Packaging substrate, measuring method of ink binding force of packaging substrate, and preparation method of packaging substrate

Abstract

The invention discloses a measurement method and a preparation method of a packaging substrate and ink binding force thereof, and the measurement method comprises the steps: providing a packaging substrate to be tested, the packaging substrate comprises a metal layer, an ink layer and a prepreg layer, and the surface of the metal layer is provided with a metal pattern used for measuring the peel strength; performing a stripping test on the packaging substrate to obtain stripping force of stripping the metal pattern from the ink layer and line width of the metal pattern; and determining the ink binding force of the packaging substrate according to the stripping force of the ink and the line width of the metal pattern. According to the invention, the peeling strength can be calculated, so that the accuracy of measuring the binding force of the ink is improved.

Description

Technical Field

[0001] The invention relates to the field of substrate detection, and in particular to a method for measuring the ink bonding force of a packaging substrate. Background Art

[0002] By measuring and analyzing the bonding strength of inks, the effects of different materials and coating processes on bonding strength can be evaluated. Currently, most packaging substrate manufacturers use tape tensile tests to evaluate the bonding strength of new inks, and manually observe the tape to compare it with the standard to determine whether the ink bonding strength is qualified. This method has a large error and is difficult to accurately measure the ink bonding strength. Summary of the invention

[0003] The embodiment of the present invention provides a packaging substrate and a method for measuring and preparing the ink bonding strength thereof, so as to solve the problem of large measurement error of the bonding strength between ink and substrate.

[0004] In one embodiment, a method for measuring ink bonding strength of a package substrate is provided, the method comprising: Provided is a packaging substrate to be tested, the packaging substrate comprising: a metal layer, an ink layer, and a prepreg layer, wherein a metal pattern for measuring peel strength is provided on the surface of the metal layer; Performing a peeling test on the packaging substrate to obtain a peeling force of the metal pattern from the ink and a line width of the metal pattern; The ink bonding force of the packaging substrate is determined according to the peeling force of the ink and the line width of the metal pattern.

[0005] In one embodiment, when the number of the metal patterns is at least two, a peeling test is performed on the packaging substrate to obtain an average peeling force of the metal pattern from the ink and an average line width of the metal pattern; The ink bonding force of the packaging substrate is determined according to the average peeling force of the ink and the average line width of the metal pattern.

[0006] In one embodiment, the metal pattern is a long line with a line width of 0.1 mm to 1 mm.

[0007] In one embodiment, obtaining the average peeling force of the metal pattern from the ink comprises: The metal patterns are peeled off one by one according to the line width by a universal material testing machine, the peeling force of each metal pattern from the ink is measured, and the average value of the peeling force is calculated.

[0008] In one embodiment, the formula for characterizing the peel strength of the ink bonding force of the packaging substrate is: P = ; Here, P represents the peeling strength of the metal pattern from the ink, Fp represents the average value of the peeling force, and W represents the line width of the metal pattern.

[0009] In one embodiment, a method for preparing a packaging substrate is provided, the method comprising: providing a metal layer; forming an ink layer on the surface of the metal layer; Placing a prepreg on the ink layer, and performing a lamination process on the metal layer, the ink layer and the prepreg to obtain a lamination package substrate; The side of the metal layer facing away from the ink layer is patterned to form a metal pattern for measuring peel strength, thereby obtaining a packaging substrate.

[0010] In one embodiment, the metal layer is patterned on a side facing away from the ink layer to form a metal pattern for measuring peel strength, thereby obtaining a packaging substrate, comprising: Using a dry film to transfer a pattern on the side of the metal layer facing away from the ink layer to obtain a substrate after pattern transfer; The substrate after the pattern transfer is etched, and the dry film is removed to obtain a packaging substrate with a metal pattern.

[0011] In one embodiment, the metal layer is patterned on a side facing away from the ink layer to form a metal pattern for measuring peel strength, thereby obtaining a packaging substrate, comprising: Attaching an adhesive tape to the side of the metal layer facing away from the ink layer to obtain a substrate with an adhesive tape; The metal at the periphery of the tape is removed by a chemical solution to obtain a packaging substrate with a metal pattern.

[0012] In one embodiment, the laminating process of the metal layer, the ink layer and the prepreg comprises: The metal layer, the ink layer and the prepreg are tightly bonded together by heating, pressurizing or using a chemical adhesive to form a laminated packaging substrate.

[0013] In one embodiment, a packaging substrate is provided, the packaging substrate comprising: A metal layer, with at least one metal pattern arranged on the surface of the metal layer; An ink layer located on the surface of the metal layer facing away from the metal pattern; A prepreg is located on the surface of the ink layer.

