Display panel and display device

Abstract

The invention discloses a display panel and a display device. A substrate, a first packaging section, a black matrix layer with an opening and a color filter layer located in the opening are sequentially arranged in a display area of the display panel in a stacked mode. A substrate, a second packaging section and a filling part are sequentially stacked in the packaging area of the display panel; the filling part comprises a part, located in the packaging area, of at least one of the black matrix layer and the color filter layer; in the direction perpendicular to the plane where the substrate is located, the distance from the side, away from the substrate, of the second packaging section to the substrate is smaller than the distance from the side, away from the substrate, of the first packaging section to the substrate. The distance from the side, away from the substrate, of the filling part to the substrate is smaller than or equal to the distance from the side, away from the substrate, of the first packaging section to the substrate. According to the display panel, the segment difference formed by the display area and the hole opening area due to the high-low terrain is reduced, meanwhile, the process of filling the hole opening area does not need to be additionally added, the production cost of the display panel can be reduced, and the productivity is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] In order to achieve a full-screen design, a hole is opened in the display area of ​​the display panel to form an open hole area (O-CUT), and a front camera is installed in the open hole area. In the manufacturing process of traditional display panels, since the open hole area does not have a thin-film transistor device layer, a pixel definition layer, and a light-emitting device, the terrain of the open hole area is lower than that of the display area. When other film layers are subsequently attached, the step difference formed by the high and low terrain will cause bubbles or stress concentration in the film layer above the open hole area, causing the film layer above the open hole area to crack.

[0003] In order to prevent the low terrain of the opening area from affecting the subsequent manufacturing steps of the traditional display panel, an additional process of filling the opening area is added in the manufacturing process of the traditional display panel to reduce the step difference between the opening area and the display area caused by the uneven terrain. However, the additional process will increase the production cost of the display panel and affect the production capacity.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above technical problems. Summary of the invention

[0005] The purpose of the present application is to provide a display panel and a display device, which can reduce the step difference between the display area and the opening area due to the high and low terrain without adding an additional process to fill the opening area, thereby reducing the production cost of the display panel and improving the production capacity.

[0006] To solve the above problems, the technical solution of this application is as follows:

[0007] In a first aspect, the present application proposes a display panel, comprising a non-display area and a display area located outside the non-display area, wherein the non-display area comprises a packaging area and an opening area, wherein the packaging area is located between the display area and the opening area, and the display panel comprises:

[0008] substrate;

[0009] an encapsulation layer, comprising a first encapsulation segment and a second encapsulation segment connected to each other, wherein the first encapsulation segment is located in the display area, and the second encapsulation segment is located in the encapsulation area, and in a direction perpendicular to the plane where the substrate is located, a distance from a side of the second encapsulation segment away from the substrate to the substrate is smaller than a distance from a side of the first encapsulation segment away from the substrate to the substrate;

[0010] a black matrix layer, at least a portion of the black matrix layer is located in the display area, the portion of the black matrix layer located in the display area is arranged on a side of the first packaging section away from the substrate, and the portion of the black matrix layer located in the display area is provided with a plurality of openings;

[0011] a color filter layer, at least a portion of the color filter layer is located in the display area, and at least a portion of the color filter layer located in the display area is disposed in the opening; and

[0012] A filling portion, located in the packaging area, and arranged on a side of the second packaging section away from the substrate;

[0013] Wherein, the filling portion includes at least one of the black matrix layer and the color filter layer;

[0014] In a direction perpendicular to a plane where the substrate is located, a distance from a side of the filling portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging section away from the substrate to the substrate.

[0015] In one embodiment of the present application, the black matrix layer includes:

[0016] A first black sub-portion, located in the display area and disposed on a side of the first packaging section away from the substrate, the first black sub-portion being provided with a plurality of the openings; and

[0017] A second black sub-portion is located in the packaging area and is disposed on a side of the second packaging section away from the substrate, and the second black sub-portion is made of the same material as the first black sub-portion;

[0018] Wherein, the filling portion includes the second black sub-portion;

[0019] In a direction perpendicular to the plane where the substrate is located, a distance from a side of the second black sub-portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging segment away from the substrate to the substrate.

[0020] In an embodiment of the present application, the first black sub-portion is connected to the second black sub-portion, and the thickness of the second black sub-portion is greater than the thickness of the first black sub-portion.

[0021] In one embodiment of the present application, the color filter layer includes:

[0022] A first sub-portion, located in the display area and disposed in the opening, wherein the first sub-portion is one of a red filter block, a blue filter block and a green filter block; and

[0023] A second sub-portion, located in the packaging area, is disposed on a side of the second black sub-portion away from the substrate, and the material of the second sub-portion includes the material of at least one of the red filter block, the blue filter block, and the green filter block;

[0024] Wherein, the filling portion further includes a second sub-portion;

[0025] In a direction perpendicular to the plane where the substrate is located, a distance from a side of the second sub-portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging section away from the substrate to the substrate.

[0026] In one embodiment of the present application, the second sub-unit includes:

[0027] A first sub-layer is provided on a side of the second black sub-portion away from the substrate, and a material of one of the red filter block, the blue filter block, and the green filter block is the same as a material of the first sub-layer; and

[0028] A second sub-layer is provided on a side of the first sub-layer away from the substrate, and the material of the other one of the red filter block, the blue filter block, and the green filter block is the same as the material of the second sub-layer;

[0029] wherein the material of the first sub-layer is different from the material of the second sub-layer;

[0030] In a direction perpendicular to the plane where the substrate is located, a distance from a side of the second sublayer away from the substrate to the substrate is less than or equal to a distance from a side of the first encapsulation segment away from the substrate to the substrate.

[0031] In one embodiment of the present application, the second sub-portion further includes a third sub-layer, which is disposed on a side of the second sub-layer away from the substrate, and a material of the third sub-layer is the same as a material of another one of the red filter block, the blue filter block, and the green filter block;

[0032] Wherein, the material of the first sub-layer, the material of the second sub-layer and the material of the third sub-layer are all different;

[0033] In a direction perpendicular to the plane where the substrate is located, a distance from a side of the third sublayer away from the substrate to the substrate is less than or equal to a distance from a side of the first encapsulation segment away from the substrate to the substrate.

[0034] In an embodiment of the present application, the thickness of the second sub-portion is greater than the thickness of the second black sub-portion.

[0035] In an embodiment of the present application, the display panel further includes a planarization layer, and the planarization layer includes:

[0036] A first flat portion, located in the display area, and disposed on the first black sub-portion and a side of the first sub-portion away from the substrate; and

[0037] A second flat portion, located in the packaging area, is provided on a side of the second sub-portion away from the substrate, and the material of the second flat portion is the same as that of the first flat portion;

[0038] Wherein, in a direction perpendicular to the plane where the substrate is located, a distance from a side of the second flat portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging section away from the substrate to the substrate.

[0039] In an embodiment of the present application, the second flat portion is connected to the first flat portion, and a thickness of the second flat portion is greater than a thickness of the first flat portion.

[0040] In one embodiment of the present application, the color filter layer includes:

[0041] A first sub-portion, located in the display area and disposed in the opening, wherein the first sub-portion is one of a red filter block, a blue filter block and a green filter block; and

[0042] A second sub-section, located in the packaging area, and disposed on a side of the second packaging section away from the substrate;

[0043] Wherein, the second sub-section comprises:

[0044] A first sub-layer is provided on a side of the second packaging section away from the substrate, and a material of one of the red filter block, the blue filter block, and the green filter block is the same as a material of the first sub-layer; and

[0045] A second sub-layer is provided on a side of the first sub-layer away from the substrate, and the material of the other one of the red filter block, the blue filter block, and the green filter block is the same as the material of the second sub-layer;

[0046] Wherein, the material of the first sub-layer is different from the material of the second sub-layer, and the filling portion further includes a second sub-portion;

[0047] In a direction perpendicular to the plane where the substrate is located, a distance from a side of the second sublayer away from the substrate to the substrate is less than or equal to a distance from a side of the first encapsulation segment away from the substrate to the substrate.

