Light-emitting device with large angle and manufacturing method

Abstract

The invention discloses a large-angle light-emitting device and a manufacturing method. The large-angle light-emitting device comprises an LED support, and the LED support is provided with an LED chip and a convex packaging layer; the LED support comprises a substrate and a box dam, and the LED chip is arranged on the substrate and located in the box dam. The convex packaging layer comprises a first packaging adhesive layer, a second packaging adhesive layer, a third packaging adhesive layer, a first particle layer and a second particle layer. By arranging the first packaging adhesive layer and the second packaging adhesive layer which are filled with the particles, and the first particle layer and the second particle layer which are higher than the box dam, more light in the center of the LED chip can be refracted to the periphery, the light emitting angle is increased, and meanwhile, the intensity of light transmitted by the particles is high, and the light loss is small.

Description

Technical Field

[0001] The present invention belongs to the technical field of LED packaging, and in particular relates to a light-emitting device with a large angle and a manufacturing method thereof. Background Art

[0002] With the development of society and the improvement of people's living standards, consumers have put forward higher and higher requirements for the color saturation, color reproduction, contrast and other display indicators of TV. The new HDR (High Dynamic Range) display with high contrast, high resolution and high color gamut has greatly promoted the display effect of LCD. HDR on the market is realized through Local Dimming technology. HDR TV can be divided into three types according to the number of backlight partitions: high partition, medium partition and low partition. Among them, the high partition has more than 1000 partitions, with high brightness, thinness and picture quality comparable to OLED, but its price is expensive. Generally, flagship high-end models, generally high partition backlight source is mainly Mini COB as the product form. The medium partition is between 500-1000 partitions, with high brightness, and its picture quality is also better than traditional LCD display, with moderate price, and the medium partition backlight source is mainly Mini POB as the product form. The low partition is 100-500 partitions. Due to the reduction in the number of partitions, the corresponding cost is greatly reduced. At the same time, the display effect is also better than the traditional LCD backlight, which is closer to mass consumption. The main product form of low-partition backlight is Mini POB. Generally, blue LED is matched with quantum film to form white light, which requires a larger angle of LED. At present, a layer of white glue light-blocking layer is covered on the surface of the lamp bead, which will cause too much loss of central light flux and low brightness; or a semi-transparent and semi-reflective layer is covered on the lamp bead to reduce the loss of central light flux, but at the same time the angle is also reduced, resulting in a smaller pitch / OD ratio, poor product experience and the number of lamp beads used. Summary of the invention

[0003] In order to overcome the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a light-emitting device with a large angle, which can reduce the loss of central light flux while ensuring a large light-emitting angle.

[0004] In order to achieve the purpose, the technical solution adopted by the present invention is as follows:

[0005] A light emitting device with a large angle, comprising an LED bracket, on which an LED chip and a convex packaging layer are arranged;

[0006] The LED bracket comprises a substrate and a dam, and the LED chip is arranged on the substrate and is located in the dam;

[0007] The convex packaging layer includes a first packaging glue layer, a second packaging glue layer, a third packaging glue layer, a first particle layer and a second particle layer. The first packaging glue layer and the second packaging glue layer are arranged in the dam. The first packaging glue layer is relatively arranged below the second packaging glue layer, and the first packaging glue layer covers the LED chip. The first particle layer is arranged on the top of the second packaging glue layer. The third packaging glue layer is relatively arranged above the dam and covers the first particle layer. The second particle layer is arranged on the top of the third packaging glue layer.

[0008] Preferably, the first particle layer and the second particle layer are in the shape of round spheres.

[0009] Preferably, the first particle layer and the second particle layer are hollow structures.

[0010] Preferably, the cross section of the first particle layer is annular, the cross section of the second particle layer is circular, and the second particle layer is located inside the annular shape of the first particle layer in a top view.

[0011] Preferably, the numerical particle size of the particles in the first particle layer is 15-65 μm, and the numerical particle size of the particles in the second particle layer is 65-115 μm.

[0012] Preferably, the colors of the first particle layer and the second particle layer are white, and the particle materials of the first particle layer and the second particle layer are gray borosilicate or SiO2 or Zn0 or Al30.

[0013] Preferably, the dam is transparent or translucent.

[0014] Preferably, the third packaging adhesive layer is in a semi-convex shape.

[0015] The present invention also includes a method for manufacturing a light-emitting device with a large angle, which is used to manufacture the light-emitting device with a large angle as described above, and the steps are as follows:

[0016] S1, placing the LED chip on the LED bracket;

[0017] S2, covering the LED chip with the first packaging adhesive layer;

[0018] S3, disposing the second encapsulation adhesive layer filled with particles above the first encapsulation adhesive layer, and baking the second encapsulation adhesive layer to form the first particle layer on the top of the second encapsulation adhesive layer;

[0019] S4, disposing the third packaging glue layer filled with particles above the second packaging glue layer, and baking the third packaging glue layer to form the second particle layer on the top of the third packaging glue layer.

