Backlight module and display equipment

Abstract

The backlight module comprises a back plate, a light source assembly, a channel device and a heat dissipation device, a plurality of first openings are formed in the back plate, and the light source assembly is arranged on the back plate; the channel device is arranged on the back face of the back plate, a cavity channel is formed in the channel device, and the cavity channel communicates with the multiple first openings; the heat dissipation device is arranged on the back face of the back plate, an input port of the heat dissipation device communicates with the cavity channel, and the heat dissipation device is configured to enable air in the cavity channel to flow. According to the backlight module and the display equipment, the first opening is formed in the back plate of the backlight module, and the channel device is arranged on the back face of the back plate and communicates with the first opening, so that a heat dissipation device located on the outer side of the back plate can exhaust hot air in the backlight module out of the backlight module through the channel device, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a backlight module and a display device. Background Art

[0002] At present, the in-vehicle LCD display module is used outdoors with a relatively high brightness. Among them, the light-emitting diode supports the high brightness requirements brought by the large current, and at the same time, the power consumption is high and the heat is huge. When the temperature reaches a certain critical value, the light-emitting diode needs to be set to reduce the power consumption, but this will cause the brightness to decrease, affecting the normal use of consumers in the car.

[0003] In the process of research and practice of the prior art, the inventor of the present application found that the heat dissipation of the current LCD display module relies on heat dissipation tape to transfer the heat from the light-emitting diode to the back plate of the backlight module, and then the back plate dissipates the high-temperature heat to the outside air through heat transfer to achieve the purpose of local heat dissipation. However, the heat conductivity of the thermal conductive adhesive is 0.6-1.2w / (m·k), and the heat dissipation efficiency is low. Summary of the invention

[0004] The embodiments of the present application provide a backlight module and a display device, which can improve heat dissipation efficiency.

[0005] The embodiment of the present application provides a backlight module, including:

[0006] A back plate is provided with a plurality of first openings, wherein the first openings penetrate the back plate in the thickness direction of the backlight module;

[0007] A light source assembly is arranged on the back plate;

[0008] a channel device, disposed on a side of the back plate away from the light source assembly, wherein the channel device has a cavity channel therein, and the cavity channel is connected to the plurality of first openings; and

[0009] The heat dissipation device is arranged on a side of the back plate away from the light source assembly, the heat dissipation device is connected to the cavity channel, and the heat dissipation device is configured to make the air in the cavity channel flow.

[0010] Optionally, in some embodiments of the present application, the backlight module further comprises a light guide plate arranged on the back panel, and the light source assembly is arranged on one side of the light guide plate; the light source assembly comprises a circuit board and a plurality of light emitting devices arranged on the circuit board, the circuit board is connected to a side wall of the backlight module, and the plurality of light emitting devices are arranged at intervals along the length direction of the circuit board;

[0011] In the length direction of the circuit board, the first openings and the light emitting devices are arranged alternately.

[0012] Optionally, in some embodiments of the present application, the backlight module further comprises a light guide plate arranged on the back panel, and the light source assembly is arranged on one side of the light guide plate; the light source assembly comprises a circuit board and a plurality of light emitting devices arranged on the circuit board, the circuit board is connected to a side wall of the backlight module, and the plurality of light emitting devices are arranged at intervals along the length direction of the circuit board;

[0013] In the thickness direction of the backlight module, one of the light emitting devices correspondingly covers at least a portion of the first opening.

[0014] Optionally, in some embodiments of the present application, the distances from the center of the first opening to the centers of the two adjacent light-emitting devices are equal.

[0015] Optionally, in some embodiments of the present application, the backlight module further includes a reflective sheet disposed on a side of the light guide plate close to the back plate, and the reflective sheet is connected to the back plate via a first adhesive layer;

[0016] In the thickness direction of the backlight module, the reflective sheet covers a portion of the first opening, and a portion of the reflective sheet close to the light source assembly is suspended and forms a gap space with the back plate, and the gap space is connected to the first opening.

[0017] Optionally, in some embodiments of the present application, the back plate includes a bottom and a side wall connected to the periphery of the bottom, the side wall and the bottom are connected to form a receiving groove, the light source assembly, the reflective sheet and the light guide plate are arranged in the receiving groove, the light source assembly is arranged on the side wall, and the light guide plate is arranged on the bottom of the back plate at a side away from the heat sink;

[0018] In the length direction of the circuit board, the reflective sheet and the light guide plate have a first spacing space respectively with the side wall, and in the direction intersecting with the length direction of the circuit board, the reflective sheet and the light guide plate have a second spacing space respectively with the light source assembly, and the second spacing space is connected to the first spacing space, the gap space and the first opening respectively.

[0019] Optionally, in some embodiments of the present application, the light guide plate is connected to the reflective sheet via a second adhesive layer, the first adhesive layer is provided with a plurality of first air channels, the second adhesive layer is provided with a plurality of second air channels, and in the thickness direction of the backlight module, the first air channels penetrate the first adhesive layer, and the second air channels penetrate the second adhesive layer;

[0020] In the backlight module in a top view, in the length direction of the circuit board, the first air duct and the second air duct are extended, and in the direction intersecting with the length direction of the circuit board, the first air duct and the second air duct are alternately arranged;

[0021] The first interval spaces are respectively connected to the plurality of first air passages and the plurality of second air passages.

