Passive heat dissipation structure of micro host

Abstract

The invention relates to the technical field of electric digital data processing devices, in particular to a micro-host passive heat dissipation structure which comprises a shell, a back plate and a heat dissipation structure arranged between the shell and the back plate. The heat dissipation structure comprises a mounting block, a plurality of copper bottoms and a plurality of heat pipes; two copper bottoms parallel to the back plate in a traditional heat dissipation structure are changed into a plurality of copper bottoms perpendicular to the back plate, and a gap is reduced in the front-back direction, so that the use of silicone grease is reduced, the heat dissipation efficiency is improved, and the normal operation of the micro host is ensured; the use of silicone grease between the copper bottom and the back plate is reduced, the heat conductivity is further improved, and the heat dissipation effect is ensured. Meanwhile, the contact surfaces of every two adjacent copper bottoms and the axes of the fixing bolts are in an inclined state, so that the use amount of silicone grease between the copper bottoms and the heat pipes is reduced, the fins on the multiple back plates are arranged in an inclined and staggered mode, air flowing through the fins is disordered, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of electronic digital data processing devices, and in particular to a passive heat dissipation structure of a micro host. Background Art

[0002] A micro-host, also often called a mini-host, is a small microcomputer host that can even fit in a pocket. Micro-hosts use large-scale and ultra-large-scale integrated circuits, which greatly reduce the size and weight, making them easy to carry and place. Because they use advanced integrated circuit technology, the power consumption of micro-hosts is relatively low, which is energy-saving and environmentally friendly. Micro-hosts provide a variety of interfaces and expansion slots, which are convenient for users to expand and upgrade according to their needs. Although the micro-host is small in size, it has the functions of a general host and can meet a variety of needs such as daily office, study, and entertainment. However, due to its small size, the heat dissipation system may be relatively limited, and special attention needs to be paid to its heat dissipation performance and stability to avoid local overheating that affects the normal operation of the micro-host.

[0003] In the prior art, the passive heat dissipation structure of the micro-host is disclosed in the Chinese patent document with the publication number CN115268603A, in which one end of the heat pipe is sandwiched between the heat conducting plate and the first fixed plate, and the other end leads to the heat dissipation component. The heat generated by the CPU is transferred to the heat dissipation fins and the bottom of the heat dissipation fan through the heat conducting plate through the heat pipe, and the heat dissipation fan negative pressure exhaust blows the hot air out of the chassis through the heat dissipation channel formed by the heat dissipation fins. Combined with the above scheme and the analysis of the heat dissipation structure of the micro-host in the prior art, due to the rough surface of the CPU, the heat conducting plate, the fins and the heat pipe, there will be gaps at the contact position during the assembly process, and the air in the gap will affect the thermal conductivity, so it is necessary to apply silicone grease at the contact position to fill the gap, but the thermal conductivity of silicone grease is much smaller than that of the copper sheet, so there is still a problem of low heat dissipation efficiency and poor heat dissipation effect. And when the heat pipe and the copper bottom are assembled, the heat pipe will collide with the copper bottom, causing the heat pipe to be damaged. Summary of the invention

[0004] In view of the deficiencies of the prior art, the present invention proposes a passive heat dissipation structure for a micro host, which solves the problems of low heat dissipation efficiency and poor heat dissipation effect of the heat dissipation structure of the micro host in the prior art and the problem of damage to the heat pipe due to collision between the heat pipe and the copper bottom when assembling the heat pipe and the copper bottom.

[0005] A passive heat dissipation structure of a micro host of the present invention adopts the following technical solution. The micro host comprises a housing, a back plate and a control board; the housing and the back plate are detachably fixedly connected, and the two define a receiving cavity, and the control board and the heat dissipation structure are installed in the receiving cavity; the control board and the back plate are parallel and spaced apart, and the electronic components are detachably installed on the control board; The heat dissipation structure includes a mounting block, a plurality of copper bases and a plurality of heat pipes; The mounting block is detachably fixedly connected to a side of the control panel away from the back panel; the mounting block is provided with mounting holes, and a plurality of mounting holes are spaced apart in the left-right direction; A plurality of copper bottoms are closely arranged in the left-right direction, the copper bottoms extend in the vertical direction, and the copper bottoms are arranged on the side of the back plate facing the accommodating cavity; the end surfaces of two adjacent copper bottoms in contact are each provided with a vertically penetrating half hole, and the two half holes enclose a complete combined hole; A plurality of heat pipes are arranged at intervals along the left-right direction; one end of the heat pipe is inserted into the mounting hole, and the other end is inserted into the combination hole; a metal powder layer is sintered on the inner wall of the heat pipe, and the heat pipe is filled with coolant.