[0048] In one embodiment of the present application, the display panel further includes:

[0049] a thin film transistor device layer, disposed on one side of the substrate, at least a portion of the thin film transistor device layer being located in the display area; and

[0050] A plurality of light emitting devices are arranged on a side of the thin film transistor device layer away from the substrate and located in the display area;

[0051] The encapsulation layer comprises:

[0052] A first inorganic encapsulation layer is provided on one side of the substrate, wherein a portion of the first inorganic encapsulation layer located in the display area covers the light-emitting device and the thin film transistor device layer, and a portion of the first inorganic encapsulation layer located in the encapsulation area covers the substrate;

[0053] an organic encapsulation layer, located in the display area and disposed on a side of the first inorganic encapsulation layer away from the substrate; and

[0054] a second inorganic encapsulation layer, wherein a portion of the second inorganic encapsulation layer located in the display area covers the organic encapsulation layer, a portion of the second inorganic encapsulation layer located in the encapsulation area covers a portion of the first inorganic encapsulation layer located in the encapsulation area, and the second inorganic encapsulation layer separates the filling portion and the organic encapsulation layer;

[0055] The portion of the first inorganic encapsulation layer located in the display area, the organic encapsulation layer, and the portion of the second inorganic encapsulation layer located in the display area form the first encapsulation segment;

[0056] The portion of the first inorganic encapsulation layer located in the encapsulation area and the portion of the second inorganic encapsulation layer located in the encapsulation area form the second encapsulation section;

[0057] In a direction perpendicular to the plane of the substrate, the distance from the side of the second inorganic encapsulation layer located in the encapsulation area away from the substrate is less than the distance from the side of the second inorganic encapsulation layer located in the display area away from the substrate; the distance from the side of the filling portion away from the substrate is less than or equal to the distance from the side of the second inorganic encapsulation layer located in the display area away from the substrate.

[0058] In the second aspect, the present application proposes a display device, including a display panel, wherein the display panel includes a non-display area and a display area located outside the non-display area, the non-display area includes a packaging area and an opening area, the packaging area is located between the display area and the opening area, the display panel also includes a substrate, a thin film transistor device layer, a plurality of light-emitting devices, a packaging layer, a black matrix layer, a color filter layer and a filling portion, the thin film transistor device layer is arranged on one side of the substrate, and at least part of the thin film transistor device layer is located in the display area; a plurality of light-emitting devices are arranged on a side of the thin film transistor device layer away from the substrate and located in the display area; the packaging layer includes a first packaging segment and a second packaging segment connected to each other, the first packaging segment is located in the display area, the first packaging segment covers the light-emitting device and the thin film transistor device layer, the second packaging segment is located in the packaging area, the second packaging segment covers the substrate, and in a direction perpendicular to the plane where the substrate is located, the second packaging segment is away from the The distance from one side of the substrate to the substrate is smaller than the distance from the side of the first packaging section away from the substrate to the substrate; at least part of the black matrix layer is located in the display area, and the part of the black matrix layer located in the display area is arranged on the side of the first packaging section away from the substrate, and the part of the black matrix layer located in the display area is provided with a plurality of openings; at least part of the color filter layer is located in the display area, and at least part of the color filter layer located in the display area is arranged in the opening; at least part of the filling part is located in the packaging area, and the filling part located in the packaging area is arranged on the side of the second packaging section away from the substrate; the filling part includes a part of at least one of the black matrix layer and the color filter layer located in the packaging area; in a direction perpendicular to the plane where the substrate is located, the distance from the side of the filling part away from the substrate to the substrate is smaller than or equal to the distance from the side of the first packaging section away from the substrate to the substrate.

[0059] In the present application, the display panel includes a substrate, a thin film transistor device layer, a plurality of light emitting devices, a packaging layer, a black matrix layer, a color filter layer and a filling portion. Among them, the thin film transistor device layer and the plurality of light emitting devices are only arranged in the display area, so that the terrain of the display area is too high, and the terrain of the packaging area and the opening area is too low. In order to reduce the step difference caused by the high and low terrain, in the subsequent process of forming the black matrix layer and the color filter layer of the display panel, the material of at least one of the black matrix layer and the color filter layer is filled into the packaging area and the opening area, and the material filled into the packaging area and the opening area forms a filling portion. The formation of the filling portion can raise the terrain of the packaging area and the opening area, so that the step difference caused by the high and low terrain between the packaging area, the opening area and the display area is reduced, thereby reducing the generation of bubbles or stress concentration in the film layer attached above the opening area. After the film layer is attached, the filling portion in the opening area will be hollowed out to install the front camera. The present application utilizes the existing process to reduce the step difference between the display area and the opening area, and there is no need to add an additional process for filling the opening area, thereby reducing the production cost of the display panel and improving production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 is a schematic diagram of a first embodiment of a display panel of the present application;

[0061] Figure 2 is a schematic diagram of a manufacturing process of a black matrix layer of a first embodiment of a display panel of the present application;

[0062] Figure 3 is another schematic diagram of the first embodiment of the display panel of the present application;

[0063] Figure 4 is a schematic diagram of another manufacturing process of the black matrix layer of the first embodiment of the display panel of the present application;

[0064] Figure 5 is a schematic diagram of a second embodiment of a display panel of the present application;

[0065] Figure 6 is a schematic diagram of a manufacturing process of a color filter layer of a second embodiment of a display panel of the present application;

[0066] Figure 7 is a schematic diagram of a third embodiment of a display panel of the present application;

[0067] Figure 8 is a schematic diagram of a manufacturing process of a color filter layer of a third embodiment of a display panel of the present application;

[0068] Fig. 9 is a schematic diagram of a fourth embodiment of a display panel of the present application;

[0069] Fig.10is a schematic diagram of a manufacturing process of a color filter layer of a fourth embodiment of a display panel of the present application;

[0070] Fig.11 is a schematic diagram of a fifth embodiment of the display panel of the present application;

[0071] Fig.12 is a schematic diagram of a manufacturing process of a black matrix layer and a color filter layer of a fifth embodiment of a display panel of the present application;

[0072] Fig.13 is a schematic diagram of a sixth embodiment of a display panel of the present application;

[0073] Fig.14 is a schematic diagram of a manufacturing process of a black matrix layer and a color filter layer of a sixth embodiment of a display panel of the present application;

[0074] Fig.15 is a schematic diagram of a seventh embodiment of the display panel of the present application;

[0075] Fig.16 is a schematic diagram of a manufacturing process of a black matrix layer and a color filter layer of a seventh embodiment of a display panel of the present application;

[0076] Fig.17 is a schematic diagram of an eighth embodiment of the display panel of the present application;

[0077] Fig.18 It is a schematic diagram of a manufacturing process of a black matrix layer, a color filter layer and a planarization layer of the eighth embodiment of the display panel of the present application. DETAILED DESCRIPTION

[0078] The meanings of the terms used in this specification and claims correspond to the meanings commonly understood by those of ordinary skill in the art to which this application belongs. The terms used in this specification and claims are only for the purpose of facilitating the description and understanding of this application, and are not intended to limit this application to the narrow interpretation of the specific terms used in the specification and claims.

[0079] The present application proposes a display device, which may be a mobile phone, a tablet computer, an e-reader, an electronic display screen, a laptop computer, a mobile phone, an augmented reality (AR) or virtual reality (VR) device, a media player, a wearable device, a digital camera, a car navigation system, etc. The display device includes a display panel 100 .

[0080] The present application proposes a display panel 100, which may be an organic light emitting diode (OLED) display panel 100. The subsequent embodiments of the present application are described by taking the organic light emitting diode display panel 100 as an example.

[0081] See also Figure 1 In the present application, the display panel 100 includes a non-display area NA and a display area AA located outside the non-display area NA. The non-display area NA includes an encapsulation area NA1 and an opening area NA2. The encapsulation area NA1 is located between the display area AA and the opening area NA2.

[0082] In the present application, the display panel 100 further includes a substrate 10 , a thin film transistor device layer 20 , a plurality of light emitting devices 40 , an encapsulation layer 50 , a black matrix layer 60 , a color filter layer 70 and a filling portion 80 .

[0083] Optionally, the thin film transistor device layer 20 is disposed on one side of the substrate 10 , and at least a portion of the thin film transistor device layer 20 is located in the display area AA.

[0084] Optionally, a plurality of light emitting devices 40 are disposed on a side of the thin film transistor device layer 20 away from the substrate 10 and located in the display area AA.

[0085] Optionally, the encapsulation layer 50 includes a first encapsulation segment 50a and a second encapsulation segment 50b connected to each other. The first encapsulation segment 50a is located in the display area AA and covers the light emitting device 40 and the thin film transistor device layer 20. The second encapsulation segment 50b is located in the encapsulation area NA1 and covers the substrate 10.

[0086] Optionally, in a direction perpendicular to the plane where the substrate 10 is located, a distance L0 from the side of the second packaging segment 50 b away from the substrate 10 to the substrate 10 is smaller than a distance L1 from the side of the first packaging segment 50 a away from the substrate 10 to the substrate 10 .

[0087] Optionally, at least part of the black matrix layer 60 is located in the display area AA. The portion of the black matrix layer 60 located in the display area AA is disposed on a side of the first encapsulation section 50a away from the substrate 10. The portion of the black matrix layer 60 located in the display area AA is provided with a plurality of openings.

[0088] Optionally, at least a portion of the color filter layer 70 is located in the display area AA. At least a portion of the color filter layer 70 located in the display area AA is disposed in the opening.