[0022] Optionally, in some embodiments of the present application, the heat dissipation device is configured to discharge the air in the cavity channel out of the backlight module.

[0023] Optionally, in some embodiments of the present application, a plurality of second openings are formed on a side of the channel device facing the first opening, and one of the second openings is connected to one of the first openings;

[0024] Alternatively, the channel device is provided with a second opening on a side facing the first opening, and the second opening is connected to a plurality of the first openings.

[0025] Optionally, in some embodiments of the present application, the channel device includes a first pipeline and a second pipeline, the first pipeline extends along the length direction of the circuit board, and the first pipeline is cross-connected with the second pipeline;

[0026] The first pipe is connected to the first opening through the second opening, and at least one of the second pipes is connected to the heat dissipation device.

[0027] Optionally, in some embodiments of the present application, each of the second pipes is connected to a heat dissipation device, and each of the second pipes has an intersection with the first pipe. In the length direction of the circuit board of the light source assembly, the distance from the edge of the first pipe to the nearest intersection is a first distance, and the distance between two adjacent intersections is a second distance, and the second distance is equal to twice the first distance.

[0028] Optionally, in some embodiments of the present application, the heat dissipation device is configured to discharge the air in the cavity channel out of the backlight module, and the backlight module also includes an air intake device configured to input external air into the backlight module, and the second pipe includes an air intake pipe and an air outlet pipe, the air outlet pipe is connected to the heat dissipation device, the air intake pipe is connected to the air intake device, the air intake pipe is connected to one end of the first pipe, and the air outlet pipe is connected to the other end of the first pipe.

[0029] Optionally, in some embodiments of the present application, at least one of the first pipeline and the second pipeline is formed by splicing at least two sections of sub-pipes.

[0030] Optionally, in some embodiments of the present application, a groove is formed on a side of the back plate close to the channel device, and the channel device is arranged in the groove.

[0031] Optionally, in some embodiments of the present application, the channel device and the groove are fixedly connected via a third adhesive layer, the third adhesive layer is provided with a plurality of third openings, and one of the third openings is connected to the first opening and the second opening.

[0032] Optionally, in some embodiments of the present application, the aperture of the third opening is larger than the aperture of the first opening, the aperture of the second opening is larger than or equal to the aperture of the third opening, and the aperture (diameter) of the first opening is larger than or equal to 1 mm.

[0033] Optionally, in some embodiments of the present application, the depth of the groove is greater than 1 mm. The thickness of the sidewall of the channel device is greater than or equal to 0.15 mm.

[0034] Optionally, in some embodiments of the present application, the backlight module further includes an optical film and a support frame, and the optical film and the support frame are arranged in the receiving groove of the back plate;

[0035] The optical film is arranged on a side of the light guide plate away from the bottom of the back plate, and the support frame is detachably connected to the side wall of the back plate and is located on a side of the light source assembly away from the bottom of the back plate.

[0036] Correspondingly, an embodiment of the present application further provides a display device, which includes a display panel and a backlight module as described in any one of the above embodiments, wherein the display panel is arranged on one side of the backlight module.

[0037] The backlight module and display device of the embodiment of the present application are provided with a first opening on the back panel of the backlight module, and a channel device is provided on the back side of the back panel and connected to the first opening, so that the heat dissipation device located on the outer side of the back panel can discharge the hot air in the backlight module out of the backlight module through the channel device, so as to improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 is a schematic diagram of the planar structure of the back side of the backlight module provided in an embodiment of the present application;

[0039] Figure 2 is a schematic diagram of the cross-sectional structure of a backlight module provided in an embodiment of the present application;

[0040] Figure 3 yes Figure 2 A magnified view of part A;

[0041] Figure 4is a top plan view of a partial structure of a backlight module provided in an embodiment of the present application;

[0042] Figure 5 is another top plan schematic diagram of a partial structure of a backlight module provided in an embodiment of the present application;

[0043] Figure 6 It is a partial top plan view of a light source assembly and a back plate in a backlight module provided in an embodiment of the present application;

[0044] Figure 7 is a schematic diagram of the structure of a channel device in a backlight module provided in an embodiment of the present application;

[0045] Figure 8 It is a partial plan view of the back side of the back plate in the backlight module provided in the embodiment of the present application;

[0046] Fig. 9 is another planar structural schematic diagram of the back side of the backlight module provided in an embodiment of the present application;

[0047] Fig.10 is a schematic diagram of the structure of a display device provided in an embodiment of the present application;

[0048] Fig.11 is a schematic plan view of the back side of the backlight module used in the display device of Comparative Example 1;

[0049] Fig.12 This is a simulation temperature gradient effect diagram of the display device of Comparative Example 1;

[0050] Fig.13 is a schematic plan view of the back side of the backlight module used in the display device of Comparative Example 2;

[0051] Fig.14 This is a simulation temperature gradient effect diagram of the display device of Comparative Example 2;

[0052] Fig.15 The display device of embodiment 1 is matched Fig. 9 A schematic diagram of the back plane structure of the backlight module;

[0053] Fig.16 is a simulation temperature gradient effect diagram of the display device of Example 1;

[0054] Fig.17 The display device of Example 2 is matched Figure 1 A schematic diagram of the back plane structure of the backlight module;

[0055] Fig.18 This is a diagram showing the simulated temperature gradient effect of the display device of Example 2. DETAILED DESCRIPTION

[0056] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, the various embodiments can be combined with each other but will not be repeated one by one, and in the absence of contrary instructions, the directional words used, such as "upper" and "lower", usually refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inside" and "outside" refer to the outline of the device; the terms "first", "second", "third", etc. are used only as markings, and no numerical requirements are imposed or order is established.

