Motor heat dissipation method and device based on semiconductor refrigeration and phase change material

Abstract

A motor heat dissipation method and device based on semiconductor refrigeration and a phase change material, and the method comprises the steps: arranging a semiconductor on a fin structure on a motor housing for refrigeration, enabling the semiconductor to be in contact with the fin structure and the motor housing, enabling a heating surface of the semiconductor not to be in contact with the motor housing and the fin structure, and enabling the fin structure to be in contact with the motor housing; and the heating surface of the semiconductor is provided with a phase change material heat dissipation device for heat conduction. The solid-state density of the phase-change material of the phase-change material heat dissipation device is smaller than that of the liquid-state phase-change material. The heat dissipation device has the beneficial effects that the fin structure of the motor shell is cooled through the semiconductor heat dissipation devices of two structures, and the first semiconductor heat dissipation device cools the semiconductor heating surface with the upward heating surface based on the heat pipe technology; the second semiconductor heat dissipation device cools the semiconductor heating surface with the heating surface facing downwards based on appropriate solid-liquid phase change temperature selection, the adverse condition that some special structural designs need to be additionally added based on a heat pipe heat dissipation method is reduced, and the complexity of a heat dissipation system is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of motor energy saving, and more specifically to a motor heat dissipation method and device based on semiconductor refrigeration and phase change material. Background Art

[0002] During the operation of a traditional asynchronous motor, a large amount of heat is inevitably generated because a magnetic field is generated by continuously passing current through the stator winding to drive the rotor to work. The solution of the existing technology is to drive a fan through the motor shaft to take away part of the heat, and the rest of the heat is radiated and dissipated through the fin structure of the motor housing. The heat dissipation effect of this method is limited, and due to untimely heat dissipation, the winding temperature is further increased, thereby increasing the resistance, generating more heat, and affecting the motor efficiency level. Summary of the invention

[0003] The present invention overcomes the deficiencies in the prior art and provides a motor heat dissipation method and device based on semiconductor refrigeration and phase change materials.

[0004] The purpose of the present invention is achieved through the following technical solutions.

[0005] A motor heat dissipation method based on semiconductor refrigeration and phase change materials includes: arranging a semiconductor on a fin structure on a motor casing for cooling, the semiconductor being arranged in contact with the fin structure and the motor casing, the heating surface of the semiconductor not being in contact with the motor casing and the fin structure, and a phase change material heat dissipation device being arranged on the heating surface of the semiconductor for heat conduction.

[0006] The phase change material of the phase change material heat sink has a solid density less than a liquid density.

[0007] Motor casing and semiconductor heat sink The semiconductor heat sink is arranged on the motor casing, the heating surface of the semiconductor heat sink is not in contact with the fin structure and the motor casing arranged on the motor casing, and a phase change material heat sink is arranged on the semiconductor heating surface.

[0008] The phase change material heat dissipation device comprises a storage shell and phase change microcapsules, wherein the phase change microcapsules are arranged in the storage shell.

[0009] The storage shell is a tubular structure with a square cross section.

[0010] The phase change temperature of the phase change microcapsule is 40℃-60℃.

[0011] The solid state density of the phase change material in the phase change microcapsule is greater than the liquid state density.

[0012] The phase change material in the phase change microcapsule is a gas-liquid phase change material.

[0013] The semiconductor has a rectangular structure with a square cross section.

[0014] The beneficial effects of the present invention are:

[0015] This solution uses two types of semiconductor heat dissipation devices to dissipate heat from the fin structure of the motor housing. The first semiconductor heat dissipation device cools the semiconductor heating surface with the heating surface facing upward based on the heat pipe technology, and the second semiconductor heat dissipation device cools the semiconductor heating surface with the heating surface facing downward based on the appropriate solid-liquid phase change temperature selection. When the temperature of the heating surface has not reached the phase change temperature, it is only cooled by sensible heat cooling. When the temperature of the heating surface reaches the phase change temperature, the heat of the heating surface is absorbed through phase change. After the solid phase changes to the liquid phase, the liquid phase material automatically floats the solid phase material, thereby improving the heat dissipation effect of the motor, thereby reducing the energy consumption of the motor. Compared with other existing heat dissipation technologies based on heat pipes, the present invention has formulated a simple and feasible cooling scheme according to the different directions of the heating surface, reducing the disadvantages of the existing technology based on the heat pipe heat dissipation method that requires additional special structural designs, and reducing the complexity of the heat dissipation system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention;

[0017] Figure 2 It is a structural schematic diagram of a semiconductor heat dissipation device;

[0018] In the figure: 1. motor housing; 11. fin structure; 2. semiconductor heat dissipation device; 3. phase change material heat dissipation device. DETAILED DESCRIPTION

[0019] Example

[0020] A motor heat dissipation method based on semiconductor refrigeration and phase change materials includes: arranging a semiconductor on a fin structure on a motor housing 1 for cooling, the semiconductor is arranged in contact with the fin structure and the motor housing, the heating surface of the semiconductor is not in contact with the motor housing 1 and the fin structure, and a phase change material heat dissipation device 3 is arranged on the heating surface of the semiconductor for heat conduction.

