Signal processing system based on glass substrate

Abstract

The invention discloses a signal processing system based on a glass substrate. The system comprises a substrate, a metal sheet is arranged on the substrate, and a port 1, a port 2, a port 3, a port 4, a port 5, a substrate integrated waveguide band-pass filter, a first substrate integrated waveguide directional coupler, a second substrate integrated waveguide directional coupler, a third substrate integrated waveguide directional coupler, an isolation port 1, an isolation port 2 and an isolation port 3 are etched on the metal sheet; the port 1 is connected with the substrate integrated waveguide band-pass filter, the substrate integrated waveguide band-pass filter is connected with the first substrate integrated waveguide directional coupler, and the first substrate integrated waveguide directional coupler is respectively connected with the isolation port 1. The technical problems that in the prior art, a scheme that a filter and a power divider are separated is adopted, the integration level is low, the system manufacturing cost is high, the machining precision requirement is high, and consequently the balance between branches is poor are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of signal processing and circuit design, and in particular to a signal processing system based on a glass substrate. Background Art

[0002] With the continuous innovation of radar detection and perception technology, the operating frequency band is getting higher and higher, and the application potential of the W band (75-110GHz) is being gradually explored. In this frequency band, traditional printed circuit board technology can no longer serve as a circuit substrate. Glass substrate has become one of the excellent choices for circuit substrates in this frequency band due to its extremely high processing accuracy and low dielectric loss.

[0003] Substrate integrated waveguide technology is a technology that uses planar processing technology to prepare metalized through-holes on various types of substrates to achieve RF / millimeter wave circuit preparation technology equivalent to waveguide cavities. The devices and circuits prepared by it have performance close to that of metal waveguides, while having lower manufacturing difficulty and cost. Substrate integrated waveguide technology on glass substrates can be manufactured with very high precision, ensuring the excellent performance and yield rate of devices and circuits prepared based on this technology.

[0004] The power distribution network (power division) in the millimeter wave circuit is responsible for combining multiple energy paths or distributing one energy path. The filter in the millimeter wave circuit is responsible for allowing the required frequency signals to pass through and filtering out the unnecessary frequency band signals. Both play a pivotal role in the front end of the millimeter wave circuit transceiver. Summary of the invention

[0005] The embodiment of the present invention provides a signal processing system based on a glass substrate, so as to at least solve the technical problems in the prior art of using separate filters and power dividers, which have low integration, high system manufacturing costs, high processing precision requirements, and lead to poor balance between each branch.

[0006] According to one aspect of an embodiment of the present invention, a signal processing system based on a glass substrate is provided. The system may include: a substrate, a metal sheet is arranged on the substrate, and port 1, port 2, port 3, port 4, port 5, a substrate integrated waveguide bandpass filter, a first substrate integrated waveguide directional coupler, a second substrate integrated waveguide directional coupler, a third substrate integrated waveguide directional coupler, an isolation port 1, an isolation port 2 and an isolation port 3 are etched on the metal sheet; port 1 is connected to the substrate integrated waveguide bandpass filter, the substrate integrated waveguide bandpass filter is connected to the first substrate integrated waveguide directional coupler, the first substrate integrated waveguide directional coupler is respectively connected to the isolation port 1, the second substrate integrated waveguide directional coupler and the third substrate integrated waveguide directional coupler; the second substrate integrated waveguide directional coupler is respectively connected to the isolation port 2, port 2 and port 3; the third substrate integrated waveguide directional coupler is respectively connected to the isolation port 3, port 4 and port 5.

[0007] Optionally, the substrate is a glass substrate, the thickness of the glass substrate is 250 μm, and the dielectric constant thereof is 3.4.

[0008] Optionally, the lengths of the first substrate integrated waveguide directional coupler, the second substrate integrated waveguide directional coupler, and the third substrate integrated waveguide directional coupler are all 4520 μm and the widths are all 3074 μm.