[0006] Optionally, a plurality of back plates are provided, which are closely arranged along the left-right direction, the plurality of back plates correspond to a plurality of copper bottoms respectively, and the back plates and the corresponding copper bottoms are integrally formed, and fins are provided on the back plates.

[0007] Optionally, the fins on two adjacent back plates are staggered in the vertical direction.

[0008] Optionally, there is an angle between the extension direction of the fin and the vertical direction, and the angle is not a right angle.

[0009] Optionally, the inclination directions of the fins on the multiple back plates are not completely consistent.

[0010] Optionally, the end surface of the copper bottom in contact with the adjacent copper bottom is an inclined surface, and an angle exists between the contact surface and the front-rear direction.

[0011] Optionally, a plurality of fixing units are arranged between two adjacent copper bottoms, the plurality of fixing units are arranged at intervals along the vertical direction, and the fixing units are used to fix and connect the two adjacent copper bottoms.

[0012] Optionally, each fixing unit includes a threaded hole and a bolt, and threaded holes are provided on one side of the copper bottom close to the mounting block and on the other side close to the back plate, and the axes of the two threaded holes of two adjacent copper bottoms close to the mounting block coincide, and a bolt is threadedly connected thereto; the axes of the two threaded holes of two adjacent copper bottoms close to the back plate coincide, and a bolt is threadedly connected thereto; and there is a non-right angle between the axes of the threaded holes and the left and right directions.

[0013] Optionally, in the projection of the cross section of the copper bottom, the axis of the threaded hole is located between the normal direction and the front-to-back direction of two adjacent copper bottom contact surfaces.

[0014] Optionally, a sealing strip is provided between two adjacent copper bottoms. The sealing strip extends in a vertical direction, is provided between the heat pipe and a threaded hole close to one side of the back plate, and has an angle with the contact surface of the two adjacent copper bottoms.

[0015] The beneficial effects of the present invention are as follows: a passive heat dissipation structure of a micro-host of the present invention changes the two copper bottoms arranged parallel to the back plate in the traditional heat dissipation structure into multiple copper bottoms perpendicular to the back plate, thereby reducing a gap in the front-to-back direction, thereby reducing the use of silicone grease, and making the heat on the copper bottom more efficient in heat conduction when transferred to the back plate, thereby improving the heat dissipation efficiency and avoiding the impact of untimely heat dissipation on the operation of the micro-host.

[0016] Furthermore, the copper bottom and the back plate are integrally formed to reduce the gap between the copper bottom and the back plate, thereby reducing the use of silicone grease, so that the heat on the copper bottom is quickly transferred to the back plate, further improving the heat dissipation efficiency and ensuring the heat dissipation effect. The fins are arranged at an angle to increase the surface area of ​​a single fin, increase the contact area between the air and the fins, and further improve the heat dissipation efficiency. The inclination directions of the fins on multiple back plates are not completely consistent, and the fins on two adjacent back plates are arranged alternately in the vertical direction, so that when the air flows in the left and right directions, it collides with the fins on the next back plate, causing turbulence, thereby destroying the boundary layer generated when the air flows through the fins, increasing the thermal conductivity between the fins and the air, and thereby improving the heat dissipation efficiency.

[0017] Furthermore, since there is an angle between the contact surface of the two adjacent copper bottoms and the front-to-back direction, the contact area between the two adjacent copper bottoms is made larger, thereby improving the heat dissipation efficiency between the two adjacent copper bottoms; and when the heat pipe and the copper bottom are spliced, when the two are close to each other in the left-right direction, the copper bottom guides the heat pipe to avoid collision between the copper bottom and the heat pipe, which may cause damage to the heat pipe.

