Intelligent wafer processing device

Abstract

The invention relates to the technical field of wafer processing, in particular to an intelligent wafer processing device, which comprises a main body, a water retaining cover, a fixed column, a water inlet pipe, a water outlet pipe, a water inlet pipe, a water outlet pipe, a water inlet pipe and a water outlet pipe, a supporting piece for fixing and supporting the wafer is arranged in the fixing column; the multiple extension rods are arranged on the outer side of the fixed column in a circumferential array mode, and the multiple extension rods are arranged on the outer side of the fixed column in a sliding mode; and the self-adaptive clamping assembly is arranged at the end part of the extension rod, can clamp the outer side of the wafer and is matched with the supporting piece to position the wafer during cleaning, and according to the intelligent wafer processing device, by utilizing alternate supporting of the electrostatic adsorption module and the supporting block and matching of the extension rod and the traction piece, dynamic adjustment of the angle of a clamping plate is realized, and the machining precision of the wafer is improved. And the clamped side surface of the wafer can be periodically exposed, so that a cleaning blind area is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, and in particular to an intelligent wafer processing device. Background Art

[0002] In the precision manufacturing process of semiconductor integrated circuit chips, the chemical mechanical planarization (CMP) processing step of the wafer plays a vital role. This step implements efficient polishing of the wafer surface through the synergistic effect of finely formulated grinding fluid and specific chemical reagents, aiming to achieve a high degree of surface flatness. It belongs to the category of advanced wet process technology. After the CMP process is completed, the subsequent cleaning process is of decisive significance to ensure that the wafer surface is clean and free of impurities and avoid defects in subsequent processes.

[0003] In the current cleaning process, there are two main ways to fix wafers: one is to use an electrostatic adsorption plate to fix the wafers, which is widely used in the industry due to its advantages of uniform pressure distribution and effective prevention of wafer deformation. However, this fixing method has an inherent defect, that is, the area at the bottom of the wafer that contacts the electrostatic adsorption plate cannot be effectively cleaned, which may cause incomplete cleaning and affect the overall cleanliness of the wafer.

[0004] Another mainstream fixing method is to use a precisely designed claw system to clamp the wafer. The advantage of this method is that it can achieve full coverage cleaning of the wafer surface and ensure that the cleaning liquid can reach every corner of the wafer. However, the only drawback is that the part of the wafer clamped by the claw is difficult to be effectively rinsed during the rinsing process, and the particles carried by the fluid during the rinsing process are often physically blocked by the claws when migrating to the outside, causing the particles to accumulate at the clamping position, which not only reduces the cleaning efficiency, but also may aggravate the degree of contamination on the wafer surface, posing a potential threat to subsequent production processes. For this reason, we propose an intelligent wafer processing device. Summary of the invention

[0005] In order to solve the above technical problems, the embodiment of the present application provides an intelligent wafer processing device, including a main body, a workbench is arranged on the main body, a cleaning head is movably arranged on the workbench, two cleaning heads are arranged and are respectively located at the upper and lower sides of the wafer clamping station, and also includes:

[0006] A water retaining cover is arranged on the workbench;

[0007] A fixed column is arranged at the center of the workbench, wherein a support member for fixing and supporting the wafer is arranged inside the fixed column;

[0008] Extension rods, wherein the extension rods are provided in a plurality and arranged in a circular array outside the fixed column, and the plurality of extension rods are all slidably arranged outside the fixed column;

[0009] The adaptive clamping assembly is arranged at the end of the extension rod, and can clamp the outer side of the wafer and cooperate with the support member to position the wafer during cleaning.

[0010] In some embodiments, a cavity is opened in the fixed column, and the support member includes an electrostatic adsorption module and a support block. The electrostatic adsorption modules and support blocks are arranged in multiple numbers and are arranged in a circle in the fixed column. The tops of the electrostatic adsorption modules and the support blocks slide through the top of the fixed column and extend to the outside thereof. A driving ring is rotatably arranged in the cavity, and a plurality of protrusions are arranged on the upper surface of the driving ring. When the driving ring rotates, the protrusions are driven to rotate, and the protrusions can prop up the electrostatic adsorption module and the support block when they abut against the bottom of the support block.

[0011] In some embodiments, elastic parts are provided at the bottom of the electrostatic adsorption module and the support block, the bottom end of the elastic part is connected to the bottom of the cavity, a reduction motor is provided inside the fixed column, the output end of the reduction motor is connected to the drive shaft, and the drive ring is fixedly connected to the outer side of the drive shaft.