[0089] Optionally, at least part of the filling portion 80 is located in the encapsulation area NA1 . The filling portion 80 located in the encapsulation area NA1 is disposed on a side of the second encapsulation section 50 b away from the substrate 10 .

[0090] Optionally, the filling portion 80 includes a portion of at least one of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1 .

[0091] Optionally, in a direction H perpendicular to the plane of the substrate 10 , a distance L2 from the side of the filling portion 80 away from the substrate 10 to the substrate 10 is less than or equal to a distance L1 from the side of the first packaging section 50 a away from the substrate 10 to the substrate 10 .

[0092] In the present application, the display panel 100 includes a substrate 10, a thin film transistor device layer 20, a plurality of light emitting devices 40, an encapsulation layer 50, a black matrix layer 60, a color filter layer 70, and a filling portion 80. The thin film transistor device layer 20 and the plurality of light emitting devices 40 are only arranged in the display area AA, so that the terrain of the display area AA is too high, and the terrain of the encapsulation area NA1 and the opening area NA2 is too low. In order to reduce the step difference caused by the high and low terrain, in the subsequent process of forming the black matrix layer 60 and the color filter layer 70 of the display panel 100, the material of at least one of the black matrix layer 60 and the color filter layer 70 is filled into the encapsulation area NA1 and the opening area NA2, and the material filled into the encapsulation area NA1 and the opening area NA2 forms a filling part 80. The formation of the filling part 80 can raise the terrain of the encapsulation area NA1 and the opening area NA2, so that the step difference caused by the high and low terrain between the encapsulation area NA1, the opening area NA2 and the display area AA is reduced, thereby reducing the situation of bubbles or stress concentration in the film layer attached to the top of the opening area NA2. After the film layer is attached, the filling part 80 in the opening area NA2 will be hollowed out to install the front camera. The present application uses the existing process to reduce the step difference between the display area AA and the opening area NA2, and there is no need to add an additional process for filling the opening area NA2, thereby reducing the production cost of the display panel 100 and improving the production capacity.

[0093] Optionally, the substrate 10 includes a substrate and a buffer layer disposed on one side of the substrate. The thin film transistor is disposed on a side of the buffer layer away from the substrate.

[0094] Optionally, the substrate is a hard substrate, and the material of the substrate is glass.

[0095] Optionally, the substrate is a flexible substrate, and the material of the substrate is polyimide. In this case, the flexible substrate can be used to manufacture the flexible display panel 100 .

[0096] Optionally, the display panel 100 further includes a pixel defining layer 30, which is disposed on a side of the thin film transistor device layer 20 away from the substrate 10, and the pixel defining layer 30 is provided with a plurality of pixel openings, each of which is provided with a light emitting device 40. The encapsulation layer 50 covers the side of the pixel defining layer 30 away from the substrate 10.

[0097] Optionally, the non-display area NA further includes a transition area NA3, the transition area NA3 is located between the encapsulation area NA1 and the opening area NA2, a portion of the thin film transistor device layer 20 is also disposed in the transition area NA3, and a portion of the organic encapsulation layer 52 covers the transition area NA3.

[0098] Optionally, the light emitting device 40 includes a red light emitting device 40 a , a green light emitting device 40 b and a blue light emitting device 40 c . One light emitting device 40 is disposed corresponding to one opening of the black matrix layer 60 .

[0099] Optionally, the color filter layer 70 includes a red filter block 71a, a green filter block 71b, and a blue filter block 71c, wherein the red filter block 71a is arranged in an opening corresponding to the red light emitting device 40a, the green filter block 71b is arranged in an opening corresponding to the green light emitting device 40b, and the blue filter block 71c is arranged in an opening corresponding to the blue light emitting device 40c.

[0100] Optionally, the display panel 100 further includes a first barrier wall Dam1.

[0101] Optionally, the first barrier wall Dam1 is disposed on the substrate 10 and located between the transition area NA3 and the encapsulation area NA1. The first barrier wall Dam1 is used to separate the transition area NA3 and the encapsulation area NA1 and prevent the organic encapsulation layer 52 from overflowing from the transition area NA3 to the encapsulation area NA1.

[0102] Optionally, during the manufacturing process of the display panel 100, a second retaining wall Dam2 is further provided. The second retaining wall Dam2 is provided on the substrate 10, and the second retaining wall Dam2 is provided on a side of the first retaining wall Dam1 away from the display area AA. The second retaining wall Dam2 is used to prevent the organic encapsulation layer 52 from further overflowing during the manufacturing process. A groove is formed between the first retaining wall Dam1 and the second retaining wall Dam2, and the groove can be used to store the organic ink overflowing from the organic encapsulation layer 52 during the manufacturing process.

[0103] Optionally, the second retaining wall Dam2 may be located in the encapsulation area NA1. The second retaining wall Dam2 may also be located between the encapsulation area NA1 and the opening area NA2. The second retaining wall Dam2 may also be located in the opening area NA2. To avoid redundancy, in the subsequent embodiments related to the process of the display panel 100, the second retaining wall Dam2 is set in the opening area NA2 as an example for explanation.

[0104] It should be noted that after the display panel 100 is film-attached, the film in the opening area NA2 will be removed by laser cutting to install the front camera. The film in the opening area NA2 includes a substrate 10 located in the opening area NA2, a second retaining wall Dam2 located in the opening area NA2, and a filling portion 80 located in the opening area NA2.

[0105] Optionally, the encapsulation layer 50 includes a first inorganic encapsulation layer 51 , an organic encapsulation layer 52 and a second inorganic encapsulation layer 53 .

[0106] Optionally, the first inorganic encapsulation layer 51 is disposed on one side of the substrate 10. The first inorganic encapsulation layer 51 in the display area AA covers the light emitting device 40 and the thin film transistor device layer 20. The first inorganic encapsulation layer 51 in the encapsulation area NA1 covers the substrate 10.

[0107] Optionally, the organic encapsulation layer 52 is located in the display area AA and is disposed on a side of the first inorganic encapsulation layer 51 away from the substrate 10 .

[0108] Optionally, the second inorganic encapsulation layer 53 in the display area AA covers the organic encapsulation layer 52 . The second inorganic encapsulation layer 53 in the encapsulation area NA1 covers the first inorganic encapsulation layer 51 in the encapsulation area NA1 . The second inorganic encapsulation layer 53 separates the filling part 80 and the organic encapsulation layer 52 .

[0109] Optionally, the portion of the first inorganic encapsulation layer 51 located in the display area AA, the portion of the organic encapsulation layer 52 and the portion of the second inorganic encapsulation layer 53 located in the display area AA form a first encapsulation segment 50 a .

[0110] Optionally, a portion of the first inorganic encapsulation layer 51 located in the encapsulation area NA1 and a portion of the second inorganic encapsulation layer 53 located in the encapsulation area NA1 are formed as a second encapsulation segment 50 b .

[0111] Optionally, in a direction H perpendicular to the plane of the substrate 10, a distance L0 from a side of the second inorganic encapsulation layer 53 located in the encapsulation area NA1 away from the substrate 10 to the substrate 10 is smaller than a distance L1 from a side of the second inorganic encapsulation layer 53 located in the display area AA away from the substrate 10 to the substrate 10.

[0112] Optionally, in a direction H perpendicular to the plane of the substrate 10 , a distance L2 from the filling portion 80 away from the substrate 10 to the substrate 10 is less than or equal to a distance L1 from the second inorganic encapsulation layer 53 located in the display area AA away from the substrate 10 to the substrate 10 .

[0113] From the film structure of the display panel 100 , it can be seen that the height difference between the display area AA and the through hole area is mainly contributed by the organic encapsulation layer 52 , the light emitting device 40 , the pixel definition layer 30 and the thin film transistor device layer 20 .

[0114] See also Figure 1 , in the first embodiment of the present application:

[0115] Optionally, the filling portion 80 includes only a portion of the black matrix layer 60 located in the encapsulation area NA1 .

[0116] Optionally, the black matrix layer 60 includes a first black sub-portion 61 and a second black sub-portion 62. The first black sub-portion 61 is located in the display area AA and is disposed on a side of the first encapsulation section 50a away from the substrate 10. The first black sub-portion 61 is provided with a plurality of openings. The second black sub-portion 62 is located in the encapsulation area NA1 and is disposed on a side of the second encapsulation section 50b away from the substrate 10. The second black sub-portion 62 is made of the same material as the first black sub-portion 61. The filling portion 80 includes the second black sub-portion 62.

[0117] In the direction H perpendicular to the plane of the substrate 10 , the distance L2 from the second black sub-portion 62 away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the first packaging segment 50 a away from the substrate 10 to the substrate 10 .

