Display panel, preparation method thereof and electronic equipment

Abstract

The invention provides a display panel, a preparation method thereof and electronic equipment, the display panel comprises a binding assembly, a display assembly, a plurality of second electrodes and a laminated structure, the binding assembly comprises a plurality of first electrodes which are sequentially arranged at intervals, the display assembly comprises a plurality of second electrodes which are sequentially arranged at intervals, and the laminated structure comprises a base layer, a supporting glue layer and a supporting film layer which are sequentially laminated. The second electrode is arranged on the surface of the base layer deviating from the supporting adhesive layer; the conductive adhesive layer is located in a press fit area between the binding assembly and the display assembly, the press fit area comprises a first area and a second area, projection planes of the first electrode and the second electrode on the conductive adhesive layer are located in the first area and the second area, and the third area is located between the first area and the second area; the display panel further comprises an anti-arching structure, and at least part of the projection plane of the anti-arching structure on the conductive adhesive layer is located in the third area. The anti-arching structure effectively prevents the problem that the supporting adhesive layer is softened and deformed during hot pressing to cause arching of the base layer.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel, a preparation method thereof, and an electronic device. Background Art

[0002] In the COP (Chip On Pi) process of the display panel, anisotropic conductive adhesive (ACF) is used to bind the chip (IC) to the predetermined position of the substrate. During binding, a pressure head is used to press the chip and apply pressure. Under high temperature and high pressure conditions, the anisotropic conductive adhesive is crushed, and the metal conductive particles inside it make the electrodes (conductive ends) on the IC and the electrodes (conductive ends) on the substrate conductive.

[0003] For flexible display panels, at high temperatures (such as 160°C), the glue layer inside the display panel softens, and the chip (IC) causes the glue layer to bulge and deform during the pressing process. The deformation of the glue layer will cause the base layer to bulge and deform, resulting in defective display panel products. Summary of the invention

[0004] The object of the present invention is to provide a display panel, a method for manufacturing the same, and an electronic device, so as to solve the problem in the prior art that the display panel product is defective due to the arching and deformation of the glue layer in the COP process.

[0005] To achieve the above purpose, the technical solution provided by the present invention is as follows:

[0006] In a first aspect, a display panel includes:

[0007] The binding component includes a plurality of first electrodes arranged in sequence and at intervals.

[0008] The display component comprises a plurality of second electrodes arranged in sequence and spaced apart from each other, and a laminated structure, wherein the laminated structure comprises a base layer, a supporting adhesive layer, and a supporting film layer stacked in sequence, and the second electrode is arranged on a surface of the base layer away from the supporting adhesive layer;

[0009] A conductive adhesive layer, the conductive adhesive layer is located in a lamination area between the binding component and the display component, and the lamination area includes:

[0010] a first region and a second region, the projection surfaces of the first electrode and the second electrode on the conductive adhesive layer are located in the first region and the second region,

[0011] a third region, the third region being located between the first region and the second region;

[0012] The display panel further includes:

[0013] An anti-arch structure, wherein at least a portion of a projection surface of the anti-arch structure on the conductive adhesive layer is located in the third area.

[0014] Furthermore, the anti-arch structure comprises:

[0015] At least one accommodating cavity is provided on the supporting adhesive layer and / or the supporting film layer.

[0016] Further, the anti-arch structure includes a heat insulation layer arranged between the base layer and the supporting adhesive layer, the heat insulation layer is arranged on the surface of the base layer facing the supporting adhesive layer, and the heat insulation layer is bonded to the supporting adhesive layer; or,

[0017] A heat-conducting layer is disposed between the base layer and the supporting adhesive layer, the heat-conducting layer is disposed on the surface of the base layer facing the supporting adhesive layer, and the heat-insulating layer is bonded to the supporting adhesive layer; or

[0018] The heat-conducting layer and the heat-insulating layer are arranged between the base layer and the supporting adhesive layer, wherein:

[0019] The heat-conducting layer is arranged on the surface of the base layer facing the supporting adhesive layer, the heat-insulating layer is arranged on the surface of the heat-conducting layer facing the supporting adhesive layer, and the heat-insulating layer is bonded to the supporting adhesive layer.

[0020] Further, the anti-arch structure includes a first anti-arch rubber block arranged on the binding component, the projection surface of the first anti-arch rubber block on the conductive adhesive is located in the third area, and the first anti-arch rubber block is protrudingly arranged on the surface of the binding component facing the pressing area; or,

[0021] The anti-arch structure comprises a second anti-arch rubber block arranged on the display assembly, the projection surface of the second anti-arch rubber block on the conductive rubber is located in the third area, and the second anti-arch rubber block is protrudingly arranged on the surface of the base layer facing the pressing area; or,

[0022] The anti-arch structure includes a first anti-arch rubber block arranged on the binding component, and a second anti-arch rubber block arranged on the display component, wherein:

[0023] The first anti-arch rubber block is protrudingly arranged on the surface of the binding component facing the pressing area, the second anti-arch rubber block is protrudingly arranged on the surface of the base layer facing the pressing area, and the projection surfaces of the first anti-arch rubber block and the second anti-arch rubber block on the conductive rubber are located in the third area.