[0012] In some embodiments, the elastic member is an elastic telescopic rod.

[0013] In some embodiments, a plurality of slide grooves are provided on the outside of the fixed column, one end of the extension rod is slidably set in the slide groove, a magnetic block is embedded in the end of the extension rod, and an electromagnet is provided on the side wall of the slide groove. When the electromagnet is energized, it can attract the magnetic block and drive the end of the extension rod to move toward the inside of the slide groove. A connecting spring is provided in the slide groove, and both ends of the connecting spring are fixedly connected to the extension rod and the side wall of the slide groove respectively.

[0014] In some embodiments, the adaptive clamping assembly includes a fixed cylinder fixedly arranged at the outer end of the extension rod, a mounting block fixedly arranged on the outer side of the fixed cylinder, a clamping plate rotatably arranged on the mounting block, the clamping plate is rotatably connected to the mounting block through a rotating shaft, a plurality of flexible sheets are arranged on the surface of the clamping plate, support springs are arranged on the upper and lower sides of the mounting block, the two ends of the support springs are respectively fixedly connected to the mounting block and the clamping plate, steel wires are fixedly arranged on the upper and lower sides of the clamping plate, the ends of the steel wires pass through the mounting block and the fixed cylinder and extend into the extension rod, and a pulling member for pulling the steel wires is arranged in the extension rod.

[0015] In some embodiments, a moving groove is provided inside the outer end of the extension rod, and the pulling member includes a moving block slidably arranged in the moving groove, a return spring is provided at one end of the moving block, and the other end of the return spring is fixedly connected to the inner wall of the moving groove, and a slide plate 1 and a slide plate 2 are respectively slidably arranged on both sides of the moving groove, and a plurality of fixed rods are fixedly arranged in the moving groove, and the slide plate 1 and the slide plate 2 are slidably arranged on the outside of the fixed rod, and the bottom of the slide plate 1 and the slide plate 2 are both provided with a fixing spring, and the bottom of the fixing spring is connected to the moving groove, and the end of the steel wire connected to the upper end of the clamping plate is fixedly connected to the slide plate 1, and the other end of the steel wire is fixedly connected to the slide plate 2, and two connecting plates are provided at the end of the moving block for driving the slide plate 1 and the slide plate 2 to move respectively, and a top block is fixedly provided at the bottom of the two connecting plates, and the length of the connecting plate cooperating with the slide plate 1 is greater than the length of the other connecting plate.

[0016] In some embodiments, a guide rod is fixedly disposed in the fixed cylinder, and two sets of guide wheels are rotatably disposed on the guide rod. The two steel wires are respectively passed around the two sets of guide wheels and connected to the slide plate one and the slide plate two.

[0017] In some embodiments, the flexible sheet is made of silicone.

[0018] In some embodiments, the water shield is slidably arranged on a workbench up and down.

[0019] The present invention has at least the following beneficial effects:

[0020] 1. All-round cleaning: The cleaning head and the rotating structure of the workbench can clean the upper and lower sides of the wafer at the same time, which improves the cleaning efficiency. At the same time, the alternating support of the electrostatic adsorption module and the support block can achieve all-round cleaning of the bottom of the wafer, avoiding blind cleaning areas;

[0021] 2. Dynamic adjustment: Through the cooperation of the extension rod and the pulling piece, the dynamic adjustment of the angle of the clamping plate is realized, which can periodically expose the clamped side of the wafer so that it can be fully cleaned. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a schematic diagram of the local structure of the present invention;

[0024] Figure 3 It is a structural schematic diagram of the workbench of the present invention;

[0025] Figure 4 This is a schematic diagram of the cross-sectional structure of the fixing column of the present invention;

[0026] Figure 5This is a schematic diagram of the structure inside the cavity of the present invention;

[0027] Figure 6 For the present invention Figure 5 Schematic diagram of local explosion structure;

[0028] Figure 7 It is a schematic diagram of the local structure of the extension rod of the present invention;

[0029] Figure 8 For the present invention Figure 7 Schematic diagram of the cross-section structure;

[0030] Fig. 9 It is a schematic diagram of the cross-sectional structure of the extension rod of the present invention;

[0031] Fig.10 This is a schematic diagram of the pulling member structure of the present invention;

[0032] Fig.11 It is a structural schematic diagram of a wafer being clamped when the workbench of the present invention rotates at a low speed.

