Electromagnetic wave shielding device of semiconductor package

Abstract

The invention discloses an electromagnetic wave shielding device of a semiconductor package, which can effectively shield electromagnetic waves generated by a semiconductor chip mounted on a circuit substrate and can release heat generated by the semiconductor chip. The electromagnetic wave shielding device of the semiconductor package may surround a semiconductor chip along a side surface of the semiconductor chip and be fixed, thereby constituting a closed circuit with respect to the semiconductor chip, so that electromagnetic waves generated in the semiconductor chip can be effectively shielded.

Description

Technical Field

[0001] The present invention relates to an electromagnetic wave shielding device for a semiconductor package, and more particularly to an electromagnetic wave shielding device that can effectively shield electromagnetic waves generated on the side surface of a semiconductor chip mounted on a circuit substrate, and in particular can release heat generated on the side surface of the semiconductor chip. Background Art

[0002] As electronic equipment and information communication equipment become smaller and more integrated, they are deeply affected by heat, static electricity and electromagnetic waves.

[0003] According to the prior art, in order to shield electromagnetic waves of electronic components such as semiconductor chips mounted on a printed circuit board or electronic component modules and to perform heat transfer and heat dispersion, conventional metal shielding cans (Metal ShieldCan) and heat-conducting components can be used, for example, as described in Korean authorized patents No. 2048809 and No. 2318858 of the applicant.

[0004] As another prior art, there is a conformal shield provided by depositing, plating, or spraying a conductive material on an epoxy resin mold constituting the outside of a semiconductor chip, and a compartment shield provided by embedding a metal wire or a metal chip inside the semiconductor chip.

[0005] As another prior art, there is a semiconductor chip package, which is composed of a computer CPU, a semiconductor bare chip mounted on a semiconductor package substrate, covered by a metal shielding can, and a thermal grease is sandwiched between the semiconductor bare chip and the metal shielding can. The metal shielding can serves to mechanically protect the semiconductor bare chip while shielding the electromagnetic waves generated by the semiconductor bare chip and receive the heat generated by the semiconductor bare chip together with the thermal grease to disperse and release it to the outside.

[0006] As described above, the metal shielding can, as a component for shielding the electromagnetic waves of the semiconductor chip, has a box-shaped metal body and is mounted on the circuit substrate by welding, etc., so that it has a size larger than a predetermined size. However, if it is to be set on a circuit substrate with a narrow space such as a smartphone, a space based on this is required, so there are limitations in its application.

[0007] In particular, conventional metal shielding cans are installed in a manner that surrounds and covers the periphery of the semiconductor chip mounted on the circuit substrate at a large distance from the semiconductor chip, and are ultimately installed away from the semiconductor chip that generates electromagnetic waves and heat. Therefore, they have limitations in economically and effectively shielding the electromagnetic waves generated by the semiconductor chip or economically and effectively transferring and dissipating heat.

[0008] In addition, after the metal shielding can is mounted on the circuit substrate, it is difficult to make an elastic electrical connection with a plate-shaped cooling unit such as a heat sink disposed on the upper portion of the metal shielding can, which ultimately makes it difficult for the grounding pattern of the circuit substrate to be electrically connected to the cooling unit. Therefore, a separate electromagnetic interference (EMI) gasket is required to electrically connect the metal shielding can and the cooling unit.

[0009] As another prior art, Korean Patent No. 2459794 proposes a method for further forming a metal film on a semiconductor chip, wherein, in order to provide the metal film, a separate metal film sheet having a support sheet and an appearance frame is prepared, and a high-pressure sterilization process is performed in a sealed process chamber, thereby pressurizing the substrate with the heated metal film sheet to attach the metal film to the surface of the semiconductor chip.

[0010] According to the above patent, the manufacturing cost is increased due to the process of manufacturing and installing the metal film.

[0011] In addition, when a plurality of semiconductor chips are closely mounted on a circuit substrate, it is difficult for the metal film to be effectively attached between the side walls of adjacent semiconductor chips due to the limited length of the metal film sheet that can be stretched.

