Display panel, display device and preparation method of display panel

Abstract

The invention provides a display panel, a display device and a preparation method of the display panel, the display panel comprises a substrate, an isolation structure, a protection part, a light-emitting function layer and a first electrode layer, the isolation structure is arranged on one side of the substrate, the isolation structure can form an isolation opening in a surrounding mode and comprises a conductive structure, and the protection part covers the isolation structure. The light-emitting functional layer is arranged on one side of the substrate, and the light-emitting functional layer comprises a light-emitting structure arranged corresponding to the isolation opening. The first electrode layer is located on the side, away from the substrate, of the light-emitting function layer and comprises a first electrode arranged corresponding to the isolation opening, and the first electrode is electrically connected to the conductive structure through the protection part. According to the embodiment of the invention, the adverse effect of the etching process corresponding to the light-emitting structure and the first electrode on the isolation structure can be reduced, so that the structural integrity of the isolation structure is improved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] Flat display panels such as Organic Light Emitting Diode (OLED) panels and display panels using light emitting diode (LED) devices have the advantages of high image quality, power saving, thin body and wide application range. They are widely used in various consumer electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, desktop computers, etc., becoming the mainstream in display devices. Summary of the invention

[0003] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel, which can improve reliability.

[0004] In the first aspect, an embodiment of the present application provides a display panel, including a substrate, an isolation structure, a protective portion, a light-emitting functional layer and a first electrode layer. The isolation structure is arranged on one side of the substrate, the isolation is sufficient to enclose an isolation opening and the isolation structure includes a conductive structure, and the protective portion covers the isolation structure.

[0005] The light-emitting functional layer is arranged on one side of the substrate, and the light-emitting functional layer includes a light-emitting structure arranged corresponding to the isolation opening. The first electrode layer is located on the side of the light-emitting functional layer away from the substrate, and the first electrode layer includes a first electrode arranged corresponding to the isolation opening, wherein the first electrode is electrically connected to the conductive structure through the protection part.

[0006] In some embodiments, the isolation structure includes a first isolation portion located on one side of the substrate, and a second isolation portion located on a side of the first isolation portion away from the substrate, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate;

[0007] In some embodiments, the first isolation portion and / or the second isolation portion form a conductive structure;

[0008] In some embodiments, the material of the first isolation portion includes at least one of metal titanium and metal aluminum; and / or the material of the second isolation portion includes at least one of metal titanium and metal aluminum;

[0009] In some embodiments, the isolation structure further includes a third isolation portion disposed on a side of the first isolation portion facing the substrate, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the third isolation portion on the substrate;

[0010] In some embodiments, the conductive structure includes a third isolation portion.

[0011] In some embodiments, the protection portion includes a first portion disposed in close contact with the first isolation portion, and a second portion disposed in close contact with the second isolation portion, the first portion being connected to the second portion;

[0012] In some embodiments, the first electrode is disposed in contact with the first portion;

[0013] In some embodiments, the second portion includes a first sub-portion disposed on a side of the second isolation portion facing the substrate, a second sub-portion disposed on a side of the second isolation portion facing away from the substrate, and a third sub-portion disposed at a side wall of the second isolation portion facing the isolation opening, the third sub-portion being connected to the first sub-portion and the second sub-portion;

[0014] In some embodiments, the isolation structure further includes a third isolation portion disposed on a side of the first isolation portion facing the substrate, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the third isolation portion on the substrate;

[0015] The protection part includes a third part which is arranged in close contact with the third isolation part, and the third part is connected to the first part;

[0016] In some embodiments, the first electrode is disposed in contact with the third portion.

[0017] In some embodiments, the plurality of isolation openings include a first isolation opening and a second isolation opening, the plurality of light-emitting structures include a first light-emitting structure corresponding to the first isolation opening and a second light-emitting structure corresponding to the second isolation opening, and the light-emitting colors corresponding to the first light-emitting structure and the second light-emitting structure are different.

[0018] The contour line of the orthographic projection of the first isolation portion on the substrate includes a first contour line corresponding to the first isolation opening and a second contour line corresponding to the second isolation opening, and the contour line of the orthographic projection of the second isolation portion on the substrate includes a third contour line corresponding to the first isolation opening and a fourth contour line corresponding to the second isolation opening;

[0019] Wherein, the distance between the corresponding first contour line and the third contour line is L1, and the distance between the corresponding second contour line and the fourth contour line is L2, L1=L2;

[0020] In some embodiments, the first isolation opening is disposed adjacent to the second isolation opening.

[0021] In some embodiments, the corrosion resistance of the protection portion is stronger than the corrosion resistance of the conductive structure;

[0022] In some embodiments, the protection portion has a stronger oxidation resistance than the conductive structure;

[0023] In some embodiments, the material of the protection portion includes at least one of indium tin oxide, indium zinc oxide, and molybdenum oxide;

[0024] In some embodiments, the protective portion includes crystallized indium tin oxide;

[0025] In some embodiments, the protection portion is formed by magnetron sputtering deposition or atomic layer deposition.

[0026] In some embodiments, the display panel further includes a second electrode layer disposed on the side of the light-emitting functional layer facing the substrate, the second electrode layer includes a plurality of second electrodes disposed at intervals, and the orthographic projection of the protection portion on the substrate is located outside the orthographic projection of the second electrode on the substrate.

[0027] In some embodiments, the invention further includes a pixel definition layer disposed on a side of the isolation structure facing the substrate, the pixel definition layer including a pixel definition portion and a pixel opening formed by the pixel definition portion, and the light emitting structure is at least partially located in the pixel opening;

[0028] The protection part includes a first protection part covering the contact surface of the isolation structure, and a second protection part connected to the first protection part, and the second protection part is arranged in contact with the surface of the pixel defining part away from the substrate;

[0029] In some embodiments, the display panel further includes a second electrode layer disposed on a side of the light-emitting functional layer facing the substrate, the second electrode layer includes a plurality of second electrodes disposed at intervals, and a portion of the second electrode is exposed to the pixel opening;

[0030] In some embodiments, the orthographic projection of the second protection portion on the substrate is located outside the orthographic projection of the second electrode on the substrate;

[0031] In some embodiments, the first protection portion and the second protection portion are both disposed in contact with the first electrode.