[0057] The embodiments of the present application provide a backlight module and a display device, which are described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0058] exist Figure 1 , Figure 2 and Figure 3 , the first direction F1 may be a direction parallel to one side of the backlight module 100 in a plan view, and may be, for example, a transverse direction of the backlight module 100. The second direction F2 may be a direction parallel to the other side of the backlight module 100 in a plan view, and may be a longitudinal direction of the backlight module 100. The third direction F3 may be a thickness direction of the backlight module 100.

[0059] In some embodiments, the first direction F1 and the second direction F2 may also be non-perpendicular to each other.

[0060] Please refer to Figure 1 , Figure 2 and Figure 3 The embodiment of the present application provides a backlight module 100 , including a back panel 11 , a light source assembly 12 , a channel device 13 and a heat dissipation device 14 .

[0061] The back plate 11 is provided with a plurality of first openings 11a. In the thickness direction F3 of the backlight module 100, the first openings 11a penetrate the back plate 11. The light source assembly 12 is disposed on the back plate 11. The channel device 13 is disposed on a side of the back plate 11 away from the light source assembly 12. The channel device 13 has a cavity channel 13v therein, and the cavity channel 13v is connected to the plurality of first openings 11a. The heat dissipation device 14 is disposed on a side of the back plate 11 away from the light source assembly 12. The heat dissipation device 14 is connected to the cavity channel 13v, and the heat dissipation device 14 is configured to allow air in the cavity channel 13v to flow.

[0062] In the embodiment of the present application, a first opening 11a is set on the back plate 11 of the backlight module 100, and a channel device 13 is set on the back side of the back plate 11 and connected to the first opening 11a, so that the heat dissipation device 14 located on the outside of the back plate 11 can discharge the hot air in the backlight module 100 out of the backlight module 100 through the channel device 13, so as to improve the heat dissipation effect.

[0063] It should be understood that the heat dissipation device 14 can discharge the hot air in the backlight module 100 out of the backlight module 100 by suction, or can bring the hot air in the backlight module 100 out of the backlight module 100 by blowing.

[0064] It should be noted that although Figure 2 The side-entry backlight module is shown, but in the present application, the backlight module 100 may also be a direct-down type. Whether it is a direct-down type or a side-entry type, heat dissipation can be achieved by providing a first opening 11a, a channel device 13, and a heat dissipation device 14. The following description takes the case where the heat dissipation device 14 is configured to discharge the air in the cavity channel 13v out of the backlight module 100 as an example.

[0065] In some embodiments of the present application, Figure 2 As shown, the backlight module 100 further includes a light guide plate 15, a reflective sheet 16, an optical film 17 and a support frame 18. The light guide plate 15 is disposed on the back plate 11. The light source assembly 12 is disposed on one side of the light guide plate 15 and connected to the side wall of the backlight module 100. The reflective sheet 16 is disposed on the backlight side of the light guide plate 15. The optical film 17 is disposed on the light emitting side of the light guide plate 15.

[0066] The back plate 11 includes a bottom 111 and a side wall 112 connected to the periphery of the bottom 111, and the side wall 112 and the bottom 111 are connected to form a receiving groove 11b. The light source assembly 12, the light guide plate 15, the reflective sheet 16, the optical film 17 and the support frame 18 are all arranged in the receiving groove 11b. The reflective sheet 16 is arranged on the side of the light guide plate 15 close to the bottom 111 of the back plate 11. The optical film 17 is arranged on the side of the light guide plate 15 away from the bottom 111 of the back plate 11. The support frame 18 is detachably connected to the side wall 112 of the back plate 11 and is located on the side of the light source assembly 12 away from the bottom 111 of the back plate 11.

[0067] It should be noted that Figure 2In the illustrated backlight module 100, the back plate 11 is a frame-like structure having a bottom 111 and a side wall 112, and the support frame 18 is detachably connected to the side wall 112 of the back plate 11, but is not limited thereto. For example, the back plate 11 can be a plate-like structure with a middle frame to support the display panel and place optical devices (light source, light guide plate, optical film, reflector, etc.); or the back plate 11 can also integrate the functions of the middle frame, such as the back plate 11 and the support frame 18 are connected as one body, so that the back plate 11 can place optical devices and support the display panel.

[0068] Optionally, the material of the back plate 11 may include one selected from metal, metal alloy and plastic. For example, the material of the back plate 11 is aluminum metal or aluminum alloy to improve the heat dissipation effect of the back plate 11.

[0069] Optionally, the light source assembly 12 includes a circuit board 121 and a plurality of light emitting devices 122 disposed on the circuit board 121. The light emitting devices 122 may be light emitting diode (LED) devices. Optionally, the circuit board 121 is connected to the side wall 112 via a fourth adhesive layer 194.