[0014] The above-mentioned method for measuring the ink bonding strength of the packaging substrate is to integrate the metal layer, the ink layer and the semi-cured layer to obtain the processed packaging substrate, and to perform a peeling test through the metal pattern set on the back of the metal layer, and to determine the ink bonding strength of the packaging substrate by measuring the line width of the metal pattern and the peeling force of the metal pattern from the ink, thereby improving the measurement accuracy.

[0015] The above-mentioned packaging substrate and preparation method thereof form a packaging substrate by laminating a metal layer, an ink layer and a semi-cured sheet, and obtain at least one metal pattern after pattern processing on the side of the metal layer facing away from the ink layer, and obtain a packaging substrate, thereby providing a measurement basis for the measurement method of the packaging substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0017] Figure 1 is a flow chart of a method for measuring ink bonding strength of a packaging substrate in one embodiment of the present invention; Figure 2 is another flow chart of a method for measuring ink bonding strength of a packaging substrate in one embodiment of the present invention; Figure 3 is a flow chart of a method for preparing a packaging substrate in one embodiment of the present invention; Figure 4 is another flow chart of a method for preparing a packaging substrate in one embodiment of the present invention; Figure 5 is another flow chart of a method for preparing a packaging substrate in one embodiment of the present invention; Figure 6 is a flow chart of a graphics transfer method in one embodiment of the present invention.

[0018] The label description is as follows: 1. Packaging substrate; 11. Metal layer; 12. Ink layer; 13. Prepreg layer; 14. Metal pattern; 15. Dry film; 16. Tape. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] It should be understood that the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present invention to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0021] It should be understood that when an element or layer is referred to as being "on, adjacent to, connected to or coupled to other elements or layers, it may be directly on, adjacent to, connected to or coupled to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, directly connected to or directly coupled to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or part discussed below may be represented as a second element, component, region, layer or part.

[0022] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0023] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present invention. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0024] In order to fully understand the present invention, detailed structures and steps will be presented in the following description to illustrate the technical solutions proposed by the present invention. The preferred embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may also have other implementations.

[0025] An embodiment of the present invention provides a method for measuring ink bonding strength of a packaging substrate.

[0026] In one embodiment, if Figure 1 As shown, a method for measuring the ink bonding force of a packaging substrate is provided, and the measuring method comprises the following steps: Step S10: providing a packaging substrate to be tested, the packaging substrate comprising: a metal layer, an ink layer, and a prepreg layer, and a metal pattern for measuring peel strength is provided on the surface of the metal layer.

[0027] Among them, copper material is usually used as the metal layer, and other metal materials, such as aluminum material, can also be used to ensure good electrical conductivity and thermal conductivity; the metal layer is mainly used as a base to support other layers to meet different packaging requirements; the ink layer can be used for electrical isolation or as a signal transmission path, and the ink is fixed on the metal layer by silk screen printing to ensure that the ink and the metal layer are firmly combined. The semi-cured layer can use a pp layer, and a metal pattern is etched on the surface of the metal layer. The metal pattern is used to measure the peel strength and can adopt a specific shape, such as strips, blocks, etc., to facilitate peel strength testing.

[0028] Step S20: performing a peeling test on the packaging substrate to obtain a peeling force of the metal pattern from the ink layer and a line width of the metal pattern.

[0029] Among them, a microscope or other measuring tools can be used on the packaging substrate to mark the metal graphic area to be tested to ensure accurate measurement. A peeling test device can be used to gradually apply force to peel the metal graphic from the ink layer, and then the peeling force during the peeling process and the line width of the peeling area can be obtained from the device.

[0030] Step S30: determining the ink bonding force of the packaging substrate according to the peeling force of the ink and the line width of the metal pattern.

[0031] Among them, the ink peeling force and the line width of the metal pattern can further reflect the ink bonding force of the packaging substrate, thereby accurately measuring the size of the ink bonding force of the packaging substrate.

[0032] The present embodiment provides a method for measuring ink bonding strength of a packaging substrate, wherein a metal layer, an ink layer, and a semi-cured layer are integrated to obtain a processed packaging substrate, and a peeling test is performed through a metal pattern set on the back of the metal layer, and the ink bonding strength of the packaging substrate is determined by measuring the line width of the metal pattern and the peeling force of the metal pattern from the ink, thereby improving the measurement accuracy.

