Small-sized dynamic seal wafer grabbing anti-collision device

Abstract

The invention relates to the field of semiconductor manufacturing, in particular to a small dynamic seal wafer grabbing anti-collision device which comprises a transmission cavity body, a plurality of feeding ports are formed in the outer wall of the transmission cavity body at equal intervals, and a wafer grabbing mechanism is installed on the inner circumferential wall of the transmission cavity body; the wafer grabbing mechanism comprises a wafer taking and placing plate, mechanical arm small arms, mechanical arm large arms and a large arm driving mechanism, the two mechanical arm large arms are symmetrically installed on the large arm driving mechanism, and the mechanical arm small arms are rotationally connected to the ends, away from the large arm driving mechanism, of the mechanical arm large arms. And one end, far away from the manipulator big arm, of the manipulator small arm is jointly and rotationally connected to the wafer taking and placing plate. The magnetic coupling connection can protect the wafer gripper to the greatest extent when collision occurs, so that the wafer gripper is prevented from being damaged; the sealing mode of the cavity is changed from dynamic sealing to static sealing through the completely-isolated structure, so that the sealing performance is greatly enhanced, and oil dirt is completely isolated.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing, and in particular to a small dynamic sealing wafer grabbing and anti-collision device. Background Art

[0002] The third-generation semiconductor SiC has more outstanding characteristics, such as wider bandgap, higher breakdown electric field, higher thermal conductivity, higher electron saturation rate and strong resistance to strong radiation. Devices with SiC as substrate have the characteristics of smaller size, higher conversion efficiency and more energy saving, which are highly consistent with the future needs of the global technology industry under the consensus of the goal of "carbon peak and carbon neutrality".

[0003] The main process flow for the preparation of SiC materials and chips covers single crystal growth, substrate cutting, grinding and polishing, epitaxial growth, mask deposition, patterning, etching, implantation, heat treatment and metal interconnection, involving dozens of key semiconductor equipment in total.

[0004] Plasma-enhanced chemical vapor deposition (PECVD) technology is a method that uses external energy to assist the decomposition of reaction precursors to generate plasma, thereby realizing the preparation of SIC thin films. In the PECVD experimental device, the transfer of wafers is mainly performed by the wafer manipulator gripping device. As a key component of the equipment, this device is responsible for the functions of placing and transferring wafers. The quality of its stability is directly related to the yield of the wafer process. Traditional wafer gripping devices will inevitably affect the yield of wafers due to mechanical wear, collisions caused by program errors, and oil stains caused by long-term operation of dynamic seals. Summary of the invention

[0005] In view of this, an object of the present invention is to provide a small static sealed anti-collision wafer grabbing device for SiC PECVD process to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the technical solutions adopted are as follows:

[0007] A small dynamic sealing wafer grabbing and anti-collision device comprises a transmission cavity body, a plurality of feed ports are opened at equal intervals on the outer wall of the transmission cavity body, and a wafer grabbing mechanism is installed on the inner circumferential wall of the transmission cavity body;

[0008] The wafer grabbing mechanism includes a wafer pick-up and placement plate, a robot arm, a robot arm and a robot arm driving mechanism. Two robot arms are symmetrically mounted on the arm driving mechanism. One end of the robot arm away from the arm driving mechanism is rotatably connected to the robot arm, and one end of the robot arm away from the robot arm is rotatably connected to the wafer pick-up and placement plate.

[0009] The upper arm driving mechanism includes a cavity isolation ring, an upper motor and a lower motor. Two groups of upper arm connecting magnetic rings are installed in the middle of the outer wall of the cavity isolation ring. The upper motor and the lower motor are symmetrically installed at the upper and lower ends of the cavity isolation ring. The upper motor and the lower motor drive the two groups of upper arm connecting magnetic rings. The ends of the two manipulator arms are respectively connected to the two upper arm connecting magnetic rings.

[0010] Preferably, an inner ring of an outer wall bearing roller is fixedly provided on the middle outer circumferential wall of the cavity isolation ring, and a large arm connecting magnetic ring is rotatably installed on the outer wall of the inner ring of the outer wall bearing roller through an external bearing roller, and internal magnetic rings are respectively installed at the rotating ends of the upper motor and the lower motor. The internal magnetic ring is arranged inside the cavity isolation ring, and the internal magnetic ring is installed cocentrically with the large arm connecting magnetic ring at its corresponding position.

