In the process, users choose high-performance lasers that support waveform editing functions. They can use the host computer software to arbitrarily edit the light processing waveform within one cycle according to the application scenario and the final cutting effect requirements. There is no need to edit the processing waveforms of more cycles, and store them with the optimal processing waveform number as the index. It should be noted that the sharp rise and slow fall waveform has no special meaning, it is just an example to illustrate that a waveform of a certain shape can be edited. What specific waveform is suitable for what material and thickness of material is evaluated by the actual use effect. The laser of this application can at least support users to design square wave / sharp rise and slow fall waveforms to control the light output. Users can also design sine wave, triangle wave, sawtooth wave and other waveforms to control the light output according to specific needs.

[0038] In this embodiment, by adopting a high-performance laser that supports free waveform editing and setting a processing waveform editing module in the laser, the laser can support the processing waveform editing function. The user only needs to use the processing waveform editing module to simply edit a processing waveform that meets the laser output power within one cycle, so that the laser can control the laser light output according to any processing waveform edited by the user, thereby meeting the laser processing requirements of the workpiece.

[0039] The host computer can also be used to configure relevant parameters of the plate to be processed, and the plate parameters at least include the plate material and the plate thickness.

[0040] During the laser processing, plates of different materials have different absorption and reflection characteristics of lasers, which directly affects the cutting efficiency and cutting quality. For example, for materials with high reflectivity such as copper and aluminum, the focus position needs to be adjusted appropriately to reduce the damage to the laser caused by reflection. In addition, plates of different materials may require different reaction gases during processing, such as inert gas for stainless steel cutting and oxygen for carbon steel cutting to increase the temperature of the reaction area and melt the material faster. Plate thickness is another important parameter in laser processing, which is closely related to factors such as laser output power and focus position. By configuring the relevant parameters of the plate, selecting the best output power, reaction gas, etc. has an important impact on the final processing effect.

[0041] In one embodiment, the FPGA module 13 responds to the switching of the waveform data information, and changes the light emitting instruction according to the switched waveform data information. Specifically, the FPGA module receives the waveform switching instruction, completes the call of the replaced waveform data information within 1 microsecond to perform waveform switching, and changes the light emitting instruction according to the switched waveform data information. It should be noted that when the laser 11 is used for laser processing, different lasers are often output according to different processes for the same workpiece. The FPGA module 13 is used to respond to the switching of the waveform data information at the microsecond level, and change the light emitting instruction sent to the laser output module 14 according to the switched waveform data information.

[0042] like Figure 5 The figure shows a schematic diagram of the FPGA module automatically completing continuous light emission.

[0043] In the embodiment of the present application, in order to facilitate the user to find the required processed waveform, the waveform storage module 12 is also used to add a waveform number to each processed waveform edited by the user, and the waveform data information is indexed by the corresponding waveform number.

[0044] It can be understood that for specific application scenarios, users can use the laser 11 to achieve any processing waveform light output according to their needs. The waveform numbers edited by the user are stored in the waveform storage module 12 of the laser 11, and the user can subsequently call it using the waveform number as an index, that is, after the laser 11 is powered on, the program in the FPGA module 13 automatically reads the corresponding processing waveform from the waveform storage module according to the waveform number for use.

[0045] The preset processing waveform table format used in the waveform storage module is shown in Table 1. It can be understood that Table 1 only illustrates part of the processing waveform data, not all of the processing waveform data.

[0046] Table 1 Preset processing waveform table format Processing waveform number Processing waveform Optimal application scenarios 1 Custom format storage 100mm carbon steel negative focus oxygen cutting 2 Custom format storage 100mm carbon steel negative coke oxygen perforation 3 Custom format storage 100mm stainless steel negative coke nitrogen cutting In this embodiment, the user can store the processing waveforms edited and set by himself through the waveform storage module 12. The waveform storage module 12 also numbers each processing waveform one by one, so that the waveforms already existing in the waveform library can be reused, reducing the operator's dependence on professional skills, and being simple and easy to use. By establishing a waveform library and pre-storing it in the laser, the required processing waveform can be selected in the waveform library to adapt to the application requirements of different scenarios, and a variety of special machine cutting equipment (such as 100mm carbon steel thick plate special machine, 5mm stainless steel thin plate special machine, etc.) can be developed to meet various differentiated market needs, save energy and reduce consumption, and bring good economic benefits.