[0033] In one embodiment, if Figure 1 to Figure 2 As shown, in step S20, a peeling test is performed on the packaging substrate to obtain the peeling force of the metal pattern from the ink layer and the line width of the metal pattern, which specifically includes the following steps: Step S21: When the number of metal patterns is at least two, a peeling test is performed on the package substrate to obtain an average peeling force of the metal pattern from the ink and an average line width of the metal pattern.

[0034] When there are multiple metal graphics, a peeling test is performed on each metal graphic in turn, and force is gradually applied to peel the metal graphic from the ink layer. The equipment will record the applied force, the maximum force value during the peeling process of each metal graphic (i.e., the peeling force of each graphic) and the line width of the peeling area.

[0035] In step S30: the ink bonding force of the package substrate is determined according to the peeling force of the ink and the line width of the metal pattern. Specifically, the following steps are included: Step S31: determining the ink bonding force of the packaging substrate according to the average peeling force of the ink and the average line width of the metal pattern.

[0036] Among them, the peeling force of the ink is recorded in sequence for multiple times, the data of each peeling force is integrated to calculate the average value, and the line width of the metal pattern peeled each time is recorded and the average line width is calculated. The average bonding force of the ink on the packaging substrate is determined by combining the average peeling force and the average line width.

[0037] The ink bonding force measurement method of this embodiment can reduce the impact of accidental errors and systematic errors through multiple measurements, and reduce the result deviation caused by improper operation, equipment failure or environmental factors. Taking the average value after multiple measurements can balance these errors and obtain more reliable data.

[0038] In one embodiment, if Figure 1 to Figure 2As shown, in step S20, a peeling test is performed on the packaging substrate to obtain the peeling force of the metal pattern from the ink and the line width of the metal pattern, wherein the metal pattern is a long line with a line width of 0.1 mm to 1 mm.

[0039] Specifically, the line width can be set as a long line with uniform width, and the metal pattern is peeled off from the ink layer according to the line width during the glassing process.

[0040] In this step, by setting the line width within a certain range, the difficulty of operation in the process of measuring the peeling force is reduced, thereby improving the accuracy and reliability of the test results and reducing the errors caused by different test areas.

[0041] In one embodiment, if Figure 2 As shown, in step S21, when there are at least two metal patterns, a peeling test is performed on the package substrate to obtain an average peeling force of the metal pattern from the ink and an average line width of the metal pattern. The specific steps are: Step S211: using a universal material testing machine to sequentially peel off each metal pattern according to the line width, measuring the peeling force of each metal pattern from the ink, and calculating the average value of the peeling force.

[0042] Among them, a universal material testing machine or a peeling test machine can be used to perform multiple peeling of metal patterns according to line width. For the same metal pattern, multiple peeling tests can be repeated to obtain sufficient experimental data.

[0043] In the ink bonding strength measurement method, a universal material machine is used to perform the peeling process and record the peeling data to ensure the reliability of the result; and the above peeling test steps are repeated for different metal patterns to ensure that the experimental results are statistically significant.

[0044] In one embodiment, the formula for characterizing the peel strength of the ink bonding force of the package substrate is: P = ; Here, P represents the peeling strength of the metal pattern from the ink, Fp represents the average value of the peeling force, and W represents the line width of the metal pattern.

[0045] Among them, the average peeling force and the line width of the metal pattern are obtained through the above steps, and the peeling strength of the metal pattern from the ink is calculated by the formula to reflect the size of the ink bonding force. The peeling strength value reflects the strength of the adhesion between the ink and the metal.

[0046] In the ink bonding force measurement method of this embodiment, the ink bonding force is reflected by using the peel strength formula of the ink bonding force of the packaging substrate, thereby more intuitively reflecting the size of the ink bonding force of the packaging substrate, and evaluating its performance under different materials and different manufacturing processes.

[0047] In one embodiment, a method for preparing a packaging substrate is provided, such as Figure 3 As shown, the preparation method comprises: Step S1: providing a metal layer; Among them, a suitable first metal layer material, such as copper (Cu), aluminum (Al), etc., can be selected according to application requirements and cost considerations to prepare a flat and clean first metal layer to ensure that the surface is free of oil and oxide layer, which serves as a base for subsequent steps.

[0048] Step S2: forming an ink layer on the surface of the metal layer.

[0049] Among them, a silk screen printing process is used to form a uniform ink layer on the surface of the metal layer to ensure that the ink layer has uniform thickness and complete coverage.

[0050] Step S3: placing the prepreg on the ink layer, and performing a lamination process on the metal layer, the ink layer and the prepreg to obtain a laminated packaging substrate.