[0118] See also Figure 2 In the process of manufacturing the black matrix layer 60 of the first embodiment, when the first black sub-portion 61 is formed in the display area AA, the second black sub-portion 62 is also formed in the packaging area NA1 and the opening area NA2. The second black sub-portion 62 provided in the packaging area NA1 and the opening area NA2 can reduce the step difference caused by the high and low terrain of the packaging area NA1, the opening area NA2 and the display area AA, thereby reducing the occurrence of bubbles or stress concentration in the film layer attached to the opening area NA2. After the film layer is attached, the filling portion 80 and other film layers in the opening area NA2 are hollowed out to install the front camera, forming a Figure 1 The structure of the display panel 100 shown in the figure. The first embodiment utilizes the existing process of the black matrix layer 60, and when the first black sub-portion 61 is formed in the display area AA, the second black sub-portion 62 is also formed in the packaging area NA1 and the opening area NA2 at the same time, so as to reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain in the process of the display panel 100. Compared with the process of the traditional display panel 100, the present application does not need to add an additional process of filling the opening area NA2, thereby reducing the production cost of the display panel 100 and improving the production capacity.

[0119] In the first embodiment of the present application, the black matrix layer 60 has a light-absorbing property. In a conventional display panel, a front camera is installed corresponding to the opening area NA2. Due to the design of the hole in the opening area NA2, the external light irradiating the front camera will be reflected from the light-emitting side of the conventional display panel, so that the position corresponding to the opening area NA2 on the light-emitting side of the conventional display panel will show a reflection of the corresponding color. In this embodiment, by setting a second black sub-portion 62 in the encapsulation area NA1, when the external light irradiates the front camera, the second black sub-portion 62 will absorb a part of the external light; when the external light is reflected from the front camera back to the light-emitting side of the display panel 100, the second black sub-portion 62 will absorb a part of the reflected light, thereby weakening or even eliminating the reflection generated by the position corresponding to the opening area NA2 on the light-emitting side of the display panel, thereby improving the display effect.

[0120] Optionally, the material of the black matrix layer 60 is black photoresist. Black photoresist is an organic material with leveling properties.

[0121] See also Figure 3 Optionally, the first black sub-portion 61 is connected to the second black sub-portion 62. The thickness of the second black sub-portion 62 is greater than the thickness of the first black sub-portion 61.

[0122] See also Figure 4 In this embodiment, the first black sub-portion 61 and the second black sub-portion 62 are formed simultaneously in the same process, and the second black sub-portion 62 is connected to the first black sub-portion 61. The first black sub-portion 61 is located in the display area AA with a higher terrain, and the second black sub-portion 62 is located in the encapsulation area NA1 with a lower terrain. In the process of the black matrix layer 60, due to the influence of gravity and the leveling property of the organic material, part of the material of the first black sub-portion 61 will flow into the encapsulation area NA1 before curing, forming a part of the second black sub-portion 62. After the black matrix layer 60 is cured, the thickness of the second black sub-portion 62 will be greater than the thickness of the first black sub-portion 61. Since in this embodiment, the filling portion 80 only includes the portion of the black matrix layer 60 located in the encapsulation area NA1, that is, the filling portion 80 only includes the second black sub-portion 62. This embodiment increases the thickness of the second black sub-portion 62 by connecting the first black sub-portion 61 and the second black sub-portion 62, thereby increasing the thickness of the filling portion 80, so that the difference between the distance L2 from the side of the second black sub-portion 62 away from the substrate 10 to the substrate 10 and the distance L1 from the side of the first packaging segment 50a away from the substrate 10 to the substrate 10 is further reduced, thereby further reducing the step difference between the display area AA and the opening area NA2, thereby further reducing the generation of bubbles or stress concentration in the film layer attached above the opening area NA2, thereby improving the yield rate of the display panel 100, thereby reducing production costs and improving production capacity.

[0123] See also Figure 5, in the second embodiment of the present application:

[0124] In order to avoid redundancy, the second embodiment of the present application will describe parts different from the first embodiment of the present application.

[0125] The second embodiment of the present application is different from the first embodiment of the present application in that:

[0126] Optionally, the filling portion 80 only includes a portion of the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 is a single-layer structure.

[0127] In the present application, the color filter layer 70 includes a red filter block 71a, a green filter block 71b and a blue filter block 71c, and the red filter block 71a, the green filter block 71b and the blue filter block 71c are manufactured step by step in the manufacturing process of the color filter layer 70.

[0128] Optionally, the color filter layer 70 includes a first sub-portion 71 and a second sub-portion 72. The first sub-portion 71 is located in the display area AA and is disposed in the opening. The first sub-portion 71 is one of a red filter block 71a, a blue filter block 71c, and a green filter block 71b. The second sub-portion 72 is located in the encapsulation area NA1 and is disposed on the side of the second encapsulation section 50b away from the substrate 10. The second sub-portion 72 is a single-layer structure, and the material of the second sub-portion 72 is the same as the material of one of the red filter block 71a, the blue filter block 71c, and the green filter block 71b. The filling portion 80 only includes the second sub-portion 72. In the direction H perpendicular to the plane where the substrate 10 is located, the distance L0 from the side of the second sub-portion 72 away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the side of the first encapsulation section 50a away from the substrate 10 to the substrate 10.

[0129] Optionally, the material of the second sub-section 72 may be the same as the material of the red filter block 71a, the material of the second sub-section 72 may be the same as the material of the green filter block 71b, and the material of the second sub-section 72 may also be the same as the material of the blue filter block 71c. To avoid redundancy, the second embodiment is described by taking the example that the material of the second sub-section 72 is the same as the material of the blue filter block 71c.

[0130] See also Figure 6In the process of manufacturing the color filter layer 70 of the second embodiment, when the first sub-portion 71 is formed in the display area AA, a second sub-portion 72 of a single-layer structure is also formed in the packaging area NA1 and the opening area NA2. The second sub-portion 72 disposed in the packaging area NA1 and the opening area NA2 can reduce the step difference caused by the high and low terrain of the packaging area NA1, the opening area NA2 and the display area AA, thereby reducing the occurrence of bubbles or stress concentration in the film layer attached to the opening area NA2. After the film layer is attached, the filling portion 80 and other film layers of the single-layer structure in the opening area NA2 are hollowed out to install the front camera, forming a Figure 5 The structure of the display panel 100 shown in the figure. This embodiment utilizes the existing manufacturing process of the color filter layer 70, and when forming the first sub-portion 71 in the display area AA, a second sub-portion 72 with a single-layer structure is also formed in the encapsulation area NA1 and the opening area NA2, so as to reduce the manufacturing process of the display panel 100.

[0131] Compared with the conventional manufacturing process of the display panel 100, the present application does not need to add an additional process of filling the opening area NA2, thereby reducing the production cost of the display panel 100 and improving the production capacity.

[0132] In the second embodiment of the present application, the color filter layer 70 has a filtering property. In the traditional display panel 100, a front camera will be installed corresponding to the opening area NA2. Due to the design of the hole in the opening area NA2, the external light irradiating the front camera will be reflected from the light-emitting side of the traditional display panel, so that the position corresponding to the opening area NA2 on the light-emitting side of the traditional display panel will show a reflection of the corresponding color. In this embodiment, by setting the second sub-section 72 in the packaging area NA1, when the external light irradiates the front camera, the second sub-section 72 will filter out a part of the external light; when the external light is reflected from the front camera back to the light-emitting side of the display panel 100, the second sub-section 72 will filter out a part of the reflected light, thereby weakening or even eliminating the reflection generated by the position corresponding to the opening area NA2 on the light-emitting side of the display panel, thereby improving the display effect.

[0133] See also Figure 7 , in the third embodiment of the present application:

[0134] In order to avoid redundancy, the third embodiment of the present application will describe the parts different from the second embodiment of the present application.

[0135] The third embodiment of the present application is different from the second embodiment of the present application in that:

[0136] Optionally, the filling portion 80 only includes a portion of the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 is a double-layer structure.

[0137] Optionally, the second sub-section 72 includes a first sub-layer 72a and a second sub-layer 72b. The first sub-layer 72a is disposed on a side of the second encapsulation section 50b away from the substrate 10. The material of one of the red filter block 71a, the blue filter block 71c, and the green filter block 71b is the same as the material of the first sub-layer 72a. The second sub-layer 72b is disposed on a side of the first sub-layer 72a away from the substrate 10. The material of the other of the red filter block 71a, the blue filter block 71c, and the green filter block 71b is the same as the material of the second sub-layer 72b. The material of the first sub-layer 72a is different from the material of the second sub-layer 72b. In the direction H perpendicular to the plane where the substrate 10 is located, the distance L4 from the side of the second sub-layer 72b away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the side of the first encapsulation section 50a away from the substrate 10 to the substrate 10.

