Method for improving PCB forming burrs

Abstract

The invention discloses a method for improving PCB (Printed Circuit Board) molding burrs, which comprises the following steps of: arranging pins on a table board of a molding machine, and fixing a PCB on the table board through the pins; a milling inner groove is not divided, a one-cutting and milling connection mode is adopted, and the cutter diameter of a milling cutter is equal to the width of a milling groove minus (0.2-0.3) mm; and chamfering the right-angle part of the PCB unit board. According to the method for improving the PCB molding burrs, the burrs at the right angles can be effectively removed, and the jointed board routing quality is improved.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board manufacturing, and in particular to a method for improving PCB molding burrs. Background Art

[0002] PCB appearance gong board is the process of using a gong machine to gong out the specified panel pattern on the circuit board according to the pre-set gong belt through the milling cutter. In the prior art, the gong cutter moves horizontally and vertically during gong board. During the gong board process, the parameters such as tool diameter and gong cutter process are not designed reasonably, which is easy to produce burrs, especially at the right angles of the panel. The main reasons for the burrs at the right angles of the panel are: 1. The PCB board is positioned by pins. Since the positioning holes on the PCB board are not the same size as the pins, the gong cutter moves horizontally and vertically, that is, multiple gong boards. In this process, each gong board is different due to factors such as force and gong diameter, so the gong diameters in the horizontal and vertical directions are inconsistent, so burrs will be generated at the right angles; 2. Uneven tool wear or excessive tool wear will cause the cutting edge to be not sharp enough, which is easy to produce burrs at the right angles; 3. The gong cutter diameter has a certain influence on the PCB processing quality. If the cutter diameter is too large, the burrs at the right angles of the panel cannot be completely removed, thereby affecting the surface quality of the PCB and the subsequent assembly effect.

[0003] In view of this, it is necessary to provide a new process to improve PCB molding burrs. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a method for improving PCB molding burrs, which can effectively remove burrs at right angles and improve the quality of PCB gong plates.

[0005] The technical solution of the present invention is as follows:

[0006] A method for improving PCB molding burrs comprises the following steps:

[0007] Step S1, planting pins on the table of the molding machine, and fixing the PCB board on the table through the pins;

[0008] Step S2, forming the gong plate, wherein the inner groove of the gong is not cut by a knife, and a one-knife gong method is adopted, and the knife diameter of the gong knife = the width of the gong groove - (0.2-0.3) mm;

[0009] Step S3, chamfering the right angles of the PCB unit board.

[0010] Furthermore, the width of the gong groove is 0.8-1.8 mm.

[0011] Furthermore, for the circuit board with window design, the knife diameter of the gong knife = the groove width of the gong groove - 0.3mm.

[0012] Furthermore, in step S2, the right angles of the PCB unit board are chamfered, and the length of the chamfer line is 0.1-0.15 mm.

[0013] Compared with the prior art, the method for improving PCB molding burrs provided by the present invention has the following beneficial effects:

[0014] The method for improving PCB forming burrs provided by the present invention does not divide the inner groove of the gong and adopts a one-knife continuous gong method, and the gong plate is formed at one time, which reduces the error caused by multiple processing and improves the precision, thereby reducing the generation of burrs at right angles; by optimizing the parameters such as the gong knife diameter, the generation of burrs, especially burrs at right angles, is reduced. Through the forming process of the present invention, there is only a slight burr phenomenon at the right angle, and then chamfering is performed at the right angle, which can completely eliminate the burrs at the right angle, and the formed PCB unit board has no abnormal appearance, which improves the quality of the gong plate. DETAILED DESCRIPTION

[0015] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention and to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific implementation modes of the present invention are further described below.

[0016] It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each embodiment of the present invention described below can be combined with each other as long as there is no conflict between them.

[0017] A method for improving PCB molding burrs comprises the following steps:

[0018] Step S1, planting pins on the table of the molding machine, and fixing the PCB board on the table through the pins;

[0019] Step S2, forming the gong plate, wherein the inner groove of the gong is not cut by a knife, and a one-knife gong method is adopted, and the knife diameter of the gong knife = the width of the gong groove - (0.2-0.3) mm;

[0020] Among them, the groove width is 0.8-1.8mm. When there is free space in the sheet material, the spacing between the panels is designed to be ≥1.7mm. The diameter of the gong cutter is generally selected as the groove width-0.2mm. For example, the gong cutter diameter can be selected as 0.8mm, 1.0mm, 1.2mm, 1.4mm, or 1.6mm; when the circuit board is designed with a window, the gong cutter diameter = groove width-0.3mm.

[0021] During the gong process, the gong tool parameters are set according to the gong tool diameter, plate thickness, number of stacked plates and other parameters. The following are the parameters corresponding to different gong tool diameters, Z-axis compensation -0.5mm~1.2mm:

[0022]

[0023]

[0024] Step S3, chamfering the right angle of the PCB unit board to remove burrs at the right angle. Preferably, the right angle is chamfered, and the length of the chamfer line is 0.1-0.15mm.

[0025] In addition, the right angles can be rounded with a diameter of 0.15-0.2mm.

[0026] The method for improving PCB forming burrs provided by the present invention does not divide the inner groove of the gong into two cutters and adopts a one-cut continuous gong method. There are only slight burrs at the right angles, and then chamfering is performed at the right angles to completely eliminate the burrs at the right angles. The formed PCB unit board has no abnormal appearance, and the quality of the assembled gong board is improved.

[0027] The embodiments of the present invention are described in detail above, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations made to these embodiments without departing from the principles and spirit of the present invention are still within the protection scope of the present invention.

Claims

1. A method for improving PCB molding burrs, characterized in that: The steps include: Step S1, planting pins on the table of the molding machine, and fixing the PCB board on the table through the pins; Step S2, forming the gong plate, wherein the inner groove of the gong is not cut by a knife, and a one-knife gong method is adopted, and the knife diameter of the gong knife = the width of the gong groove - (0.2-0.3) mm; Step S3, chamfering the right angles of the PCB unit board.

2. The method for improving PCB molding burrs according to claim 1, characterized in that: The width of the gong groove is 0.8-1.8mm.

3. The method for improving PCB molding burrs according to claim 2, characterized in that: For circuit boards with window design, the diameter of the gong cutter = the width of the gong groove - 0.3mm.

4. The method for improving PCB molding burrs according to claim 1, characterized in that: In step S2, the right angles of the PCB unit board are chamfered, and the length of the chamfer line is 0.1-0.15 mm.

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