[0020] Preferably, in step S2, phosphor powder is provided in the first packaging adhesive layer, and the phosphor powder is precipitated by a centrifugal process, or the phosphor powder is treated by a suspension process.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The light-emitting device with a large angle proposed by the present invention can refract more light from the center of the LED chip to the surrounding area by providing a first encapsulation glue layer and a second encapsulation glue layer filled with particles, and a first particle layer and a second particle layer higher than the dam, thereby improving the light-emitting angle. At the same time, the intensity of the light transmitted by the particles is high and the light loss is small. The two-layer structure can reduce the loss of brightness while improving the light-emitting angle. At the same time, the first particle layer covers the light-emitting surface of the LED chip to obtain a more uniform color and ensure the consistency of light emission. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0024] Figure 1 is a cross-sectional structural diagram of the first embodiment of the present invention;

[0025] Figure 2 is a cross-sectional structural diagram of the second embodiment of the present invention;

[0026] Figure 3 It is a cross-sectional structural diagram of the third embodiment of the present invention;

[0027] Figure 4 is a cross-sectional structural diagram of a fourth embodiment of the present invention;

[0028] Figure 5 It is a structural diagram of the first embodiment of the present invention when viewed from above.

[0029] Description of reference numerals:

[0030] 1. LED chip; 2. substrate; 3. dam; 4. first encapsulation adhesive layer; 5. second encapsulation adhesive layer; 6. third encapsulation adhesive layer; 7. first particle layer; 8. second particle layer. DETAILED DESCRIPTION

[0031] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present invention, and the embodiments described are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present invention.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0033] Embodiment 1:

[0034] like Figure 1 and Figure 5 , a light emitting device with a large angle, comprising an LED bracket, on which an LED chip 1 and a convex packaging layer are arranged;

[0035] The LED bracket comprises a substrate 2 and a dam 3, and the LED chip 1 is arranged on the substrate 2 and in the dam 3;

[0036] The convex packaging layer includes a first packaging glue layer 4, a second packaging glue layer 5, a third packaging glue layer 6, a first particle layer 7 and a second particle layer 8. The first packaging glue layer 4 and the second packaging glue layer 5 are arranged in the dam 3. The first packaging glue layer 4 is relatively arranged below the second packaging glue layer 5, and the first packaging glue layer 4 covers the LED chip 1. The first particle layer 7 is arranged on the top of the second packaging glue layer 5. The third packaging glue layer 6 is relatively arranged above the dam 3 and covers the first particle layer 7. The second particle layer 8 is arranged on the top of the third packaging glue layer 6.

[0037] This embodiment provides a first encapsulation glue layer 4 and a second encapsulation glue layer 5 filled with particles, and a first particle layer 7 and a second particle layer 8 higher than the dam 3, so that the light from the center of the LED chip 1 can be refracted more to the surroundings, thereby improving the light-emitting angle. At the same time, the intensity of the light transmitted by the particles is high and the light loss is small. The two-layer structure can reduce the loss of brightness while improving the light-emitting angle. At the same time, the first particle layer 7 covers the light-emitting surface of the LED chip 1 to obtain a more uniform color and ensure the consistency of light emission.

[0038] Specifically, the first particle layer 7 and the second particle layer 8 are in the shape of round spheres.

[0039] Specifically, the first particle layer 7 and the second particle layer 8 are hollow structures.

[0040] Specifically, the cross section of the first particle layer 7 is in the shape of a circular ring, and the cross section of the second particle layer 8 is in the shape of a circle. In a plan view, the second particle layer 8 is located inside the circular ring of the first particle layer 7 .

[0041] Specifically, the particle size of the particles in the first particle layer 7 is 15-65 μm, and the particle size of the particles in the second particle layer 8 is 65-115 μm.

[0042] Specifically, the colors of the first particle layer 7 and the second particle layer 8 are white, and the particle materials of the first particle layer 7 and the second particle layer 8 are gray borosilicate or SiO2 or Zn0 or Al30.

[0043] Specifically, the dam 3 is transparent or semi-transparent.

[0044] Specifically, the third packaging adhesive layer 6 is in a semi-convex shape.

[0045] Among them, the distance between the top of the second encapsulation glue layer 5 and the top of the dam 3 is 0-100μm, and the top of the second encapsulation glue layer 5 is a planar structure, so that the first particle layer 7 forms a flat cup structure, so that the particles of the first particle layer 7 are evenly covered to obtain more uniform color and luminous consistency.