[0070] Optionally, the optical film 17 may be a composite film of a single film layer, or may be an optical film of a stack of multiple film layers. For example, the optical film 17 includes a diffusion film, a first brightness enhancement film, and a second brightness enhancement film.

[0071] Optionally, the heat sink 14 may be an exhaust fan, an exhaust pump or other exhaust devices. The heat sink 14 may be fixed to the back of the back plate 11 by screw locking or bayonet limiting.

[0072] Optional, see Figure 3 In some embodiments of the present application, the reflective sheet 16 is connected to the back panel 11 through a first adhesive layer 191 .

[0073] In the thickness direction F3 of the backlight module 100 , the reflective sheet 16 covers a portion of the first opening 11 a . The portion of the reflective sheet 16 close to the light source assembly 12 is suspended and forms a gap space 11 c with the back plate 11 . The gap space 11 c communicates with the first opening 11 a .

[0074] It is understandable that the design of the reflector 16 covering a part of the first opening 11a can not only enlarge the aperture of the first opening 11a to improve the heat dissipation efficiency, but also improve the light utilization rate. In particular, based on the fact that light also has heat, the design of the gap space 11c between the reflector 16 and the bottom 111 of the back plate 11 increases the contact area between the air and the reflector 16, and expands and lengthens the exhaust path of the air to exhaust more heat, thereby improving the heat dissipation efficiency.

[0075] Please refer to Figure 3 and Figure 4 , Figure 4FIG. 1 is a schematic top view of a partial structure of the backlight module 100 .

[0076] In some embodiments of the present application, the light source assembly 12 is disposed on the side wall 112 of the back plate 11 . The light guide plate 15 is disposed on a side of the bottom 111 of the back plate 11 away from the heat sink 14 .

[0077] In the length direction of the circuit board 121, the reflective sheet 16 and the light guide plate 15 respectively have a first spacing space 11d with the side wall 112. In the direction intersecting the length direction of the circuit board 121, the reflective sheet 16 and the light guide plate 15 respectively have a second spacing space 11f with the light source assembly 12. The second spacing space 11f is connected to the first spacing space 11d, the gap space 11c and the first opening 11a.

[0078] In some embodiments of the present application, the direction intersecting with the length direction of the circuit board 121 may be the second direction F2. The design of the first spacing space 11d and the second spacing space 11f expands the contact area between the air and the optical device in the backlight module 100, and expands and extends the exhaust path of the air to exhaust more heat, further improving the heat dissipation effect.

[0079] Secondly, the first spacing space 11d and the second spacing space 11f are appropriately enlarged based on the requirements of device assembly (assembly allowable error), without the need to design additional air circulation paths, thereby simplifying the structure. For example, the width of the first spacing space 11d and the second spacing space 11f is between 1.1 and 1.5 times the minimum assembly precision requirement of the light guide plate 15 and the back plate 11, such as 1.1 times, 1.2 times, 1.3 times, 1.4 times or 1.5 times. Among them, although the minimum assembly precision requirement of the light guide plate 15 and the back plate 11 varies due to different backlight module designs, manufacturing processes and application scenarios, the minimum assembly precision requirement of the light guide plate 15 and the back plate 11 is generally between 0.1 mm and 0.5 mm, such as 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm or 0.5 mm.

[0080] Furthermore, the first spacing space 11 d and the second spacing space 11 f are located in the surrounding area of ​​the backlight module 100 , thereby improving the uniformity of the overall heat dissipation of the backlight module 100 .

[0081] In some embodiments, a third spacing space 11g is provided between the light source assembly 12 and the bottom of the back panel 11, and the third spacing space 11g is connected to the second spacing space 11f and the first opening 11a, thereby expanding the contact area between the air and the light source assembly 12 and extending the air exhaust path to exhaust more heat, thereby further improving the heat dissipation effect.

[0082] In the thickness direction of the backlight module 100 , the width of the third spacing space 11g is greater than the width of the gap space 11c . It should be understood that the third spacing space 11g is larger, which can better dissipate heat for the light source assembly 12 .

[0083] In some embodiments, the side wall 112 of the back plate 11 is provided with a first air inlet 11k connected to the receiving groove 11b, and the first air inlet 11k is configured to let in cool air from the outside. The first air inlet 11k and the light source assembly 12 are arranged on the same side wall 112, and the first air inlet 11k is located on a side of the light source assembly 12 away from the bottom 111 of the back plate 11.

[0084] Optionally, the first air inlets 11k are arranged at intervals along the length direction of the circuit board 121. It is understandable that, since the light source assembly 12 is the largest heat source, the first air inlet 11k is close to the light source assembly 12 and is located above the light source assembly 12, and the first opening 11a is located below the light source assembly 12, which greatly shortens the heat dissipation path and increases the exchange speed of cold air and hot air, thereby improving the heat dissipation effect.

[0085] Please refer to Figure 3 and Figure 5 , Figure 5 Another schematic top view of a partial structure of the backlight module 100 according to an embodiment of the present application is shown.