[0032] In some embodiments, it further includes a first encapsulation layer located on a side of the first electrode layer away from the substrate;

[0033] The first encapsulation layer includes a plurality of encapsulation units arranged at intervals, and the encapsulation units and the orthographic projections of the corresponding light-emitting structures on the substrate are overlapped;

[0034] In some embodiments, the first encapsulation layer includes an inorganic material;

[0035] In some embodiments, the display panel further includes a second encapsulation layer disposed on a side of the first encapsulation layer facing away from the substrate;

[0036] The second packaging layer is in a planar structure, and the orthographic projection of the second packaging layer on the substrate covers the orthographic projections of the plurality of packaging units on the substrate;

[0037] In some embodiments, the second encapsulation layer includes an organic material;

[0038] In some embodiments, the display panel further includes a third encapsulation layer disposed on a side of the second encapsulation layer facing away from the substrate;

[0039] In some embodiments, the third encapsulation layer includes an inorganic material.

[0040] In a second aspect, an embodiment of the present application provides a display device, comprising a display panel in any of the aforementioned embodiments.

[0041] In a third aspect, an embodiment of the present application provides a method for preparing a display panel, comprising:

[0042] An isolation structure is formed on one side of the substrate, wherein the isolation structure encloses a plurality of isolation openings and includes a conductive structure;

[0043] A protection portion is formed on one side of the substrate, and a conductive material layer covers the isolation structure arrangement;

[0044] A plurality of light emitting structures and corresponding first electrodes are formed on one side of the substrate and are arranged corresponding to the isolation openings. The first electrodes are electrically connected to the conductive structure through the protection portion.

[0045] In some embodiments, the protection portion includes a first opening within the isolation opening;

[0046] Before forming the isolation structure on one side of the substrate, the method further includes:

[0047] forming a second electrode layer on one side of the substrate, the second electrode layer comprising a plurality of second electrodes arranged at intervals;

[0048] forming a pixel definition material layer on a side of the second electrode layer away from the substrate, wherein the pixel definition material layer covers the plurality of second electrode arrangements;

[0049] After forming the protection portion on one side of the substrate, the method includes:

[0050] A portion of the structure of the pixel definition material layer at the first opening is removed by etching to form a pixel definition portion and a pixel opening surrounded by the pixel definition portion, and the second electrode is exposed in the pixel opening.

[0051] In some embodiments, in forming the protection portion on one side of the substrate, the protection portion is formed by a yellow light process;

[0052] In some embodiments, the pixel definition material layer is partially removed in the first opening by etching, and the pixel defining portion is formed by photolithography.

[0053] The embodiments of the present application provide a display panel, a display device, and a method for manufacturing a display panel. By setting an isolation structure, it is possible to realize the preparation of light-emitting structures of various colors and corresponding first electrodes without the need for a fine metal mask plate, thereby reducing the preparation cost of the display panel. At the same time, a protective portion is also added. By setting the protective portion to cover the isolation structure, the adverse effects of the etching process corresponding to the light-emitting structure and the first electrode on the isolation structure are reduced, thereby improving the structural integrity of the isolation structure. As a result, the first electrode and the protective portion can have a good overlap effect, thereby improving the conduction performance between the first electrode and the conductive structure, improving the transmission reliability of the power signal corresponding to the first electrode, reducing the problems of abnormal display brightness and uneven display, and improving the reliability and display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0055] Figure 1 is a schematic diagram of a cross-sectional structure of a display panel provided in an embodiment of the present application;

[0056] Figure 2 is a schematic cross-sectional structure diagram of another display panel provided in an embodiment of the present application;

[0057] Figure 3 yes Figure 1 Schematic diagram of the enlarged structure at the middle area Q;

[0058] Figure 4 is a partial cross-sectional enlarged structural schematic diagram of another display panel provided in an embodiment of the present application;

[0059] Figure 5 is a schematic cross-sectional structure diagram of another display panel provided in an embodiment of the present application;

[0060] Figure 6 is a structural schematic diagram of a display device provided in an embodiment of the present application;

[0061] Figure 7 is a flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0062] Figures 8a to 8c It is a process structure schematic diagram of a method for preparing a display panel provided in an embodiment of the present application;

[0063] Fig. 9 is a flow chart of another method for preparing a display panel provided in an embodiment of the present application;

[0064] Figures 10a to 10c It is a process structure schematic diagram of a method for preparing a display panel provided in an embodiment of the present application.

[0065] Marking Description:

[0066] 10. Substrate;

[0067] 20, isolation structure; 21, isolation opening; 22, first isolation part; 23, second isolation part; 24, third isolation part; 21a, first isolation opening; 21b, second isolation opening;

[0068] 30. protection part; 31. first part; 32. second part; 321. first sub-part; 322. second sub-part; 323. third sub-part; 33. third part; 34. first protection part; 35. second protection part; 36. first opening;

[0069] 40. Light-emitting functional layer; 41. Light-emitting structure; 41a. First light-emitting structure; 41b. Second light-emitting structure;

[0070] 50. first electrode layer; 51. first electrode;

[0071] 60, pixel definition layer; 61, pixel definition portion; 62, pixel opening; 60', pixel definition material layer;

[0072] 70. second electrode layer; 71. second electrode;

[0073] 81, first encapsulation layer; 811, encapsulation unit; 82, second encapsulation layer; 83, third encapsulation layer;

[0074] D. Conductive structure;

[0075] X, thickness direction. DETAILED DESCRIPTION

[0076] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0077] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0078] With the development of informatization, the field of display panels has developed rapidly, and people have higher and higher requirements for display panels. On this basis, how to reduce the preparation cost of display panels and improve the display reliability of display panels has become the key research direction of major manufacturers.

[0079] Regarding the above issues, please refer to Figure 1 and Figure 3 An embodiment of the present application provides a display panel, which includes a substrate 10, an isolation structure 20, a protection portion 30, a light-emitting functional layer 40 and a first electrode layer 50. The isolation structure 20 is arranged on one side of the substrate 10. The isolation structure 20 is capable of enclosing an isolation opening 21 and the isolation structure 20 includes a conductive structure D. The protection portion 30 covers the isolation structure 20.

[0080] The light-emitting functional layer 40 is disposed on one side of the substrate 10, and the light-emitting functional layer 40 includes a light-emitting structure 41 disposed corresponding to the isolation opening 21. The first electrode layer 50 is located on the side of the light-emitting functional layer 40 away from the substrate 10, and the first electrode layer 50 includes a first electrode 51 disposed corresponding to the isolation opening 21, wherein the first electrode 51 is electrically connected to the conductive structure D through the protection portion 30.

[0081] The substrate 10 mainly plays a supporting role, and other film layers are stacked on the substrate 10 in sequence. The stacking arrangement mentioned here means that other film layers are arranged in sequence along the thickness direction X of the substrate 10, wherein the substrate 10 may include multiple film layer structures. The specific film layer structure composition of the film layer is not limited in the embodiment of the present application. And the thickness direction X of other film layers located on one side of the substrate 10 is usually consistent with the thickness direction X of the substrate 10 itself. Therefore, for the convenience of expression, the thickness direction X of the substrate 10 or the thickness direction X of other film layers mentioned later in the embodiment of the present application are all indicated in the same direction.

