Ceramic metallization cold end copper contact film heat flow sensor used in high temperature environment

Abstract

The invention provides a ceramic metalized cold-end copper contact film heat flow sensor for a high-temperature environment, which comprises a ceramic metalized cold-end copper contact film heat flow sensor and a sensor base, and is characterized in that the ceramic metalized cold-end copper contact film heat flow sensor comprises an Al2O3 thermal resistance layer film, a NiSi functional film and a NiCr functional film; the NiCr functional film, the NiSi functional film and the Al2O3 thermal resistance layer film are sequentially arranged on the upper surface of the sensor base; the NiSi functional thin film and the NiCr functional thin film are subjected to cold end and hot end separation through the Al2O3 thermal resistance layer thin film, and a thermopile functional thin film hot contact A and a thermopile functional thin film cold contact B are formed; the sensor base comprises a ceramic element and a copper heat sink, two through holes are formed in the ceramic element, and NiCr compensation wires are placed in the through holes; the measuring end M of the NiCr compensation lead protrudes 0.2 mm, the measuring end M, the upper surface of the ceramic element and the upper surface of the copper heat sink are polished to be in the same plane, the surfaces reach a mirror surface, the lead end N of the NiCr compensation lead protrudes 40 mm, and a measuring instrument is connected for data acquisition.

Description

Technical Field

[0001] The invention relates to the field of heat flow measurement technology and sensor preparation technology, and in particular to a ceramic metallized cold-end copper contact thin-film heat flow sensor for high-temperature environments. Background Art

[0002] In the field of aerospace, the transient heating of key components poses a huge thermal challenge to the structure and materials, and poses a major threat to operational safety. In order to ensure the safety of these key components in operation, it is essential to accurately and in real time monitor the surface heat flux. This paper focuses on solving the technical difficulties of surface transient heat flux that is difficult to measure in aerospace flight, especially in evaluating the performance and life of key components such as turbines, combustion chambers, blades, and engines. Aerospace key components are critical components in flight equipment and systems, involving core components such as turbines and combustion chambers. The failure of these key components may lead to system failures and even serious accidents, causing huge losses to flight personnel safety, equipment efficiency, and property. At critical moments, the transient heating of aerospace key components during operation will cause their structures to bear huge thermal loads, which will have a serious impact on operational safety. Therefore, real-time and accurate measurement of the heat flux on the surface of key components is essential for evaluating performance and life. However, traditional heat flux sensors are limited by response time, thermal capacitance and thermal resistance, measurement environment, and spatial distribution, making it difficult to accurately and in real time measure the instantaneous heat flux. Summary of the invention

[0003] According to the technical problems raised above, a ceramic metallized cold-end copper contact thin-film heat flux sensor for high-temperature environments is provided, which has the advantages of fast response time, high measurement accuracy, and easy assembly.

[0004] The technical means adopted by the present invention are as follows:

[0005] A ceramic metallized cold-end copper contact thin film heat flow sensor for high temperature environment, comprising: a ceramic metallized cold-end copper contact thin film heat flow sensor and a sensor base, wherein:

[0006] The ceramic metallized cold-end copper contact thin film heat flow sensor comprises an Al2O3 thermal resistance layer film, a NiSi functional film, and a NiCr functional film; wherein the NiCr functional film, the NiSi functional film, and the Al2O3 thermal resistance layer film are sequentially arranged on the upper surface of the sensor base; the Al2O3 thermal resistance layer film separates the cold end and hot end of the NiSi functional film and the NiCr functional film to form a thermopile functional film hot junction A and a thermopile functional film cold junction B;

[0007] The sensor base includes a ceramic element and a copper heat sink. The ceramic element has two through holes, and a NiCr compensation wire is placed in the through holes. The measuring end M of the NiCr compensation wire protrudes 0.2 mm and is polished to the same plane together with the upper surface of the ceramic element and the upper surface of the copper heat sink, and the surface reaches a mirror surface. The lead end N of the NiCr compensation wire protrudes 40 mm and is connected to a measuring instrument for data collection.

[0008] Furthermore, the Al2O3 thermal resistance layer film makes the cold end and hot end of the NiSi functional film and the NiCr functional film have different temperatures when they are in the same environment. Based on the Seebeck effect, a thermoelectric potential is generated between the NiSi functional film and the NiCr functional film, and the output thermoelectric potential is output to the signal acquisition device through the built-in NiCr compensation wire.