[0011] Preferably, permanent magnets are installed at equal intervals on the outer wall of the upper arm connecting magnetic ring and the inner magnetic ring.

[0012] Preferably, the upper motor and the lower motor are installed at both ends of the cavity isolation ring through fixings, and connecting holes are opened on the outer circumferential wall of the cavity isolation ring near the two ends. Fixed sealing cover plates are installed on the connecting holes by bolts, and the fixings are fixedly installed on the inner wall of the cavity isolation ring by bolts.

[0013] Preferably, both ends of the cavity isolation ring are fixedly connected with cavity cover plates, a sealing ring groove is provided on the cavity cover plate, and a sealing ring is sleeved in the sealing ring groove.

[0014] Preferably, one end of the robot arm is connected to the wafer pick-and-place plate through a joint shaft, and a joint sealing cover is installed at the rotation connection position of the other end of the robot arm and the robot arm.

[0015] The beneficial effects of the present invention are:

[0016] This device converts the rigid connection into a flexible connection, and indirectly drives the mechanical arm to rotate by means of magnetic coupling during motor drive. This structure is driven by two upper and lower motors, and the rotation and extension of the wafer gripper are achieved by rotating the two sets of mechanical arms; this magnetic coupling method ensures the complete isolation of the motor drive part and the mechanical arm gripper part, and guarantees the vacuum seal during the movement of the mechanical arm; and because of the complete isolation, the wear and dust of the mechanical connection can be significantly reduced; the magnetic coupling connection can protect the wafer gripper to the maximum extent in the event of a collision and prevent it from being damaged; the completely isolated structure converts the sealing method of the cavity from dynamic sealing to static sealing, which greatly enhances the sealing performance and completely isolates the oil stains. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0018] Figure 1 It is a structural schematic diagram of the present invention;

[0019] Figure 2 It is a structural schematic diagram of the wafer grabbing mechanism in the present invention;

[0020] Figure 3 It is a structural schematic diagram of the upper arm driving mechanism in the present invention;

[0021] Figure 4 It is a structural schematic diagram of the cavity isolation ring in the present invention;

[0022] Figure 5 This is a working state diagram of the wafer grabbing mechanism in the present invention. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0025] Please refer to Figure 1-5A small dynamic sealing wafer grabbing and anti-collision device comprises a transmission cavity 1, a plurality of feed ports 11 are evenly spaced on the outer wall of the transmission cavity 1, and a wafer grabbing mechanism 2 is installed on the inner circumferential wall of the transmission cavity 1;

[0026] The wafer grabbing mechanism 2 comprises a wafer pick-up and placement plate 21, a robot arm 22, a robot arm 23 and an arm driving mechanism 24. Two robot arms 23 are symmetrically mounted on the arm driving mechanism 24. One end of the robot arm 23 away from the arm driving mechanism 24 is rotatably connected to the robot arm 22. One end of the robot arm 22 away from the robot arm 23 is rotatably connected to the wafer pick-up and placement plate 21. One end of the robot arm 22 is connected to the wafer pick-up and placement plate 21 through a joint shaft 26. A joint sealing cover 25 is mounted on the other end of the robot arm 22 at the rotationally connected position of the robot arm 23.

[0027] The upper arm driving mechanism 24 includes a cavity isolation ring 241, an upper motor 242 and a lower motor 243. Two groups of upper arm connecting magnetic rings 244 are installed in the middle of the outer wall of the cavity isolation ring 241. The upper motor 242 and the lower motor 243 are symmetrically installed at the upper and lower ends of the cavity isolation ring 241. The upper motor 242 and the lower motor 243 drive the two groups of upper arm connecting magnetic rings 244. The ends of the two manipulator arms 23 are respectively connected to the two upper arm connecting magnetic rings 244.

[0028] An outer wall bearing roller inner ring 245 is fixedly arranged on the middle outer circumferential wall of the cavity isolation ring 241, and the upper arm connecting magnetic ring 244 is rotatably installed on the outer wall of the outer wall bearing roller inner ring 245 through the external bearing roller 246. The rotating ends of the upper motor 242 and the lower motor 243 are respectively installed with internal magnetic rings 247, and the internal magnetic ring 247 is arranged inside the cavity isolation ring 241. The internal magnetic ring 247 is installed cocentrically with the upper arm connecting magnetic ring 244 at its corresponding position; permanent magnets 248 are installed on the outer walls of the upper arm connecting magnetic ring 244 and the internal magnetic ring 247 at equal intervals.