[0082] The light-emitting functional layer 40 and the isolation structure 20 are located on the same side of the substrate 10. The light-emitting functional layer 40 is a film layer structure used to perform the light-emitting function in the display panel, and the isolation structure 20 is a structure in the display panel that can separate different light-emitting structures 41 in the light-emitting functional layer 40. The isolation structure 20 can enclose a plurality of isolation openings 21, and the light-emitting functional layer 40 includes a light-emitting structure 41 arranged corresponding to the isolation openings 21. The "light-emitting structure 41 is arranged corresponding to the isolation openings 21" mentioned here means that the orthographic projection of the light-emitting structure 41 on the substrate 10 is at least partially located within the orthographic projection of the isolation opening 21 on the substrate 10, that is, the position of the light-emitting structure 41 corresponds to the position of the isolation opening 21.

[0083] The light-emitting structure 41 includes but is not limited to a red light-emitting structure 41 for emitting red light, a green light-emitting structure 41 for emitting green light, and a blue light-emitting structure 41 for emitting blue light. Each light-emitting structure 41 may include a stacked hole injection layer (HIL), a hole transport layer (HTL), a light-emitting layer, an electron injection layer (EIL), and an electron transport layer (ETL). In some other embodiments, the light-emitting structure 41 may include a plurality of stacked light-emitting layers, and a charge generation layer is provided between adjacent light-emitting layers.

[0084] The first electrode layer 50 is located on the side of the light-emitting functional layer 40 away from the substrate 10. The first electrode layer 50 includes a first electrode 51 arranged corresponding to the isolation opening 21. The "first electrode 51 arranged corresponding to the isolation opening 21" mentioned here means that the orthographic projection of the first electrode 51 on the substrate 10 is at least partially located within the orthographic projection of the isolation opening 21 on the substrate 10, that is, the position of the first electrode 51 corresponds to the position of the isolation opening 21. Further, the orthographic projection of the first electrode 51 on the substrate 10 can overlap with the orthographic projection of the light-emitting structure 41 on the substrate 10, so as to control whether the light-emitting structure 41 emits light or not by means of the first electrode 51. Exemplarily, the first electrode 51 is a cathode.

[0085] The setting of the isolation structure 20 can enable the light-emitting functional layer 40 and the first electrode layer 50 to form a plurality of light-emitting structures 41 and a first electrode 51 arranged at intervals without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel. Specifically, taking the red light-emitting structure 41 as an example before the preparation of the green light-emitting structure 41, since the fine metal mask is cancelled, the red light-emitting material corresponding to the red light-emitting structure 41 and the electrode material corresponding to the red light-emitting structure 41 will first fall into each isolation opening 21, and then the red light-emitting material and the electrode material in a part of the isolation opening 21 are selectively etched away, and the red light-emitting material and the electrode material in a part of the isolation opening 21 are retained to form the red light-emitting structure 41 and the corresponding first electrode 51. After that, the green light-emitting material corresponding to the green light-emitting structure 41 and the electrode material corresponding to the green light-emitting structure 41 will fall into each isolation opening 21, and then the green light-emitting material and the electrode material in a part of the isolation opening 21 are selectively etched away, and the green light-emitting material and the electrode material in a part of the isolation opening 21 are retained to form the green light-emitting structure 41 and the corresponding first electrode 51.

[0086] In order to meet the signal transmission needs of the first electrode 51, a conductive structure D is provided in the isolation structure 20. The conductive structure D is a structure in the isolation structure 20 that can realize signal transmission. The first electrode 51 is contacted with the conductive structure D and the corresponding power signal is transmitted by using the conductive structure D, so that the first electrode 51 can receive the corresponding power signal, thereby satisfying the control of whether the light-emitting structure 41 emits light or not.

[0087] Furthermore, since the isolation structure 20 is prepared before the light emitting structure 41, and the formation of the light emitting structures 41 of various colors and the first electrode 51 requires multiple etching processes, the isolation structure 20 is easily corroded by the etching process during the preparation of the light emitting structure 41 and the first electrode 51, resulting in a larger etching amount corresponding to the isolation structure 20, thereby affecting the overlap effect between the first electrode 51 and the isolation structure 20, and thus easily causing problems such as display uniformity, affecting the yield rate and reliability of the display panel.

[0088] In view of this, the embodiment of the present application adds a protective portion 30, and the protective portion 30 covers the isolation structure 20. The "covering the isolation structure 20" mentioned here means that the outer surface of the isolation structure 20 can be in contact with the protective portion 30. Specifically, in the process of preparing the display panel, the isolation structure 20 is first formed, and then the protective portion 30 that can cover the isolation structure 20 is formed. With the help of the protective portion 30, the isolation structure 20 is protected, and the influence of the subsequent etching process corresponding to the light-emitting structure 41 and the first electrode 51 on the isolation structure 20 is reduced, that is, the etching amount corresponding to the isolation structure 20 is reduced, and the structural integrity of the isolation structure 20 is improved. Furthermore, after the first electrode 51 is prepared, since the isolation structure 20 itself is less affected by the etching, the isolation structure 20 can still have a certain width dimension in the direction parallel to the plane of the substrate 10, so that the first electrode 51 can have a good contact effect with the protective portion 30 covering the isolation structure 20. And because the protection part 30 itself includes conductive material, the protection part 30 can be used to achieve electrical connection between the first electrode 51 and the conductive structure D in the isolation structure 20. This design helps to improve the conductivity between the first electrode 51 and the conductive structure D, reduce the problems of abnormal display brightness and uneven display, thereby improving the reliability and display effect of the display panel.

[0089] It should be noted that the embodiment of the present application does not limit the material composition of the protection portion 30. For example, the material of the protection portion 30 may be the same as the material of at least one of the first electrode 51 and the conductive structure D, or the material of the protection portion 30 may be different from the material of both the first electrode 51 and the conductive structure D. As long as the protection portion 30 can meet the signal transmission requirements and the existence of the protection portion 30 can reduce the adverse effects of the etching process on the isolation structure 20, it will be sufficient.

[0090] In addition, the isolation structure 20 may only include the conductive structure D, that is, each part of the isolation structure 20 can realize signal transmission, or the isolation structure 20 may include an insulating structure in addition to the conductive structure D, and the embodiment of the present application does not limit this.