[0024] Furthermore, the anti-arch structure includes a support block arranged between the binding component and the display component, and a projection surface of the support block on the conductive adhesive layer is located in the third area.

[0025] In a second aspect, a method for preparing a display panel is provided, the method comprising:

[0026] A binding assembly is provided, the binding assembly comprising a plurality of first electrodes arranged in sequence and at intervals,

[0027] A display component is prepared, wherein the display component includes a plurality of second electrodes arranged in sequence and a stacked structure, wherein the stacked structure includes a base layer, a supporting adhesive layer, and a supporting film layer stacked in sequence, an anti-arch structure is formed on the binding component and / or the display component, a pressing area is provided between the binding component and the display component, the pressing area includes a first area, a second area, and a third area located between the first area and the area, and the projection surfaces of the first electrode and the second electrode on the conductive adhesive layer are located in the first area and the second area,

[0028] A conductive adhesive layer is attached to the surface of the display component facing the binding component, and a projection surface of the anti-arch structure on the conductive adhesive layer is at least partially located in the third area.

[0029] The binding component is pressed down to fit with the display component based on a thermal compression head, so that the first electrode on the binding component and the second electrode on the display component are correspondingly connected to achieve electrical conduction.

[0030] Furthermore, the preparation method comprises:

[0031] A supporting adhesive layer is coated on the surface of the base layer away from the binding component.

[0032] A receiving cavity is etched on the surface of the supporting adhesive layer facing away from the binding component.

[0033] Providing a supporting film layer, and laminating the supporting film layer to the surface of the supporting adhesive layer with the accommodating cavity; or coating a supporting adhesive layer on the surface of the base layer away from the binding component,

[0034] Providing a supporting film layer, etching a receiving cavity on a surface of the supporting film layer facing the binding component,

[0035] Laminating the surface of the supporting film layer with the accommodating cavity to the supporting adhesive layer; or,

[0036] A supporting adhesive layer is coated on the surface of the base layer away from the binding component.

[0037] A receiving cavity is etched on the surface of the supporting adhesive layer facing away from the binding component.

[0038] A supporting film layer is provided, and a receiving cavity is also etched on the surface of the supporting film layer facing the binding component.

[0039] The surface of the supporting film layer with the accommodating cavity is laminated with the surface of the supporting adhesive layer with the accommodating cavity.

[0040] Furthermore, the preparation method comprises:

[0041] Providing a heat-insulating layer, and applying the heat-insulating layer to the surface of the base layer facing away from the binding component,

[0042] A supporting adhesive layer is applied on the surface of the heat insulation layer away from the binding component.

[0043] Providing a supporting film layer, and laminating the supporting film layer to the surface of the supporting adhesive layer facing away from the binding component; or,

[0044] Providing a heat-conducting layer, and attaching the heat-conducting layer to the surface of the base layer away from the binding component,

[0045] A supporting adhesive layer is coated on the surface of the heat conductive layer facing away from the binding component.

[0046] Providing a supporting film layer, and laminating the supporting film layer to the surface of the supporting adhesive layer facing away from the binding component; or,

[0047] Providing a heat-conducting layer, and applying the heat-conducting layer to a surface of the binding component facing away from the binding component;

[0048] Providing a heat-insulating layer, and attaching the heat-insulating layer to the surface of the heat-conducting layer facing away from the binding assembly;

[0049] Coating a supporting adhesive layer on the surface of the heat insulation layer on the side away from the binding component;

[0050] A supporting film layer is provided, and the supporting film layer is bonded to a surface of the supporting adhesive layer that is away from the binding component.

[0051] Furthermore, the preparation method comprises:

[0052] Prepare a first anti-arching rubber block on the surface of the binding component facing the pressing area; or,

[0053] Prepare a second anti-arching rubber block on the surface of the display assembly facing the lamination area; or,

[0054] A first anti-arching rubber block is prepared on the surface of the binding component facing the pressing area, and a second anti-arching rubber block is prepared on the surface of the display component facing the pressing area.

[0055] Furthermore, a support block is provided and placed in a pressing area between the binding component and the display component.

[0056] In a third aspect, an electronic device includes the above-mentioned display panel.

[0057] It can be seen from the above content that the inkjet printing device and display panel preparation method provided by this solution have the following advantages:

[0058] A receiving cavity is provided in the area between the supporting glue layer and the supporting film layer, and the supporting glue layer is gathered in the receiving cavity during the pressing process of the IC, thereby solving the problem of the supporting glue layer being deformed and arched due to heat extrusion, and further avoiding the problem of the film layer breaking in the COP area of ​​the display panel;

[0059] A heat-conducting layer and a heat-insulating layer structure are arranged between the base layer and the supporting adhesive layer. The heat of the hot pressing head is conducted outwards through the heat-conducting layer, and the heat is isolated by the heat-insulating layer to reduce the heating of the supporting adhesive layer and prevent excessive heat from being conducted to the supporting adhesive layer and causing the supporting adhesive layer to soften.