[0012] Furthermore, a thin metal film is formed on the upper surface of the semiconductor chip, which results in insufficient heat transfer and heat dispersion with the opposing circuit substrate or metal cover, and is inconvenient when reworking the semiconductor chip mounted on the circuit substrate. Summary of the invention

[0013] Therefore, an object of the present invention is to provide an electromagnetic wave shielding device for a semiconductor package that can effectively electromagnetically shield electromagnetic waves and heat generated on the side surface of a semiconductor chip mounted on a circuit board at a close distance while performing heat transfer and heat dispersion.

[0014] Another object of the present invention is to provide an electromagnetic wave shielding device for a semiconductor package that can be easily mounted on a circuit substrate having a narrow area.

[0015] Another object of the present invention is to provide an electromagnetic wave shielding device that can be easily electrically and thermally connected to a metal cover covering a semiconductor chip mounted on a circuit substrate, and can easily protect the semiconductor chip from the metal cover or external force.

[0016] The purpose is achieved by an electromagnetic wave shielding device, which is an electromagnetic wave shielding device for shielding electromagnetic waves of a semiconductor package having a semiconductor chip mounted on a circuit substrate. The electromagnetic wave shielding device is composed of a ring-shaped conductive body, the body has heat resistance corresponding to the welding temperature, and a housing portion is formed on the inner side of the body, the semiconductor chip is accommodated in the housing portion, the body surrounds the side surface of the semiconductor chip and forms a closed circuit, thereby shielding electromagnetic waves flowing out from the side surface of the semiconductor chip or flowing into the side surface of the semiconductor chip, and at least a portion of the inner surface of the body is in contact with at least a portion of the side surface of the semiconductor chip.

[0017] Preferably, an inner surface of the body may elastically contact a side surface of the semiconductor chip.

[0018] Preferably, the body may be composed of a stack of a contact portion fixed along a side surface of the semiconductor chip and a shielding portion bonded to an outer surface of the contact portion. More preferably, the contact portion and the shielding portion may have different resistances from each other.

[0019] Preferably, the height of the body may be equal to or greater than the height of the semiconductor chip.

[0020] Preferably, a lower surface of the body may be in electrical contact with a ground pattern portion formed on the circuit substrate.

[0021] Preferably, at least a portion of an inner surface of the body may be in direct contact with at least one side surface of the semiconductor chip or may be bonded via an interposed adhesive, and the body and the adhesive may have thermal conductivity.

[0022] Preferably, the main body may be integrally formed of a vertical portion and a horizontal portion expanded inwardly from an upper end of the vertical portion.

[0023] Preferably, the electromagnetic wave shielding device may further include: a heat dissipation portion that expands integrally and horizontally toward the outside of the main body.

[0024] Preferably, at least a portion of the inner surface of the main body may be spaced apart from the semiconductor chip by a predetermined distance, and the lower surface of the main body may be bonded to the circuit substrate by bonding.

[0025] Preferably, the housing portion may house more than one semiconductor chip, and at least a portion of the inner surface of the body may be in direct contact with at least one side surface of the semiconductor chip or be bonded with an adhesive therebetween.

[0026] Preferably, the receiving portion may be formed so that when the semiconductor chip is viewed in a vertical direction from top to bottom, the entire upper surface of the semiconductor chip is exposed to the outside.

[0027] According to the electromagnetic wave shielding device of the present invention, by making at least a portion of the inner surface of the ring-shaped body contact the side surface of the semiconductor chip, it is possible to effectively electromagnetically shield the electromagnetic waves and heat generated on the side surface of the semiconductor chip at the closest distance while performing heat transfer or heat dispersion, and better thermal contact can be achieved by means of a thermally conductive adhesive.

[0028] Furthermore, by reducing the thickness of the main body constituting the electromagnetic wave shielding device, it is easy to apply to a circuit board having a narrow area.

[0029] Furthermore, when the electromagnetic wave shielding device is made of an elastic rubber material, it can shield electromagnetic waves from the semiconductor chip while elastically contacting the side surface of the semiconductor chip and can be electrically connected elastically to the metal cover covering the semiconductor chip.