[0009] Furthermore, the paired NiSi functional film and the NiCr functional film are connected in series to form a thermopile, the cold end of the thermopile is on the copper heat sink, and the hot end of the thermopile is on the ceramic element.

[0010] Furthermore, the ceramic element and the copper heat sink are connected into an integrated structure through ceramic metallization technology.

[0011] Furthermore, the ceramic metallized cold-end copper contact thin film heat flow sensor also includes a SiO2 insulating film, and the SiO2 insulating film is arranged between the sensor base and the NiCr functional film.

[0012] Furthermore, the ceramic metallized cold-end copper contact thin-film heat flux sensor further comprises a SiO2 protective film, and the SiO2 protective film is arranged on the upper surface of the Al2O3 thermal resistance layer film.

[0013] Furthermore, the ceramic metallized cold-end copper contact thin film heat flux sensor further comprises a stainless steel housing and a stainless steel flange, wherein:

[0014] The stainless steel shell is provided with external threads, and the stainless steel flange is provided with internal threads, and the two cooperate with each other, and the position of the stainless steel flange can be adjusted arbitrarily according to actual conditions.

[0015] Furthermore, the ceramic metallized cold-end copper contact thin film heat flux sensor further comprises a stainless steel gasket and bolts, wherein:

[0016] The stainless steel gasket is provided with four threaded holes, the stainless steel shell is provided with four bolt through holes, and the copper heat sink is fixed to the stainless steel shell by bolts.

[0017] Compared with the prior art, the present invention has the following advantages:

[0018] 1. The present invention provides a ceramic metallized cold-end copper contact thin-film heat flux sensor for use in high-temperature environments. The substrate is composed of a ceramic element and a copper heat sink. The cold junction is located close to the copper heat sink, and the hot junction is located far from the copper heat sink. The temperature difference between the cold and hot ends is large, and the sensor has a large output thermoelectric potential.

[0019] 2. The present invention provides a ceramic metallized cold-end copper contact thin-film heat flow sensor for use in high-temperature environments, which uses Al2O3 material as the thermal resistance layer film material, which has the advantages of high temperature resistance, high hardness, high density, and excellent thermal conductivity.

[0020] 3. The ceramic metallized cold-end copper contact thin film heat flux sensor for high temperature environment provided by the present invention adopts the lead base integrated sintering technology, has the advantage of stable thin film lead connection, and avoids the disadvantages of hard, brittle and easy to fall off lead ends caused by the use of conductive silver glue.

[0021] 4. The present invention provides a ceramic metallized cold-end copper contact thin film heat flux sensor for use in high-temperature environments. It uses stainless steel as a packaging shell and is matched with the shell through a flange. The relative position between the flange and the shell can be adjusted. The shell has an external thread that can be directly threaded with the measured object.

[0022] 5. The ceramic metallized cold-end copper contact thin film heat flux sensor for high-temperature environments provided by the present invention has a flange position that can be adjusted up and down by means of a thread. The flange is provided with four threaded holes that can be fixed with bolts, which is flexible. At the same time, the flange is provided with four threaded holes for easy assembly and replacement of parts.

[0023] Based on the above reasons, the present invention can be widely promoted in the fields of heat flow measurement technology and sensor preparation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0025] Figure 1 It is a schematic diagram of the explosion of the ceramic metallized cold-end copper contact thin film heat flux sensor of the present invention.

[0026] Figure 2 It is a top view of the ceramic metallized cold-end copper contact thin film heat flow sensor of the present invention.

[0027] Figure 3 It is a cross-sectional view of the ceramic metallized cold-end copper contact thin film heat flow sensor of the present invention.

[0028] Figure 4 A top view of the mechanical mask of the nickel-chromium thermopile thin film made in the present invention.

[0029] Figure 5 A top view of the mechanical mask of the nickel-silicon thermopile film made in the present invention.

[0030] Figure 6 A top view of the mechanical mask of the SiO2 film made in the present invention.