[0138] It should be understood that the filling portion 80 of the second embodiment and the third embodiment only includes the portion of the color filter layer 70 located in the packaging area NA1, but the filling portion 80 of the second embodiment is a single-layer structure, and the filling portion 80 of the third embodiment is a double-layer structure. The thickness of the filling portion 80 with the double-layer structure is thicker than that of the filling portion 80 with the single-layer structure, which can further reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain, thereby further reducing the generation of bubbles or stress concentration in the film layer attached to the top of the opening area NA2.

[0139] Optionally, the material of the first sub-layer 72a is the same as that of the red filter block 71a, and the material of the second sub-layer 72b is the same as that of the green filter block 71b.

[0140] Optionally, the material of the first sub-layer 72a is the same as that of the red filter block 71a, and the material of the second sub-layer 72b is the same as that of the blue filter block 71c.

[0141] Optionally, the material of the first sub-layer 72 a is the same as that of the green filter block 71 b , and the material of the second sub-layer 72 b is the same as that of the red filter block 71 a .

[0142] Optionally, the material of the first sub-layer 72a is the same as that of the green filter block 71b, and the material of the second sub-layer 72b is the same as that of the blue filter block 71c.

[0143] Optionally, the material of the first sub-layer 72a is the same as that of the blue filter block 71c, and the material of the second sub-layer 72b is the same as that of the red filter block 71a.

[0144] Optionally, the material of the first sub-layer 72a is the same as that of the blue filter block 71c, and the material of the second sub-layer 72b is the same as that of the green filter block 71b.

[0145] To avoid redundancy, the third embodiment is described by taking the example that the material of the first sub-layer 72 a is the same as the material of the blue filter block 71 c , and the material of the second sub-layer 72 b is the same as the material of the green filter block 71 b .

[0146] See also Figure 8 In the process of manufacturing the color filter layer 70 of the third embodiment, when the first sub-portion 71 is formed in the display area AA, a second sub-portion 72 with a double-layer structure is also formed in the packaging area NA1 and the opening area NA2 at the same time. The second sub-portion 72 includes a first sub-layer 72a and a second sub-layer 72b. The first sub-layer 72a is located between the second packaging section 50b and the second sub-layer 72b. The second sub-portion 72 disposed in the packaging area NA1 and the opening area NA2 can reduce the step difference between the packaging area NA1, the opening area NA2 and the display area AA caused by the high and low terrain. Compared with the filling portion 80 of the single-layer structure of the second embodiment, the thickness of the filling portion 80 of the double-layer structure of the third embodiment is thicker. The display panel 100 of the third embodiment can further reduce the generation of bubbles or stress concentration in the film layer attached to the top of the opening area NA2. After the film layer is attached, the double-layer structure filling portion 80 and other film layers in the opening area NA2 will be hollowed out to install the front camera, forming a structure such as Figure 7 The structure of the display panel 100 shown in the figure. The third embodiment utilizes the existing process of the color filter layer 70. When the first sub-portion 71 is formed in the display area AA, the second sub-portion 72 of the double-layer structure is also formed in the encapsulation area NA1 and the opening area NA2 at the same time, so as to reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain in the process of the display panel 100. Compared with the process of the traditional display panel 100, the present application does not need to add an additional process of filling the opening area NA2, thereby reducing the production cost of the display panel 100 and improving the production capacity.

[0147] In the third embodiment of the present application, the double-layer color filter layer 70 has a better filtering effect. Since the material of the first sub-layer 72a is the same as that of the blue filter block 71c, after the natural light from the outside passes through the first sub-layer 72a, only blue light is left after being filtered out. The material of the second sub-layer 72b is the same as that of the green light block, and the blue light will be completely filtered out after entering the second sub-layer 72b. Compared with the single-layer color filter layer 70 of the second embodiment, it has a better filtering effect, thereby further reducing or even eliminating the reflection generated at the position corresponding to the opening area NA2 on the light-emitting side of the display panel, thereby improving the display effect.

[0148] See also Fig. 9 , in the fourth embodiment of the present application:

[0149] In order to avoid redundancy, the fourth embodiment of the present application will describe the parts different from the third embodiment of the present application.

[0150] The fourth embodiment of the present application is different from the third embodiment of the present application in that:

[0151] Optionally, the filling portion 80 only includes a portion of the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 is a three-layer structure.

[0152] Optionally, the second sub-section 72 further includes a third sub-layer 72c, which is disposed on a side of the second sub-layer 72b away from the substrate 10. The material of the third sub-layer 72c is the same as the material of another one of the red filter block 71a, the blue filter block 71c, and the green filter block 71b. The material of the first sub-layer 72a, the material of the second sub-layer 72b, and the material of the third sub-layer 72c are all different. In the direction H perpendicular to the plane where the substrate 10 is located, the distance L5 from the side of the third sub-layer 72c away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the side of the first encapsulation section 50a away from the substrate 10 to the substrate 10.

[0153] It should be understood that the filling portion 80 of the fourth embodiment and the third embodiment only includes the portion of the color filter layer 70 located in the packaging area NA1, but the filling portion 80 of the third embodiment is a double-layer structure, and the filling portion 80 of the fourth embodiment is a three-layer structure. The thickness of the filling portion 80 with the three-layer structure is thicker than that of the filling portion 80 with the double-layer structure, which can further reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain, thereby further reducing the generation of bubbles or stress concentration in the film layer attached to the top of the opening area NA2.

[0154] Optionally, the material of the first sublayer 72a is the same as that of the red filter block 71a, the material of the second sublayer 72b is the same as that of the green filter block 71b, and the material of the third sublayer 72c is the same as that of the blue filter block 71c.

[0155] Optionally, the material of the first sublayer 72a is the same as that of the red filter block 71a, the material of the second sublayer 72b is the same as that of the blue filter block 71c, and the material of the third sublayer 72c is the same as that of the green filter block 71b.

[0156] Optionally, the material of the first sublayer 72a is the same as that of the green filter block 71b, the material of the second sublayer 72b is the same as that of the red filter block 71a, and the material of the third sublayer 72c is the same as that of the blue filter block 71c.

[0157] Optionally, the material of the first sublayer 72a is the same as that of the green filter block 71b, the material of the second sublayer 72b is the same as that of the blue filter block 71c, and the material of the third sublayer 72c is the same as that of the red filter block 71a.

[0158] Optionally, the material of the first sublayer 72a is the same as that of the blue filter block 71c, the material of the second sublayer 72b is the same as that of the red filter block 71a, and the material of the third sublayer 72c is the same as that of the green filter block 71b.

[0159] Optionally, the material of the first sublayer 72a is the same as that of the blue filter block 71c, the material of the second sublayer 72b is the same as that of the green filter block 71b, and the material of the third sublayer 72c is the same as that of the red filter block 71a.

[0160] To avoid redundancy, the fourth embodiment is described by taking the example that the material of the first sublayer 72a is the same as the material of the blue filter block 71c, the material of the second sublayer 72b is the same as the material of the green filter block 71b, and the material of the third sublayer 72c is the same as the material of the red filter block 71a.

[0161] See also Fig.10 In the fourth embodiment, in the process of manufacturing the color filter layer 70, when the first sub-portion 71 is formed in the display area AA, a second sub-portion 72 with a three-layer structure is also formed in the encapsulation area NA1 and the opening area NA2. The second sub-portion 72 includes a first sub-layer 72a, a second sub-layer 72b and a third sub-layer 72c. The first sub-layer 72a is located between the second encapsulation section 50b and the second sub-layer 72b, and the second sub-layer 72b is located between the first sub-layer 72a and the third sub-layer 72c. The second sub-portion 72 disposed in the encapsulation area NA1 and the opening area NA2 can reduce the step difference between the encapsulation area NA1, the opening area NA2 and the display area AA due to the high and low terrain. Compared with the filling portion 80 of the double-layer structure of the third embodiment, the filling portion 80 of the three-layer structure of the fourth embodiment is thicker. The display panel 100 of the fourth embodiment can further reduce the occurrence of bubbles or stress concentration in the film layer attached to the opening area NA2. After the film layer is attached, the filling portion 80 and other film layers of the three-layer structure in the opening area NA2 are hollowed out to install the front camera, forming a Fig. 9 The structure of the display panel 100 shown in FIG. 4 is a structure of the display panel 100 shown in FIG. 4. The fourth embodiment utilizes the existing process of the color filter layer 70. When the first sub-portion 71 is formed in the display area AA, the second sub-portion 72 of the three-layer structure is also formed in the encapsulation area NA1 and the opening area NA2 at the same time to reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain in the process of the display panel 100. Compared with the process of the traditional display panel 100, the present application does not need to add an additional process of filling the opening area NA2, thereby reducing the production cost of the display panel 100 and improving the production capacity.