[0091] In summary, the embodiment of the present application sets an isolation structure 20, thereby realizing the preparation of light-emitting structures 41 of various colors and corresponding first electrodes 51 without the need for a fine metal mask plate, thereby reducing the preparation cost of the display panel. At the same time, a protective portion 30 is also added, and the protective portion 30 is set to cover the isolation structure 20, thereby reducing the adverse effects of the etching process corresponding to the light-emitting structure 41 and the first electrode 51 on the isolation structure 20, thereby improving the structural integrity of the isolation structure 20. In addition, the first electrode 51 and the protective portion 30 can have a good overlap effect, thereby improving the conduction performance between the first electrode 51 and the conductive structure D, improving the transmission reliability of the power signal corresponding to the first electrode 51, reducing the problems of abnormal display brightness and uneven display, and improving the reliability and display effect of the display panel.

[0092] In some embodiments, Figure 1 and Figure 2 As shown, the isolation structure 20 includes a first isolation portion 22 arranged on one side of the substrate 10 and a second isolation portion 23 located on the side of the first isolation portion 22 away from the substrate 10 , and the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10 .

[0093] In combination with the above content, it can be known that the setting of the isolation structure 20 can form a plurality of light-emitting structures 41 and a first electrode 51 arranged at intervals without the need for a fine metal mask plate, thereby reducing the manufacturing cost of the display panel. Among them, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 arranged in sequence in a direction away from the substrate 10, and the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10. Further, the orthographic projection of the second isolation portion 23 covers and exceeds the orthographic projection of the first isolation portion 22.

[0094] The specific size and shape of the first isolation portion 22 and the second isolation portion 23 are not limited in the embodiment of the present application. For example, the longitudinal section of the isolation structure 20 can be T-shaped. This design helps in the preparation process of the light-emitting structure 41, making it difficult for the light-emitting material to extend along the side wall of the first isolation portion 22 to the side wall of the second isolation portion 23, thereby realizing the preparation and mutual separation of the light-emitting structures 41 corresponding to different isolation openings 21 without the need for a fine metal mask. The preparation process of the first electrode 51 is similar to this, and the embodiment of the present application will not be repeated.

[0095] In some embodiments, the first isolation portion 22 and / or the second isolation portion form a conductive structure D.

[0096] According to different actual needs, the conductive structure D may include only the first isolation portion 22, that is, only the first isolation portion 22 includes a conductive material, and the second isolation portion 23 does not include a conductive material. Alternatively, the conductive structure D may include only the second isolation portion 23, that is, only the second isolation portion 23 includes a conductive material, and the first isolation portion 22 does not include a conductive material. Alternatively, the conductive structure D may include both the first isolation portion 22 and the second isolation portion 23, that is, both the first isolation portion 22 and the second isolation portion 23 include a conductive material.

[0097] Furthermore, the protection part 30 can cover the first isolation part 22 and the second isolation part 23, that is, the protection part 30 is in contact with both the first isolation part 22 and the second isolation part 23. On this basis, due to the existence of the protection part 30, the etching effect on the first isolation part 22 and the second isolation part 23 can be reduced at the same time, the etching amount of the first isolation part 22 and the second isolation part 23 can be reduced, and the structural integrity of the first isolation part 22 and the second isolation part 23 can be improved.

[0098] Furthermore, even if only one of the first isolation portion 22 and the second isolation portion 23 includes conductive material, since the protection portion 30 is arranged in contact with both the first isolation portion 22 and the second isolation portion 23, the power signal corresponding to the first electrode 51 can still be transmitted with the help of the protection portion 30, which has strong flexibility and practicality.

[0099] Optionally, the material of the first isolation portion includes at least one of metal titanium and metal aluminum; and / or the material of the second isolation portion includes at least one of metal titanium and metal aluminum.

[0100] In some embodiments, see Figure 2 and Figure 4 The isolation structure 20 further includes a third isolation portion 24 disposed on the side of the first isolation portion 22 facing the substrate 10 , and the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the third isolation portion 24 on the substrate 10 .

[0101] The third isolation portion 24 is a structure in the isolation structure 20 located on the side of the first isolation portion 22 facing the substrate 10. The orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the third isolation portion 24 on the substrate 10, that is, in a direction parallel to the plane of the substrate 10, the third isolation portion 24 can be partially disposed beyond the first isolation portion 22.

[0102] In the embodiment of the present application, the protection part 30 can also cover the third isolation part 24, which helps to increase the overlap area between the first electrode 51 and the protection part 30, and reduce the overlap difficulty between the two, and further improve the transmission reliability of the power signal corresponding to the first electrode 51. Further optionally, the conductive structure D includes the third isolation part 24, that is, the protection part 30 can realize the electrical connection between the first electrode 51 and the third isolation part 24, and meet the transmission needs of the power signal between the first electrode 51 and the third isolation part 24.

[0103] In some embodiments, see Figure 1 and Figure 3 The protection portion 30 includes a first portion 31 that is disposed in close contact with the first isolation portion 22 , and a second portion 32 that is disposed in close contact with the second isolation portion 23 , and the first portion 31 is connected to the second portion 32 .

[0104] In the embodiment of the present application, in view of the situation that the isolation structure 20 includes the first isolation part 22 and the second isolation part 23, the protection part 30 includes a first part 31 covering the first isolation part 22, and a second part 32 covering the second isolation part 23, wherein the first part 31 is arranged at the side wall of the first isolation part 22, that is, the first part 31 is located on at least one side of the first isolation part 22 in a direction parallel to the plane of the substrate 10. Further optionally, the first electrode 51 is arranged in contact with the first part 31, so that the first part 31 can not only protect the first isolation part 22 to reduce the risk of the first isolation part 22 being damaged by etching, but also play the role of transmitting the power signal corresponding to the first electrode 51 to meet the display needs of the display panel.

[0105] The second portion 32 is used to cover the second isolation portion 23. Optionally, the second portion 32 includes a first sub-portion 321 arranged on the side of the second isolation portion 23 facing the substrate 10, a second sub-portion 322 arranged on the side of the second isolation portion 23 away from the substrate 10, and a third sub-portion 323 arranged at the side wall of the second isolation portion 23 facing the isolation opening 21, and the third sub-portion 323 is connected to the first sub-portion 321 and the second sub-portion 322.

[0106] In this design, the second portion 32 can reduce the risk of etching damage to the sidewall of the second isolation portion 23, and can also reduce the risk of etching damage to the two surfaces of the second isolation portion 23 in the thickness direction X, thereby further improving the protection effect of the second isolation portion 23. Among them, the first sub-portion 321 can also be connected to the first portion 31, so that the first portion 31 and the second portion 32 are connected and arranged as a whole, which can improve the protection effect of the protection portion 30 on the isolation structure 20, and has strong practicality.