[0018] Furthermore, by providing a sealing strip, dust is prevented from passing through the back plate into the gap between the copper bottom and the heat pipe to affect the heat dissipation effect. In the process of tightening the bolts, the silicone grease between two adjacent copper bottoms and between the copper bottom and the heat pipe is squeezed out only from the gap on the side facing the mounting block, thereby preventing the silicone grease from reaching the side of the back plate where the fins are provided and on the fins, making it difficult to remove and affecting the use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 This is a schematic diagram of the overall structure of a passive heat dissipation structure of a micro host of the present invention; Figure 2 It is a schematic diagram of the overall structure of a micro-host passive heat dissipation structure after being cut open in the present invention; Figure 3 It is a schematic diagram from a first perspective of a back plate and a heat dissipation structure in a passive heat dissipation structure of a micro host according to the present invention; Figure 4 A schematic diagram from a second perspective of a back plate and a heat dissipation structure in a passive heat dissipation structure of a micro host according to the present invention; Figure 5 It is a front view of a back plate and a heat dissipation structure in a passive heat dissipation structure of a micro host of the present invention; Figure 6 for Figure 5 Middle AA section cutaway view; Figure 7 for Figure 6 Enlarged image at the center X.

[0021] In the figure: 100, housing; 110, back plate; 111, receiving chamber; 112, fins; 120, control panel; 200, heat dissipation structure; 210, mounting block; 211, mounting hole; 220, copper bottom; 221, combination hole; 222, threaded hole; 223, bolt; 224, sealing strip; 230, heat pipe; 231, metal powder layer. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0023] like Figures 1 to 7 As shown, an embodiment of the present invention provides a passive heat dissipation structure 200 of a micro host, the micro host comprises a housing 100, a back plate 110 and a control board 120; the housing 100 and the back plate 110 are detachably fixedly connected, and the two define a receiving cavity 111, and the control board 120 and the heat dissipation structure 200 are installed in the receiving cavity 111; the control board 120 is parallel to the back plate 110 and is spaced apart, and the electronic components are detachably installed on the control board 120; The heat dissipation structure 200 includes a mounting block 210, a plurality of copper bases 220, and a plurality of heat pipes 230; The mounting block 210 is detachably fixedly connected to a side of the control board 120 away from the back plate 110; the mounting block 210 is provided with mounting holes 211, and a plurality of mounting holes 211 are spaced apart in the left-right direction; A plurality of copper bottoms 220 are closely arranged in the left-right direction, and the copper bottoms 220 extend in the vertical direction. The copper bottoms 220 are arranged on the side of the back plate 110 facing the accommodating cavity 111; the contacting end surfaces of two adjacent copper bottoms 220 are each provided with a half hole that passes through from top to bottom, and the two half holes enclose a complete combined hole 221; A plurality of heat pipes 230 are arranged at intervals along the left-right direction; one end of the heat pipe 230 is inserted into the mounting hole 211 , and the other end is inserted into the combination hole 221 ; a metal powder layer 231 is sintered on the inner wall of the heat pipe 230 , and the heat pipe 230 is filled with coolant.

[0024] When the microcomputer is working, the electronic components therein continuously generate heat, which is transferred to the control board 120 and the mounting block 210 in turn. The heat on the mounting block 210 is transferred to the heat pipe 230. After the heat pipe 230 absorbs the heat, the coolant inside it evaporates into gas, which then flows in the heat pipe. When it comes into contact with the heat pipe with a lower temperature, it condenses into liquid, moves in the powder gaps of the metal powder layer 231, and refills to the position where the temperature was originally higher. At the same time, the heat pipe 230 exchanges heat with the copper bottom 220, and the temperature of the heat pipe 230 decreases. Since the traditional heat dissipation structure 200 is provided with two copper bottoms 220 parallel to the back plate 110, when the heat of the heat pipe 230 is transferred to the copper bottom 220 close to the back plate 110, the heat of the copper bottom 220 can be transferred to the back plate 110 only through a layer of silicone grease; when the heat is transferred to the copper bottom 220 far away from the back plate 110, the heat of the copper bottom 220 needs to pass through the silicone grease between the two copper bottoms 220 and the silicone grease between the copper bottom 220 and the back plate 110 before it can be transferred to the back plate 110. The present invention reduces a gap in the front and rear directions by changing the two copper bottoms 220 arranged parallel to the back plate 110 in the traditional heat dissipation structure 200 into multiple copper bottoms 220 perpendicular to the back plate 110, thereby reducing the use of silicone grease, making the heat on the copper bottom 220 more efficient in heat conduction when transferred to the back plate 110, thereby improving the heat dissipation efficiency and avoiding the operation of the micro host being affected by untimely heat dissipation.