[0060] An anti-arch glue is arranged between the binding component and the display component in the COP area of ​​the display panel, and the film layer in the COP area is pressed by the anti-arch glue to avoid the problem of the supporting glue layer being squeezed and arched due to heat.

[0061] A support block with high hardness (modulus) is arranged between the binding component and the display component in the COP area of ​​the display panel, and the film layer in the COP area is pressed by the support block to avoid the problem of the support adhesive layer being squeezed and arched due to heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0063] Figure 1 This is a schematic diagram of the structure of the binding components in the binding area of ​​a traditional display panel before hot pressing.

[0064] Figure 2 This is a schematic diagram of the structure of the binding components in the binding area of ​​a traditional display panel after hot pressing.

[0065] Figure 3 Schematic diagram showing the distribution of the first electrode at the conductive end of the chip.

[0066] Figure 4 It is a schematic diagram of a first structure of a display panel binding area in an embodiment of the present invention.

[0067] Figure 5 It is a schematic diagram of a second structure of a display panel binding area in an embodiment of the present invention.

[0068] Figure 6Schematic diagram of a third structure of a display panel binding area in an embodiment of the present invention.

[0069] Figure 7 It is a schematic diagram of a first structure of a display panel binding area in another embodiment of the present invention.

[0070] Figure 8 It is a schematic diagram of a second structure of a display panel binding area in another embodiment of the present invention.

[0071] Fig. 9 A schematic diagram of a third structure of a display panel binding area in another embodiment of the present invention

[0072] Fig.10 It is a schematic diagram of a first structure of a display panel binding area in yet another embodiment of the present invention.

[0073] Fig.11 It is a schematic diagram of a second structure of a display panel binding area in yet another embodiment of the present invention.

[0074] Fig.12 A third structural diagram of a display panel binding area in another embodiment of the present invention

[0075] Fig.13 FIG. 4 is a schematic diagram of the structure of the binding area of ​​a display panel in yet another embodiment of the present invention.

[0076] Fig.14 FIG. 4 is a flow chart of a method for manufacturing a display panel in an embodiment of the present invention.

[0077] Fig.15 FIG. 4 is a flow chart of a first method of manufacturing a display panel in an embodiment of the present invention.

[0078] Fig.16 FIG. 4 is a flow chart of a second method of manufacturing a display panel in an embodiment of the present invention.

[0079] Fig.17 FIG. 4 is a flow chart of a third method of manufacturing a display panel in an embodiment of the present invention.

[0080] Fig.18 FIG. 4 is a flow chart of a first method of manufacturing a display panel in another embodiment of the present invention.

[0081] Fig.19 The flowchart of the second method of manufacturing a display panel in another embodiment of the present invention is shown.

[0082] Fig. 20 FIG. 4 is a flow chart of a third method of manufacturing a display panel in another embodiment of the present invention.

[0083] Fig.21The flowchart of the first method of manufacturing a display panel in another embodiment of the present invention is shown.

[0084] Fig. 22 This is a flow chart of a second method of manufacturing a display panel in yet another embodiment of the present invention.

[0085] Fig.23 This is a flow chart of a third method of manufacturing a display panel in yet another embodiment of the present invention.

[0086] Fig.24 The flowchart of the first method of manufacturing a display panel in another embodiment of the present invention is shown.

[0087] The components in the figure are shown as follows:

[0088] 1. Binding component; 3. Display component; 31. Base layer; 32. Supporting adhesive layer; 33. Supporting film layer; 4. Conductive adhesive layer; 5. First accommodating cavity; 6. Second accommodating cavity; 7. Thermal conductive layer; 8. Thermal insulating layer; 9. First anti-arching rubber block; 10. Second anti-arching rubber block; 11. Supporting block; 12. Pressing head.

[0089] 100, first area; 200, second area; 300, third area.

[0090] A, first electrode; B, second electrode. DETAILED DESCRIPTION

[0091] The preferred embodiments of the present invention are described below with reference to the drawings in the specification to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied through many different forms of embodiments of the invention, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0092] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0093] In addition, the following descriptions of the various embodiments of the invention are made with reference to the attached diagrams to illustrate specific embodiments of the invention that the present invention can be implemented with. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0094] When some components are described as being "on" another component, the component may be directly placed on the other component; there may also be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "mounted on" or "connected to" another component, the two may be understood to be directly "mounted on" or "connected", or one component may be indirectly "mounted on" or "connected to" another component via an intermediate component.

[0095] Overview

[0096] As described in the background technology, in the COP process of the display panel (such as the IC and screen line binding process of mobile phone products), anisotropic conductive adhesive (ACF) is used to press the IC (chip) under a large pressure in a high temperature environment. After the anisotropic conductive adhesive (ACF) is crushed, the metal conductive particles inside it can connect and conduct the first electrode A on the IC and the second electrode B on the display component. Figure 1 As shown, the structural distribution of the COP area of ​​the display panel before IC thermal pressing.