[0107] It should be noted that, during the preparation of the light-emitting structure 41 and the first electrode 51, due to the influence of the material types and process technology of the light-emitting material and the electrode material, the light-emitting material and the electrode material cannot extend from the side wall of the first isolation portion 22 to the side wall of the second isolation portion 23. However, due to the influence of the material and process technology of the protection portion 30 itself, the protection portion 30 can extend from the side wall of the first isolation portion 22 to the side wall of the second isolation portion 23, and form the first portion 31 and the second portion 32 connected as one.

[0108] In some embodiments, Figure 2 and Figure 4 As shown, the isolation structure 20 further includes a third isolation portion 24 disposed on the side of the first isolation portion 22 facing the substrate 10, and the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the third isolation portion 24 on the substrate 10. The protection portion 30 includes a third portion 33 disposed in contact with the third isolation portion 24, and the third portion 33 is connected to the first portion 31.

[0109] In the embodiment of the present application, the third portion 33 is a partial structure in the protection portion 30 for protecting the third isolation portion 24, and the two ends of the first portion 31 in the thickness direction X are respectively connected to the second portion 32 and the third portion 33, so that the first portion 31, the second portion 32 and the third portion 33 are connected and arranged as a whole. Further optionally, the first electrode 51 is arranged in contact with the third portion 33, that is, the first electrode 51 is in contact with the first portion 31 and the third portion 33 at the same time, so that the contact area between the first electrode 51 and the protection portion 30 can be increased, the conductive performance between the first electrode 51 and the conductive structure D is improved, and the reliability of the display panel is further improved.

[0110] In some embodiments, Figure 1 As shown, the plurality of isolation openings 21 include a first isolation opening 21a and a second isolation opening 21b, and the plurality of light-emitting structures 41 include a first light-emitting structure 41a corresponding to the first isolation opening 21a and a second light-emitting structure 41b corresponding to the second isolation opening 21b, and the light-emitting colors corresponding to the first light-emitting structure 41a and the second light-emitting structure 41b are different.

[0111] The contour lines of the orthographic projection of the first isolation portion 22 on the substrate 10 include a first contour line corresponding to the first isolation opening 21a and a second contour line corresponding to the second isolation opening 21b, and the contour lines of the orthographic projection of the second isolation portion 23 on the substrate 10 include a third contour line corresponding to the first isolation opening 21a and a fourth contour line corresponding to the second isolation opening 21b; wherein, the distance between the corresponding first contour line and the third contour line is L1, and the distance between the corresponding second contour line and the fourth contour line is L2, and L1=L2.

[0112] The first light-emitting structure 41a and the second light-emitting structure 41b are two types of light-emitting structures 41 for emitting light of different colors. Due to the difference in the color of the light emitted, the first light-emitting structure 41a and the second light-emitting structure 41b are usually prepared and formed in sequence during the preparation process. For the convenience of description, the embodiments of the present application are described below by taking the preparation of the first light-emitting structure 41a before the second light-emitting structure 41b as an example. Optionally, the first light-emitting structure 41a can be a light-emitting structure 41 for emitting red light, and the second light-emitting structure 41b can be a light-emitting structure 41 for emitting blue or green light.

[0113] The first isolation opening 21a and the second isolation opening 21b are isolation openings 21 for accommodating the first light emitting structure 41a and the second light emitting structure 41b, respectively. The first contour line is the outer contour line of the first isolation portion 22 toward the first isolation opening 21a. Usually, in the direction away from the substrate 10, the cross-sectional size of the first isolation portion 22 gradually decreases, so the first contour line can be a part of the outer contour line on the surface of the first isolation portion 22 facing the substrate 10. The third contour line is the same, and the embodiment of the present application will not be repeated.

[0114] The second contour line is the outer contour line of the second isolation portion 23 toward the first isolation opening 21a. Similar to the first isolation portion 22, the cross-sectional size of the second isolation portion 23 gradually decreases in the direction away from the substrate 10. Therefore, the second contour line can be a part of the outer contour line on the surface of the second isolation portion 23 facing the substrate 10. The fourth contour line is the same, and the embodiment of the present application will not be repeated.

[0115] In the related art, during the preparation of the second light-emitting structure 41b, since the first light-emitting structure 41a and its corresponding first electrode 51 and the packaging structure exist at the corresponding position of the first isolation opening 21a, the first light-emitting structure 41a and the first electrode layer 50 structure can protect the isolation structure 20 on the periphery of the first isolation opening 21a, and reduce the first isolation portion 22 on the periphery of the first isolation opening 21a from being affected by the etching process corresponding to the second light-emitting structure 41b. However, at other isolation openings 21, since there is no first light-emitting structure 41a, the isolation structure 20 on the periphery thereof cannot be protected, which easily causes the first isolation portion 22 on the periphery of other isolation openings 21 to be affected by the etching process corresponding to the second light-emitting structure 41b. On this basis, there will be differences in the etching amounts corresponding to the first isolation portions 22 on the peripheries of different isolation openings 21, which will result in differences in the distances between the outer contours of the first isolation portion 22 and the second isolation portion 23 on the peripheries of different isolation openings 21.

[0116] In the embodiment of the present application, the presence of the protection portion 30 can play a common protective role on the isolation structures 20 around the isolation openings 21 during the preparation of each light-emitting structure 41, thereby reducing the difference between the isolation structures 20 around different isolation openings 21, so that L1 = L2. This design helps to reduce the difference in the conduction effect of the first electrode 51 corresponding to the light-emitting structure 41 of different colors relative to the conductive structure D in the isolation structure 20, and improve the uniformity of line display.

[0117] The present embodiment does not limit the positional relationship between the first isolation opening 21a and the second isolation opening 21b. There may be other isolation openings 21 between the first isolation opening 21a and the second isolation opening 21b, or optionally, the first isolation opening 21a may also be disposed adjacent to the second isolation opening 21b.

[0118] In some embodiments, the corrosion resistance of the protection part 30 is stronger than that of the conductive structure D. The corrosion resistance mentioned here refers to the ability of the structure to resist corrosion from the etching medium. In other words, the material in the protection part 30 is less susceptible to etching than the material in the conductive structure D. In this way, during the preparation of the light-emitting functional layer or other film layers, the protection part 30 can exist for a long time in the etching process and protect the conductive structure D, thereby helping to further improve the structural integrity of the conductive structure D and improve the preparation yield.

[0119] In some embodiments, the protection portion 30 has a stronger oxidation resistance than the conductive structure D. The oxidation resistance means that the stronger the material's ability to resist oxidation, the less likely it is to undergo oxidation reaction with the external environment.