[0162] In the fourth embodiment of the present application, the three-layer color filter layer 70 has a better filtering effect. The material of the first sublayer 72a is the same as that of the blue filter block 71c. After the natural light from the outside passes through the first sublayer 72a, only blue light is left after filtering. The material of the second sublayer 72b is the same as that of the green light block. The blue light will be completely filtered out after entering the second sublayer 72b. The third sublayer 72c can ensure that part of the natural light that is not filtered out by the first sublayer 72a and the second sublayer 72b is completely filtered out. Compared with the double-layer color filter layer 70 of the third embodiment, it has a better filtering effect, thereby further reducing or even eliminating the reflection generated at the position corresponding to the opening area NA2 on the light-emitting side of the display panel, thereby improving the display effect.

[0163] See also Fig.11 , in the fifth embodiment of the present application:

[0164] In order to avoid redundancy, the fifth embodiment of the present application will describe the parts different from the second embodiment of the present application.

[0165] The fifth embodiment of the present application is different from the second embodiment of the present application in that:

[0166] Optionally, the filling portion 80 includes portions of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 is a double-layer structure.

[0167] Optionally, the black matrix layer 60 includes a first black sub-portion 61 and a second black sub-portion 62. The first black sub-portion 61 is located in the display area AA and is provided on the side of the first encapsulation section 50a away from the substrate 10. The first black sub-portion 61 is provided with a plurality of openings. The second black sub-portion 62 is located in the encapsulation area NA1 and is located between the second encapsulation section 50b and the second sub-portion 72. The second black sub-portion 62 is made of the same material as the first black sub-portion 61. The filling portion 80 of the double-layer structure is formed by a single-layer second black sub-portion 62 and a single-layer second sub-portion 72. In the direction H perpendicular to the plane where the substrate 10 is located, the distance L6 from the side of the second sub-portion 72 away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the side of the first encapsulation section 50a away from the substrate 10 to the substrate 10.

[0168] It should be understood that the filling portion 80 of the fifth embodiment includes the portion of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the fifth embodiment is a double-layer structure. The filling portion 80 of the second embodiment only includes the portion of the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the second embodiment is a single-layer structure. The thickness of the filling portion 80 of the double-layer structure is thicker than that of the filling portion 80 of the single-layer structure, which can further reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain, thereby further reducing the generation of bubbles or stress concentration in the film layer attached to the opening area NA2.

[0169] See also Fig.12 In the fifth embodiment, in the process of manufacturing the black matrix layer 60, when the first black sub-portion 61 is formed in the display area AA, the second black sub-portion 62 is also formed in the packaging area NA1 and the opening area NA2 at the same time. In the fifth embodiment, in the process of manufacturing the color filter layer 70, when the first sub-portion 71 is formed in the display area AA, the second sub-portion 72 of the single-layer structure is also formed in the packaging area NA1 and the opening area NA2 at the same time. The second black sub-portion 62 and the second sub-portion 72 of the single-layer structure can form a filling portion 80 of a double-layer structure. Compared with the filling portion 80 of the single-layer structure of the second embodiment, the thickness of the filling portion 80 of the double-layer structure of the fifth embodiment is thicker. The display panel 100 of the fifth embodiment can further reduce the generation of bubbles or stress concentration in the film layer attached above the opening area NA2. After the film layer is attached, the double-layer structure filling portion 80 and other film layers in the opening area NA2 will be hollowed out to install the front camera, forming a double-layer structure. Fig.11 The structure of the display panel 100 shown in the figure. The fifth embodiment utilizes the existing process of the black matrix layer 60 and the color filter layer 70. When the first black sub-section 61 and the first sub-section 71 are formed in the display area AA, a second black sub-section 62 and a second sub-section 72 of a double-layer structure are formed in the encapsulation area NA1 and the opening area NA2, so as to reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain in the process of the display panel 100. Compared with the process of the traditional display panel 100, the present application does not need to add an additional process of filling the opening area NA2, thereby reducing the production cost of the display panel 100 and improving the production capacity.

[0170] Optionally, the thickness of the second sub-portion 72 is greater than the thickness of the second black sub-portion 62. The thickness of the filling portion 80 can be further increased to further reduce the occurrence of bubbles or stress concentration in the film layer attached to the opening area NA2.

[0171] The thickness of the second black sub-portion 62 is in the range of 1 micrometer to 1.5 micrometers. The thickness of the second black sub-portion 62 is one of 1 micrometer, 1.1 micrometers, 1.2 micrometers, 1.3 micrometers, 1.4 micrometers, and 1.5 micrometers.

[0172] When the second sub-portion 72 is a single-layer structure, the thickness of the second sub-portion 72 is in the range of 2.5 microns to 3.5 microns. The thickness of the second sub-portion 72 is a value of 2.5 microns, 2.6 microns, 2.7 microns, 2.8 microns, 2.9 microns, 3 microns, 3.1 microns, 3.2 microns, 3.3 microns, 3.4 microns, and 3.5 microns. When the material of the second sub-portion 72 is the same as that of the red filter block 71a, the thickness of the second sub-portion 72 is in the range of 2.5 microns to 3 microns. When the material of the second sub-portion 72 is the same as that of the green filter block 71b, the thickness of the second sub-portion 72 is in the range of 2.8 microns to 3.5 microns. When the material of the second sub-portion 72 is the same as that of the blue filter block 71c, the thickness of the second sub-portion 72 is in the range of 2.8 microns to 3.5 microns.

[0173] In the fourth embodiment of the present application, the filling portion 80 of the double-layer structure includes a second black sub-portion 62 and a second sub-portion 72, the second black sub-portion 62 has a light absorption effect, and the second sub-portion 72 has a light filtering effect. After the natural light from the outside passes through the second sub-portion 72, part of the outside light will be filtered out. The light that is not filtered out by the second sub-portion 72 passes through the second black sub-portion 62 and will be absorbed by the second black sub-portion 62. Compared with the second embodiment in which only a single-layer second black sub-portion 62 is provided, the fifth embodiment has better light filtering and light absorption effects, and the fifth embodiment can further weaken or even eliminate the reflection generated at the position corresponding to the opening area NA2 on the light-emitting side of the display panel, thereby improving the display effect.

[0174] See also Fig.13 , in the sixth embodiment of the present application:

[0175] In order to avoid redundancy, the sixth embodiment of the present application will describe the parts that are different from the third embodiment of the present application.

[0176] The sixth embodiment of the present application is different from the third embodiment of the present application in that:

[0177] Optionally, the filling portion 80 includes portions of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 is a three-layer structure.

[0178] Optionally, the black matrix layer 60 includes a first black sub-portion 61 and a second black sub-portion 62. The first black sub-portion 61 is located in the display area AA and is provided on the side of the first encapsulation section 50a away from the substrate 10. The first black sub-portion 61 is provided with a plurality of openings. The second black sub-portion 62 is located in the encapsulation area NA1 and is located between the second encapsulation section 50b and the first sub-layer 72a. The second black sub-portion 62 is made of the same material as the first black sub-portion 61. The filling portion 80 of the three-layer structure is formed by a single-layer second black sub-portion 62 and a double-layer second sub-portion 72, and the double-layer second sub-portion 72 includes a first sub-layer 72a and a second sub-layer 72b. In the direction H perpendicular to the plane where the substrate 10 is located, the distance L7 from the side of the second sub-layer 72b away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the side of the first encapsulation section 50a away from the substrate 10 to the substrate 10.

[0179] It should be understood that the filling portion 80 of the sixth embodiment includes the portion of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the sixth embodiment is a three-layer structure. The filling portion 80 of the third embodiment only includes the portion of the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the third embodiment is a double-layer structure. The thickness of the filling portion 80 of the three-layer structure is thicker than that of the filling portion 80 of the double-layer structure, which can further reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain, thereby further reducing the generation of bubbles or stress concentration in the film layer attached to the opening area NA2.

[0180] See also Fig.14 In the sixth embodiment, in the process of manufacturing the black matrix layer 60, when the first black sub-portion 61 is formed in the display area AA, the second black sub-portion 62 is also formed in the packaging area NA1 and the opening area NA2 at the same time. In the sixth embodiment, in the process of manufacturing the color filter layer 70, when the first sub-portion 71 is formed in the display area AA, the second sub-portion 72 of the double-layer structure is also formed in the packaging area NA1 and the opening area NA2 at the same time. The second black sub-portion 62 and the second sub-portion 72 of the double-layer structure can form a filling portion 80 of a three-layer structure. Compared with the filling portion 80 of the double-layer structure of the third embodiment, the filling portion 80 of the three-layer structure of the sixth embodiment is thicker. The display panel 100 of the sixth embodiment can further reduce the generation of bubbles or stress concentration in the film layer attached above the opening area NA2. After the film layer is attached, the filling portion 80 of the three-layer structure and other film layers in the opening area NA2 will be hollowed out to install the front camera, forming a filling portion 80 of a three-layer structure. Fig.13The structure of the display panel 100 shown in the figure. The sixth embodiment utilizes the existing process of the black matrix layer 60 and the color filter layer 70. When the first black sub-portion 61 and the first sub-portion 71 are formed in the display area AA, a three-layer structure of the second black sub-portion 62, the first sub-layer 72a and the second sub-layer 72b are formed in the encapsulation area NA1 and the opening area NA2, so as to reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain in the process of the display panel 100. Compared with the process of the traditional display panel 100, the present application does not need to add an additional process of filling the opening area NA2, thereby reducing the production cost of the display panel 100 and improving the production capacity.