[0086] In some embodiments of the present application, the light guide plate 15 is connected to the reflective sheet 16 through the second adhesive layer 192. The first adhesive layer 191 defines a plurality of first air channels 19a, and the second adhesive layer 192 defines a plurality of second air channels 19b. In the thickness direction F3 of the backlight module 100, the first air channels 19a penetrate the first adhesive layer 191, and the second air channels 19b penetrate the second adhesive layer 192.

[0087] In the backlight module 100 in a top view, the first air passage 19a and the second air passage 19b extend in the length direction of the circuit board 121. In a direction intersecting the length direction of the circuit board 121, the first air passage 19a and the second air passage 19b are alternately arranged.

[0088] The first partition spaces 11d are connected to the plurality of first air passages 19a and the plurality of second air passages 19b respectively.

[0089] It should be understood that the design of the first air duct 19a and the second air duct 19b expands the contact area between the air and the light guide plate 15 and the reflective sheet 16, and expands and extends the air exhaust path to exhaust more heat, further improving the heat dissipation effect.

[0090] Secondly, the first air channel 19 a and the second air channel 19 b are located in the middle area of ​​the backlight module 100 , which improves the uniformity of the overall heat dissipation of the backlight module 100 .

[0091] In addition, in the backlight module 100 viewed from a top perspective, the first adhesive layer 191 and the second adhesive layer 192 are partially overlapped, which improves the stability of the connection between the light guide plate 15 and the reflective sheet 16, improves the flatness of the reflective sheet 16, and reduces the risk of the reflective sheet 16 falling in the first airway 19a due to gravity, thereby reducing the risk of the first airway 19a shrinking.

[0092] Optionally, in the length direction (first direction F1) of the circuit board 121, the overlapping width of the first adhesive layer 191 and the second adhesive layer 192 is greater than the width of the first air channel 19a, further reducing the risk of shrinkage of the first air channel 19a.

[0093] In some embodiments, the bottom 111 of the back plate 11 is further provided with a second air inlet 11v, which is connected to the first air passage 19a. The second air inlet 11v is an auxiliary air inlet, which is disposed in the support column 113 on the back of the back plate 11 and penetrates the support column 113 in the thickness direction of the backlight module 100.

[0094] Please refer to Figure 6 , Figure 6 The diagram shows a schematic plan view of the light source assembly 12 and the first opening 11 a in a top view. In some embodiments, a plurality of light emitting devices 122 are arranged in an intermittent manner along the length direction of the circuit board 121 .

[0095] In the length direction of the circuit board 121 , the first openings 11 a and the light emitting devices 122 are arranged alternately.

[0096] It should be understood that, optionally, the length direction of the circuit board 121 is the first direction F1. That is, a first opening 11a and a light-emitting device 122 are alternately arranged along the first direction F1. Since the heat source of the backlight module 100 mainly comes from the light-emitting device 122 in the light source assembly 12, a first opening 11a is set between two adjacent light-emitting devices 122, so that the distance from the first opening 11a to the light-emitting device 122 becomes uniform, and the heat emitted by the light-emitting device 122 can not only be quickly discharged through the first opening 11a, but also improve the uniformity of heat dissipation, reducing the risk of excessive local heat.

[0097] Optionally, in some embodiments of the present application, in the thickness direction F3 of the backlight module 100 , a light emitting device 122 corresponds to covering at least a portion of a first opening 11 a to improve the heat dissipation effect of the light emitting device 122 .

[0098] That is, the light emitting device 122 may partially cover the first opening 11 a or may fully cover the first opening 11 a. In some embodiments, the area of ​​the first opening 11 a at least partially exceeds the area where the light emitting device 122 is disposed.

[0099] In some embodiments of the present application, the distances from the center of the first opening 11 a to the centers of two adjacent light emitting devices 122 are equal.

[0100] It can be understood that the distances from the center of the first opening 11 a to the centers of the two adjacent light emitting devices 122 are equal, so that the heat dissipation distance of each light emitting device 122 is the same, thereby improving the uniformity of heat dissipation.

[0101] Optionally, the shape of the first opening 11a may be any shape such as a circle, a square, a trapezoid, etc. The embodiment of the present application is described by taking the first opening 11a being a circle as an example.

[0102] The aperture (diameter) of the first opening 11a is greater than or equal to 1 mm, for example, it can be 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm or 2 mm.

[0103] Optionally, the aperture of the first opening 11 a is less than or equal to 1.5 mm, so as to improve the waterproof and dustproof performance of the backlight module 100 and ensure the supporting performance of the back plate 11 .

[0104] Please refer to Figure 3 and Figure 7 , Figure 7 What is shown is a schematic diagram of the three-dimensional structure of the channel device 13 in the backlight module 100 .

[0105] In some embodiments of the present application, a plurality of second openings 13 a are formed on a side of the channel device 13 facing the first opening 11 a , and one second opening 13 a is connected to one first opening 11 a .

[0106] Of course, in some embodiments, a second opening 13 a may be formed on one side of the channel device 13 facing the first opening 11 a , and the second opening 13 a is connected to the plurality of first openings 11 a .

[0107] Combination Figure 1 and Figure 7 In some embodiments of the present application, the channel device 13 includes a first pipe 131 and a second pipe 132. The first pipe 131 extends along the length direction of the circuit board 121, and the first pipe 131 and the second pipe 132 are cross-connected.