[0051] Among them, select a suitable semi-cured sheet, such as a semi-cured sheet of PP material, ensure that it can be effectively combined with the ink layer and the metal layer, place the semi-cured sheet accurately on the ink layer, ensure that it is flat and free of bubbles, ensure flatness and alignment, use a press machine or heat and pressurize to perform the pressing process, set appropriate pressure and temperature, and ensure that the metal layers and the ink layers are firmly bonded.

[0052] Step S4: performing pattern processing on the side of the metal layer facing away from the ink layer to form a metal pattern for measuring peel strength, thereby obtaining a packaging substrate.

[0053] Among them, photolithography technology is used to prepare a uniform metal pattern on the metal layer, such as long lines with consistent line width; unnecessary metal parts are removed by etching, and the predetermined metal pattern is retained to prepare a packaging substrate that meets the requirements of the peeling test.

[0054] The method for preparing a package substrate of this embodiment forms a package substrate by laminating a metal layer, an ink layer and a prepreg, and obtains at least one metal pattern after pattern processing on the side of the metal layer facing away from the ink layer, thereby providing a measurement basis for the package substrate measurement method.

[0055] In one embodiment, if Figure 4 As shown, in step S4, a metal layer facing away from the ink layer is patterned to form a metal pattern for measuring peel strength, thereby obtaining a packaging substrate, including: Step S41: using a dry film to transfer a pattern on the side of the metal layer facing away from the ink layer to obtain a substrate after pattern transfer.

[0056] Among them, Figure 5 As shown, a suitable dry film is selected, and its thickness is suitable for subsequent etching. The dry film is evenly attached to the clean and dry metal layer surface, and the substrate with the dry film is placed in an exposure machine. The dry film is exposed using ultraviolet light (UV light) of a corresponding wavelength to ensure that the pattern can be transferred to the dry film. The dry film in the unexposed area is removed using a developer, and the exposed part is retained to form a packaging substrate with a metal pattern.

[0057] Step S42: etching the substrate after pattern transfer, and removing the dry film to obtain a packaging substrate with a metal pattern.

[0058] Among them, according to the pattern transferred by the dry film, dry etching is selected using plasma or chemical vapor deposition method for etching, and the excess dry film is removed with a stripping liquid to obtain a packaging substrate with only metal patterns.

[0059] The method for preparing the package substrate of this embodiment forms the metal pattern required for subsequent peeling by transferring the pattern on the side of the metal layer relative to the ink layer, paving the way for the subsequent etching operation, and further obtains the package substrate with the metal pattern by using a chemical solution to visualize the metal pattern, thereby providing a measurement basis for the measurement of the peeling force.

[0060] In one embodiment, in step S4, a metal layer facing away from the ink layer is patterned to form a metal pattern for measuring peel strength to obtain a packaging substrate, further comprising: Step S43: attaching a tape to the side of the metal layer facing away from the ink layer to obtain a substrate with the tape; removing the metal at the periphery of the tape by a chemical solution to obtain a packaging substrate with a metal pattern.

[0061] Specifically, Figure 6 As shown, choose a suitable tape, such as polyester tape or tape with low adhesion, to ensure that the substrate will not be damaged during the peeling test, and evenly stick the tape on the surface of the metal layer to ensure good contact between the tape and the metal layer; choose a suitable chemical solution, such as ferric chloride solution or other metal etching solution to remove the metal around the tape; gently tear off the tape to ensure that the metal pattern under the tape is intact to form the final metal pattern. This method can ensure the efficiency and accuracy of the preparation process while maintaining the integrity of the metal pattern.

[0062] In one embodiment, in step S3, a prepreg is placed on the ink layer, and the metal layer, the ink layer and the prepreg are pressed together to obtain a pressed packaging substrate. The pressing process includes: The metal layer, ink layer and prepreg are tightly bonded by heating, pressurizing or chemical adhesive to form a laminated packaging substrate.

[0063] It can be understood that a press machine or vacuum laminator is used for heating, and a suitable heating temperature (generally 170-180°C) is set to fully cure the prepreg to form a strong bond, and a suitable chemical adhesive (such as epoxy resin adhesive) can be selected to enhance the bonding strength. Thus, a high-quality packaging substrate is prepared.

[0064] In one embodiment, if Figure 5 As shown, a packaging substrate is provided, which is prepared according to the above-mentioned packaging substrate preparation method, and the packaging substrate includes: a metal layer, at least one metal pattern is arranged on the surface of the metal layer; an ink layer is located on the surface of the metal layer facing away from the metal pattern; and a semi-cured sheet is located on the surface of the ink layer.