[0009] Optionally, two grooves are provided on the port 1, the port 2, the port 3, the port 4 and the port 5.

[0010] Optionally, the substrate integrated waveguide bandpass filter comprises an input end and an output end, the input end of the substrate integrated waveguide bandpass filter is connected to port 1, and the output end of the substrate integrated waveguide bandpass filter is connected to the first substrate integrated waveguide directional coupler.

[0011] Optionally, the first substrate integrated waveguide directional coupler includes a first input end, a first isolation end, a first output end and a second output end, the output end of the substrate integrated waveguide bandpass filter is connected to the first input end, the first isolation end is connected to the isolation port 1, the first output end is connected to the second substrate integrated waveguide directional coupler, and the second output end is connected to the third substrate integrated waveguide directional coupler.

[0012] Optionally, the second substrate integrated waveguide directional coupler includes a second input end, a second isolation end, a third output end and a fourth output end, the second input end is connected to the first output end, the second isolation end is connected to the isolation port 2, the third output end is connected to the port 2, and the fourth output end is connected to the port 3.

[0013] Optionally, the third substrate integrated waveguide directional coupler includes a third input end, a third isolation end, a fifth output end and a sixth output end, the third input end is connected to the second output end, the third isolation end is connected to the isolation port 3, the fourth output end is connected to the port 4, and the sixth output end of the third substrate integrated waveguide directional coupler is connected to the port 5.

[0014] According to another aspect of an embodiment of the present invention, a method for using a signal processing system based on a glass substrate is provided. The method may include: obtaining an initial RF signal from port 1; filtering the initial RF signal through a substrate integrated waveguide bandpass filter to obtain an RF signal of a target frequency band; inputting the RF signal of the target frequency band into a first substrate integrated waveguide directional coupler to obtain a first RF signal and a second RF signal; inputting the first RF signal into a second substrate integrated waveguide directional coupler to obtain a third RF signal and a fourth RF signal; inputting the second RF signal into a third substrate integrated waveguide directional coupler to obtain a fifth RF signal and a sixth RF signal.

[0015] Beneficial effects of the present invention: 1. The millimeter wave glass substrate has high processing precision, and the through-hole diameter can reach 50μm. The substrate integrated waveguide circuit prepared by this technology has performance closer to that of the waveguide cavity; 2. Integrating the filtering function and the power distribution / synthesis function through the same set of processes can reduce the manufacturing cost of the entire circuit on the one hand, and improve the integration of discrete devices on the other hand, which can reduce the system volume; 3. It has a higher degree of power distribution balance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings: Figure 1 is a schematic diagram of a signal processing system based on a glass substrate according to an embodiment of the present invention; Figure 2 is a schematic diagram of a metallized through-hole structure on a glass substrate according to an embodiment of the present invention; Figure 3 is a schematic diagram of a substrate integrated waveguide directional coupler according to an embodiment of the present invention; Figure 4 is a schematic diagram of a substrate integrated waveguide bandpass filter according to an embodiment of the present invention; Figure 5 is a flow chart of a method for using a signal processing system based on a glass substrate according to an embodiment of the present invention; Figure 64 is a schematic diagram of a simulation result of a signal processing system performance of a glass substrate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0017] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only embodiments of a part of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0018] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods or devices.

[0019] Example 1 Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that the disclosure will be more comprehensive and complete and to fully convey the concepts of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0020] In addition, the accompanying drawings are only schematic illustrations of the embodiments of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the figures represent the same or similar parts, and their repeated descriptions will be omitted. Some of the block diagrams shown in the accompanying drawings are functional entities and do not necessarily correspond to physically or logically independent entities.