[0108] The first pipe 131 is connected to the first opening 11 a through the second opening 13 a , and at least one second pipe 132 is connected to the heat dissipation device 14 .

[0109] It can be understood that the embodiment of the present application adopts the first pipe 131 to connect all the first openings 11a, and adopts the second pipe 132 to connect the first pipe 131, so as to lead the heat discharge channel to the space in the second direction F2, save the layout space in the first direction F1, and make the first pipe 131 long enough to connect more first openings 11a, thereby improving the heat dissipation effect.

[0110] Optionally, in some embodiments of the present application, each second pipe 132 is connected to a heat dissipation device 14 , and each second pipe 132 has an intersection with the first pipe 131 .

[0111] In the length direction of the circuit board 121, the distance from the edge of the first pipe 131 to the nearest intersection is a first distance L1, and the distance between two adjacent intersections is a second distance L2. The second distance L2 is equal to twice the first distance L1.

[0112] It can be understood that the design that the second distance L2 is equal to twice the first distance L1 allows each second pipe 132 to be connected to the first pipe 131 with the same distance, thereby improving the heat dissipation efficiency and uniformity of heat dissipation.

[0113] Optionally, in some embodiments of the present application, at least one of the first pipe 131 and the second pipe 132 is formed by splicing at least two sections of sub-pipes.

[0114] It is understandable that at least one of the first pipe 131 and the second pipe 132 is formed by splicing sub-pipes, which can be better adapted to backlight modules 100 of various sizes. The sub-pipes can be connected by welding, such as ultrasonic process. Optionally, the wall thickness of the sub-pipe is greater than or equal to 0.15 mm, such as 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, 0.2 mm, 0.21 mm, 0.22 mm, 0.23 mm, 0.24 mm or 0.25 mm, etc.

[0115] Optionally, the material of the channel device 13 may include one of a plastic tube, a metal, and a metal alloy, such as a metal or a metal alloy, based on the high thermal conductivity of the metal or the metal alloy, so as to improve the heat dissipation effect.

[0116] In some embodiments of this application, please refer to Figure 3 and Figure 8 , Figure 8 A partial schematic plan view of the back side of the back plate 11 is shown.

[0117] exist Figure 8 In the embodiment, a groove 11h is formed on one side of the back plate 11 close to the channel device 13, and the channel device 13 is arranged in the groove 11h.

[0118] It is understandable that the groove 11h is formed on the back plate 11 and the channel device 13 is disposed in the groove 11h, which not only protects the channel device 13 but also facilitates the positioning and installation of the channel device 13 and improves the stability of the fixed connection between the channel device 13 and the back plate 11.

[0119] Optionally, the depth of the groove 11h is greater than 1 mm, such as 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm or 2.0 mm. Optionally, the depth of the groove 11h is less than or equal to 1.5 mm to prevent the thickness of the back plate 11 from being too small.

[0120] In some embodiments, the groove 11h includes a first sub-groove h1 configured to accommodate the first pipe 131 and a second sub-groove h2 configured to accommodate the second pipe 132. The first sub-groove h1 and the second sub-groove h2 are connected and cross-arranged. The first openings 11a are arranged along the length direction of the first sub-groove h1.

[0121] In some embodiments of the present application, the channel device 13 and the groove 11h are fixedly connected by a third adhesive layer 193. The third adhesive layer 193 is provided with a plurality of third openings 19c, and a third opening 19c is connected to the first opening 11a and the second opening 13a.

[0122] It is understandable that the third adhesive layer 193 is used to connect the channel device 13 and the back plate 11 to improve the stability of the channel device 13 .

[0123] Optionally, the thickness of the third adhesive layer 193 is greater than or equal to 0.04 mm and less than or equal to 0.06 mm, for example, it can be 0.04 mm, 0.05 mm or 0.06 mm. Such a setting takes into account the adhesion between the channel device 13 and the back plate 11 and prevents the third adhesive layer 193 from being too thick, which affects the degree to which the channel device 13 sinks into the groove 11h.

[0124] Optionally, the third adhesive layer 193 may be a conventional fixing adhesive or a thermal conductive adhesive to improve heat dissipation efficiency.

[0125] In some embodiments of the present application, the aperture of the third opening 19 c is larger than the aperture of the first opening 11 a , and the aperture of the second opening 13 a is larger than or equal to the aperture of the third opening 19 c .

[0126] Considering the attachment accuracy, the aperture of the third opening 19 c is set to be larger than the aperture of the first opening 11 a to ensure that the third opening 19 c fully covers the first opening 11 a and prevent the third adhesive layer 193 from blocking the first opening 11 a .

[0127] Optionally, the diameter of the third opening 19 c is greater than or equal to the sum of the diameter of the first opening 11 a and 0.2 mm, so as to prevent the third adhesive layer 193 from blocking the first opening 11 a .

[0128] Optionally, in some embodiments of the present application, Fig. 9 Another schematic plan view of the back side of the backlight module 100 according to the embodiment of the present application is shown.

[0129] exist Fig. 9 In the present invention, parts different from those of the above-described embodiment will be described to avoid redundancy.