[0047] In one embodiment of the present application when the laser is used for cutting, the laser 11 is connected to the cutting device. The FPGA module 13 calls the corresponding waveform data information according to the optimal processing waveform number issued by the cutting device to complete the light output control of the laser output module 14. The FPGA module also calls the waveform data information in sequence according to the received optimal processing waveform number to perform waveform switching and change the light output instruction.

[0048] Specifically, the cutting device automatically selects the optimal processing waveform number according to the plate parameters and sends it to the FPGA module 13. The FPGA module 13 calls and parses the corresponding waveform data information according to the optimal processing waveform number sent by the cutting device to control the laser output module 14 to output laser.

[0049] Various types of plates and their corresponding optimal processing waveform numbers, optimal processing waveforms and processing parameters are each combined into an optimal processing waveform process and stored in the cutting device to form an optimal processing waveform process library indexed by the optimal processing waveform number.

[0050] Specifically, the cutting device is used to establish and store the optimal processing waveform process library indexed by the optimal processing waveform number according to the processing parameters and optimal processing waveform number of various types of plates, and to set the plate parameters, and automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the FPGA module 13. Specifically, the plate parameters include the plate material and the plate thickness. A process card is provided on the cutting device.

[0051] After obtaining several optimal processing waveforms, the cutting equipment will use a preset optimal processing waveform process table to form an optimal processing waveform process corresponding to each type of plate and its corresponding optimal processing waveform number, optimal processing waveform, and processing parameters, thereby obtaining several optimal processing waveform processes corresponding to various types of plates, establishing an optimal processing waveform process library for laser cutting indexed by the optimal processing waveform number, and storing the optimal processing waveform process library in the process card.

[0052] The preset optimal processing waveform process table format used by the optimal processing waveform process library is shown in Table 2. It can be understood that Table 2 only illustrates some of the optimal processing waveform process data in the optimal processing waveform process library, and is not all of the optimal processing waveform process data in the optimal processing waveform process library.

[0053] Table 2 Preset optimal processing waveform process table format Plate Type Auxiliary gas focus Optimal processing waveform number 100mm Carbon Steel oxygen Negative focus 1 100mm Carbon Steel oxygen Negative focus 2 100mm stainless steel Nitrogen Negative focus 3 In one embodiment of the present application when the laser is used for cutting, the host computer includes a cutting system software interface, and the cutting system software interface includes a CAM (Computer Aided Manufacturing) sub-interface and a one-key cutting button. The CAM sub-interface is used to layout the workpiece to be processed, and the one-key cutting button is used to start the cutting system software to complete the workpiece cutting task.

[0054] After the layout of the workpiece is completed in the CAM sub-interface, and after the plate material, plate thickness and other plate parameters are simply set in the cutting system software interface, click the "one-key cutting" button in the cutting system software interface, the cutting system software calls the process card, the process card receives the layout data issued by the cutting system software, and automatically selects the processing parameters and the optimal processing waveform number from the optimal processing waveform process library according to the plate material type and plate thickness plate parameters, and sends the optimal processing waveform number to the laser 11, so that the laser 11 selects the optimal processing waveform corresponding to the optimal processing waveform number from the waveform library according to the waveform number issued by the cutting device to control the light, and at the same time, the real-time coordinates of the X / Y / Z axis of the machine tool are calculated in real time according to the layout data issued by the cutting system software, and the processing parameters are automatically selected to control the X / Y / Z axis of the machine tool, the cutting head, and the laser to collaboratively complete the workpiece cutting task. In addition, the process card switches the corresponding optimal processing waveform at different process stages according to the layout data issued by the cutting system software, and sends the corresponding waveform number to the FPGA module 13 to complete the control of the light processing waveform.