[0021] Figure 1 is a schematic diagram of a signal processing system based on a glass substrate according to an embodiment of the present invention. Figure 1As shown, the system may include: a substrate, a metal sheet is arranged on the substrate, port 1, port 2, port 3, port 4, port 5, a substrate integrated waveguide bandpass filter, a first substrate integrated waveguide directional coupler, a second substrate integrated waveguide directional coupler, a third substrate integrated waveguide directional coupler, an isolation port 1, an isolation port 2 and an isolation port 3 are etched on the metal sheet; port 1 is connected to the substrate integrated waveguide bandpass filter, the substrate integrated waveguide bandpass filter is connected to the first substrate integrated waveguide directional coupler, the first substrate integrated waveguide directional coupler is respectively connected to the isolation port 1, the second substrate integrated waveguide directional coupler and the third substrate integrated waveguide directional coupler; the second substrate integrated waveguide directional coupler is respectively connected to the isolation port 2, port 2 and port 3; the third substrate integrated waveguide directional coupler is respectively connected to the isolation port 3, port 4 and port 5.

[0022] Specifically, Figure 1 As shown, a rectangular glass is used as a substrate, a metal sheet is arranged on the substrate, and port 1, port 2, port 3, port 4, port 5, a substrate integrated waveguide bandpass filter ①, a first substrate integrated waveguide directional coupler ②, a second substrate integrated waveguide directional coupler ③, a third substrate integrated waveguide directional coupler ④, an isolation port 1, an isolation port 2 and an isolation port 3 are etched on the metal sheet, wherein, as Figure 1 As shown, ⑤ is a metallized through hole on a glass substrate, which is the basic structure of the port 1, port 2, port 3, port 4, port 5, substrate integrated waveguide bandpass filter, first substrate integrated waveguide directional coupler, second substrate integrated waveguide directional coupler, third substrate integrated waveguide directional coupler, isolated port 1, isolated port 2 and isolated port 3 in the present invention, and the size of the five ports, port 1, port 2, port 3, port 4 and port 5, is the same; Figure 2 Schematic diagram of a metallized through hole structure on a glass substrate according to an embodiment of the present invention. Figure 2 As shown, the metallized through hole is an hourglass shape.

[0023] Next, we will refer to Figure 1 The respective parts of the above-mentioned signal processing system based on a glass substrate in this exemplary embodiment are described in more detail.

[0024] In one embodiment, the substrate is a glass substrate, the thickness of the glass substrate is 250 μm, and the dielectric constant thereof is 3.4.

[0025] Specifically, Figure 1 As shown, the substrate is a glass substrate, the thickness of the glass substrate is 250 μm, and its dielectric constant is 3.4.

[0026] In one embodiment, the lengths of the first substrate integrated waveguide directional coupler, the second substrate integrated waveguide directional coupler, and the third substrate integrated waveguide directional coupler are all 4520 μm and the widths are all 3074 μm.

[0027] Specifically, Figure 3 Schematic diagram of a substrate integrated waveguide directional coupler according to an embodiment of the present invention. Figure 3 As shown, the length of the first substrate integrated waveguide directional coupler, the second substrate integrated waveguide directional coupler, and the third substrate integrated waveguide directional coupler are all 4520 μm, the width is all 3074 μm, and the first substrate integrated waveguide directional coupler, the second substrate integrated waveguide directional coupler, and the third substrate integrated waveguide directional coupler all have an input end, an isolation end, and two output ends.

[0028] In one embodiment, two grooves are provided on each of the port 1 , the port 2 , the port 3 , the port 4 , and the port 5 .

[0029] Specifically, Figure 1 As shown, two grooves are provided on port 1, port 2, port 3, port 4, and port 5, and there is no metal sheet in the grooves.

[0030] In one embodiment, the substrate integrated waveguide bandpass filter includes an input end and an output end, the input end of the substrate integrated waveguide bandpass filter is connected to port 1, and the output end of the substrate integrated waveguide bandpass filter is connected to the first substrate integrated waveguide directional coupler.