[0130] Please refer to Fig. 9 The backlight module 100 further includes an air intake device 101 configured to input external air into the backlight module 100. The second pipe 132 includes an air intake pipe 13j and an air outlet pipe 13c. The air outlet pipe 13c is connected to the heat dissipation device 14, the air intake pipe 13j is connected to the air intake device 101, the air intake pipe 13j is connected to one end of the first pipe 131, and the air outlet pipe 13c is connected to the other end of the first pipe 131.

[0131] In some embodiments, a retaining wall is disposed in the first pipe 131 to prevent the inlet and outlet air from interfering with each other.

[0132] Please refer to Fig.10 The embodiment of the present application further provides a display device 1000 , which includes a display panel 200 and a backlight module 100 as in any one of the above embodiments, and the display panel 200 is disposed on one side of the backlight module 100 .

[0133] It should be noted that the structure of the backlight module 100 of the display device 1000 of the embodiment of the present application is similar or identical to the structure of the backlight module 100 of any of the above embodiments. Figures 1 to 9 The explanation will not be repeated here.

[0134] Optionally, the display device 1000 further includes a cover plate 300 disposed on the light emitting side of the display panel 200, and the cover plate 300 can be attached to the display panel 200 by optical adhesive. The periphery of the cover plate 300 is overlapped on the side wall 112 of the back plate 11 by a fifth adhesive layer 195.

[0135] Optionally, the cover plate 300 may be a glass cover plate or other plate with protective properties.

[0136] Optionally, the display panel 200 is disposed in the receiving groove 11 b and overlapped on the supporting frame 18 through the sixth adhesive layer 196 .

[0137] The display panel 200 is a liquid crystal display panel, and the specific structure of the display panel 200 is not described in detail here.

[0138] Optionally, the driving architecture of the display panel 200 may be a fringe field switching technology driving architecture, an in-plane switching technology driving architecture, a vertical alignment technology driving architecture, a twisted nematic technology driving architecture, and so on.

[0139] In addition, the display device 1000 of the embodiment of the present application is matched with the backlight module 100 of the above embodiment to achieve a better heat dissipation effect.

[0140] Specifically, Fig.11 The display device of comparative example 1 is shown, and the back side of the backlight module matched therewith has no heat dissipation device for heat dissipation treatment; Fig.12 The simulated temperature gradient effect diagram of the display device of Comparative Example 1 is shown. Fig.13 The display device of comparative example 2 is shown, and the back side of the backlight module matched therewith only adopts the heat dissipation device 14 for conventional surface heat dissipation; Fig.14 The simulated temperature gradient effect diagram of the display device of Comparative Example 2 is shown. Fig.15 The display device 1000 of the embodiment 1 is shown, and the backlight module 100 matched therewith corresponds to Fig. 9 The backlight module 100 of the embodiment of the present application; Fig.16 FIG. 1 is a diagram showing a simulated temperature gradient effect of the display device 1000 of Example 1. FIG. Fig.17 The display device 1000 of the second embodiment is shown, and the backlight module 100 is corresponding to Figure 1 The backlight module 100 of the embodiment of the present application; Fig.18 FIG. 1 is a diagram showing a simulated temperature gradient effect of the display device 1000 according to Embodiment 2.

[0141] It should be noted that, except for the differences in the heat dissipation devices and related structures, the structures of the backlight module 100 and the display panel 200 remain unchanged, and the temperature test positions and test points of the four experimental examples are the same.

[0142] The test environment and test means are the same. The heat sink 14 is a fan, and the back plate 11 is a cast aluminum part.

[0143]

[0144]

[0145] According to the above simulation data, compared with comparative examples 1 and 2, the temperature of embodiment 1 and embodiment 2 has dropped significantly. Compared with comparative example 1, the temperature drop of embodiment 2 is the largest, with the temperature drop value at the optical film being 31.146°C, the temperature drop value at the driver chip being 23.067°C, and the temperature drop value at the glass cover being 19.837°C.

[0146] It can be seen that the display device 1000 of the embodiment of the present application improves the heat dissipation effect by providing a heat dissipation device 14 or providing a heat dissipation device 14 in combination with an air intake device 101 and in combination with the first opening 11a and the channel device 13 to achieve a relatively large temperature reduction.

[0147] The display device 1000 of the embodiment of the present application is provided with a first opening 11a on the back panel of the backlight module 100, and the channel device 13 is provided on the back side of the back panel 11 and connected to the first opening 11a, so that the heat dissipation device 14 located on the outer side of the back panel 11 can discharge the hot air in the backlight module 100 out of the backlight module 100 through the channel device 13, so as to improve the heat dissipation effect.

[0148] The above is a detailed introduction to a backlight module and a display device provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A backlight module, characterized in that: include: A back plate is provided with a plurality of first openings, wherein the first openings penetrate the back plate in the thickness direction of the backlight module; A light source assembly is arranged on the back plate; A channel device is arranged on a side of the back plate away from the light source assembly, wherein the channel device has a cavity channel therein, and the cavity channel is connected to the plurality of first openings; as well as The heat dissipation device is arranged on a side of the back plate away from the light source assembly, the heat dissipation device is connected to the cavity channel, and the heat dissipation device is configured to make the air in the cavity channel flow.