[0033] In the figure: 1-main body; 2-workbench; 3-water shield; 4-fixed column; 5-support member; 51-electrostatic adsorption module; 52-support block; 53-driving ring; 54-bump; 55-elastic member; 56-driving shaft; 6-extension rod; 7-adaptive clamping assembly; 71-fixed cylinder; 72-mounting block; 73-clamping plate; 74-flexible sheet; 75-support spring; 76-steel wire; 8-pulling member; 81-moving block; 82-reset spring; 83-slide plate one; 84-slide plate two; 85-fixed rod; 86-fixed spring; 87-connecting plate; 88-top block; 9-slide groove; 10-magnetic block; 11-electromagnet; 12-connecting spring; 13-moving groove; 14-guide rod; 15-guide wheel. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Example 1: Please refer to Figure 1-Figure 11The present invention provides a technical solution: an intelligent wafer processing device, including a main body 1, a workbench 2 is arranged on the main body 1, the workbench 2 is a rotary workbench 2, and its rotary structure is all prior art, which will not be repeated here. A cleaning head is movably arranged on the workbench 2, and two cleaning heads are arranged and are respectively located at the upper and lower sides of the wafer clamping station, so that the upper and lower sides of the wafer can be cleaned during cleaning, and a water shield 3 is also included on the workbench 2 to shield the cleaning liquid during cleaning to prevent splashing. A fixed column 4 is arranged at the center of the workbench 2, and a support 5 for fixing and supporting the wafer is arranged in the fixed column 4. A plurality of extension rods 6 are arranged on the outer side of the fixed column 4, and the plurality of extension rods 6 are arranged in a circle, and the ends of the plurality of extension rods 6 are all slidably arranged on the outer side of the fixed column 4. An adaptive clamping component 7 is arranged at the outer end of the extension rod 6, which can adjust the clamping state of the wafer according to the rotation speed of the workbench 2:

[0036] A cavity is provided in the fixed column 4, and the support member 5 includes an electrostatic adsorption module 51 and a support block 52. The electrostatic adsorption module 51 can adsorb and fix the bottom of the wafer by electrostatic adsorption. The specific structures thereof are all prior arts and will not be described in detail here. The electrostatic adsorption modules 51 and the support blocks 52 are arranged in a staggered manner and are arranged in a circle in the fixed column 4. The top ends of the electrostatic adsorption modules 51 and the support blocks 52 slide through the top of the fixed column 4 and extend to the outside thereof. A driving ring 53 is rotatably provided in the cavity, and a plurality of protrusions 54 are provided on the upper surface of the driving ring 53. The number of the protrusions 54 is the same as the number of the electrostatic adsorption modules 51 and the support blocks 52. When the driving ring 53 rotates, the protrusions 54 are driven to rotate. When the protrusions 54 abut against the bottom of the electrostatic adsorption module 51 and the support block 52, they can prop them up. By supporting the support block 52 and the electrostatic adsorption module 51 respectively with the protrusions 54, the two can realize alternating support for the bottom of the wafer during the cleaning process, thereby being able to perform all-round cleaning on the wafer.

[0037] The bottom of the electrostatic adsorption module 51 and the support block 52 are both provided with elastic members 55, which are elastic telescopic rods, which can not only play an elastic supporting role for the two, but also ensure the stability of the two when moving. The bottom end of the elastic telescopic rod is connected to the bottom of the cavity, and a reduction motor is provided inside the fixed column 4. The output end of the reduction motor is connected to a driving shaft 56, and the driving ring 53 is fixedly connected to the outer side of the driving shaft 56;

[0038] The reduction motor drives the driving ring 53 to rotate through the driving shaft 56, and then drives the multiple protrusions 54 on the driving ring 53 to rotate. When the protrusion 54 rotates, the multiple protrusions 54 will support the electrostatic adsorption module 51 and the support block 52 in turn during the rotation process. When the protrusion 54 rotates to the bottom of the electrostatic adsorption module 51, it can lift the electrostatic adsorption module 51 so that it can adsorb and fix the wafer. When the protrusion 54 rotates to the bottom of the support block 52, the electrostatic adsorption module 51 no longer works. At the same time, the support block 52 is lifted up by the protrusion 54 to support the wafer, and the positioning of the wafer is completed in cooperation with the adaptive clamping component 7. It should be noted that when the rotation speed of the workbench 2 is low, the support block 52 can be used to fix the wafer. When the rotation speed of the workbench 2 is high, the electrostatic adsorption module 51 is required to adsorb and fix the wafer to ensure that the wafer will not shake or even deform due to high-speed rotation.