[0097] In the COP process, in order to ensure that the ACF has good fluidity, it is necessary to use a large pressure to press the IC under a high temperature environment. However, the high temperature generated by the thermal press head 12 will be transmitted to the supporting glue layer of the display component, and the supporting glue layer will soften under the action of the high temperature. Figure 2 As shown, during the IC pressing process, the first electrode (conductive end) of the IC and the second electrode (conductive end) of the display component are connected and conducted, and the softened glue between the two electrodes gathers toward the middle area, causing the supporting glue layer in the middle area to arch upward, thereby causing the base layer in the middle area to warp upward, resulting in the problem of screen film layer breaking, causing defective display panel products.

[0098] In view of the above problems, the inventors have improved the structure of the display panel, including providing an anti-arch structure in the middle area between the two electrodes of the display panel, so as to prevent the supporting adhesive layer in the middle area from arching upward, thereby fundamentally solving the problem of defective base products caused by the fracture of the screen film layer. The anti-arch structure includes the following:

[0099] Structure 1: The anti-arch structure includes at least one accommodating cavity, which is opened on the supporting glue layer and / or the supporting film layer, that is, by opening the accommodating cavity in the area between the supporting glue layer and the supporting film layer, the accommodating cavity can be opened on the surface of the supporting glue layer, and can also be opened on the surface of the supporting film layer. At the same time, the accommodating cavity can be opened on the surface of the supporting glue layer and the supporting film layer at the same time. During the IC pressing process, the supporting glue layer is gathered into the accommodating cavity, thereby solving the problem of the supporting glue layer being deformed and arched due to heat extrusion, and further avoiding the problem of film layer breakage in the COP area of ​​the display panel.

[0100] Structure 2: By setting a heat-conducting layer and a heat-insulating layer structure between the base layer and the supporting adhesive layer, only a heat-insulating layer can be set between the base layer and the supporting adhesive layer, or only a heat-conducting layer can be set between the base layer and the supporting adhesive layer, or both a heat-conducting layer and a heat-insulating layer can be set between the base layer and the supporting adhesive layer. The function of the heat-conducting layer is to conduct the heat of the hot pressing head outward, and the function of the heat-insulating layer is to isolate the heat and prevent the heat from being conducted to the supporting adhesive layer. The above method can reduce the heat of the supporting adhesive layer as much as possible, and prevent excessive heat from being conducted to the supporting adhesive layer to cause the supporting adhesive layer to soften. If the supporting adhesive layer is not softened, it can avoid arching and deformation due to force, thereby solving the problem of film breakage in the COP area of ​​the display panel.

[0101] Structure three: Anti-arch glue is set between the binding component and the display component in the COP area of ​​the display panel. The anti-arch glue can be only attached to the surface of the binding component, or only attached to the surface of the display component, or attached to the surface of both the binding component and the display component. The anti-arch glue presses the film layer in the COP area to prevent the supporting glue layer from arching due to heat extrusion, thereby solving the problem of film layer breakage in the COP area of ​​the display panel.

[0102] Structure 4: By setting a support block with higher hardness between the binding component and the display component in the COP area of ​​the display panel, the film layer in the COP area is pressed by the support block to prevent the supporting glue layer from being squeezed and arched due to heat, thereby solving the problem of film layer breakage in the COP area of ​​the display panel.

[0103] It should be noted that the anti-arch structure in the present solution may be any one of the above four structures, or a combination of any two, three, or four of the four structures.

[0104] Based on the above concept, the present application will be exemplarily described below in conjunction with the accompanying drawings.

[0105] Exemplary Display Panel Structures

[0106] An embodiment provides a display panel, the display panel comprising:

[0107] A chip (IC), which is a binding component 1 of a display panel, and includes a plurality of first electrodes A arranged in sequence and at intervals;

[0108] The display component 3 includes a laminated structure in which a base layer 31, a supporting adhesive layer 32 and a supporting film layer 33 are stacked in sequence. A plurality of second electrodes B connected to the screen body circuits are arranged in sequence and spaced apart from each other on the upper surface of the base layer 31. The second electrodes B correspond to the first electrodes A in upper and lower directions, and the layout distribution of the second electrodes B is the same as that of the first electrodes.

[0109] ACF (anisotropic conductive adhesive layer 4), the conductive adhesive layer 4 is located in the lamination area between the binding component 1 and the display component 3, the lamination area includes a first area 100, a second area 200 and a third area 300, wherein the first area 100 and the second area 200 are located on the left and right sides respectively,

[0110] The first region 100 and the second region 200 are regions where the first electrode A and the second electrode B are connected and conductive. The third region 300 is a region between the first region 100 and the second region 200, and is a region between two adjacent conductive electrodes. For example, the distribution of the conductive end first electrode A of the chip is shown in FIG. Figure 3 As shown, the third region 300 is the region between the upper and lower rows of electrodes, and the portion where the supporting adhesive layer 32 is squeezed and deformed and arched due to the heat on both sides corresponds to the third region 300, that is, Figure 3 The easy arching area G

[0111] The anti-arch structure has a projection surface on the conductive adhesive layer 4 at least partially located in the third area 300 .