[0025] In a further embodiment, a plurality of back plates 110 are provided, which are closely arranged in the left-right direction, and the plurality of back plates 110 correspond to a plurality of copper bottoms 220 respectively, and the back plates 110 and the corresponding copper bottoms 220 are integrally formed, and fins 112 are provided on the back plates 110 .

[0026] By providing fins 112 on the back plate 110, the contact area between the back plate 110 and the air is increased, thereby further improving the heat dissipation efficiency. Furthermore, since the copper bottom 220 and the back plate 110 are integrally formed, there is no gap between the two, and there is no need to fill the gap with silicone grease, so that the heat on the copper bottom 220 is quickly transferred to the back plate 110, thereby further improving the heat dissipation efficiency.

[0027] In a further embodiment, the fins 112 on two adjacent back plates 110 are staggered in the vertical direction, an angle exists between the extension direction of the fins 112 and the vertical direction, and the angle is non-right angle, and the inclination directions of the fins 112 on multiple back plates 110 are not completely consistent.

[0028] By setting the fins 112 in an inclined state, the surface area of ​​the fins 112 is increased, and the contact area between the air and the fins 112 is increased, thereby further improving the heat dissipation efficiency. When the flowing air contacts the fins 112, heat exchange occurs between the air and the fins 112. Since the fins 112 on the two adjacent back plates 110 are staggered in the vertical direction, when the air flows in the left and right directions, when it reaches the junction between the two adjacent back plates 110, it will collide with the fins 112 on the next back plate 110, causing turbulence, thereby destroying the boundary layer generated when the air flows through the fins 112, increasing the thermal conductivity between the fins 112 and the air, and thus improving the heat dissipation efficiency.

[0029] In a further embodiment, the end surface of the copper bottom 220 in contact with the adjacent copper bottom is an inclined surface, and there is an angle between the contact surface and the front-to-back direction. This facilitates the fixed connection of two adjacent copper bottoms 220. When the heat pipe 230 and the copper bottom 220 are spliced, the two are close to each other in the left-right direction. When the contact surface between the two adjacent copper bottoms 220 extends along the front-to-back direction, the heat pipe 230 and the copper bottom 220 will collide, resulting in damage to the heat pipe 230. In the present invention, there is an angle between the contact surface between the two adjacent copper bottoms 220 and the front-to-back direction, so that the contact area between the two adjacent copper bottoms 220 is larger, thereby improving the heat dissipation efficiency between the two adjacent copper bottoms 220; and when the copper bottom 220 and the heat pipe 230 are close to each other in the left-to-right direction, the copper bottom 220 guides the heat pipe 230 to avoid collision between the copper bottom 220 and the heat pipe 230, resulting in damage to the heat pipe 230.

[0030] In a further embodiment, a plurality of fixing units are arranged between two adjacent copper bottoms 220, and the plurality of fixing units are arranged at intervals in the vertical direction, and the fixing units are used to fix and connect two adjacent copper bottoms 220. Each fixing unit includes a threaded hole 222 and a bolt 223, and the copper bottom 220 is provided with a threaded hole 222 on one side close to the mounting block 210 and on one side close to the back plate 110, and the axes of the two threaded holes 222 on the side close to the mounting block 210 of the two adjacent copper bottoms 220 coincide, wherein a bolt 223 is threadedly connected; the axes of the two threaded holes 222 on the side close to the back plate 110 of the two adjacent copper bottoms 220 coincide, wherein a bolt 223 is threadedly connected; and there is a non-right angle between the axis of the threaded hole 222 and the left and right directions.

[0031] When the bolt 223 is screwed into the threaded hole 222, the gap between two adjacent copper bottoms 220 is gradually reduced, and the silicone grease filled between the heat pipe 230 and the copper bottom 220 is squeezed outward, avoiding the heat dissipation effect affected by excessive silicone grease filled between the heat pipe 230 and the copper bottom 220, thereby further improving the heat dissipation efficiency.

[0032] In a further embodiment, in the projection of the cross section of the copper bottom 220, the axis of the threaded hole 222 is located between the normal direction and the front-to-back direction of the contact surface of two adjacent copper bottoms 220. In the process of screwing the bolt 223 into the threaded hole 222, not only can the gap between the two adjacent copper bottoms 220 be gradually reduced, but also a component force pointing to the axis of the heat pipe 230 can be given to the thinner position of the copper bottom 220, so that the copper bottom 220 can better wrap the heat pipe 230, making the gap between the two smaller, further reducing the amount of silicone grease filled in the gap, and further improving the heat dissipation efficiency.