[0039] A plurality of slide grooves 9 are provided on the outside of the fixed column 4, one end of the extension rod 6 is slidably arranged in the slide groove 9, a magnetic block 10 is embedded in the end of the extension rod 6, an electromagnet 11 is provided on the side wall of the slide groove 9, a connecting spring 12 is provided in the slide groove 9, and both ends of the connecting spring 12 are respectively fixedly connected to the extension rod 6 and the side wall of the slide groove 9. When the electromagnet 11 is energized, it can attract the magnetic block 10 to drive the end of the extension rod 6 to move toward the inside of the slide groove 9, and then the extension rod 6 drives the adaptive clamping assembly 7 at its end to move toward the center of the workbench 2, thereby clamping the wafer disk.

[0040] The adaptive clamping assembly 7 includes a fixed cylinder 71 fixedly arranged at the outer end of the extension rod 6, a mounting block 72 is fixedly arranged on the outer side of the fixed cylinder 71, a clamping plate 73 is rotatably arranged on the mounting block 72, the clamping plate 73 is rotatably connected to the mounting block 72 through a rotating shaft, a plurality of flexible sheets 74 are arranged on the surface of the clamping plate 73, the flexible sheets 74 are made of silicone material, support springs 75 are arranged on the upper and lower sides of the mounting block 72, the two ends of the support spring 75 are respectively fixedly connected to the mounting block 72 and the clamping plate 73, a steel wire 76 is fixedly arranged on the upper and lower sides of the clamping plate 73, the end of the steel wire 76 passes through the mounting block 72 and the fixed cylinder 71 and extends into the extension rod 6, a pulling member 8 for pulling the steel wire 76 is arranged in the extension rod 6, when the pulling member 8 pulls the steel wire 76, it can drive the clamping plate 73 to rotate, thereby changing its clamping angle for the wafer.

[0041] A moving groove 13 is provided inside the outer end of the extension rod 6, and the pulling member 8 includes a moving block 81 slidably arranged in the moving groove 13, and a return spring 82 is provided at one end of the moving block 81, and the other end of the return spring 82 is fixedly connected to the inner wall of the moving groove 13, and a slide plate 83 and a slide plate 84 are respectively slidably arranged on both sides of the moving groove 13, and a plurality of fixed rods 85 are fixedly arranged in the moving groove 13, and the slide plates 83 and the slide plates 84 are slidably arranged on the outside of the fixed rods 85, and the bottoms of the slide plates 83 and the slide plates 84 are both provided with fixed springs 86, and the bottoms of the fixed springs 86 are connected to the moving groove 13, and the ends of the steel wires 76 connected to the upper ends of the clamping plates 73 are fixedly connected to the slide plates 83, and the ends of the other steel wires 76 are fixedly connected to the slide plates 84, and the ends of the moving block 81 are provided with two connecting plates 87 for driving the slide plates 83 and the slide plates 84 to move, respectively, and the bottoms of the two connecting plates 87 are fixedly provided with top blocks 88, and the length of the connecting plate 87 matched with the slide plate 83 is greater than the length of the other connecting plate 87;

[0042] During cleaning, the workbench 2 rotates to drive the fixed column 4 to rotate, and the extension rod 6 will also rotate accordingly. When it rotates, under the action of centrifugal force, the moving block 81 inside it will also move along the moving groove 13, and the moving distance is related to the rotation speed of the workbench 2. When its rotation speed is higher, the moving block 81 moves farther. When the moving block 81 moves, it can drive the connecting plate 87 and the top block 88 to move. When the top block 88 moves to contact the slide plate 1 83 and the slide plate 2 84, it can drive the slide plate 1 83 and the slide plate 2 84 to move downward, thereby pulling the steel wire 76 to drive the clamping plate 73 to rotate.