[0021] The phase change material of the phase change material heat sink 3 has a density in a solid state that is lower than that in a liquid state.

[0022] Motor casing 1 and semiconductor heat sink 2 The semiconductor heat sink 2 is arranged on the motor casing 1, and the heating surface of the semiconductor heat sink 2 is not in contact with the fin structure 11 and the motor casing 1 arranged on the motor casing 1. A phase change material heat sink 3 is arranged on the semiconductor heating surface.

[0023] The phase change material heat dissipation device 3 comprises a storage shell and phase change microcapsules, and the phase change microcapsules are arranged in the storage shell.

[0024] The storage shell is a tubular structure with a square cross section.

[0025] The phase change temperature of the phase change microcapsule is 40℃-60℃.

[0026] The solid state density of the phase change material in the phase change microcapsule is greater than the liquid state density.

[0027] The phase change material in the phase change microcapsule is a gas-liquid phase change material.

[0028] The semiconductor has a rectangular structure with a square cross section.

[0029] The working principle of the present invention is as follows: Figure 1-2 As shown, in this solution, the motor housing 1 and its fin structure 11 are cooled by using a semiconductor heat dissipation device 2 in conjunction with a phase change material heat dissipation device 3 .

[0030] When the heating surface temperature of the semiconductor heat sink 2 has not reached the phase change temperature, cooling is performed only through sensible heat cooling; when the heating surface temperature of the semiconductor heat sink 2 reaches the phase change temperature, due to the effect of gravity, the solid phase part of the solid-liquid phase change material or the gas phase part of the gas-liquid phase change material of the phase change microcapsule contacts the semiconductor heating surface, and the heat of the heating surface is absorbed by the solid phase part of the solid-liquid phase change material or the gas phase part of the gas-liquid phase change material in the phase change material heat sink 3, thereby achieving the goal of improving the heat dissipation effect.

[0031] The embodiments of the present invention are described in detail above, but the contents described are only preferred embodiments of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A motor heat dissipation method based on semiconductor refrigeration and phase change materials, characterized in that: include: A semiconductor is arranged on the fin structure on the motor casing for cooling. The semiconductor is arranged in contact with the fin structure and the motor casing. The heating surface of the semiconductor does not contact the motor casing and the fin structure. A phase change material heat sink is arranged on the heating surface of the semiconductor for heat conduction.

2. The motor heat dissipation method based on semiconductor refrigeration and phase change material according to claim 1 is characterized in that: The phase change material of the phase change material heat sink has a solid density less than a liquid density.

3. The motor heat dissipation device based on semiconductor refrigeration and phase change material according to claim 1, characterized in that: include: Motor casing and semiconductor heat sink The semiconductor heat sink is arranged on the motor casing, the heating surface of the semiconductor heat sink is not in contact with the fin structure and the motor casing arranged on the motor casing, and a phase change material heat sink is arranged on the semiconductor heating surface.

4. The motor heat dissipation device based on semiconductor refrigeration and phase change material according to claim 3 is characterized in that: The phase change material heat dissipation device comprises a storage shell and phase change microcapsules, and the phase change microcapsules are arranged in the storage shell.

5. The motor heat dissipation device based on semiconductor refrigeration and phase change material according to claim 4 is characterized in that: The storage shell is a tubular structure with a square cross section.

6. The motor heat dissipation device based on semiconductor refrigeration and phase change material according to claim 4, characterized in that: The phase change temperature of the phase change microcapsule is 40°C-60°C.

7. The motor heat dissipation device based on semiconductor refrigeration and phase change material according to claim 4, characterized in that: The solid state density of the phase change material in the phase change microcapsule is greater than the liquid state density.

8. The motor heat dissipation device based on semiconductor refrigeration and phase change material according to claim 4 is characterized in that: The phase change material in the phase change microcapsule is a gas-liquid phase change material.

9. The motor heat dissipation device based on semiconductor refrigeration and phase change material according to claim 3, characterized in that: The semiconductor is a rectangular structure with a square cross section.

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