Server heat dissipation control method and server

Abstract

The invention discloses a server heat dissipation control method and a server, and relates to the technical field of servers, a first air guide plate is arranged on the outer side of the server, the first air guide plate is connected with the outer side of the server through a first deformation spring, and the temperature of the first deformation spring can be adjusted according to the temperature of the server so as to control the first deformation spring to contract; further, the opening and closing angle of the first air guide plate is adjusted, and the heat dissipation area of the server with the high temperature can be increased; meanwhile, a second air guide plate is arranged in the server, the second air guide plate is connected with the preset position through a second deformation spring, the temperature of the second deformation spring can be adjusted according to the processor temperature of each processor in the target server, so that the second deformation spring is shrunk, the orientation of the second air guide plate is adjusted, and air of the fan is divided. Under the condition that the power of the heat dissipation system is not increased, heat dissipation of the server with the temperature increased can be increased, and power consumption of heat dissipation of the server can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a method for controlling heat dissipation of a server and a server. Background Art

[0002] As the computing performance of servers continues to improve, the power consumption of servers has increased dramatically, and the heat dissipation problem of servers has become increasingly prominent.

[0003] In the related art, when the power consumption of a server is too large, the speed of the fan can be increased to increase the air volume and speed up the heat dissipation of the server. However, different servers have different power consumptions, and controlling the speed of the fan to increase the air volume and dissipate heat for all servers results in higher power consumption for server heat dissipation. Summary of the invention

[0004] The present application provides a control method for heat dissipation of a server and a server, so as to at least solve the problem of high power consumption of heat dissipation of the server in the related art.

[0005] The present application provides a method for controlling heat dissipation of a server, which is applied to a target server, wherein a first air guide plate is arranged outside the target server, and the first air guide plate is connected to the outside of the target server through a first deformation spring, and a second air guide plate is arranged inside the target server, and the second air guide plate is connected to a preset position through a second deformation spring. The method includes:

[0006] Obtaining a server temperature of a target server and a processor temperature of each processor in the target server;

[0007] Determine a first target temperature corresponding to the first deformation spring according to the server temperature, and adjust the temperature of the first deformation spring to the first target temperature to control the contraction of the first deformation spring, wherein the contraction of the first deformation spring is used to control the opening and closing angle of the first air guide plate;

[0008] The second target temperature corresponding to the second deformation spring is determined according to the processor temperature of each processor, and the temperature of the second deformation spring is adjusted to the second target temperature to control the contraction of the second deformation spring. The contraction of the second deformation spring is used to control the direction of the second air guide plate, and the second air guide plate is used to divert the wind of the fan in the target server.

[0009] The present application also provides a control device for heat dissipation of a server, the device comprising an acquisition module, a first determination module, a first adjustment module, a second determination module and a second adjustment module:

[0010] The acquisition module is used to acquire the server temperature of the target server and the processor temperature of each processor in the target server;

[0011] The first determination module is used to determine a first target temperature corresponding to the first deformation spring according to the server temperature;

[0012] The first adjustment module is used to adjust the temperature of the first deformation spring to a first target temperature to control the contraction of the first deformation spring, and the contraction of the first deformation spring is used to control the opening and closing angle of the first air guide plate;

[0013] The second determination module is used to determine a second target temperature corresponding to the second deformation spring according to the processor temperature of each processor;

[0014] The second regulating module is used to regulate the temperature of the second deformable spring to a second target temperature to control the contraction of the second deformable spring. The contraction of the second deformable spring is used to control the direction of the second air guide plate. The second air guide plate is used to divert the wind of the fan in the target server.

[0015] The present application also provides a server, the server comprising a first air guide plate, a second air guide plate and a temperature controller, wherein:

[0016] The first air guide plate is hinged to the outer side of the server, and the first air guide plate is also connected to the outer side of the server through a first deformation spring;

[0017] The second air guide plate is hinged to a first preset position inside the server, and the second air guide plate is also connected to the second preset position inside the server through a second deformation spring;

[0018] The temperature controller is used to execute computer instructions to control the first air guide plate and the second air guide plate to implement the control method for heat dissipation of the server as claimed in any one of claims 1 to 12.

[0019] The present application also provides a server cabinet, which includes a plurality of any of the above-mentioned servers.