[0120] In the related art, during the preparation of the light-emitting structure 41, the conductive structure D will come into contact with the external environment, which is prone to oxidation reaction, thereby easily affecting the lap impedance between the first electrode 51 and the conductive structure D and affecting the normal transmission of the power signal.

[0121] In the embodiment of the present application, by controlling the material of the protective part 30, the material of the protective part 30 has stronger oxidation resistance than the material of the conductive structure D, that is, the protective part 30 is less likely to undergo oxidation reaction with the external environment than the conductive structure D, which helps to reduce the overlap impedance between the first electrode 51 and the protective part 30. In addition, the presence of the protective part 30 can reduce the risk of oxidation reaction in at least part of the conductive structure D while reducing the corresponding etching amount of the isolation structure 20, thereby improving the conductivity between the first electrode 51 and the conductive structure D and improving the display effect.

[0122] In some embodiments, the material of the protection portion 30 includes at least one of indium tin oxide, indium zinc oxide, and molybdenum oxide.

[0123] In the embodiments of the present application, materials such as indium tin oxide, indium zinc oxide and molybdenum oxide are all materials that are not easily oxidized, and by setting the material of the protection part 30 to include at least one of indium tin oxide, indium zinc oxide and molybdenum oxide, the protection part 30 can be extended from the side wall of the first isolation part 22 to the side wall of the second isolation part 23 during the preparation process of the protection part 30, thereby achieving an overall coverage protection effect on the isolation structure 20, and while satisfying the conductive performance, the protection effect of the protection part 30 on the isolation structure 20 can be improved.

[0124] In some embodiments, the protection portion 30 includes crystallized indium tin oxide. This design helps to enhance the density of the protection portion 30 itself, thereby further improving the protection effect on the conductive structure D.

[0125] In some embodiments, the protection portion 30 is formed by magnetron sputtering deposition or atomic layer deposition. Both magnetron sputtering deposition and atomic layer deposition can help form the protection portion 30 that completely covers the isolation structure 20, meeting the preparation requirements of the conductive isolation portion.

[0126] In some embodiments, the display panel also includes a second electrode layer 70 arranged on the side of the light-emitting functional layer 40 facing the substrate 10, the second electrode layer 70 includes a plurality of second electrodes 71 arranged at intervals, and the orthographic projection of the protection portion 30 on the substrate 10 is located outside the orthographic projection of the second electrode 71 on the substrate 10.

[0127] In the embodiment of the present application, the orthographic projection of the protection portion 30 on the substrate 10 is located outside the orthographic projection of the second electrode 71 on the substrate 10, that is, the protection portion 30 and the second electrode 71 are not arranged in a corresponding overlapping manner, which helps to increase the relative distance between the two and reduce the occurrence of signal crosstalk problems.

[0128] In some embodiments, Figure 1 As shown, the display panel also includes a pixel definition layer 60 arranged on the side of the isolation structure 20 facing the substrate 10, the pixel definition layer 60 includes a pixel defining portion 61 and a pixel opening 62 formed by the pixel defining portion 61, and the light-emitting structure 41 is at least partially located in the pixel opening 62; the protection portion 30 includes a first protection portion 34 covering the surface of the isolation structure 20, and a second protection portion 35 connected to the first protection portion 34, and the second protection portion 35 is arranged in contact with the surface of the pixel defining portion 61 away from the substrate 10.

[0129] The pixel opening 62 is an opening structure for defining the light emitting structure 41. Optionally, the display panel further includes a second electrode layer 70 disposed on the side of the light emitting functional layer 40 facing the substrate 10. The second electrode layer 70 includes a plurality of second electrodes 71 disposed at intervals. The second electrodes 71 are partially exposed to the pixel opening 62. Exemplarily, the first electrode 51 is a cathode, the second electrode 71 is an anode, and the first electrode 51 and the second electrode 71 jointly drive and control whether the light emitting structure 41 emits light. Among them, the second electrode 71 is partially exposed to the pixel opening 62, and is partially covered and blocked by the pixel defining portion 61. The pixel defining portion 61 can cover and protect part of the structure of the second electrode 71.

[0130] The protection part 30 includes a first protection part 34 and a second protection part 35. The first protection part 34 is a partial structure of the protection part 30 for covering the protection isolation structure 20. Exemplarily, the first protection part 34 may include a first portion 31 and a second portion 32. Further, when the isolation structure 20 includes the third isolation part 24, the first protection part 34 also includes a third portion 33.

[0131] The second portion 32 is a partial structure of the protection portion 30 located in the isolation opening 21. The second protection portion 35 is arranged in contact with the surface of the pixel defining portion 61 facing away from the substrate 10, that is, the second protection portion 35 can cover and protect the pixel defining portion 61. Specifically, during the preparation process of the light emitting structure 41, the second protection portion 35 can isolate part of the structure in the pixel defining portion 61 from the etching medium to reduce the etching effect on the pixel defining portion 61 and improve the structural reliability of the pixel defining portion 61.

[0132] Further, in some optional embodiments, the orthographic projection of the second protection portion 35 on the substrate 10 is located outside the orthographic projection of the second electrode 71 on the substrate 10. This design can help increase the distance between the second protection portion 35 and the second electrode 71, thereby reducing the risk of signal crosstalk between the two and improving the reliability of the display panel.

[0133] In some embodiments, Figure 3 and Figure 4 As shown, the first protection portion 34 and the second protection portion 35 are both disposed in contact with the first electrode 51 .

[0134] In the embodiment of the present application, in addition to covering and protecting the pixel defining portion 61, the second protective portion 35 can also be used to contact the first electrode 51 to increase the contact area between the first electrode 51 and the protective portion 30, thereby further enhancing the conductivity between the first electrode 51 and the conductive structure D in the isolation structure 20 and improving display reliability.

[0135] In some embodiments, see Figure 5The display panel further includes a first encapsulation layer 81 located on a side of the first electrode layer 50 away from the substrate 10 . The first encapsulation layer 81 includes a plurality of encapsulation units 811 arranged at intervals. The encapsulation units 811 overlap with the orthographic projections of the corresponding light emitting structures 41 on the substrate 10 .

[0136] The first encapsulation layer 81 mainly plays the role of encapsulation protection, and the first encapsulation layer 81 includes an encapsulation portion arranged corresponding to the isolation opening 21. That is, the preparation of the first encapsulation layer 81 will be affected by the isolation structure 20, thereby forming a plurality of encapsulation units 811 arranged at intervals corresponding to different light-emitting structures 41, so as to achieve separate encapsulation of different light-emitting structures 41 and improve encapsulation reliability. Among them, due to the influence of factors such as the material composition and film forming method in the first encapsulation layer 81, some structures in the encapsulation unit 811 will also extend relative to the side wall of the isolation structure 20, and extend to the side of the isolation structure 20 away from the substrate 10.