[0030] Furthermore, the height of the electromagnetic wave shielding device is equal to or slightly higher than the height of the semiconductor chip mounted on the circuit substrate, thereby being able to protect the semiconductor bare die or the semiconductor chip including the semiconductor bare die from the metal cover pressed downward.

[0031] Furthermore, one or more semiconductor chips mounted on a circuit substrate can be electromagnetically shielded individually or collectively by one electromagnetic wave shielding device, and heat can be transferred or dispersed. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 An electromagnetic wave shielding device according to an embodiment of the present invention is shown in an exploded view.

[0033] Figure 2 The electromagnetic wave shielding device is shown in a state where it is bonded to a semiconductor chip.

[0034] Figure 3 An electromagnetic wave shielding device according to another embodiment of the present invention is shown.

[0035] Figure 4 A structure in which the electromagnetic wave shielding device is fixed to a semiconductor chip is shown.

[0036] Figure 5 Modifications of the electromagnetic wave shielding device are shown.

[0037] Figure 6 An electromagnetic wave shielding device according to still another embodiment of the present invention is shown.

[0038] Figure 7 An electromagnetic wave shielding device according to still another embodiment of the present invention is shown.

[0039] Description of Reference Numerals 10: Circuit board 100: Semiconductor chip 110: Electromagnetic wave shielding device 111: Main body DETAILED DESCRIPTION

[0040] It should be noted that the technical terms used in the present invention are only used to illustrate specific embodiments and are not intended to limit the present invention. In addition, unless specifically defined as other meanings in the present invention, the technical terms used in the present invention should be interpreted as the meanings commonly understood by ordinary technicians in the technical field to which the present invention belongs, and should not be interpreted as overly generalized meanings or overly narrowed meanings.

[0041] The electromagnetic wave shielding device of the present invention is applicable not only to semiconductor chips mounted on circuit substrates, but also to semiconductor packages in which semiconductor chips are electrically connected to substrates through lead frames, wire bonding or flip chip bonding, and is independent of epoxy resin-based sealing structures.

[0042] Furthermore, in the present invention, the electromagnetic wave shielding device plays a role in shielding electromagnetic waves generated in the semiconductor chip and flowing out to the outside, and shielding electromagnetic waves flowing into the semiconductor chip from the outside.

[0043] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings, wherein the accompanying drawings are used to help understand the present invention, and for the sake of convenience of description, the dimensions of some components may be omitted and slightly exaggerated.

[0044] Figure 1 The electromagnetic wave shielding device according to one embodiment of the present invention is shown in an exploded view. Figure 2 The electromagnetic wave shielding device is shown in a state where it is bonded to a semiconductor chip.

[0045] Reference Figure 1 The electromagnetic wave shielding device 110 of the present invention elastically contacts the side surface of the semiconductor chip 100 of the semiconductor package mounted on the circuit substrate and forms a closed circuit relative to the semiconductor chip 100, thereby easily shielding the electromagnetic waves generated from the side surface of the semiconductor chip 100 and transferring or dissipating the generated heat to the outside.

[0046] Structurally, the electromagnetic wave shielding device 110 is composed of a ring-shaped main body 111. Figure 1As shown in the enlarged circle of FIG. 1 , the contact portion 112 fixed along the side surface of the semiconductor chip 100 and the shield portion 113 formed on the outer surface of the contact portion 112 are stacked.

[0047] The contact portion 112 and the shield portion 113 may have different resistances from each other, for example, the contact portion 112 may be electrically insulating and the shield portion 113 may be conductive, or vice versa, and alternatively, both the contact portion 112 and the shield portion 113 may be conductive and have the same resistance.

[0048] As an example, the resistance of the contact portion 112 may be greater than 10 10 ohms, and the upper and lower resistances of the shielding portion 113 may be less than 1 ohm, but the present invention is not limited thereto.

[0049] The contact portion 112 and the shielding portion 113 may have different mechanical properties from each other. For example, the contact portion 112 may be rubber having elasticity, and the shielding portion 113 may be a polymer resin having no elasticity.

[0050] For example, the shielding portion 113 may be a conductive coating formed by solidifying a liquid conductive material corresponding to the shielding portion 113 on the outer surface of the contact portion 112 .