[0112] In some embodiments, Figure 4 As shown, the anti-arch structure includes at least one accommodating cavity. Specifically, a first accommodating cavity 5 is opened on the surface of the supporting adhesive layer 32 facing away from the binding component 1. When the supporting adhesive layer 32 is softened by heat and squeezed on both sides, the adhesive in the third area can be gathered in the first accommodating cavity 5, thereby effectively preventing the third area of ​​the supporting adhesive layer 32 from deforming and arching.

[0113] In some embodiments, Figure 5 As shown, the anti-arch structure includes at least one accommodating cavity. Specifically, a second accommodating cavity 6 is opened on the surface of the supporting film layer 33 facing the binding component 1. When the conductive adhesive layer 4 is softened by heat and squeezed on both sides, the glue in the third area can be gathered in the second accommodating cavity 6, thereby effectively avoiding deformation and arching of the third area of ​​the conductive adhesive layer 4.

[0114] In some embodiments, Figure 6 As shown, a first accommodating cavity 5 is opened on the surface of the side of the supporting adhesive layer 32 facing away from the binding component 1, and a second accommodating cavity 6 is opened on the surface of the supporting film layer 33 facing the binding component 1. When the conductive adhesive layer 4 is softened by heat and squeezed on both sides, the adhesive in the third area 300 can be gathered in the first accommodating cavity 5 and the second accommodating cavity 6, thereby effectively avoiding deformation and arching of the third area 300 of the conductive adhesive layer 4.

[0115] It should be noted that the number of the first accommodating chamber 5 and the second accommodating chamber 6 can be one or more, and the shapes of the first accommodating chamber 5 and the second accommodating chamber 6 are not limited, and can be rectangular or any other shape. The opening positions of the first accommodating chamber 5 and the second accommodating chamber 6 are distributed within the third area after the first electrode A and the second electrode B are conductive, that is, within the third area 300. When the first accommodating chamber 5 and the second accommodating chamber 6 are opened at the same time, the two accommodating chambers can correspond to each other in the upper and lower positions, or can be staggered and separated.

[0116] In some embodiments, Figure 7 As shown, the anti-arch structure includes a heat insulation layer 8 arranged between the base layer 31 and the supporting adhesive layer 32. The heat insulation layer 8 is arranged on the surface of the base layer 31 facing the supporting adhesive layer 32, and the heat insulation layer 8 is in contact with the supporting adhesive layer 32. When the heat from the hot press head is conducted to the base layer 31, the heat insulation layer 8 can effectively isolate the heat from being transferred to the supporting adhesive layer 32, thereby effectively preventing the supporting adhesive layer 32 from being softened by heat. If the supporting adhesive layer 32 is not softened, it can avoid arching and deformation due to force.

[0117] In some embodiments, Figure 8 As shown, the anti-arch structure includes a heat-conducting layer 7 arranged between the base layer 31 and the supporting adhesive layer 32. The heat-conducting layer 7 is arranged on the surface of the base layer 31 facing the supporting adhesive layer 32, and the heat-conducting layer 7 is in contact with the supporting adhesive layer 32. When the heat on the hot press head is conducted to the base layer 31, the heat-conducting layer 7 conducts the heat to the outside of the display panel. The heat-conducting layer 7 can absorb a large amount of heat, thereby effectively preventing the supporting adhesive layer 32 from being softened by heat. If the supporting adhesive layer 32 is not softened, it can avoid arching and deformation due to force.

[0118] In some embodiments, Fig. 9As shown, the anti-arch structure includes a heat-conducting layer 7 and a heat-insulating layer 8 arranged between the base layer 31 and the supporting adhesive layer 32, wherein the heat-conducting layer 7 is arranged on the surface of the base layer 31 facing the supporting adhesive layer 32, and the heat-insulating layer 8 is arranged on the surface of the heat-conducting layer 7 facing the supporting adhesive layer 32, and the heat-insulating layer 8 is in contact with the supporting adhesive layer 32; when the heat on the hot press head is conducted to the base layer 31, the heat is first conducted to the outside of the display panel through the heat-conducting layer 7, and the heat-conducting layer 7 can absorb a large amount of heat, and finally the heat is effectively insulated by the heat-insulating layer 8, which can further prevent the supporting adhesive layer 32 from being softened by heat.

[0119] It should be noted that the heat-conducting layer 7 can be made of graphene tape, which is attached to the lower surface of the base layer 31. The graphene tape has a good heat dissipation effect and can effectively absorb heat. The heat-conducting layer 7 can also be other materials that can achieve the same or similar functions.

[0120] The heat insulation layer 8 can be a sheet material such as glass fiber, asbestos, rock wool, silicate, etc., which is attached to the lower surface of the graphene tape. The heat insulation layer 8 can also be other materials that can achieve the same or similar functions.

[0121] The heat-conducting layer 7 and the heat-insulating layer 8 are arranged in the middle region after the first electrode A and the second electrode B are electrically connected, that is, in the third region 300 .