[0181] Compared with the structure of the third embodiment which only includes a double-layer color filter layer 70, the filling portion 80 of the sixth embodiment also includes a total of three layers including a second black sub-portion 62. The second black sub-portion 62 has a light absorption effect and can further absorb external light on the basis of the third embodiment. Compared with the third embodiment which only has a double-layer color filter layer 70 and has a better light absorption effect, the sixth embodiment can further reduce or even eliminate the reflection generated at the position corresponding to the opening area NA2 on the light-emitting side of the display panel, thereby improving the display effect.

[0182] See also Fig.15 , in the seventh embodiment of the present application:

[0183] In order to avoid redundancy, the seventh embodiment of the present application will describe the parts that are different from the fourth embodiment of the present application.

[0184] The seventh embodiment of the present application is different from the fourth embodiment of the present application in that:

[0185] Optionally, the filling portion 80 includes portions of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 is a four-layer structure.

[0186] Optionally, the black matrix layer 60 includes a first black sub-portion 61 and a second black sub-portion 62. The first black sub-portion 61 is located in the display area AA and is provided on the side of the first encapsulation section 50a away from the substrate 10. The first black sub-portion 61 is provided with a plurality of openings. The second black sub-portion 62 is located in the encapsulation area NA1 and is located between the second encapsulation section 50b and the first sub-layer 72a. The second black sub-portion 62 is made of the same material as the first black sub-portion 61. Among them, the filling portion 80 of the four-layer structure is formed by a single-layer second black sub-portion 62 and a three-layer second sub-portion 72, and the three-layer second sub-portion 72 includes a first sub-layer 72a, a second sub-layer 72b and a third sub-layer 72c. In the direction H perpendicular to the plane where the substrate 10 is located, the distance L8 from the side of the third sub-layer 72c away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the side of the first encapsulation section 50a away from the substrate 10 to the substrate 10.

[0187] It should be understood that the filling portion 80 of the seventh embodiment includes the portion of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the seventh embodiment is a four-layer structure. The filling portion 80 of the fourth embodiment only includes the portion of the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the fourth embodiment is a three-layer structure. The thickness of the filling portion 80 of the four-layer structure is thicker than that of the filling portion 80 of the three-layer structure, which can further reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain, thereby further reducing the generation of bubbles or stress concentration in the film layer attached to the opening area NA2.

[0188] See also Fig.16 In the seventh embodiment, in the process of manufacturing the black matrix layer 60, when the first black sub-portion 61 is formed in the display area AA, the second black sub-portion 62 is also formed in the packaging area NA1 and the opening area NA2 at the same time. In the seventh embodiment, in the process of manufacturing the color filter layer 70, when the first sub-portion 71 is formed in the display area AA, the second sub-portion 72 with a three-layer structure is also formed in the packaging area NA1 and the opening area NA2 at the same time. The second black sub-portion 62 and the second sub-portion 72 with a three-layer structure can form a filling portion 80 with a four-layer structure. Compared with the filling portion 80 with a three-layer structure of the fourth embodiment, the filling portion 80 with a four-layer structure of the seventh embodiment is thicker. The display panel 100 of the seventh embodiment can further reduce the generation of bubbles or stress concentration in the film layer attached above the opening area NA2. After the film layer is attached, the filling portion 80 with a four-layer structure and other film layers in the opening area NA2 will be hollowed out to install the front camera, forming a structure such as Fig.15 The structure of the display panel 100 shown. The seventh embodiment utilizes the existing process of the black matrix layer 60 and the color filter layer 70. When the first black sub-portion 61 and the first sub-portion 71 are formed in the display area AA, a second black sub-portion 62, a first sub-layer 72a, a second sub-layer 72b and a third sub-layer 72c of a four-layer structure are formed in the encapsulation area NA1 and the opening area NA2 to reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain in the process of the display panel 100. Compared with the process of the traditional display panel 100, the present application does not need to add an additional process of filling the opening area NA2, thereby reducing the production cost of the display panel 100 and improving the production capacity.

[0189] Compared with the structure of the fourth embodiment including only three layers of color filter layers 70, the filling portion 80 of the seventh embodiment also includes a total of four layers including the second black sub-portion 62. The second black sub-portion 62 has a light absorption effect and can further absorb external light on the basis of the fourth embodiment. Compared with the fourth embodiment having only three layers of color filter layers 70, the embodiment has a better light absorption effect. The seventh embodiment can further reduce or even eliminate the reflection generated at the position corresponding to the opening area NA2 on the light-emitting side of the display panel, thereby improving the display effect.

[0190] See also Fig.17 , in the eighth embodiment of the present application:

[0191] In order to avoid redundancy, the eighth embodiment of the present application will describe the parts that are different from the seventh embodiment of the present application.

[0192] The eighth embodiment of the present application is different from the seventh embodiment of the present application in that:

[0193] Optionally, the display panel 100 further includes a planarization layer 90 (Passivation, PAS). The planarization layer 90 includes a first planar portion 91 and a second planar portion 92. The first planar portion 91 is located in the display area AA and is disposed on a side of the first black sub-portion 61 and the first sub-portion 71 away from the substrate 10. The second planar portion 92 is located in the encapsulation area NA1 and is disposed on a side of the second sub-portion 72 away from the substrate 10. The material of the second planar portion 92 is the same as that of the first planar portion 91. In the direction H perpendicular to the plane where the substrate 10 is located, the distance L9 from the side of the second planar portion 92 away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the side of the first encapsulation segment 50a away from the substrate 10 to the substrate 10.

[0194] Optionally, the material of the planarization layer 90 includes an organic photoresist material. The organic photoresist material has a leveling property.

[0195] Optionally, the filling portion 80 includes a portion of the black matrix layer 60 , the color filter layer 70 , and the planarization layer 90 located in the encapsulation area NA1 , and the filling portion 80 is a five-layer structure.

[0196] It should be understood that the filling portion 80 of the eighth embodiment includes the black matrix layer 60, the color filter layer 70 and the portion of the planarization layer 90 located in the encapsulation area NA1, and the filling portion 80 of the eighth embodiment is a five-layer structure. The filling portion 80 of the seventh embodiment only includes the portion of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the seventh embodiment is a four-layer structure. The thickness of the filling portion 80 of the five-layer structure is thicker than that of the filling portion 80 of the four-layer structure, which can further reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain, thereby further reducing the generation of bubbles or stress concentration in the film layer attached to the opening area NA2.

[0197] Optional, see Fig.18 In the eighth embodiment, in the process of manufacturing the planarization layer 90, when the first planar portion 91 is formed in the display area AA, the second planar portion 92 is also formed in the encapsulation area NA1 and the opening. The five-layer structure of the filling portion 80 of the eighth embodiment includes the second black sub-portion 62, the first sub-layer 72a, the second sub-layer 72b, the third sub-layer 72c and the second planar portion 92. Compared with the filling portion 80 of the fourth embodiment, the filling portion 80 of the fifth embodiment is thicker.

[0198] The display panel 100 of the eighth embodiment can further reduce the occurrence of bubbles or stress concentration in the film layer attached to the opening area NA2. After the film layer is attached, the filling portion 80 and other film layers of the five-layer structure in the opening area NA2 are hollowed out to install the front camera, forming a Fig.17 The structure of the display panel 100 shown. The eighth embodiment utilizes the existing process of the black matrix layer 60, the color filter layer 70 and the planarization layer 90, and forms the first black sub-portion 61, the first sub-portion 71 and the first planar portion 91 in the display area AA, respectively, and also forms the second black sub-portion 62, the first sub-layer 72a, the second sub-layer 72b, the third sub-layer 72c and the second planar portion 92 of the five-layer structure in the encapsulation area NA1 and the opening area NA2, so as to reduce the step difference caused by the high and low terrain in the process of the display panel 100. Compared with the process of the traditional display panel 100, the present application does not need to add an additional process of filling the opening area NA2, thereby reducing the production cost of the display panel 100 and improving the production capacity.

[0199] Optionally, the second flat portion 92 is connected to the first flat portion 91. The thickness of the second flat portion 92 is greater than the thickness of the first flat portion 91.