[0031] Specifically, Figure 1 As shown, a substrate integrated waveguide bandpass filter ① with a passband of 87.1 GHz-89.5 GHz, the input end of the substrate integrated waveguide bandpass filter is connected to port 1, and the output end of the substrate integrated waveguide bandpass filter is connected to the first substrate integrated waveguide directional coupler ②, Figure 4 Schematic diagram of a substrate integrated waveguide bandpass filter according to an embodiment of the present invention, Figure 4 As shown, during the design process of the substrate integrated waveguide bandpass filter, there are several heights, namely 1350μm, 626.4μm, 1235μm, 376μm and 1369μm.

[0032] In one embodiment, the first substrate integrated waveguide directional coupler includes a first input end, a first isolation end, a first output end and a second output end, the output end of the substrate integrated waveguide bandpass filter is connected to the first input end, the first isolation end is connected to the isolation port 1, the first output end is connected to the second substrate integrated waveguide directional coupler, and the second output end is connected to the third substrate integrated waveguide directional coupler.

[0033] Specifically, Figure 3As shown, the first substrate integrated waveguide directional coupler includes a first input end, a first isolation end, a first output end and a second output end, as shown in Figure 1 As shown, the output end of the substrate integrated waveguide bandpass filter is connected to the first input end of the first substrate integrated waveguide directional coupler, the first isolation end of the first substrate integrated waveguide directional coupler is connected to the isolation port 1, the first output end of the first substrate integrated waveguide directional coupler is connected to the second substrate integrated waveguide directional coupler, and the second output end of the first substrate integrated waveguide directional coupler is connected to the third substrate integrated waveguide directional coupler.

[0034] In one embodiment, the second substrate integrated waveguide directional coupler includes a second input end, a second isolation end, a third output end and a fourth output end, the second input end is connected to the first output end, the second isolation end is connected to the isolation port 2, the third output end is connected to the port 2, and the fourth output end is connected to the port 3.

[0035] Specifically, Figure 1 As shown, the second input end of the second substrate integrated waveguide directional coupler is connected to the first output end of the first substrate integrated waveguide directional coupler, the second isolation end is connected to the isolation port 2, the third output end is connected to the port 2, and the fourth output end is connected to the port 3.

[0036] In one embodiment, the third substrate integrated waveguide directional coupler includes a third input end, a third isolation end, a fifth output end and a sixth output end, the third input end is connected to the second output end, the third isolation end is connected to the isolation port 3, the fourth output end is connected to the port 4, and the sixth output end of the third substrate integrated waveguide directional coupler is connected to the port 5.

[0037] Specifically, Figure 1 As shown, the third input end of the third substrate integrated waveguide directional coupler is connected to the second output end of the first substrate integrated waveguide directional coupler, the third isolation end is connected to the isolation port 3, the fourth output end is connected to the port 4, and the sixth output end of the third substrate integrated waveguide directional coupler is connected to the port 5.

[0038] In the embodiment of the present invention, a metal sheet is arranged on the substrate through a substrate, and port 1, port 2, port 3, port 4, port 5, a substrate integrated waveguide bandpass filter, a first substrate integrated waveguide directional coupler, a second substrate integrated waveguide directional coupler, a third substrate integrated waveguide directional coupler, an isolation port 1, an isolation port 2 and an isolation port 3 are etched on the metal sheet; port 1 is connected to the substrate integrated waveguide bandpass filter, the substrate integrated waveguide bandpass filter is connected to the first substrate integrated waveguide directional coupler, the first substrate integrated waveguide directional coupler is connected to the isolation port 1, the second substrate integrated waveguide directional coupler and the isolation port 3 respectively. The third substrate integrated waveguide directional coupler is connected; the second substrate integrated waveguide directional coupler is respectively connected to the isolation port 2, port 2 and port 3; the third substrate integrated waveguide directional coupler is respectively connected to the isolation port 3, port 4 and port 5, which solves the technical problems of the prior art that the solution of using separate filters and power dividers has low integration, high system manufacturing cost, high processing precision requirements, and leads to poor balance between each branch, and achieves integration with the same set of processes, reduces the manufacturing cost of the entire circuit, improves the integration of discrete devices, can reduce the system volume, and improves the technical effect of power distribution balance.