[0031] In the figure: 1. SiO2 protective film; 2. Al2O3 thermal resistance layer film; 3. NiCr functional film; 4. NiSi functional film; 5. SiO2 insulating film; 6. NiCr compensation wire; 7. Ceramic component; 8. Copper heat sink; 9. Stainless steel housing; 10. Stainless steel gasket; 11. Bolt; 12. Stainless steel flange; A. Thermopile functional membrane hot junction; B. Thermopile functional membrane cold junction. DETAILED DESCRIPTION

[0032] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0035] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, the numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be clear that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0036] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention: the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0037] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below their position devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0038] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0039] like Figure 1-3As shown, the present invention provides a ceramic metallized cold-end copper contact thin film heat flow sensor for high temperature environment, comprising: a ceramic metallized cold-end copper contact thin film heat flow sensor and a sensor base, wherein:

[0040] The ceramic metallized cold-end copper contact thin film heat flow sensor comprises an Al2O3 thermal resistance layer film 2, a NiSi functional film 3, and a NiCr functional film 4; wherein the NiCr functional film 4, the NiSi functional film 3, and the Al2O3 thermal resistance layer film 2 are sequentially arranged on the upper surface of the sensor base; the Al2O3 thermal resistance layer film 2 separates the cold end and hot end of the NiSi functional film 3 and the NiCr functional film 4 to form a thermopile functional film hot junction A and a thermopile functional film cold junction B;

[0041] The sensor base includes a ceramic element 7 and a copper heat sink 8. The ceramic element 7 has two through holes, and a NiCr compensation wire 6 is placed in the through holes. The measuring end M of the NiCr compensation wire 6 protrudes 0.2 mm, and is polished to the same plane together with the upper surface of the ceramic element 7 and the upper surface of the copper heat sink 8, and the surface reaches a mirror surface. The lead end N of the NiCr compensation wire 6 protrudes 40 mm and is connected to a measuring instrument for data collection.

[0042] In specific implementation, as a preferred embodiment of the present invention, the Al2O3 thermal resistance layer film 2 makes the cold end and hot end of the NiSi functional film 3 and the NiCr functional film 4 have different temperatures when they are in the same environment. Based on the Seebeck effect, a thermoelectric potential is generated between the NiSi functional film 3 and the NiCr functional film 4. The output thermoelectric potential is output to the signal acquisition device through the built-in NiCr compensation wire 6. The heat flux density loaded on the heat flux sensor per unit time is obtained by conversion through a formula. The output thermoelectric potential of the thermopile film is related to the heat flux density, thereby realizing transient measurement of the heat flux density.

[0043] In this embodiment, in order to make the sensor more sensitive, it is necessary to increase the thermoelectric potential generated between the NiSi functional film 3 and the NiCr functional film 4. The present invention increases the temperature difference between the cold and hot ends to increase the output thermoelectric potential of the NiSi functional film 3 and the NiCr functional film 4. Therefore, the distribution of the cold and hot junctions is such that the cold junction is placed at a position close to the copper heat sink and the hot junction is placed at a position far from the copper heat sink, so as to increase the temperature difference between the cold and hot junctions, thereby increasing the output signal of the transient thin film heat flux sensor and improving the sensitivity.

[0044] In specific implementation, as a preferred embodiment of the present invention, the paired NiSi functional film 3 and the NiCr functional film 4 are connected in series to form a thermopile, the cold end of the thermopile is on the copper heat sink 8, and the hot end of the thermopile is on the ceramic element 7. In this embodiment, the thermopile film includes nickel-chromium and nickel-silicon thermopile films, which are formed by 29 pairs of NiCr and NiSi film thermocouples connected in series, and the thermopile film and the Al2O3 thermal resistance layer film together constitute the thermopile functional film of the thin film heat flux meter;

[0045] In specific implementation, as a preferred embodiment of the present invention, the ceramic element 7 and the copper heat sink 8 are connected into an integrated structure through ceramic metallization technology.

[0046] In specific implementation, as a preferred embodiment of the present invention, the ceramic metallized cold-end copper contact thin film heat flow sensor further includes a SiO2 insulating film 5 , which is disposed between the sensor base and the NiCr functional film 4 .

[0047] In specific implementation, as a preferred embodiment of the present invention, the ceramic metallized cold-end copper contact thin film heat flux sensor further includes a SiO2 protective film 1 , which is arranged on the upper surface of the Al2O3 thermal resistance layer film 2 .

[0048] In specific implementation, as a preferred embodiment of the present invention, the ceramic metallized cold-end copper contact thin film heat flux sensor further includes a stainless steel housing 9 and a stainless steel flange 12, wherein:

[0049] The stainless steel housing 9 is provided with external threads, and the stainless steel flange 12 is provided with internal threads, and the two cooperate with each other, and the position of the stainless steel flange 12 can be adjusted arbitrarily according to actual conditions.