[0055] It should be noted that the above embodiments are only used as an example to further explain the laser when it is used for cutting applications, and do not mean that the laser can only be used in cutting scenarios and only has the above effects; and, in other applications and embodiments, several optimal processing waveform processes / process cards can also be stored on the laser end, and this application does not limit it here.

[0056] In this embodiment, by simply setting the plate parameters including the plate material and plate thickness on the host computer, and automatically selecting the optimal processing waveform number from the preset optimal processing waveform process library according to the plate parameters and sending it to the FPGA module 13, the operator can complete the plate cutting and blanking task through a simple one-key operation, and can automatically select the optimal processing waveform when the optimal cutting performance of the plate of a specific material and a specific thickness is met. As a result, the laser of the present invention can be processed in an easy-to-use mode of one-key cutting, which is easy to use and has high cutting performance, and will have obvious competitive advantages in the market. In other embodiments, the action of setting the plate parameters can also be implemented directly on the laser end, and is not limited to the host computer here.

[0057] Therefore, the present invention provides a high-performance laser supporting waveform editing function, adopts a high-performance laser supporting waveform free editing, and simply edits any processing waveform within a cycle to control the laser light emission; the processing waveform edited by the user is numbered, and one-key call can be realized in the actual processing process, which is conducive to improving the work efficiency when used for laser processing, reducing the dependence of the staff on professional skills, and making the laser perform extreme performance optimization in cutting speed and cutting effect; establishes a processing waveform process database for various profiles, including processing parameters and processing waveform numbers of various profiles, and stores them in the process card; the cutting system software interface only needs to simply set the plate material, plate thickness and other plate parameters, and perform a one-key cutting operation to complete the cutting task of the workpiece, and the process card automatically selects the processing parameters and the optimal processing waveform according to the plate parameters, and controls the machine tool X / Y / Z axis, cutting head, and laser to collaboratively complete the cutting task of the workpiece. Thus, the laser cutting equipment can reuse the expert operation experience library, reduce the dependence on the operator's skills, and is simple and easy to use. At the same time, it can also optimize the cutting effect and cutting speed for various specific types of plates, establish a waveform library and preset it in the laser, so that the optimal processing waveform can be selected from the waveform library to adapt to the application needs of different market scenarios, and develop a variety of special machine cutting equipment (such as 100mm carbon steel thick plate special machine, 5mm stainless steel thin plate special machine, etc.) to meet various differentiated market needs, save energy and reduce consumption, and bring good economic benefits. It can solve the problems that traditional laser cutting equipment has high requirements for operator skills, cutting performance has not been optimized to the extreme, and the laser processing waveform used for cutting cannot be arbitrarily controlled.

[0058] Based on the same concept, in one embodiment, the present invention also provides an application method of a high-performance laser supporting waveform editing function as described in any of the above embodiments, comprising the following steps: providing at least one cycle of a preset processing waveform to the laser, and controlling the laser to emit light according to the processing waveform.

[0059] The laser of the present application can support users to edit any processing waveform directly on the laser, which is beneficial to improve the accuracy of the final output laser pulse and flexibly meet the laser processing requirements of the workpiece; the FPGA module is used to parse and execute the waveform data information provided by the user, and the laser has a fast response speed; the processing waveforms edited by the user are numbered, and one-click call can be realized during the actual processing process, which is beneficial to improve the work efficiency during laser processing, reduce the staff's dependence on professional skills, and enable the laser to perform ultimate performance optimization in cutting speed and cutting effect; an optimal processing waveform process library formed by several optimal processing waveforms and their corresponding optimal processing waveform numbers enables the laser to automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the FPGA module. The FPGA module selects the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform process library according to the sent optimal processing waveform number to control the light output, so that the operator can complete the plate cutting and blanking task through a simple one-click operation, and can automatically select the optimal processing waveform when the optimal cutting performance of plates of specific materials and specific thicknesses is met. With the laser of this application, users can design any processing waveform to control the laser light, optimize the cutting performance of specific plates, and use the easy-to-use mode of one-key cutting for processing. It has good usability and high cutting performance, and will have obvious competitive advantages in the market. The technical solution of this application solves the technical problems in the prior art that the reliability of laser light wavelength control caused by the use of waveform control cards to change the laser light waveform is low, the plates to be processed are limited, and the laser response speed is slow and the control accuracy is low.