[0043] Since the lengths of the two connecting plates 87 are inconsistent, the longer connecting plate 87 will drive the top block 88 at its end to contact the slide plate 1 83 first, and the slide plate 1 83 drives the upper end of the clamping plate 73 to rotate through the steel wire 76. At this time, the speed of the workbench 2 is relatively low. When the speed of the workbench 2 continues to increase, the longer connecting plate 87 drives the top block 88 thereon to pass over the slide plate 1 83, and the other connecting plate 87 drives the top block 88 thereon to abut against the slide plate 2 84, and then drives the lower end of the clamping plate 73 to rotate through the steel wire 76. When the clamping plate 73 is pulled by the steel wire 76 at its upper end When the clamping plate 73 is moving, the angle formed by the upper half of the clamping plate 73 and the wafer is an obtuse angle. Conversely, when the clamping plate 73 is pulled by the steel wire 76 at its lower end, the angle formed by the upper half of the clamping plate 73 and the wafer is an acute angle. In this way, the clamped side of the wafer can be periodically exposed through the angle adjustment of the clamping plate 73 so that it can be cleaned. When the rotation speed of the workbench 2 is relatively high, the electrostatic adsorption module 51 fixes the bottom of the wafer, and the angle formed by the upper half of the clamping plate 73 and the wafer is an acute angle, so as to achieve a better clamping effect and avoid dislocation of the wafer.

[0044] A guide rod 14 is fixedly arranged in the fixed cylinder 71, and two sets of guide wheels 15 are rotatably arranged on the guide rod 14. Two steel wires 76 pass through the two sets of guide wheels 15 and are connected to the slide plate 1 83 and the slide plate 2 84 respectively, which can reduce the wear of the steel wires 76 and make the pulling smoother.

[0045] The intelligent wafer processing device drives the wafer to rotate through the rotary workbench 2, and the cleaning heads on the upper and lower sides clean the wafer. During the cleaning process, the electrostatic adsorption module 51 and the support block 52 in the fixed column 4 are alternately supported through the cooperation of the drive ring 53 and the protrusion 54, ensuring that the bottom of the wafer is cleaned in all directions. At the same time, the adaptive clamping component 7 on the extension rod 6 automatically adjusts the clamping state according to the rotation speed of the workbench 2, and dynamically adjusts the angle of the clamping plate 73 through the cooperation of the pulling member 8 and the steel wire 76, so that the clamped side of the wafer can also be cleaned. The entire device realizes intelligent, efficient and all-round cleaning of the wafer.

[0046] Embodiment 2: Embodiment 2 has the same main structure as Embodiment 1, except that, on the basis of Embodiment 1, Embodiment 2 sets the water shield 3 on the workbench 2 so as to slide up and down, and a driving source capable of driving the water shield 3 to move up and down is provided in the workbench 2, and the driving source can be an electric push rod or other driving elements with linear motion characteristics;

[0047] The movable design of the water shield 3 can simplify the movement process of the manipulator. During the cleaning process of the wafer, a manipulator is generally required to transfer it between various processes. If the water shield 3 is designed to be fixed, the manipulator needs to move the end to the inside of the water shield 3 to clamp the wafer. It is necessary to add a vertical movement drive module to the manipulator to enable the manipulator to reach into the water shield 3. Therefore, the water shield 3 is set to be movable. In this way, during the loading and unloading process of the wafer, the water shield 3 can be folded up, so that the manipulator can directly move horizontally to clamp the wafer, thereby increasing work efficiency.

[0048] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0049] While the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and alterations may be made to the embodiments without departing from the principles and spirit of the invention.

Claims

1. An intelligent wafer processing device, comprising a main body (1), a workbench (2) being arranged on the main body (1), a cleaning head being movably arranged on the workbench (2), two cleaning heads being arranged and respectively located at the upper and lower sides of a wafer clamping station, characterized in that: Also included are: A water shield (3) is arranged on the workbench (2); A fixed column (4) is arranged at the center of the workbench (2), wherein a support member (5) for fixing and supporting a wafer is arranged inside the fixed column (4); Extension rods (6), a plurality of the extension rods (6) are provided and arranged in a circular array outside the fixed column (4), and the plurality of the extension rods (6) are all slidably arranged outside the fixed column (4); The adaptive clamping assembly (7) is arranged at the end of the extension rod (6) and can clamp the outer side of the wafer and cooperate with the support member (5) to position the wafer during cleaning.