[0051] Furthermore, preferably, the hardness of the shielding part 113 may be higher than that of the contact part 112 , and the elongation of the shielding part 113 may be lower than that of the contact part 112 , so as to have low resistance and be easily inserted into the semiconductor chip 100 .

[0052] For example, the hardness of the contact portion 112 may be Shore hardness A30 to A60, the hardness of the shielding portion 113 may be Shore hardness A45 to A75, and the elongation of the contact portion 112 may be 1.3 times or more of the initial length, but is not limited thereto.

[0053] Preferably, the shape of the ring formed by the body 111 can be circular or quadrilateral, but is not limited thereto. For example, when the body 111 is circular, it can be deformed in a manner of contacting the side surface of the quadrilateral semiconductor chip 100, thereby forming a quadrilateral ring shielding device.

[0054] For example, the electromagnetic wave shielding device 110 can be formed by impregnating liquid conductive rubber into the outer surface of a roll-shaped non-conductive rubber tube and curing it to form a conductive rubber coating, and then cutting the tube into a predetermined length, but is not limited to this. It can also be prepared by simultaneously extruding or injection molding liquid non-conductive silicone rubber and liquid conductive silicone rubber.

[0055] As an example, the width of the body 111 may be 0.5 mm to 2 mm.

[0056] The height of the body 111 may be formed to be equal to or greater than the height of the semiconductor chip 100 into which the body 111 is inserted. Figure 2 As shown, when a heat conducting component 130 is interposed between the semiconductor chip 100 and the metal cover 20 , a flexible electrical connection can be established with the metal cover 20 disposed on the upper portion.

[0057] As an example, the height of the body 111 may be 0.5 mm to 2 mm.

[0058] For example, the semiconductor chip 100 may be a flip chip, with a ball grid array (BGA) 102 protruding from the lower surface thereof and electrically connected to the circuit substrate 10 , and the exterior of the semiconductor chip 100 may be sealed with epoxy resin.

[0059] The electromagnetic wave shielding device 110 can be provided by being inserted along the side surface of the semiconductor chip 100 before the semiconductor chip 100 is installed on the circuit substrate 10, or can be inserted along the side surface of the semiconductor chip 100 after the semiconductor chip 100 is installed on the circuit substrate 10, so that an appropriate method can be selected according to the size or number of the semiconductor chips 100 or the structure of the mounted circuit substrate 10.

[0060] When the electromagnetic wave shielding device 110 is combined with the semiconductor chip 100, the contact portion 112 of the main body 111 can elastically contact the semiconductor chip 100 along the side surface of the semiconductor chip 100, and the shielding portion 113 can form a closed circuit relative to the semiconductor chip 100, thereby shielding electromagnetic waves and transferring or dissipating the heat generated on the side surface of the semiconductor chip 100 to the outside.

[0061] Preferably, the lower surface of the conductive contact portion 112 or the shielding portion 113 is electrically connected to the ground pattern of the circuit substrate 10. For example, in the lower surface of the body 111, the shielding portion 113 may be electrically in contact with the ground pattern portion of the circuit substrate 10, and the contact portion 112 may be in contact with the insulating portion of the circuit substrate 10.

[0062] Preferably, the main body 111 of the electromagnetic wave shielding device 110 has heat resistance corresponding to reflow soldering. However, if the main body 111 is made of rubber having good elasticity, it may be made of silicone rubber.

[0063] Since the body 111 has heat resistance corresponding to soldering, soldering may be performed after the body 111 is inserted into the semiconductor chip 100 , and re-work may be performed after soldering.

[0064] In this way, the body 111 inserted by contacting the side surface of the semiconductor chip 100 can shield electromagnetic waves generated on the side surface of the semiconductor chip 100 at a close distance, and can transfer or disperse heat generated on the side surface of the semiconductor chip 100 to the outside.

[0065] Furthermore, electromagnetic wave shielding or heat transfer and heat dispersion can be performed individually for the plurality of semiconductor chips 100 .