[0039] Example 2 According to an embodiment of the present invention, a method for using a signal processing system based on a glass substrate is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system containing at least one set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0040] Figure 5 is a flow chart of a method for using a signal processing system based on a glass substrate according to an embodiment of the present invention. Figure 5 As shown, the method may include the following steps: Step S501: Acquire an initial radio frequency signal from port 1.

[0041] In the technical solution provided in the above step S501 of the present invention, an initial radio frequency signal from the non-groove portion of port 1 is obtained.

[0042] Step S502: filtering the initial radio frequency signal through a substrate integrated waveguide bandpass filter to obtain a radio frequency signal of a target frequency band.

[0043] In the technical solution provided in the above step S502 of the present invention, the substrate integrated waveguide bandpass filter filters the initial RF signal, so that the RF signal (millimeter wave) in the frequency band of 87.1GHz-89.5GHz enters the next step, and the signal not in the range of 87.1GHz-89.5GHz is filtered out.

[0044] Step S503: inputting a radio frequency signal of a target frequency band into a first substrate integrated waveguide directional coupler to obtain a first radio frequency signal and a second radio frequency signal.

[0045] In the technical solution provided in the above step S503 of the present invention, the RF signal of the target frequency band is input into the first substrate integrated waveguide directional coupler to obtain the first RF signal and the second RF signal, that is, the RF signal of the target frequency band is divided into two.

[0046] Step S504: input the first radio frequency signal into the second substrate integrated waveguide directional coupler to obtain a third radio frequency signal and a fourth radio frequency signal.

[0047] In the technical solution provided in the above step S504 of the present invention, the first RF signal is input into the second substrate integrated waveguide directional coupler, that is, the first RF signal is divided into two to obtain a third RF signal and a fourth RF signal, wherein the third RF signal and the fourth RF signal are given to port 2 and port 3 respectively.

[0048] Step S505: input the second radio frequency signal into the third substrate integrated waveguide directional coupler to obtain a fifth radio frequency signal and a sixth radio frequency signal.

[0049] In the technical solution provided in the above step S505 of the present invention, the second RF signal is input into the third substrate integrated waveguide directional coupler, that is, the second RF signal is divided into two to obtain a fifth RF signal and a sixth RF signal, wherein the fifth RF signal and the sixth RF signal are given to port 4 and port 5 respectively, and the balance of the four signals obtained at port 2, port 3, port 4 and port 5 differs by 0.5.

[0050] Experimental part: Figure 6 FIG. 1 is a schematic diagram of a performance simulation result of a signal processing system for a glass substrate according to an embodiment of the present invention. Figure 6 As shown, when the RF signal is in the frequency band of 87.1GHz-89.5GHz, the return loss is less than -20dB.

[0051] In this embodiment, an initial RF signal is obtained from port 1; the initial RF signal is filtered by a substrate integrated waveguide bandpass filter to obtain an RF signal of a target frequency band; the RF signal of the target frequency band is input into a first substrate integrated waveguide directional coupler to obtain a first RF signal and a second RF signal; the first RF signal is input into a second substrate integrated waveguide directional coupler to obtain a third RF signal and a fourth RF signal; the second RF signal is input into a third substrate integrated waveguide directional coupler to obtain a fifth RF signal and a sixth RF signal. This solves the technical problem that the prior art uses a solution of using separate filters and power dividers, which has low integration, high system manufacturing cost, and high processing precision requirements, resulting in poor balance between each branch. This achieves integration using the same set of processes, reduces the manufacturing cost of the entire circuit, improves the integration of discrete devices, can reduce the system volume, and improves the technical effect of power distribution balance.