[0029] The upper motor 242 and the lower motor 243 are installed at the two ends of the cavity isolation ring 241 through the fixing part 240. The outer circumferential wall of the cavity isolation ring 241 is provided with connecting holes near the two ends. The connecting holes are fixed with sealing cover plates 249 by bolts, and the fixing part 240 is fixedly installed on the inner wall of the cavity isolation ring 241 by bolts.

[0030] The two ends of the cavity isolation ring 241 are fixedly connected with the cavity cover plate 2401 . The cavity cover plate 2401 is provided with a sealing ring groove 2402 . A sealing ring is sleeved in the sealing ring groove 2402 .

[0031] When the wafer is transferred in the transfer chamber 1, the wafer substrate is placed on the wafer pick-and-place plate 21. The wafer grabbing mechanism 2 is driven by the arm drive mechanism 24 and can perform 360° grabbing. The two manipulator arms 23 control the rotation and extension of the wafer pick-and-place plate 21 according to the rotation direction. The arm drive mechanism 24 is the core mechanism. The rigid connection is converted into a flexible connection. During the driving of the upper motor 242 and the lower motor 243, the manipulator arm 23 is indirectly driven to rotate by means of magnetic coupling to achieve the rotation and extension of the wafer pick-and-place plate 21. This magnetic coupling method ensures the complete isolation of the motor drive part and the gripper part of the manipulator, and ensures the vacuum seal during the movement of the manipulator; and because of the complete isolation, the wear and dust of the mechanical connection can be significantly reduced.

[0032] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A small dynamic sealing wafer grabbing and anti-collision device, comprising a transmission cavity, a plurality of feed ports are evenly spaced on the outer wall of the transmission cavity, and a wafer grabbing mechanism is installed on the inner circumferential wall of the transmission cavity; The wafer grabbing mechanism includes a wafer pick-up and placement plate, a robot arm, a robot arm and a robot arm driving mechanism. Two robot arms are symmetrically mounted on the arm driving mechanism. One end of the robot arm away from the arm driving mechanism is rotatably connected to the robot arm, and one end of the robot arm away from the robot arm is rotatably connected to the wafer pick-up and placement plate. The upper arm driving mechanism includes a cavity isolation ring, an upper motor and a lower motor. Two groups of upper arm connecting magnetic rings are installed in the middle of the outer wall of the cavity isolation ring. The upper motor and the lower motor are symmetrically installed at the upper and lower ends of the cavity isolation ring. The upper motor and the lower motor drive the two groups of upper arm connecting magnetic rings. The ends of the two manipulator arms are respectively connected to the two upper arm connecting magnetic rings.

2. A small dynamic sealing wafer grabbing and anti-collision device according to claim 1, characterized in that: An inner ring of an outer wall bearing roller is fixedly arranged on the middle outer circumferential wall of the cavity isolation ring, and a large arm connecting magnetic ring is rotatably installed on the outer wall of the inner ring of the outer wall bearing roller through an external bearing roller. Internal magnetic rings are respectively installed on the rotating ends of the upper motor and the lower motor. The internal magnetic ring is arranged inside the cavity isolation ring, and the internal magnetic ring is installed cocentrically with the large arm connecting magnetic ring at its corresponding position.

3. A small dynamic sealing wafer grabbing and anti-collision device according to claim 2, characterized in that: Permanent magnets are installed at equal intervals on the outer wall of the large arm connecting magnetic ring and the inner magnetic ring.

4. A small dynamic sealing wafer grabbing and anti-collision device according to claim 3, characterized in that: The upper motor and the lower motor are installed at the two ends of the cavity isolation ring through fixings. The outer circumferential wall of the cavity isolation ring is provided with connecting holes near the two ends. Fixed sealing cover plates are installed on the connecting holes through bolts, and the fixings are fixedly installed on the inner wall of the cavity isolation ring through bolts.

5. A small dynamic sealing wafer grabbing and anti-collision device according to claim 4, characterized in that: The two ends of the cavity isolation ring are fixedly connected with the cavity cover plate, the cavity cover plate is provided with a sealing ring groove, and a sealing ring is sleeved in the sealing ring groove.

6. A small dynamic sealing wafer grabbing and anti-collision device according to claim 1, characterized in that: One end of the robot arm is connected to the wafer pick-and-place plate through a joint shaft, and a joint sealing cover is installed at the rotation connection position of the other end of the robot arm and the robot arm.

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