[0066] Although not shown, it is obvious that the body 111 may be inserted in a manner not to contact the entire side surface of the semiconductor chip 100, but may be inserted in a manner to contact only a portion or may be arranged in a manner to contact only a portion. In other words, a portion of the inner surface of the body 111 may contact only a portion of the side surface of the semiconductor chip 100, or the entire inner surface of the body 111 may contact the entire side surface of the semiconductor chip 100.

[0067] Reference Figure 2 The upper surface of the main body 111 of the electromagnetic wave shielding device 110 is covered by the conductive metal cover 20 , so that the upper surface of the shielding part 113 can be elastically electrically connected to the metal cover 20 .

[0068] According to this structure, the metal cover 20 presses the upper surface of the body 111 and makes electrical contact, so that electromagnetic waves generated throughout the semiconductor chip 100 are shielded by the metal cover 20 and the body 111 .

[0069] Furthermore, when the heat conducting member 130 is interposed between the metal cover 20 and the upper surface of the semiconductor chip 100 , heat generated from the semiconductor chip 100 is more quickly transferred to the metal cover 20 through the heat conducting member 130 .

[0070] Figure 3 An electromagnetic wave shielding device according to another embodiment of the present invention is shown.

[0071] The electromagnetic wave shielding device 120 includes a ring-shaped conductive body 121 having a housing portion 122 capable of housing the semiconductor chip 100 , thereby surrounding the side surface of the semiconductor chip 100 and forming a closed circuit to shield electromagnetic waves generated from the semiconductor chip 100 .

[0072] In addition, the electromagnetic wave shielding device 120 directly or indirectly contacts the side surface of the semiconductor chip 100 , thereby absorbing the heat generated in the semiconductor chip 100 and transferring and dissipating the heat to the outside to release the heat.

[0073] Reference Figure 3 The main body 121 of the electromagnetic wave shielding device 120 is formed as a single body in the shape of a quadrangular ring having a housing portion 122 corresponding to the quadrangular semiconductor chip 100 formed therein.

[0074] The receiving portion 122 is formed so that the entire upper surface of the semiconductor chip 100 is exposed to the outside when the semiconductor chip 100 is viewed in a vertical direction from top to bottom.

[0075] Preferably, the upper and lower surfaces of the main body 121 are formed into planes so that the main body 121 can contact the circuit substrate 10 and the conductive cover described later that are opposite to each other with a large area.

[0076] The main body 121 has an appropriate size and shape so as to effectively electromagnetically shield the electromagnetic waves generated on the side surface of the semiconductor chip 100 at a relatively close distance to the side surface of the semiconductor chip 100, while better transferring and dissipating the heat generated by the semiconductor chip 100 from the side surface to the outside.

[0077] The main body 121 is made of a metal material with good electrical conductivity, preferably a material with good thermal conductivity and capable of being soldered by solder paste. For example, when the main body 121 is metal, it can be manufactured by extruding a plate-shaped copper, iron or alloy thereof with uniform thickness.

[0078] In the present invention, at least a portion of the inner surface of the body 121 is in contact with and fixed to at least a portion of the side surface of the semiconductor chip 100. Here, fixing with respect to the semiconductor chip means directly or indirectly bonding and fixing with the semiconductor chip 100 as the center in a broad sense as described below.

[0079] Preferably, at least a portion of the inner surface of the body 121 is securely contacted and fixed by interposing the adhesive 125 on at least a portion of the side surface of the semiconductor chip 100 .

[0080] Figure 4 A structure in which the electromagnetic wave shielding device is fixed to a semiconductor chip is shown.

[0081] Reference Figure 4 The main body 121 of the electromagnetic wave shielding device 110 can be bonded to the side surface of the semiconductor chip 100 by sandwiching an adhesive 125, the inner surface of the main body 121 can be bonded and fixed to only one of the four side surfaces of the semiconductor chip 100, or the inner surface of the main body 121 can be bonded to all the side surfaces of the semiconductor chip 100.

[0082] If the inner surface of the main body 121 is bonded and fixed to the four side surfaces of the semiconductor chip 100 by the adhesive 125, heat transfer can be performed well in a symmetrical manner in all directions. In the case where the inner surface of the main body 121 is only bonded and fixed to one of the four side surfaces of the semiconductor chip 100, the amount of consumed adhesive can be reduced and the operation can be simplified, thereby improving operating efficiency.