[0060] In one embodiment, please refer to Figure 6 , the application may specifically include: S1, providing the laser with a processing waveform within a complete cycle; S2, adding waveform numbers to a plurality of processed waveforms in sequence and storing them; S3. Using the various processing waveforms provided to perform cutting tests on various types of plates to obtain the optimal processing waveforms corresponding to the various types of plates; S4. According to the processing parameters of various types of plates and the corresponding optimal processing waveform numbers, an optimal processing waveform process library indexed by the optimal processing waveform number is established; S5. Automatically selecting a corresponding optimal processing waveform number from the waveform library according to the plate parameters of the plate to be processed; S6. Calling the optimal processing waveform corresponding to the optimal processing waveform number with one key and controlling the laser to output laser according to the processing waveform.

[0061] In this embodiment, by providing such an application method of a high-performance laser that supports waveform editing function, users can design any processing waveform to control the laser light output, optimize the cutting performance of specific plates, and use an easy-to-use one-key cutting mode for processing. It has good ease of use and high cutting performance, and will have obvious competitive advantages in the market.

[0062] In one embodiment, the layout data of the plate to be processed is provided to the laser, and the laser is controlled to emit light according to the corresponding processing waveform at different process stages.

[0063] Taking the laser of this application for cutting application as an example, the host computer includes a cutting system software interface, and the cutting system software interface includes a CAM (Computer Aided Manufacturing) sub-interface and a one-key cutting button. The CAM sub-interface is used to layout the workpiece to be processed, and the one-key cutting button is used to start the cutting system software to complete the workpiece cutting task.

[0064] After completing the layout of the workpiece in the CAM sub-interface, and simply setting the plate parameters such as plate material and plate thickness in the cutting system software interface, click the "One-click Cutting" button in the cutting system software interface, and the cutting system software calls the process card. The process card receives the layout data issued by the cutting system software, and automatically selects the processing parameters and the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters of the plate material type and plate thickness, and issues the optimal processing waveform number to the laser 11, so that the laser 11 selects the optimal processing waveform corresponding to the optimal processing waveform number from the waveform library according to the optimal processing waveform number issued by the cutting equipment to control the light. At the same time, the real-time coordinates of the X / Y / Z axis of the machine tool are calculated in real time according to the layout data issued by the cutting system software, and the processing parameters are automatically selected to control the X / Y / Z axis of the machine tool, the cutting head, and the laser to collaboratively complete the workpiece cutting task. In addition, the process card switches the corresponding optimal processing waveform at different process stages according to the layout data issued by the cutting system software, and sends the corresponding optimal processing waveform number to the FPGA module 13 to complete the control of the light-emitting processing waveform, which is beneficial to improve the cutting efficiency and switching accuracy, and further improve the cutting quality of the plate.

[0065] Furthermore, when the laser is used for cutting, the laser is connected to the cutting device through an interface, and the laser output from the laser is shaped by the optical path system in the cutting device to complete the cutting of the plate to be processed. The cutting head can be implemented using existing technology, and the optical path system therein is also implemented using existing technology.

[0066] For the application method of the high-performance laser that supports the waveform editing function in this application, the laser uses an FPGA module to control the light emission, and has a fast response speed, which is at the microsecond level, and can meet the response speed requirements of plate processing. The edited processing waveform is saved in the laser and parsed and executed by the program in the FPGA module. The user only needs to complete the editing of the processing waveform within one cycle. The FPGA module calls the optimal processing waveform corresponding to the optimal processing waveform number from the waveform library according to the optimal processing waveform number issued to automatically complete the continuous light emission, and the switching of the processing waveform is completed within the microsecond response time.

[0067] It can be understood that the above-mentioned application embodiment of the high-performance laser supporting the waveform editing function and the high-performance laser embodiment supporting the waveform editing function belong to the same concept, and the specific implementation process is detailed in the high-performance laser embodiment supporting the waveform editing function, and the technical features in the high-performance laser embodiment supporting the waveform editing function are correspondingly applicable in the above-mentioned application embodiment of the high-performance laser supporting the waveform editing function, which will not be repeated here.