[0137] The present embodiment does not limit the material composition of the first encapsulation layer 81. Optionally, the first encapsulation layer 81 includes an inorganic material.

[0138] In some embodiments, the display panel further includes a second encapsulation layer 82 disposed on the side of the first encapsulation layer 81 away from the substrate 10 . The second encapsulation layer 82 has a planar structure and its orthographic projection on the substrate 10 covers the orthographic projections of the plurality of encapsulation units 811 on the substrate 10 .

[0139] Unlike the first encapsulation layer 81, the second encapsulation layer 82 can be a whole-surface structure and cover multiple encapsulation units 811 at the same time. Optionally, the second encapsulation layer 82 includes an organic material. Further, the display panel also includes a third encapsulation layer 83 arranged on the side of the second encapsulation layer 82 away from the substrate 10. The first encapsulation layer 81, the second encapsulation layer 82 and the third encapsulation layer 83 can together constitute a thin film encapsulation structure, thereby further improving the corresponding encapsulation reliability of the display panel. Optionally, the third encapsulation layer 83 includes an inorganic material.

[0140] Second, see Figure 6 An embodiment of the present application provides a display device, which includes a display panel in any of the aforementioned embodiments.

[0141] It should be noted that the display device provided in the embodiment of the present application has the beneficial effects of the display panel in any of the aforementioned embodiments. For details, please refer to the aforementioned description of the beneficial effects of the display panel, and the embodiment of the present application will not be repeated.

[0142] Third, see Figure 7 8 , an embodiment of the present application provides a method for preparing a display panel, the method comprising:

[0143] S100: forming an isolation structure on one side of the substrate.

[0144] See also Figure 8a In step S100, the isolation structure 20 encloses a plurality of isolation openings 21 and includes a conductive structure D. The specific composition of the isolation structure 20 is not limited in the embodiment of the present application. Optionally, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 located on a side of the first isolation portion 22 away from the substrate 10, and the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10.

[0145] S110: forming a protection portion on one side of the substrate.

[0146] See also Figure 8b In step S110, the protection portion 30 is formed behind the isolation structure 20 and covers the isolation structure 20 to protect the isolation structure 20 and reduce the adverse effects of subsequent etching processes on the isolation structure 20. Optionally, the protection portion 30 is formed by magnetron sputtering deposition or atomic layer deposition.

[0147] S120: forming a plurality of light-emitting structures and corresponding first electrodes arranged corresponding to the isolation openings on one side of the substrate.

[0148] See also Figure 8c In step S120, light-emitting structures 41 of different colors are formed in sequence in different processes. In the preparation process of multiple light-emitting structures 41 and their corresponding first electrodes 51, there are often multiple etching processes. On this basis, by covering the isolation structure 20 with the protection part 30, the adverse effects of the etching process corresponding to the light-emitting structure 41 and the first electrode 51 on the isolation structure 20 are reduced, thereby improving the structural integrity of the isolation structure 20. In addition, the first electrode 51 and the protection part 30 can have a good overlap effect, thereby improving the conduction performance between the first electrode 51 and the conductive structure D, improving the transmission reliability of the power signal corresponding to the first electrode 51, reducing the problems of abnormal display brightness and uneven display, and improving the reliability and display effect of the display panel.

[0149] In some embodiments, see Fig. 9 10 , the protection portion 30 includes a first opening 36 located in the isolation opening 21 , and before step S100 , the following steps are further included:

[0150] S130: forming a second electrode layer on one side of the substrate.

[0151] See also Fig.10aIn step S130, the second electrode layer 70 includes a plurality of second electrodes 71 arranged at intervals. Exemplarily, the second electrode 71 is an anode, the first electrode is a cathode, and the first electrode and the second electrode 71 jointly control whether the light emitting structure emits light.

[0152] S140: forming a pixel definition material layer on a side of the second electrode layer facing away from the substrate.

[0153] See also Fig.10b In step S140 , the pixel definition material layer 60 ′ is used to subsequently form the pixel definition layer 60 , and the pixel definition material layer 60 ′ is a full-surface structure and covers a plurality of second electrodes 71 .

[0154] After step S110, the method further includes:

[0155] S150 : etching and removing a portion of the pixel definition material layer 60 ′ at the first opening 36 .

[0156] See also Fig.10c In step S150 , the structure of the pixel definition material layer 60 ′ at the first opening 36 may be etched to form a pixel defining portion 61 and a pixel opening 62 surrounded by the pixel defining portion 61 , and the second electrode 71 is exposed in the pixel opening 62 .

[0157] In the embodiment of the present application, during the formation of the isolation structure 20, the pixel definition material layer 60' in the entire surface can completely cover and protect the second electrode 71, thereby improving the structural reliability of the second electrode 71. At the same time, the pixel opening 62 is formed by etching with the aid of the first opening 36, that is, the pixel definition layer 60 is formed with the aid of the protection portion 30, which helps to reduce the manufacturing cost and difficulty.

[0158] In some optional embodiments, in step S110, the protection portion 30 is processed by a yellow light process. The yellow light process mentioned here refers to using a photoresist or the like as a sacrificial layer to shield part of the material used to form the protection portion 30, and etching the opening position of the sacrificial layer to form a protection portion 30 with a specific morphology.

[0159] In the embodiment of the present application, the protective portion 30 formed by the yellow light process has a stronger preparation accuracy, so that the orthographic projection of the protective portion 30 on the substrate 10 can be located outside the orthographic projection of the second electrode 71 on the substrate 10, thereby helping to improve the risk of signal crosstalk between the protective portion 30 and the second electrode 71.

[0160] In some optional embodiments, in step S150 , the pixel defining portion 61 is formed by a yellow light process.

[0161] In the embodiment of the present application, the pixel defining portion 61 formed by the yellow light process has a higher manufacturing accuracy and helps to reduce the problem of side engraving and indentation of the pixel defining portion 61, thereby reducing the risk of breakage of the first electrode 51 and improving the manufacturing reliability of the first electrode 51.

[0162] Although the embodiments disclosed in this application are as above, the contents described are only embodiments adopted for facilitating the understanding of this application and are not intended to limit the present invention. Any technician in the technical field to which this application belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in this application, but the scope of protection of this application shall still be subject to the scope defined in the attached claims.