[0083] For example, in the case where the semiconductor chip 100 has a flip chip bonding structure and an underfill 104 is applied to the lower surface, the adhesive 125 may be bonded to the underfill 104. That is, in the case where the lower surface of the semiconductor chip 100 is bonded to the circuit substrate 10 through the underfill 104, the adhesive 125 may be formed to protrude from the lower surface to the side surface and cover the underfill 104 exposed to the outside.

[0084] The adhesive 125 may be epoxy resin or silicone rubber having heat resistance corresponding to welding, and may be provided by curing after discharging a liquid adhesive corresponding to the adhesive 125 through a dispenser or the like.

[0085] Preferably, the adhesive 125 may have electrical insulation in order to prevent electrical connection with the circuit substrate 10 or the semiconductor chip, and may have thermal conductivity in order to achieve good heat transfer, but is not limited thereto.

[0086] Preferably, the height of the adhesive 125 is equal to or lower than the height of the semiconductor chip 100 mounted on the package substrate or the circuit substrate 10 .

[0087] Before the semiconductor chip 100 is mounted on the circuit substrate 10, the electromagnetic wave shielding device 110 can be inserted and fixed in a manner surrounding the side surface of the semiconductor chip 100, or after the semiconductor chip 100 is mounted on the circuit substrate 10, the electromagnetic wave shielding device 110 can be inserted in a manner surrounding the side surface of the semiconductor chip 100, so that an appropriate method can be selected according to the size or number of the semiconductor chips 100 or the structure of the mounted circuit substrate 10.

[0088] For example, after the semiconductor chip 100 is mounted on the circuit substrate 10 , the electromagnetic wave shielding device 110 suitable for the application is installed around the side surface of the semiconductor chip 100 and then fixed to the side surface of the semiconductor chip 100 using the adhesive 125 .

[0089] Reference Figure 4 The lower surface of the body 121 can be electrically contacted with a ground pattern portion formed on the circuit substrate 10, and the electrical contact can be achieved by welding using solder, conductive epoxy resin or silicon adhesive or welding.

[0090] In this case, the lower surface of the body 121 of the electromagnetic wave shielding device 120 may improve the electromagnetic wave shielding effect by making electrical contact with the ground pattern portion of the circuit substrate 10 .

[0091] As another embodiment, when the main body 121 is separated from the semiconductor chip 100 by a predetermined interval and surrounds the semiconductor chip 100 to form a closed circuit, if the interval is wider, it may be difficult to fill the adhesive 125. In this case, the lower surface of the main body 121 can be bonded and fixed to the circuit substrate 10 by means of solder or epoxy adhesive.

[0092] As the upper surface of the body 121 may be pressed and covered by the metal cover 20 and electrically connected to each other through contact, preferably, the metal cover 20 covers both the upper surface of the semiconductor chip 100 and the upper surface of the body 121 .

[0093] Here, the metal cover 20 may be a plate-shaped metal sheet or a heat plate, a heat sink or a steam chamber.

[0094] The height of the main body 121 may be equal to or slightly greater than the height of the semiconductor chip 100 mounted on the circuit substrate 10. Figure 4 As shown, when the height of the main body 121 is greater than the height of the semiconductor chip 100, a gap can be formed between the upper surface of the semiconductor chip 100 and the metal cover 20, and the heat generated from the semiconductor chip 100 can be quickly and massively transferred to the metal cover 20 by sandwiching a heat-conducting component 130 in the gap.

[0095] The heat conductive member 130 may be a heat conductive rubber in the form of gel, grease, or sheet.

[0096] Figure 5 Modifications of the electromagnetic wave shielding device are shown.

[0097] The electromagnetic wave shielding device 210 is integrally formed of a ring-shaped vertical portion 213 and a horizontal portion 211 extending inward from an upper end of the vertical portion 213 .

[0098] An opening 212 may be formed in the center of the horizontal portion 211 , and the horizontal portion 211 may be expanded as needed to reduce or eliminate the opening 212 .