2. The backlight module according to claim 1, characterized in that: The backlight module further comprises a light guide plate arranged on the back panel, and the light source assembly is arranged on one side of the light guide plate; the light source assembly comprises a circuit board and a plurality of light emitting devices arranged on the circuit board, the circuit board is connected to the side wall of the backlight module, and the plurality of light emitting devices are arranged at intervals along the length direction of the circuit board; In the length direction of the circuit board, the first openings and the light emitting devices are arranged alternately.

3. The backlight module according to claim 1, characterized in that: The backlight module further comprises a light guide plate arranged on the back panel, and the light source assembly is arranged on one side of the light guide plate; the light source assembly comprises a circuit board and a plurality of light emitting devices arranged on the circuit board, the circuit board is connected to the side wall of the backlight module, and the plurality of light emitting devices are arranged at intervals along the length direction of the circuit board; In the thickness direction of the backlight module, one of the light emitting devices correspondingly covers at least a portion of the first opening.

4. The backlight module according to claim 2 or 3, characterized in that: The distances from the center of the first opening to the centers of the two adjacent light emitting devices are equal.

5. The backlight module according to claim 2 or 3, characterized in that: The backlight module further includes a reflective sheet disposed on a side of the light guide plate close to the back plate, and the reflective sheet is connected to the back plate via a first adhesive layer; In the thickness direction of the backlight module, the reflective sheet covers a portion of the first opening, and a portion of the reflective sheet close to the light source assembly is suspended and forms a gap space with the back plate, and the gap space is connected to the first opening.

6. The backlight module according to claim 5, characterized in that: The back plate comprises a bottom and a side wall connected to the periphery of the bottom, the side wall and the bottom are connected to form a receiving groove, the light source assembly, the reflective sheet and the light guide plate are arranged in the receiving groove, the light source assembly is arranged on the side wall, and the light guide plate is arranged on the bottom of the back plate at a side away from the heat dissipation device; In the length direction of the circuit board, the reflective sheet and the light guide plate have a first spacing space respectively with the side wall, and in the direction intersecting with the length direction of the circuit board, the reflective sheet and the light guide plate have a second spacing space respectively with the light source assembly, and the second spacing space is connected to the first spacing space, the gap space and the first opening respectively.

7. The backlight module according to claim 6, characterized in that: The light guide plate is connected to the reflective sheet via a second adhesive layer, the first adhesive layer is provided with a plurality of first air channels, the second adhesive layer is provided with a plurality of second air channels, and in the thickness direction of the backlight module, the first air channels penetrate the first adhesive layer, and the second air channels penetrate the second adhesive layer; In the backlight module in a top view, in the length direction of the circuit board, the first air duct and the second air duct are extended, and in the direction intersecting with the length direction of the circuit board, the first air duct and the second air duct are alternately arranged; The first interval spaces are respectively connected to the plurality of first air passages and the plurality of second air passages.

8. The backlight module according to any one of claims 1 to 3, characterized in that: The heat dissipation device is configured to discharge the air in the cavity channel out of the backlight module.

9. The backlight module according to claim 8, characterized in that: The channel device is provided with a plurality of second openings on one side facing the first opening, and one of the second openings is connected to one of the first openings; Alternatively, the channel device is provided with a second opening on a side facing the first opening, and the second opening is connected to a plurality of the first openings.

10. The backlight module according to claim 9, characterized in that: The channel device comprises a first pipeline and a second pipeline, the first pipeline extends along the length direction of the circuit board, and the first pipeline is cross-connected with the second pipeline; The first pipe is connected to the first opening through the second opening, and at least one of the second pipes is connected to the heat dissipation device.

11. The backlight module according to claim 10, characterized in that: Each of the second pipes is connected to a heat dissipation device, and each of the second pipes has an intersection with the first pipe. In the length direction of the circuit board of the light source assembly, the distance from the edge of the first pipe to the nearest intersection is a first distance, and the distance between two adjacent intersections is a second distance, and the second distance is equal to twice the first distance.

12. The backlight module according to claim 10, characterized in that: The backlight module also includes an air intake device configured to input external air into the backlight module, the second pipe includes an air intake pipe and an air outlet pipe, the air outlet pipe is connected to the heat dissipation device, the air intake pipe is connected to the air intake device, the air intake pipe is connected to one end of the first pipe, and the air outlet pipe is connected to the other end of the first pipe.

13. The backlight module according to claim 10, characterized in that: At least one of the first pipe and the second pipe is formed by splicing at least two sections of sub-pipes.

14. The backlight module according to claim 9, characterized in that: A groove is formed on one side of the back plate close to the channel device, and the channel device is arranged in the groove.

15. The backlight module according to claim 14, characterized in that: The channel device and the groove are fixedly connected via a third adhesive layer, and the third adhesive layer is provided with a plurality of third openings, and one of the third openings is connected to the first opening and the second opening.

16. The backlight module according to claim 14, characterized in that: The backlight module further comprises an optical film and a support frame, wherein the optical film and the support frame are arranged in the receiving groove of the back plate; The optical film is arranged on a side of the light guide plate away from the bottom of the back plate, and the support frame is detachably connected to the side wall of the back plate and is located on a side of the light source assembly away from the bottom of the back plate.

17. A display device, characterized in that: It comprises a display panel and a backlight module as claimed in any one of claims 1 to 16, wherein the display panel is arranged on one side of the backlight module.

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