[0200] In this embodiment, the first flat portion 91 and the second flat portion 92 are formed simultaneously in the same process, and the second flat portion 92 is connected to the first flat portion 91. The first flat portion 91 is located in the display area AA with a higher terrain, and the second flat portion 92 is located in the encapsulation area NA1 with a lower terrain. In the process of the planarization layer 90, due to the influence of gravity and the leveling property of the organic material, part of the material of the first flat portion 91 will flow into the encapsulation area NA1 before curing, forming a part of the second flat portion 92. After the planarization layer 90 is cured, the thickness of the second flat portion 92 will be greater than the thickness of the first flat portion 91. Since in this embodiment, the filling portion 80 also includes the portion of the planarization layer 90 located in the encapsulation area NA1, that is, the filling portion 80 also includes the second flat portion 92. This embodiment increases the thickness of the second flat portion 92 by connecting the first flat portion 91 and the second flat portion 92, thereby increasing the thickness of the filling portion 80, further reducing the step difference between the display area AA and the opening area NA2, thereby further reducing the generation of bubbles or stress concentration in the film layer attached to the opening area NA2, and improving the yield of the display panel 100, thereby reducing production costs and improving production capacity.

[0201] The above is a detailed description of the specific implementation of the present application. The above implementation disclosed in the present application is only the preferred implementation of the present application. For ordinary technicians in this field, many modifications and improvements can be made without departing from the concept of the present application. These modifications and improvements all fall within the scope of protection defined by the claims of the present application.

Claims

1. A display panel, comprising a non-display area and a display area located outside the non-display area, wherein the non-display area comprises a packaging area and an opening area, and the packaging area is located between the display area and the opening area, characterized in that: The display panel comprises: substrate; an encapsulation layer, disposed on one side of the substrate, comprising a first encapsulation segment and a second encapsulation segment connected to each other, wherein the first encapsulation segment is located in the display area, and the second encapsulation segment is located in the encapsulation area, and in a direction perpendicular to the plane where the substrate is located, a distance from a side of the second encapsulation segment away from the substrate to the substrate is smaller than a distance from a side of the first encapsulation segment away from the substrate to the substrate; a black matrix layer, at least a portion of the black matrix layer is located in the display area, the portion of the black matrix layer located in the display area is arranged on a side of the first packaging section away from the substrate, and the portion of the black matrix layer located in the display area is provided with a plurality of openings; a color filter layer, at least a portion of the color filter layer is located in the display area, and at least a portion of the color filter layer located in the display area is disposed in the opening; and A filling portion, located in the packaging area, and arranged on a side of the second packaging section away from the substrate; Wherein, the filling portion includes at least one of the black matrix layer and the color filter layer; In a direction perpendicular to a plane where the substrate is located, a distance from a side of the filling portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging section away from the substrate to the substrate.

2. The display panel according to claim 1, wherein: The black matrix layer comprises: A first black sub-portion, located in the display area and disposed on a side of the first packaging section away from the substrate, the first black sub-portion being provided with a plurality of the openings; and A second black sub-portion is located in the packaging area and is disposed on a side of the second packaging section away from the substrate, and the second black sub-portion is made of the same material as the first black sub-portion; Wherein, the filling portion includes the second black sub-portion; In a direction perpendicular to the plane where the substrate is located, a distance from a side of the second black sub-portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging segment away from the substrate to the substrate.

3. The display panel according to claim 2, wherein: The first black sub-portion is connected to the second black sub-portion, and a thickness of the second black sub-portion is greater than a thickness of the first black sub-portion.

4. The display panel according to claim 2, wherein: The color filter layer comprises: A first sub-portion, located in the display area and disposed in the opening, wherein the first sub-portion is one of a red filter block, a blue filter block and a green filter block; and A second sub-portion, located in the packaging area, is disposed on a side of the second black sub-portion away from the substrate, and the material of the second sub-portion includes the material of at least one of the red filter block, the blue filter block, and the green filter block; Wherein, the filling portion further includes a second sub-portion; In a direction perpendicular to the plane where the substrate is located, a distance from a side of the second sub-portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging section away from the substrate to the substrate.

5. The display panel according to claim 4, wherein: The second subsection comprises: A first sub-layer is provided on a side of the second black sub-portion away from the substrate, and a material of one of the red filter block, the blue filter block, and the green filter block is the same as a material of the first sub-layer; and A second sub-layer is provided on a side of the first sub-layer away from the substrate, and the material of the other one of the red filter block, the blue filter block, and the green filter block is the same as the material of the second sub-layer; wherein the material of the first sub-layer is different from the material of the second sub-layer; In a direction perpendicular to the plane where the substrate is located, a distance from a side of the second sublayer away from the substrate to the substrate is less than or equal to a distance from a side of the first encapsulation segment away from the substrate to the substrate.

6. The display panel according to claim 5, wherein: The second sub-section further includes a third sub-layer, which is disposed on a side of the second sub-layer away from the substrate, and a material of the third sub-layer is the same as a material of another one of the red filter block, the blue filter block, and the green filter block; Wherein, the material of the first sub-layer, the material of the second sub-layer and the material of the third sub-layer are all different; In a direction perpendicular to the plane where the substrate is located, a distance from a side of the third sublayer away from the substrate to the substrate is less than or equal to a distance from a side of the first encapsulation segment away from the substrate to the substrate.

7. The display panel according to any one of claims 4 to 6, characterized in that: The thickness of the second sub-portion is greater than the thickness of the second black sub-portion.

8. The display panel according to any one of claims 4 to 6, characterized in that: The display panel further includes a planarization layer, and the planarization layer includes: A first flat portion, located in the display area, and disposed on the first black sub-portion and a side of the first sub-portion away from the substrate; and A second flat portion, located in the packaging area, is provided on a side of the second sub-portion away from the substrate, and the material of the second flat portion is the same as that of the first flat portion; Wherein, in a direction perpendicular to the plane where the substrate is located, a distance from a side of the second flat portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging section away from the substrate to the substrate.

9. The display panel according to claim 8, wherein: The second flat portion is connected to the first flat portion, and a thickness of the second flat portion is greater than a thickness of the first flat portion.

10. The display panel according to claim 1, wherein: The color filter layer comprises: A first sub-portion, located in the display area and disposed in the opening, wherein the first sub-portion is one of a red filter block, a blue filter block and a green filter block; and A second sub-section, located in the packaging area, and disposed on a side of the second packaging section away from the substrate; Wherein, the second sub-section comprises: A first sub-layer is provided on a side of the second packaging section away from the substrate, and a material of one of the red filter block, the blue filter block, and the green filter block is the same as a material of the first sub-layer; and A second sub-layer is provided on a side of the first sub-layer away from the substrate, and the material of the other one of the red filter block, the blue filter block, and the green filter block is the same as the material of the second sub-layer; Wherein, the material of the first sub-layer is different from the material of the second sub-layer, and the filling portion further includes a second sub-portion; In a direction perpendicular to the plane where the substrate is located, a distance from a side of the second sublayer away from the substrate to the substrate is less than or equal to a distance from a side of the first encapsulation segment away from the substrate to the substrate.

11. The display panel according to any one of claims 1 to 6, characterized in that: The display panel further includes: a thin film transistor device layer, disposed on one side of the substrate, at least a portion of the thin film transistor device layer being located in the display area; and A plurality of light emitting devices are arranged on a side of the thin film transistor device layer away from the substrate and located in the display area; The encapsulation layer comprises: A first inorganic encapsulation layer is provided on one side of the substrate, wherein a portion of the first inorganic encapsulation layer located in the display area covers the light-emitting device and the thin film transistor device layer, and a portion of the first inorganic encapsulation layer located in the encapsulation area covers the substrate; an organic encapsulation layer, located in the display area and disposed on a side of the first inorganic encapsulation layer away from the substrate; and a second inorganic encapsulation layer, wherein a portion of the second inorganic encapsulation layer located in the display area covers the organic encapsulation layer, a portion of the second inorganic encapsulation layer located in the encapsulation area covers a portion of the first inorganic encapsulation layer located in the encapsulation area, and the second inorganic encapsulation layer separates the filling portion and the organic encapsulation layer; The portion of the first inorganic encapsulation layer located in the display area, the organic encapsulation layer, and the portion of the second inorganic encapsulation layer located in the display area form the first encapsulation segment; The portion of the first inorganic encapsulation layer located in the encapsulation area and the portion of the second inorganic encapsulation layer located in the encapsulation area form the second encapsulation section; In a direction perpendicular to the plane of the substrate, the distance from the side of the second inorganic encapsulation layer located in the encapsulation area away from the substrate is less than the distance from the side of the second inorganic encapsulation layer located in the display area away from the substrate; the distance from the side of the filling portion away from the substrate is less than or equal to the distance from the side of the second inorganic encapsulation layer located in the display area away from the substrate.

12. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 11.

Images