[0046] Also included is a method for manufacturing a light-emitting device with a large angle, which is used to manufacture the light-emitting device with a large angle, and the steps are as follows:

[0047] S1, placing the LED chip 1 on the LED bracket;

[0048] S2, covering the LED chip 1 with a first encapsulation adhesive layer 4, providing phosphor in the first encapsulation adhesive layer 4, sedimenting the phosphor by a centrifugal process, and putting the first encapsulation adhesive layer 4 in a cured or semi-cured state by a quick baking process;

[0049] S3, disposing a second encapsulation adhesive layer 5 filled with particles on the first encapsulation adhesive layer 4 by dispensing, and baking the second encapsulation adhesive layer 5 to form a first particle layer 7 on the top of the second encapsulation adhesive layer 5, and covering the light-emitting surface of the LED chip 1;

[0050] S4. A third encapsulation adhesive layer 6 filled with particles is arranged above the second encapsulation adhesive layer 5 by dispensing, so that the third encapsulation adhesive layer 6 covers the light-emitting surface of the LED chip 1 and forms a semi-convex shape, and the third encapsulation adhesive layer 6 is baked to form a second particle layer 8 on the top of the third encapsulation adhesive layer 6.

[0051] Meanwhile, the transparent encapsulating glue of the encapsulating glue layer can be made of, but not limited to, a light-transmitting thixotropic silicone resin. The LED bracket can adopt a solution of a transparent bracket with light emission on four sides, and is formed on the substrate 2 by thermoplastic means. The transparent bracket can generally be made of, but not limited to, transparent or translucent plastic materials, such as PPA (poly(p-phenylene terephthalamide), PCT (poly(ethylene terephthalate)), thermoplastic resin, etc.

[0052] Embodiment 2:

[0053] like Figure 2 The difference from the first embodiment is that the second encapsulation glue layer 5 is a slightly convex circular structure, so that the first particle layer 7 is slightly convex circular and covers the light emitting surface.

[0054] Embodiment three:

[0055] like Figure 3 The difference from the first embodiment is that the phosphor in the first packaging glue layer 4 is processed by a suspension process to increase the excitation efficiency of the phosphor and reduce the amount of the phosphor.

[0056] Embodiment 4:

[0057] like Figure 4 , the LED chip 1 is a structure in which the LED chip 1 is mounted upright.

[0058] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment according to the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A light emitting device with a large angle, characterized in that: It comprises an LED bracket, on which an LED chip and a convex packaging layer are arranged; The LED bracket comprises a substrate and a dam, and the LED chip is arranged on the substrate and is located in the dam; The convex packaging layer includes a first packaging glue layer, a second packaging glue layer, a third packaging glue layer, a first particle layer and a second particle layer. The first packaging glue layer and the second packaging glue layer are arranged in the dam. The first packaging glue layer is relatively arranged below the second packaging glue layer, and the first packaging glue layer covers the LED chip. The first particle layer is arranged on the top of the second packaging glue layer. The third packaging glue layer is relatively arranged above the dam and covers the first particle layer. The second particle layer is arranged on the top of the third packaging glue layer.

2. The light emitting device with a large angle according to claim 1, characterized in that: The first particle layer and the second particle layer are in the shape of a round sphere.

3. The light emitting device with a large angle according to claim 1, characterized in that: The first particle layer and the second particle layer are hollow structures.

4. The light emitting device with a large angle according to claim 1, characterized in that: The cross section of the first particle layer is annular, the cross section of the second particle layer is circular, and the second particle layer is located inside the annular shape of the first particle layer in a plan view.

5. The light emitting device with a large angle according to claim 1, characterized in that: The numerical particle size of the particles in the first particle layer is 15-65 μm, and the numerical particle size of the particles in the second particle layer is 65-115 μm.

6. The light emitting device with a large angle according to claim 1, characterized in that: The colors of the first particle layer and the second particle layer are white, and the particle materials of the first particle layer and the second particle layer are gray borosilicate or SiO2 or Zn0 or Al30.

7. The light emitting device with a large angle according to claim 1, characterized in that: The dam is transparent or translucent.

8. The light emitting device with a large angle according to claim 1, characterized in that: The third packaging adhesive layer is in a semi-convex shape.

9. A method for manufacturing a light emitting device with a large angle, characterized in that: The steps for manufacturing the light-emitting device with a large angle as described in any one of claims 1 to 8 are as follows: S1, placing the LED chip on the LED bracket; S2, covering the LED chip with the first packaging adhesive layer; S3, disposing the second encapsulation adhesive layer filled with particles above the first encapsulation adhesive layer, and baking the second encapsulation adhesive layer to form the first particle layer on the top of the second encapsulation adhesive layer; S4, disposing the third packaging glue layer filled with particles above the second packaging glue layer, and baking the third packaging glue layer to form the second particle layer on the top of the third packaging glue layer.

10. The method for manufacturing a light emitting device with a large angle according to claim 9, characterized in that: In step S2, phosphor powder is disposed in the first packaging adhesive layer, and the phosphor powder is precipitated by a centrifugal process or treated by a suspension process.

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