[0163] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the replacement of other connection methods described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: substrate; An isolation structure, disposed on one side of the substrate, the isolation structure encloses an isolation opening and includes a conductive structure; A protection portion, the protection portion covering the isolation structure; A light-emitting functional layer is disposed on one side of the substrate, and the light-emitting functional layer includes a light-emitting structure disposed corresponding to the isolation opening; A first electrode layer, located on a side of the light-emitting functional layer away from the substrate, the first electrode layer comprising a first electrode arranged corresponding to the isolation opening; Wherein, the first electrode is electrically connected to the conductive structure through the protection portion.

2. The display panel according to claim 1, characterized in that: The isolation structure comprises a first isolation portion disposed on one side of the substrate, and a second isolation portion located on a side of the first isolation portion away from the substrate, wherein the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; Preferably, the first isolation portion and / or the second isolation portion forms the conductive structure; Preferably, the material of the first isolation portion includes at least one of metal titanium and metal aluminum; and / or the material of the second isolation portion includes at least one of metal titanium and metal aluminum; Preferably, the isolation structure further comprises a third isolation portion provided on a side of the first isolation portion facing the substrate, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the third isolation portion on the substrate; Preferably, the conductive structure includes the third isolation portion.

3. The display panel according to claim 2, characterized in that: The protection part includes a first part which is arranged in close contact with the first isolation part, and a second part which is arranged in close contact with the second isolation part, wherein the first part is connected to the second part; Preferably, the first electrode is arranged in contact with the first portion; Preferably, the second portion includes a first sub-portion disposed on a side of the second isolation portion facing the substrate, a second sub-portion disposed on a side of the second isolation portion facing away from the substrate, and a third sub-portion disposed on a side wall of the second isolation portion facing the isolation opening, wherein the third sub-portion is connected to the first sub-portion and the second sub-portion; Preferably, the isolation structure further comprises a third isolation portion provided on a side of the first isolation portion facing the substrate, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the third isolation portion on the substrate; Wherein, the protection part comprises a third part which is arranged in close contact with the third isolation part, and the third part is connected to the first part; Preferably, the first electrode is arranged in contact with the third portion.

4. The display panel according to claim 3, characterized in that: The plurality of isolation openings include a first isolation opening and a second isolation opening, the plurality of light-emitting structures include a first light-emitting structure corresponding to the first isolation opening and a second light-emitting structure corresponding to the second isolation opening, and the first light-emitting structure and the second light-emitting structure have different light-emitting colors; The contour line of the orthographic projection of the first isolation portion on the substrate includes a first contour line corresponding to the first isolation opening and a second contour line corresponding to the second isolation opening, and the contour line of the orthographic projection of the second isolation portion on the substrate includes a third contour line corresponding to the first isolation opening and a fourth contour line corresponding to the second isolation opening; Wherein, the distance between the corresponding first contour line and the third contour line is L1, and the distance between the corresponding second contour line and the fourth contour line is L2, L1=L2; Preferably, the first isolation opening is arranged adjacent to the second isolation opening.

5. The display panel according to claim 1, characterized in that: The corrosion resistance of the protection portion is stronger than that of the conductive structure; Preferably, the protection portion has a stronger oxidation resistance than the conductive structure; Preferably, the material of the protection portion includes at least one of indium tin oxide, indium zinc oxide and molybdenum oxide; Preferably, the protection portion comprises crystallized indium tin oxide; Preferably, the protection portion is formed by magnetron sputtering deposition or atomic layer deposition; Preferably, the display panel further comprises a second electrode layer arranged on the side of the light-emitting functional layer facing the substrate, the second electrode layer comprises a plurality of second electrodes arranged at intervals, and the orthographic projection of the protection portion on the substrate is located outside the orthographic projection of the second electrode on the substrate.

6. The display panel according to claim 1, characterized in that: It also includes a pixel definition layer disposed on a side of the isolation structure facing the substrate, the pixel definition layer includes a pixel definition portion and a pixel opening formed by the pixel definition portion, and the light emitting structure is at least partially located in the pixel opening; The protection portion includes a first protection portion covering the surface of the isolation structure, and a second protection portion connected to the first protection portion, wherein the second protection portion is arranged in contact with a surface of the pixel defining portion away from the substrate; Preferably, the display panel further comprises a second electrode layer disposed on a side of the light-emitting functional layer facing the substrate, the second electrode layer comprises a plurality of second electrodes disposed at intervals, and a portion of the second electrode is exposed to the pixel opening; Preferably, the orthographic projection of the second protection portion on the substrate is located outside the orthographic projection of the second electrode on the substrate; Preferably, both the first protection portion and the second protection portion are arranged in contact with the first electrode.

7. The display panel according to claim 1, characterized in that: It also includes a first packaging layer located on a side of the first electrode layer away from the substrate; The first encapsulation layer includes a plurality of encapsulation units arranged at intervals, and the encapsulation units and the corresponding light-emitting structures are arranged to overlap with the orthographic projections of the substrate; Preferably, the first encapsulation layer comprises an inorganic material; Preferably, the display panel further comprises a second encapsulation layer arranged on a side of the first encapsulation layer away from the substrate; The second encapsulation layer is in a planar structure, and the orthographic projection of the second encapsulation layer on the substrate covers the orthographic projections of a plurality of the encapsulation units on the substrate; Preferably, the second encapsulation layer comprises an organic material; Preferably, the display panel further comprises a third encapsulation layer disposed on a side of the second encapsulation layer away from the substrate; Preferably, the third encapsulation layer comprises an inorganic material.

8. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 7.

9. A method for preparing a display panel, characterized in that: include: An isolation structure is formed on one side of the substrate, wherein the isolation structure encloses a plurality of isolation openings and includes a conductive structure; A protection portion is formed on one side of the substrate, wherein the protection portion covers the isolation structure; A plurality of light emitting structures and corresponding first electrodes are formed on one side of the substrate and are arranged corresponding to the isolation openings. The first electrodes are electrically connected to the conductive structure through the protection portion.

10. The preparation method according to claim 9, characterized in that: The protection portion includes a first opening located within the isolation opening; Before forming the isolation structure on one side of the substrate, the method further includes: forming a second electrode layer on one side of the substrate, wherein the second electrode layer includes a plurality of second electrodes arranged at intervals; forming a pixel definition material layer on a side of the second electrode layer away from the substrate, wherein the pixel definition material layer covers a plurality of second electrode arrangements; After forming the protection portion on one side of the substrate, the method includes: Etching and removing a portion of the structure of the pixel definition material layer at the first opening to form a pixel definition portion and a pixel opening surrounded by the pixel definition portion, wherein the second electrode is exposed to the pixel opening; Preferably, in forming the protection portion on one side of the substrate, the protection portion is formed by a yellow light process; Preferably, the etching removes a portion of the pixel definition material layer at the first opening, and the pixel defining portion is formed by a yellow light process.

Images