[0052] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0053] In the above embodiments of the present invention, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0054] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of units can be a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0055] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed over multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0056] In addition, each functional unit in each embodiment of the present invention may be integrated into a first processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0057] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A signal processing system based on a glass substrate, characterized in that: The system includes: A substrate, a metal sheet is arranged on the substrate, and port 1, port 2, port 3, port 4, port 5, a substrate integrated waveguide bandpass filter, a first substrate integrated waveguide directional coupler, a second substrate integrated waveguide directional coupler, a third substrate integrated waveguide directional coupler, an isolation port 1, an isolation port 2 and an isolation port 3 are etched on the metal sheet; Port 1 is connected to a substrate integrated waveguide bandpass filter, the substrate integrated waveguide bandpass filter is connected to a first substrate integrated waveguide directional coupler, and the first substrate integrated waveguide directional coupler is connected to the isolation port 1, the second substrate integrated waveguide directional coupler, and the third substrate integrated waveguide directional coupler respectively; The second substrate integrated waveguide directional coupler is connected to the isolation port 2, the port 2 and the port 3 respectively; The third substrate integrated waveguide directional coupler is connected to the isolation port 3, the port 4 and the port 5 respectively.

2. The signal processing system based on a glass substrate according to claim 1, characterized in that: The substrate is a glass substrate with a thickness of 250 μm and a dielectric constant of 3.

4.

3. The signal processing system based on a glass substrate according to claim 1, characterized in that: The lengths of the first substrate integrated waveguide directional coupler, the second substrate integrated waveguide directional coupler and the third substrate integrated waveguide directional coupler are all 4520 μm and the widths are all 3074 μm.

4. The signal processing system based on a glass substrate according to claim 1, characterized in that: Two grooves are arranged on the port 1, the port 2, the port 3, the port 4 and the port 5.

5. The signal processing system based on a glass substrate according to claim 1, characterized in that: The substrate integrated waveguide bandpass filter comprises an input end and an output end, wherein the input end of the substrate integrated waveguide bandpass filter is connected to port 1, and the output end of the substrate integrated waveguide bandpass filter is connected to the first substrate integrated waveguide directional coupler.

6. The signal processing system based on a glass substrate according to claim 5, characterized in that: The first substrate integrated waveguide directional coupler includes a first input end, a first isolation end, a first output end and a second output end. The output end of the substrate integrated waveguide bandpass filter is connected to the first input end, the first isolation end is connected to the isolation port 1, the first output end is connected to the second substrate integrated waveguide directional coupler, and the second output end is connected to the third substrate integrated waveguide directional coupler.

7. The signal processing system based on a glass substrate according to claim 6, characterized in that: The second substrate integrated waveguide directional coupler includes a second input end, a second isolation end, a third output end and a fourth output end, the second input end is connected to the first output end, the second isolation end is connected to the isolation port 2, the third output end is connected to the port 2, and the fourth output end is connected to the port 3.

8. The signal processing system based on a glass substrate according to claim 7, characterized in that: The third substrate integrated waveguide directional coupler includes a third input end, a third isolation end, a fifth output end and a sixth output end. The third input end is connected to the second output end, the third isolation end is connected to the isolation port 3, the fourth output end is connected to the port 4, and the sixth output end of the third substrate integrated waveguide directional coupler is connected to the port 5.

9. A method for using a signal processing system based on a glass substrate, characterized in that: include: Get the initial RF signal from port 1; The initial radio frequency signal is filtered by a substrate integrated waveguide bandpass filter to obtain a radio frequency signal of a target frequency band; Inputting a radio frequency signal of a target frequency band into a first substrate integrated waveguide directional coupler to obtain a first radio frequency signal and a second radio frequency signal; Inputting the first radio frequency signal into the second substrate integrated waveguide directional coupler to obtain a third radio frequency signal and a fourth radio frequency signal; The second radio frequency signal is input into the third substrate integrated waveguide directional coupler to obtain a fifth radio frequency signal and a sixth radio frequency signal.

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