[0068] The solution of the present invention avoids the use of an external waveform editing card to control the output of the laser, reduces the error in the data transmission process, and the laser can support users to directly edit any processing waveform on the laser, which is beneficial to improving the accuracy of the final output laser pulse and flexibly meeting the laser processing requirements of the workpiece; an FPGA module is used to parse and execute the waveform data information provided by the user, and the laser has a fast response speed; an optimal processing waveform process library formed by a number of optimal processing waveforms and their corresponding optimal processing waveform numbers enables the laser to automatically select the optimal processing waveform number from the optimal processing waveform process library according to the plate parameters and send it to the FPGA module. The FPGA module selects the optimal processing waveform corresponding to the optimal processing waveform number from the optimal processing waveform process library according to the sent optimal processing waveform number to control the light output, so that the operator can complete the plate cutting and blanking task through a simple one-key operation, and can automatically select the optimal processing waveform when the optimal cutting performance of a specific material and a specific thickness plate is met. With the laser of this application, users can design any processing waveform to control the laser light, optimize the cutting performance of specific plates, and use the easy-to-use mode of one-key cutting for processing. It has good usability and high cutting performance, and will have obvious competitive advantages in the market. The technical solution of this application solves the technical problems in the prior art that the reliability of laser light wavelength control caused by the use of waveform control cards to change the laser light waveform is low, the plates to be processed are limited, and the laser response speed is slow and the control accuracy is low.

[0069] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0070] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may also be combined, the steps may be implemented in any order, and there are many other changes in different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity. Although the present invention has been described in detail with reference to the above embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the above embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-performance laser supporting waveform editing function, characterized in that: The laser includes a waveform storage module, an FPGA module and a laser output module. The waveform storage module is used to store the processing waveform of the complete cycle edited by the user and generate waveform data information corresponding to the processing waveform, and is also used to send the waveform data information to the FPGA module; The FPGA module receives the waveform data information and parses and executes it, and sends a light output instruction to the laser output module; The laser output module outputs laser according to the light output instruction.

2. The high-performance laser supporting waveform editing function according to claim 1, characterized in that: The user can adjust the frequency, energy duty cycle and average power of the output laser by editing the complete cycle processing waveform.

3. The high-performance laser supporting waveform editing function according to claim 2, characterized in that: The average power refers to the average value of the power amplitude of the laser output by the laser in the complete cycle according to the processing waveform.

4. The high-performance laser supporting waveform editing function according to claim 1, characterized in that: The waveform editing module adds a waveform number to each processed waveform edited by the user, and the waveform data information uses the waveform number as an index.

5. The high-performance laser supporting waveform editing function according to claim 1, characterized in that: The FPGA module automatically calls the waveform data information according to the waveform number to complete the continuous light emission of the laser output module.

6. The high-performance laser supporting waveform editing function according to claim 4, characterized in that: The FPGA module calls the corresponding waveform data information according to the optimal processing waveform number issued by the cutting equipment to complete the light output control of the laser output module.

7. The high-performance laser supporting waveform editing function according to claim 1, characterized in that: The FPGA module sequentially calls the waveform data information according to the received optimal processing waveform number to perform waveform switching and change the light emitting instruction.

8. The high-performance laser supporting waveform editing function according to claim 7, characterized in that: The optimal processing waveform process library refers to a number of optimal processing waveform processes indexed by the optimal processing waveform number. The optimal processing waveform process consists of various types of plates and their corresponding optimal processing waveform numbers, optimal processing waveforms, and processing process parameters.

9. The high-performance laser supporting waveform editing according to claim 1, characterized in that: The laser at least supports the user to design a square wave or a sharp rise and slow fall waveform to control the light output.

10. The high-performance laser supporting waveform editing according to claim 1, characterized in that: When used for cutting, the laser is connected to the cutting equipment, and the laser emitted from the laser is shaped by the optical path system in the cutting equipment to complete the cutting of the workpiece.

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