[0065] Among them, the metal layer is the core part of the packaging substrate, which is usually made of highly conductive metal materials such as copper, aluminum or their alloys. At least one metal pattern is arranged on the surface of the metal layer. These patterns are used to realize etching operations and stripping experiments. The metal patterns are arranged on the surface of the metal layer, and the line width ranges from 0.1 mm to 1 mm long lines. The metal patterns can be manufactured by processes such as electroplating, etching or laser cutting; the ink layer is located on the side of the metal layer facing away from the metal pattern, and the ink layer and the metal layer are tightly attached to each other. The semi-cured sheet will be further cured in the subsequent hot pressing process, bonding the various layers together to form an integral packaging substrate, which increases the mechanical strength and stability of the packaging substrate.

[0066] It should be understood that the order of execution of the steps in the above embodiment does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0067] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A method for measuring ink bonding strength of a packaging substrate, characterized in that: The measuring method comprises: Provided is a packaging substrate to be tested, the packaging substrate comprising: a metal layer, an ink layer, and a prepreg layer, wherein a metal pattern for measuring peel strength is provided on the surface of the metal layer; Performing a peeling test on the packaging substrate to obtain a peeling force of the metal pattern from the ink layer and a line width of the metal pattern; The ink bonding force of the packaging substrate is determined according to the peeling force of the ink and the line width of the metal pattern.

2. The ink bonding force measurement method of a packaging substrate according to claim 1, characterized in that: When the number of the metal patterns is at least two, performing a peeling test on the packaging substrate to obtain an average peeling force of the metal pattern from the ink and an average line width of the metal pattern; The ink bonding force of the packaging substrate is determined according to the average peeling force of the ink and the average line width of the metal pattern.

3. The ink bonding force measurement method of a packaging substrate according to claim 2, characterized in that: The metal pattern is a long line with a line width of 0.1 mm to 1 mm.

4. The ink bonding force measurement method of a packaging substrate according to claim 3, characterized in that: The step of obtaining an average peeling force of the metal pattern from the ink comprises: The metal patterns are peeled off one by one according to the line width by a universal material testing machine, the peeling force of each metal pattern from the ink is measured, and the average value of the peeling force is calculated.

5. The ink bonding force measurement method of a packaging substrate according to claim 2, characterized in that: The formula for characterizing the peel strength of the ink bonding force of the package substrate is: P= ； Here, P represents the peeling strength of the metal pattern from the ink, Fp represents the average value of the peeling force, and W represents the line width of the metal pattern.

6. A method for preparing a packaging substrate, characterized in that: The preparation method comprises: providing a metal layer; forming an ink layer on the surface of the metal layer; Placing a prepreg on the ink layer, and performing a lamination process on the metal layer, the ink layer and the prepreg layer to obtain a lamination package substrate; The side of the metal layer facing away from the ink layer is patterned to form a metal pattern for measuring peeling strength, thereby obtaining a packaging substrate.

7. The method for preparing a packaging substrate according to claim 6, characterized in that: The metal layer is patterned on the side facing away from the ink layer to form a metal pattern for measuring peel strength, thereby obtaining a packaging substrate, comprising: Using a dry film to transfer a pattern on the side of the metal layer facing away from the ink layer to obtain a substrate after pattern transfer; The substrate after the pattern transfer is etched, and the dry film is removed to obtain a packaging substrate with a metal pattern.

8. The method for preparing a packaging substrate according to claim 7, characterized in that: The metal layer is patterned on the side facing away from the ink layer to form a metal pattern for measuring peel strength, thereby obtaining a packaging substrate, comprising: Attaching an adhesive tape to the side of the metal layer facing away from the ink layer to obtain a substrate with an adhesive tape; The metal at the periphery of the tape is removed by a chemical solution to obtain a packaging substrate with a metal pattern.

9. The method for preparing a packaging substrate according to claim 6, characterized in that: The laminating process of the metal layer, the ink layer and the prepreg comprises: The metal layer, the ink layer and the prepreg layer are tightly bonded together by heating, pressurizing or applying chemical adhesive to form a laminated packaging substrate.

10. A packaging substrate, characterized in that: The packaging substrate is prepared according to the method for preparing a packaging substrate according to any one of claims 6 to 9, and the packaging substrate comprises: A metal layer, with at least one metal pattern arranged on the surface of the metal layer; An ink layer located on the surface of the metal layer facing away from the metal pattern; A prepreg layer is located on the surface of the ink layer.

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