[0122] In some embodiments, Fig.10 As shown, the anti-arch structure includes a first anti-arch rubber block 9 arranged on the binding component 1, the projection surface of the first anti-arch rubber block 9 on the conductive adhesive layer 4 is located in the third area 300, and the first anti-arch rubber block 9 is protrudingly arranged on the surface of the binding component 1 facing the pressing area. When the IC is pressed down and fits with the base layer 31, the first anti-arch rubber block 9 can be pressed on the surface of the third area of ​​the base layer 31, and the first anti-arch rubber block 9 can resist the base layer 31 to prevent the base layer 31 and the supporting adhesive layer 32 from arching in the third area.

[0123] In some embodiments, Fig.11 As shown, the anti-arch structure includes a second anti-arch rubber block 10 arranged on the display component 3, the projection surface of the second anti-arch rubber block 10 on the conductive adhesive layer 4 is located in the third area 300, and the second anti-arch rubber block 10 is protrudingly arranged on the surface of the base layer 31 facing the pressing area. When the IC is pressed down and fits with the base layer 31, the second anti-arch rubber block 10 can be pressed on the surface of the third area 300 of the base layer 31, and the second anti-arch rubber block 10 can resist the base layer 31 to prevent the base layer 31 and the supporting adhesive layer 32 from arching in the third area 300.

[0124] In some embodiments, Fig.12As shown, the anti-arch structure includes a first anti-arch rubber block 9 arranged on the binding component 1, and a second anti-arch rubber block 10 arranged on the display component 3, wherein the first anti-arch rubber block 9 is protrudingly arranged on the surface of the binding component 1 facing the pressed area, and the second anti-arch rubber block 10 is protrudingly arranged on the surface of the base layer 31 facing the pressed area, and the projection surfaces of the first anti-arch rubber block 9 and the second anti-arch rubber block 10 on the conductive adhesive layer 4 are located in the third area 300, and the first anti-arch rubber block 9 and the second anti-arch rubber block 10 correspond to each other up and down. When the IC is pressed down and fits with the base layer 31, the first anti-arch rubber block 9 and the second anti-arch rubber block 10 correspond to each other up and down, and the two rubber blocks can resist the base layer 31 to prevent the base layer 31 and the supporting adhesive layer 32 from arching in the third area 300.

[0125] It should be noted that the shapes of the first anti-arch rubber block 9 and the second anti-arch rubber block 10 are not limited, and can be rectangular or trapezoidal, as long as the end face facing the pressing area is flat. The number of the first anti-arch rubber block 9 and the second anti-arch rubber block 10 can be one or more, and the positions of the first anti-arch rubber block 9 and the second anti-arch rubber block 10 are in the area between the first electrode A and the second electrode B. They can be set in the middle of the area or at other positions within the area.

[0126] In some embodiments, Fig.13 As shown, a support block 11 is arranged between the binding component 1 and the display component 3, and the projection surface of the support block 11 on the conductive adhesive layer 4 is located in the third area 300. The support block 11 needs to adopt a rectangular block structure with higher hardness or a laminated structure with higher modulus. The support block 11 can be placed on the surface of the base layer 31 before lamination. When the binding component 1 is pressed down, the support block 11 can support the third area 300, thereby effectively preventing the base layer 31 and the supporting adhesive layer 32 of the third area 300 from arching.

[0127] Exemplary Preparation Methods

[0128] This embodiment provides a method for preparing a display panel. Fig.14 As shown, the preparation method comprises:

[0129] S1. providing a binding component, wherein the binding component comprises a plurality of first electrodes arranged in sequence and at intervals,

[0130] S2, preparing a display component, the display component comprising a plurality of second electrodes arranged in sequence and spaced apart, and a laminated structure, the laminated structure comprising a base layer, a supporting adhesive layer, and a supporting film layer stacked in sequence,

[0131] S3, forming an anti-arch structure on the binding component and / or the display component,

[0132] S4, applying a conductive adhesive layer on the surface of the display component facing the binding component,

[0133] There is a pressing area between the binding component and the display component, the pressing area includes a first area, a second area and a third area located between the first area and the area, the projection surfaces of the first electrode and the second electrode on the conductive adhesive layer are located in the first area and the second area, and the projection surface of the anti-arch structure on the conductive adhesive layer is at least partially located in the third area,

[0134] S5. Using a thermal compression head, press the binding component downward to fit it to the display component, so that the first electrode on the binding component and the second electrode on the display component are correspondingly connected to achieve electrical conduction.