[0050] In specific implementation, as a preferred embodiment of the present invention, the ceramic metallized cold-end copper contact thin film heat flux sensor further includes a stainless steel gasket 10 and a bolt 11, wherein:

[0051] The stainless steel gasket 10 is provided with four threaded holes, the stainless steel housing 9 is provided with four bolt through holes, and the copper heat sink 8 and the stainless steel housing 9 are fixed by bolts 11 .

[0052] In this embodiment, preferably, the stainless steel housing 9, the stainless steel flange 12, and the bolts 11 are all made of high temperature resistant materials.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A ceramic metallized cold-end copper contact thin film heat flow sensor for high temperature environment, characterized in that: include: Ceramic metallized cold-end copper contact thin-film heat flow sensor and sensor base, where: The ceramic metallized cold-end copper contact thin film heat flow sensor comprises an Al2O3 thermal resistance layer film (2), a NiSi functional film (3), and a NiCr functional film (4); wherein the NiCr functional film (4), the NiSi functional film (3), and the Al2O3 thermal resistance layer film (2) are sequentially arranged on the upper surface of the sensor base; the Al2O3 thermal resistance layer film (2) separates the cold end and hot end of the NiSi functional film (3) and the NiCr functional film (4), forming a thermopile functional film hot junction A and a thermopile functional film cold junction B; The sensor base comprises a ceramic element (7) and a copper heat sink (8); the ceramic element (7) is provided with two through holes, in which a NiCr compensation wire (6) is placed; a measuring end M of the NiCr compensation wire (6) protrudes 0.2 mm, and is polished together with the upper surface of the ceramic element (7) and the upper surface of the copper heat sink (8) to the same plane, and the surface reaches a mirror surface; a lead end N of the NiCr compensation wire (6) protrudes 40 mm, and is connected to a measuring instrument for data collection.

2. The ceramic metallized cold-end copper contact thin film heat flow sensor for high temperature environment according to claim 1, characterized in that: The Al2O3 thermal resistance layer film (2) causes the cold end and the hot end of the NiSi functional film (3) and the NiCr functional film (4) to have different temperatures when they are in the same environment. Based on the Seebeck effect, a thermoelectric potential is generated between the NiSi functional film (3) and the NiCr functional film (4), and the output thermoelectric potential is output to a signal acquisition device through a built-in NiCr compensation wire (6).

3. The ceramic metallized cold-end copper contact thin-film heat flow sensor for high-temperature environments according to claim 1, characterized in that: The paired NiSi functional film (3) and the NiCr functional film (4) are connected in series to form a thermopile, the cold end of the thermopile is on the copper heat sink (8), and the hot end of the thermopile is on the ceramic element (7).

4. The ceramic metallized cold-end copper contact thin-film heat flow sensor for high-temperature environments according to claim 1, characterized in that: The ceramic element (7) and the copper heat sink (8) are connected into an integrated structure through ceramic metallization technology.

5. The ceramic metallized cold-end copper contact thin-film heat flow sensor for high-temperature environments according to claim 1, characterized in that: The ceramic metallized cold-end copper contact thin-film heat flow sensor further comprises a SiO2 insulating film (5), wherein the SiO2 insulating film (5) is arranged between the sensor base and the NiCr functional film (4).

6. The ceramic metallized cold-end copper contact thin-film heat flow sensor for high-temperature environments according to claim 1, characterized in that: The ceramic metallized cold-end copper contact thin-film heat flow sensor further comprises a SiO2 protective film (1), wherein the SiO2 protective film (1) is arranged on the upper surface of the Al2O3 thermal resistance layer film (2).

7. The ceramic metallized cold-end copper contact thin-film heat flow sensor for high-temperature environments according to claim 1, characterized in that: The ceramic metallized cold-end copper contact thin-film heat flow sensor further comprises a stainless steel housing (9) and a stainless steel flange (12), wherein: The stainless steel housing (9) is provided with external threads, and the stainless steel flange (12) is provided with internal threads, and the two cooperate with each other, and the position of the stainless steel flange (12) can be adjusted arbitrarily according to actual conditions.

8. The ceramic metallized cold-end copper contact thin-film heat flow sensor for high-temperature environments according to claim 1, characterized in that: The ceramic metallized cold-end copper contact thin-film heat flow sensor further comprises a stainless steel gasket (10) and a bolt (11), wherein: The stainless steel gasket (10) is provided with four threaded holes, the stainless steel housing (9) is provided with four bolt through holes, and the copper heat sink (8) and the stainless steel housing (9) are fixed by bolts (11).

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