[0099] According to such a structure, the heat dispersion and heat dissipation area can be increased without increasing the height of the main body 211 (or the horizontal portion 211 ) of the electromagnetic wave shielding device 210 .

[0100] In particular, when the openings 212 are formed less or not at all, since the shape is similar to that of the metal shield case, electromagnetic waves can be shielded more effectively even without the metal cover 20 .

[0101] Figure 6 An electromagnetic wave shielding device according to still another embodiment of the present invention is shown.

[0102] In this embodiment, the electromagnetic wave shielding device 310 is composed of a single body 312 of a metal material, and a plurality of housing portions 313 , 314 , 315 , and 316 are formed inside at predetermined intervals.

[0103] According to this structure, when multiple semiconductor chips 103, 104, 105, and 106 are mounted on the circuit substrate 10 in an adjacent manner, an electromagnetic wave shielding device 310 is used to be inserted into the housing portions 313, 314, 315, and 316 in a manner that contacts the side surfaces of each semiconductor chip 103, 104, 105, and 106.

[0104] Such an electromagnetic wave shielding device 310 can be effectively applied when the plurality of semiconductor chips 103 , 104 , 105 , and 106 are arranged on the circuit substrate 10 at uniform intervals and in a constant size like a dynamic random access memory (DRAM).

[0105] The sizes of the receiving portions 313 , 314 , 315 , and 316 may be different depending on the semiconductor chips 103 , 104 , 105 , and 106 .

[0106] In this embodiment, the case where each receiving portion 313, 314, 315, 316 receives one semiconductor chip is described as an example, but it is obvious that the size and arrangement of the receiving portions in the main body 312 can be adjusted so that multiple semiconductor chips can be received in one receiving portion.

[0107] According to such a structure, the semiconductor chips 103 , 104 , 105 , and 106 mounted on the circuit board 10 can efficiently perform electromagnetic wave shielding, heat transfer, and heat dispersion individually or as a whole.

[0108] Figure 7 An electromagnetic wave shielding device according to still another embodiment of the present invention is shown.

[0109] In this embodiment, for example, the semiconductor chip 400 can be a semiconductor die processed from a semiconductor wafer used for a computer CPU, and is mounted on the package substrate 50 in a flip-chip bonding manner by coating a bottom filling glue 404 connected to the package substrate 50 on the lower surface of the semiconductor chip 400.

[0110] As described above, although the semiconductor chip 400 without an epoxy resin molded article formed on the outside has a disadvantage of being easily damaged by external force, the heat generated in the semiconductor chip 400 is quickly transferred to the outside.

[0111] The electromagnetic wave shielding device 410 of this embodiment is composed of a main body 411 in a square ring shape and a heat dissipation portion 412 that expands horizontally to the outside of the main body 411 .

[0112] Preferably, the inner surface of the body 411 and the side surface of the semiconductor chip 400 are adhered and fixed to each other by interposing the adhesive 425 therebetween, and the adhesive 425 is interposed with respect to the entire side surface of the semiconductor chip 400 .

[0113] Preferably, when the underfill 404 is formed, the adhesive 425 is formed to cover the underfill 404 .

[0114] Optionally, semiconductor chips different from the plurality of electronic components 52 may be mounted on the package substrate 50 . These semiconductor chips may be located below the heat dissipation portion 412 of the electromagnetic wave shielding device 410 and fixed to the lower surface of the heat dissipation portion 412 by means of an electrically insulating thermally conductive adhesive component 430 .

[0115] According to this structure, the main body 411 is in contact with the semiconductor chip 400 which is not molded by epoxy resin through the adhesive 425, so that electromagnetic waves can be effectively shielded and the generated heat can be transferred to the outside more quickly.

[0116] In particular, the heat generated from the semiconductor chip 400 can be quickly released or transferred to the outside by the heat dissipation portion 412 having a larger area.

[0117] In this embodiment, the electromagnetic wave shielding device 410 may have a main body 411 having a quadrangular ring shape corresponding to the shape of the semiconductor chip 400 , and may be manufactured using a metal plate having a housing portion for housing the semiconductor chip 400 when the height of the semiconductor chip 400 is relatively low.