[0135] In some embodiments, Fig.15 As shown, the preparation method comprises:

[0136] S31, coating a supporting adhesive layer on the surface of the base layer away from the binding component,

[0137] S32, etching a receiving cavity on the surface of the supporting adhesive layer away from the binding component,

[0138] S33, providing a supporting film layer, and laminating the supporting film layer to the surface of the supporting adhesive layer with the accommodating cavity;

[0139] In some embodiments, Fig.16 As shown, the preparation method comprises:

[0140] S31, coating a supporting adhesive layer on the surface of the base layer away from the binding component,

[0141] S32, providing a supporting film layer, and etching a receiving cavity on a surface of the supporting film layer facing the binding component,

[0142] S33, laminating the surface of the supporting film layer with the accommodating cavity to the supporting adhesive layer;

[0143] In some embodiments, Fig.17 As shown, the preparation method comprises:

[0144] S31, coating a supporting adhesive layer on the surface of the base layer away from the binding component,

[0145] S32, etching a receiving cavity on the surface of the supporting adhesive layer away from the binding component,

[0146] S33, providing a supporting film layer, and etching a receiving cavity on a surface of the supporting film layer facing the binding component.

[0147] S34, laminating the surface of the supporting film layer with the accommodating cavity and the surface of the supporting adhesive layer with the accommodating cavity.

[0148] In some embodiments, Fig.18 As shown, the preparation method comprises:

[0149] S31, providing a heat insulation layer, and attaching the heat insulation layer to the surface of the base layer away from the binding component.

[0150] S32, coating a supporting adhesive layer on the surface of the heat insulation layer away from the binding component,

[0151] S33, providing a supporting film layer, and bonding the supporting film layer to a surface of the supporting adhesive layer facing away from the binding component.

[0152] In some embodiments, Fig.19 As shown, the preparation method comprises:

[0153] S31, providing a heat-conducting layer, and attaching the heat-conducting layer to the surface of the base layer away from the binding component.

[0154] S32, coating a supporting adhesive layer on the surface of the heat conductive layer away from the binding component,

[0155] S33, providing a supporting film layer, and bonding the supporting film layer to a surface of the supporting adhesive layer facing away from the binding component.

[0156] In some embodiments, Fig. 20 As shown, the preparation method comprises:

[0157] S31, providing a heat-conducting layer, and attaching the heat-conducting layer to the surface of the base layer away from the binding component.

[0158] S32, providing a heat insulation layer, and attaching the heat insulation layer to the surface of the heat conductive layer facing away from the binding component,

[0159] S33, coating a supporting adhesive layer on the surface of the heat insulation layer away from the binding component,

[0160] S34, providing a supporting film layer, and bonding the supporting film layer to a surface of the supporting adhesive layer facing away from the binding component.

[0161] In some embodiments, Fig.21 As shown, the preparation method comprises:

[0162] S31, preparing a first anti-arching rubber block on the surface of the binding component facing the pressing area;

[0163] In some embodiments, Fig. 22 As shown, the preparation method comprises:

[0164] S31, preparing a second anti-arching rubber block on the surface of the display component 3 facing the pressing area;

[0165] In some embodiments, Fig.23 As shown, the preparation method comprises:

[0166] S31, preparing a first anti-arching rubber block on the surface of the binding component facing the pressing area,

[0167] S32, preparing a second anti-arching rubber block on the surface of the display assembly facing the lamination area;

[0168] In some embodiments, Fig.24 As shown, the preparation method comprises:

[0169] S31, providing a support block,

[0170] S32, placing a support block in the pressing area between the binding component and the display component.

[0171] Exemplary Electronic Devices

[0172] This embodiment provides an electronic device, which includes any of the display panels described above.

[0173] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A display panel, characterized in that: include: The binding component includes a plurality of first electrodes arranged in sequence and at intervals. The display component comprises a plurality of second electrodes arranged in sequence and spaced apart from each other, and a laminated structure, wherein the laminated structure comprises a base layer, a supporting adhesive layer, and a supporting film layer stacked in sequence, and the second electrode is arranged on a surface of the base layer away from the supporting adhesive layer; A conductive adhesive layer, the conductive adhesive layer is located in a lamination area between the binding component and the display component, and the lamination area includes: a first region and a second region, the projection surfaces of the first electrode and the second electrode on the conductive adhesive layer are located in the first region and the second region, a third region, the third region being located between the first region and the second region; The display panel further includes an anti-arch structure, wherein a projection surface of the anti-arch structure on the conductive adhesive layer is at least partially located in the third area.

2. The display panel according to claim 1, wherein: The anti-arch structure comprises: At least one accommodating cavity is provided on the supporting adhesive layer and / or the supporting film layer.

3. The display panel according to claim 1, wherein: The anti-arch structure comprises: A heat-insulating layer is disposed between the base layer and the supporting adhesive layer, the heat-insulating layer is disposed on a surface of the base layer facing the supporting adhesive layer, and the heat-insulating layer is bonded to the supporting adhesive layer; or, A heat-conducting layer is disposed between the base layer and the supporting adhesive layer, the heat-conducting layer is disposed on the surface of the base layer facing the supporting adhesive layer, and the heat-insulating layer is bonded to the supporting adhesive layer; or The heat-conducting layer and the heat-insulating layer are arranged between the base layer and the supporting adhesive layer, wherein: The heat-conducting layer is arranged on the surface of the base layer facing the supporting adhesive layer, the heat-insulating layer is arranged on the surface of the heat-conducting layer facing the supporting adhesive layer, and the heat-insulating layer is bonded to the supporting adhesive layer.