[0033] In a further embodiment, a sealing strip 224 is provided between two adjacent copper bottoms 220. The sealing strip 224 extends in the vertical direction and is provided between the heat pipe 230 and the threaded hole 222 on the side close to the back plate 110, and an angle is formed between the contact surface of the two adjacent copper bottoms 220. This prevents dust from passing through the back plate 110 and entering the gap between the copper bottom 220 and the heat pipe 230 to affect the heat dissipation effect. In the process of tightening the bolt 223, the silicone grease between the two adjacent copper bottoms 220 and between the copper bottom 220 and the heat pipe 230 is squeezed out only from the gap on the side facing the mounting block 210, so as to prevent the silicone grease from reaching the side of the back plate 110 where the fins 112 are provided and on the fins 112, making it difficult to remove and affecting the use.

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A passive heat dissipation structure of a micro host, characterized in that: The micro host comprises a housing, a back plate and a control board; the housing and the back plate are detachably fixedly connected, and the two define a receiving cavity, and the control board and the heat dissipation structure are installed in the receiving cavity; the control board and the back plate are parallel and spaced apart, and the electronic components are detachably installed on the control board; The heat dissipation structure includes a mounting block, a plurality of copper bases and a plurality of heat pipes; The mounting block is detachably fixedly connected to a side of the control panel away from the back panel; the mounting block is provided with mounting holes, and a plurality of mounting holes are spaced apart in the left-right direction; A plurality of copper bottoms are closely arranged in the left-right direction, the copper bottoms extend in the vertical direction, and the copper bottoms are arranged on the side of the back plate facing the accommodating cavity; the end surfaces of two adjacent copper bottoms in contact are each provided with a vertically penetrating half hole, and the two half holes enclose a complete combined hole; A plurality of heat pipes are arranged at intervals along the left-right direction; one end of the heat pipe is inserted into the mounting hole, and the other end is inserted into the combination hole; a metal powder layer is sintered on the inner wall of the heat pipe, and the heat pipe is filled with coolant.

2. A micro host passive heat dissipation structure according to claim 1, characterized in that: There are multiple back plates, which are closely arranged in the left-right direction. The multiple back plates correspond to the multiple copper bottoms respectively, and the back plates and the corresponding copper bottoms are integrally formed. Fins are arranged on the back plates.

3. A passive heat dissipation structure of a micro host according to claim 2, characterized in that: The fins on two adjacent back plates are staggered in the vertical direction.

4. A passive heat dissipation structure of a micro host according to claim 3, characterized in that: There is an angle between the extension direction of the fin and the vertical direction, and the angle is not a right angle.

5. A micro host passive heat dissipation structure according to claim 4, characterized in that: The inclination directions of the fins on multiple back panels are not completely consistent.

6. The passive heat dissipation structure of a micro host according to claim 5, characterized in that: The end surface of the copper bottom that contacts the adjacent copper bottom is an inclined surface, and an angle exists between the contact surface and the front-back direction.

7. The passive heat dissipation structure of a micro host according to claim 1, characterized in that: A plurality of fixing units are arranged between two adjacent copper bottoms. The plurality of fixing units are arranged at intervals along the vertical direction. The fixing units are used to fix and connect the two adjacent copper bottoms.

8. The passive heat dissipation structure of a micro host according to claim 3, characterized in that: Each fixing unit includes a threaded hole and a bolt. The copper bottom is provided with a threaded hole on one side close to the mounting block and on the other side close to the back plate. The axes of the two threaded holes of two adjacent copper bottoms close to the mounting block coincide with each other, and a bolt is connected to the threads therein. The axes of the two threaded holes of two adjacent copper bottoms close to the back plate coincide with each other, and a bolt is connected to the threads therein. There is a non-right angle between the axes of the threaded holes and the left and right directions.

9. The passive heat dissipation structure of a micro host according to claim 8, characterized in that: In the projection of the cross section of the copper bottom, the axis of the threaded hole is located between the normal direction and the front-to-back direction of two adjacent copper bottom contact surfaces.

10. The passive heat dissipation structure of a micro host according to claim 1, characterized in that: A sealing strip is arranged between two adjacent copper bottoms. The sealing strip extends in a vertical direction and is arranged between the heat pipe and the threaded hole close to one side of the back plate. There is an angle between the sealing strip and the contact surface of the two adjacent copper bottoms.

Images