[0118] As described above, the inner surface of the housing portion of the metal plate (ie, the inner side wall portion in the thickness direction) is bonded and fixed to the side surface of the semiconductor chip 400 by the adhesive 425 .

[0119] As described above, the electromagnetic wave shielding device 110 according to the present invention has the advantage of being able to perform heat transfer and heat dispersion while effectively electromagnetically shielding electromagnetic waves and heat generated on the side surface of the semiconductor chip 100 at a close distance.

[0120] The above is described with the embodiment of the present invention as the center, but various changes or deformations can be made at the level of a technician in the technical field to which the present invention belongs. Such changes and deformations can be regarded as belonging to the present invention without departing from the scope of the present invention. The scope of rights of the present invention should be judged according to the scope of the claims recorded.

Claims

1. An electromagnetic wave shielding device for a semiconductor package, characterized in that: An electromagnetic wave shielding device for a semiconductor package for shielding electromagnetic waves of a semiconductor package having a semiconductor chip mounted on a circuit board, The electromagnetic wave shielding device of the semiconductor package is composed of a ring-shaped conductive body. The main body has heat resistance corresponding to the welding temperature, and a receiving portion is formed inside the main body. The semiconductor chip is accommodated in the accommodation portion, and the main body surrounds the side surface of the semiconductor chip and forms a closed circuit, thereby shielding electromagnetic waves flowing out from the side surface of the semiconductor chip or flowing into the side surface of the semiconductor chip. At least a portion of an inner surface of the body contacts at least a portion of a side surface of the semiconductor chip.

2. The electromagnetic wave shielding device for a semiconductor package according to claim 1, wherein: The inner surface of the body elastically contacts the side surface of the semiconductor chip.

3. The electromagnetic wave shielding device for a semiconductor package according to claim 1, wherein: The main body is formed by stacking a contact portion fixed by contact along a side surface of the semiconductor chip and a shield portion bonded to an outer surface of the contact portion.

4. The electromagnetic wave shielding device for a semiconductor package according to claim 3, wherein: The contact portion and the shield portion have resistances different from each other.

5. The electromagnetic wave shielding device for a semiconductor package according to claim 1, wherein: The height of the body is equal to or greater than the height of the semiconductor chip.

6. The electromagnetic wave shielding device for a semiconductor package according to claim 1, wherein: A lower surface of the main body is in electrical contact with a ground pattern portion formed on the circuit substrate.

7. The electromagnetic wave shielding device for a semiconductor package according to claim 1, wherein: At least a portion of an inner surface of the body is in direct contact with at least one side surface of the semiconductor chip or is bonded with an adhesive interposed therebetween.

8. The electromagnetic wave shielding device for a semiconductor package according to claim 7, wherein: The body and the adhesive are thermally conductive.

9. The electromagnetic wave shielding device for a semiconductor package according to claim 1, wherein: The main body is formed integrally with a vertical portion and a horizontal portion that expands inward from an upper end of the vertical portion.

10. The electromagnetic wave shielding device of a semiconductor package according to claim 1, wherein: Also includes: The heat dissipation portion is integrally expanded horizontally toward the outside of the main body.

11. The electromagnetic wave shielding device for a semiconductor package according to claim 1, wherein: At least a portion of the inner surface of the body is spaced apart from the semiconductor chip by a predetermined distance, The lower surface of the main body is bonded to the circuit substrate by bonding.

12. The electromagnetic wave shielding device of a semiconductor package according to claim 1, wherein: One or more semiconductor chips are housed in the housing portion.

13. The electromagnetic wave shielding device of a semiconductor package according to claim 12, wherein: At least a portion of an inner surface of the body is in direct contact with at least one side surface of the semiconductor chip or is bonded with an adhesive interposed therebetween.

14. The electromagnetic wave shielding device of a semiconductor package according to claim 13, wherein: The body and the adhesive are thermally conductive.

15. The electromagnetic wave shielding device of a semiconductor package according to claim 1 or 12, characterized in that: The housing portion is formed so that when the semiconductor chip is viewed in a vertical direction from top to bottom, the entire upper surface of the semiconductor chip is exposed to the outside.

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