2. The intelligent wafer processing device according to claim 1, characterized in that: A cavity is provided in the fixed column (4), and the support member (5) comprises an electrostatic adsorption module (51) and a support block (52). The electrostatic adsorption modules (51) and the support block (52) are arranged in a staggered manner and arranged in a circle in the fixed column (4). The top ends of the electrostatic adsorption modules (51) and the support blocks (52) slide through the top of the fixed column (4) and extend to the outside thereof. A driving ring (53) is rotatably arranged in the cavity, and a plurality of protrusions (54) are arranged on the upper surface of the driving ring (53). When the driving ring (53) rotates, the protrusions (54) are driven to rotate, and when the protrusions (54) abut against the bottom of the electrostatic adsorption module (51) and the support block (52), they can prop them up.

3. The intelligent wafer processing device according to claim 2, characterized in that: The bottom of the electrostatic adsorption module (51) and the support block (52) are both provided with an elastic member (55), the bottom end of the elastic member (55) is connected to the bottom of the cavity, a reduction motor is provided inside the fixed column (4), the output end of the reduction motor is connected to a drive shaft (56), and the drive ring (53) is fixedly connected to the outside of the drive shaft (56).

4. The intelligent wafer processing device according to claim 3, characterized in that: The elastic member (55) is an elastic telescopic rod.

5. The intelligent wafer processing device according to claim 4, characterized in that: A plurality of slide grooves (9) are provided on the outer side of the fixed column (4), one end of the extension rod (6) is slidably arranged in the slide groove (9), a magnetic block (10) is embedded in the end of the extension rod (6), and an electromagnet (11) is provided on the side wall of the slide groove (9). When the electromagnet (11) is energized, it can attract the magnetic block (10) to drive the end of the extension rod (6) to move toward the inside of the slide groove (9), and a connecting spring (12) is provided in the slide groove (9), and the two ends of the connecting spring (12) are respectively fixedly connected to the extension rod (6) and the side wall of the slide groove (9).

6. The intelligent wafer processing device according to claim 5, characterized in that: The adaptive clamping assembly (7) comprises a fixed cylinder (71) fixedly arranged at the outer end of the extension rod (6), a mounting block (72) fixedly arranged on the outer side of the fixed cylinder (71), a clamping plate (73) rotatably arranged on the mounting block (72), the clamping plate (73) being rotatably connected to the mounting block (72) via a rotating shaft, a plurality of flexible sheets (74) being arranged on the surface of the clamping plate (73), support springs (75) being arranged on the upper and lower sides of the mounting block (72), the two ends of the support spring (75) being fixedly connected to the mounting block (72) and the clamping plate (73) respectively, a steel wire (76) being fixedly arranged on the upper and lower sides of the clamping plate (73), the end of the steel wire (76) passing through the mounting block (72) and the fixed cylinder (71) extending into the extension rod (6), and a pulling member (8) for pulling the steel wire (76) being arranged in the extension rod (6).

7. The intelligent wafer processing device according to claim 6, characterized in that: A movable groove (13) is provided inside the outer end of the extension rod (6); the pulling member (8) comprises a movable block (81) slidably arranged in the movable groove (13); a return spring (82) is arranged at one end of the movable block (81); the other end of the return spring (82) is fixedly connected to the inner wall of the movable groove (13); a slide plate (83) and a slide plate (84) are slidably arranged on both sides of the movable groove (13); a plurality of fixed rods (85) are fixedly arranged in the movable groove (13); the slide plate (83) and the slide plate (84) are slidably arranged on the outside of the fixed rod (85); A fixing spring (86) is provided at the bottom, the bottom of the fixing spring (86) is connected to the moving groove (13), the end of the steel wire (76) connected to the upper end of the clamping plate (73) is fixedly connected to the first slide plate (83), and the other end of the steel wire (76) is fixedly connected to the second slide plate (84). The end of the moving block (81) is provided with two connecting plates (87) for driving the first slide plate (83) and the second slide plate (84) to move respectively, and the bottom of the two connecting plates (87) is fixedly provided with a top block (88), and the length of the connecting plate (87) matched with the first slide plate (83) is greater than the length of the other connecting plate (87).

8. The intelligent wafer processing device according to claim 7, characterized in that: A guide rod (14) is fixedly arranged in the fixed cylinder (71), and two groups of guide wheels (15) are rotatably arranged on the guide rod (14). The two steel wires (76) respectively pass around the two groups of guide wheels (15) and are connected to the first slide plate (83) and the second slide plate (84).

9. The intelligent wafer processing device according to claim 6, characterized in that: The flexible sheet (74) is made of silicone.

10. The intelligent wafer processing device according to claim 1, characterized in that: The water shield (3) is slidably arranged on the workbench (2) up and down.

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