4. The display panel according to claim 1, wherein: The anti-arch structure comprises a first anti-arch rubber block arranged on the binding component, the projection surface of the first anti-arch rubber block on the conductive rubber layer is located in the third area, and the first anti-arch rubber block is protrudingly arranged on the surface of the binding component facing the pressing area; or, The anti-arch structure comprises a second anti-arch rubber block arranged on the display assembly, the projection surface of the second anti-arch rubber block on the conductive adhesive layer is located in the third area, and the second anti-arch rubber block is protrudingly arranged on the surface of the base layer facing the lamination area; or, The anti-arch structure includes a first anti-arch rubber block arranged on the binding component and a second anti-arch rubber block arranged on the display component, wherein the first anti-arch rubber block is protrudingly arranged on the surface of the binding component facing the pressing area, and the second anti-arch rubber block is protrudingly arranged on the surface of the base layer facing the pressing area, and the projection surfaces of the first anti-arch rubber block and the second anti-arch rubber block on the conductive rubber are located in the third area.

5. The display panel according to claim 1, wherein: The anti-arch structure includes a support block arranged between the binding component and the display component, and a projection surface of the support block on the conductive adhesive layer is located in the third area.

6. A method for preparing a display panel, characterized in that: The preparation method comprises: A binding assembly is provided, the binding assembly comprising a plurality of first electrodes arranged in sequence and at intervals, A display component is prepared, wherein the display component includes a plurality of second electrodes arranged in sequence and at intervals, and a laminated structure, wherein the laminated structure includes a base layer, a supporting glue layer, and a supporting film layer stacked in sequence, forming an anti-arch structure on the binding component and / or the display component, A conductive adhesive layer is attached to the surface of the display component facing the binding component. There is a pressing area between the binding component and the display component, the pressing area includes a first area, a second area and a third area located between the first area and the area, the projection surfaces of the first electrode and the second electrode on the conductive adhesive layer are located in the first area and the second area, and the projection surface of the anti-arch structure on the conductive adhesive layer is at least partially located in the third area. The binding component is pressed down to fit with the display component based on a thermal compression head, so that the first electrode on the binding component and the second electrode on the display component are correspondingly connected to achieve electrical conduction.

7. The method for preparing a display panel according to claim 6, wherein: The preparation method comprises: A supporting adhesive layer is coated on the surface of the base layer away from the binding component. A receiving cavity is etched on the surface of the supporting adhesive layer facing away from the binding component. Providing a supporting film layer, and laminating the supporting film layer to the surface of the supporting adhesive layer with the accommodating cavity; or coating a supporting adhesive layer on the surface of the base layer away from the binding component, Providing a supporting film layer, etching a receiving cavity on a surface of the supporting film layer facing the binding component, Laminating the surface of the supporting film layer with the accommodating cavity to the supporting adhesive layer; or, A supporting adhesive layer is coated on the surface of the base layer away from the binding component. A receiving cavity is etched on the surface of the supporting adhesive layer facing away from the binding component. A supporting film layer is provided, a receiving cavity is etched on a surface of the supporting film layer facing the binding component, and a surface of the supporting film layer with the receiving cavity is bonded to a surface of the supporting adhesive layer with the receiving cavity.

8. The method for preparing a display panel according to claim 6, wherein: The preparation method comprises: Providing a heat-insulating layer, and applying the heat-insulating layer to the surface of the base layer facing away from the binding component, A supporting adhesive layer is applied on the surface of the heat insulation layer away from the binding component. Providing a supporting film layer, and laminating the supporting film layer to the surface of the supporting adhesive layer away from the binding component; or providing a heat-conducting layer, and laminating the heat-conducting layer to the surface of the base layer away from the binding component, A supporting adhesive layer is coated on the surface of the heat conductive layer facing away from the binding component. Providing a supporting film layer, and laminating the supporting film layer to the surface of the supporting adhesive layer on the side away from the binding component; or providing a heat-conducting layer, and laminating the heat-conducting layer to the surface of the base layer on the side away from the binding component; Providing a heat-insulating layer, and attaching the heat-insulating layer to the surface of the heat-conducting layer facing away from the binding assembly; Coating a supporting adhesive layer on the surface of the heat insulation layer facing away from the binding assembly; A supporting film layer is provided, and the supporting film layer is bonded to a surface of the supporting adhesive layer that is away from the binding component.

9. The method for preparing a display panel according to claim 6, wherein: The preparation method comprises: Prepare a first anti-arching rubber block on the surface of the binding component facing the pressing area; or, Prepare a second anti-arching rubber block on the surface of the display assembly facing the lamination area; or, A first anti-arching rubber block is prepared on the surface of the binding component facing the pressing area, and a second anti-arching rubber block is prepared on the surface of the display component facing the pressing area; or, A support block is provided and placed in a pressing area between the binding assembly and the display assembly.

10. An electronic device, characterized in that: include: A display panel as claimed in any one of claims 1 to 5.

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