[0020] The present application also provides an electronic device, including: a memory for storing a computer program; and a processor for implementing the steps of any of the above-mentioned server heat dissipation control methods when executing the computer program.

[0021] The present application also provides a computer-readable storage medium, in which a computer program is stored, wherein when the computer program is executed by a processor, any of the above-mentioned steps of controlling the heat dissipation of the server is implemented.

[0022] The present application also provides a computer program product, including a computer program, which implements any of the above-mentioned steps of controlling the heat dissipation of the server when the computer program is executed by a processor.

[0023] Through the present application, a first air guide plate is arranged outside the server, and the first air guide plate is connected to the outside of the server through a first deformation spring. The temperature of the first deformation spring can be adjusted according to the temperature of the server to control the contraction of the first deformation spring, and then the opening and closing angle of the first air guide plate can be adjusted, so that the heat dissipation area of ​​the server with a higher temperature can be increased; at the same time, a second air guide plate is arranged inside the server, and the second air guide plate is connected to a preset position through a second deformation spring. The temperature of the second deformation spring can be adjusted according to the processor temperature of each processor in the target server, so that the second deformation spring contracts, and then the direction of the second air guide plate is adjusted to realize the wind diversion of the fan. Without increasing the power of the heat dissipation system, the heat dissipation of the server with increased temperature can be increased, and the power consumption of the server heat dissipation can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 A schematic diagram of an application scenario provided in an embodiment of the present application;

[0026] Figure 2A A structural side view of a first air guide plate provided in an embodiment of the present application;

[0027] Figure 2B A top view of the structure of a first air guide plate provided in an embodiment of the present application;

[0028] Figure 3 A schematic structural diagram of an air guide plate frame provided in an embodiment of the present application;

[0029] Figure 4 A schematic diagram of the installation of the second air guide plate provided in an embodiment of the present application;

[0030] Figure 5 A schematic diagram of installing a second air guide plate provided in an embodiment of the present application;

[0031] Figure 6 A schematic diagram of the torque of a deformation spring and a torsion spring provided in an embodiment of the present application;

[0032] Figure 7 A schematic diagram of a flow chart of a method for controlling heat dissipation of a server provided in an embodiment of the present application;

[0033] Figure 8 A schematic diagram of a process for determining server temperature provided in an embodiment of the present application;

[0034] Fig. 9 A schematic diagram of a process for determining a first target temperature provided in an embodiment of the present application;

[0035] Fig.10 A signal interaction diagram of a method for controlling heat dissipation of a server provided in an embodiment of the present application;

[0036] Fig.11 A schematic diagram of the structure of a control device for heat dissipation of a server provided in an embodiment of the present application;

[0037] Fig.12 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] It should be noted that, in the description of this application, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in this application are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0040] In the related art, when the power consumption of a server is too large, the speed of the fan of the cooling system can be increased to increase the air volume and speed up the heat dissipation of the server. However, different servers have different power consumptions, and controlling the speed of the fan to increase the air volume and dissipate heat for all servers results in higher power consumption for server heat dissipation.

[0041] In the embodiment of the present application, a first air guide plate is arranged outside the server, and the first air guide plate is connected to the outside of the server through a first deformation spring. The temperature of the first deformation spring can be adjusted according to the temperature of the server to control the contraction of the first deformation spring, and then the opening and closing angle of the first air guide plate can be adjusted, so that the heat dissipation area of ​​the server with a higher temperature can be increased; at the same time, a second air guide plate is arranged inside the server, and the second air guide plate is connected to a preset position through a second deformation spring. The temperature of the second deformation spring can be adjusted according to the processor temperature of each processor in the target server, so that the second deformation spring contracts, and then the direction of the second air guide plate is adjusted to achieve the wind diversion of the fan. Without increasing the power of the heat dissipation system, the heat dissipation of the server with increased temperature can be increased, and the power consumption of the server heat dissipation can be reduced.

[0042] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0043] In combination with the specific application environment architecture or specific hardware architecture on which the execution of the server heat dissipation control method depends, the specific application environment architecture or specific hardware architecture is described here. Figure 1 , Figure 1 A schematic diagram of an application scenario provided by an embodiment of the present application. Multiple server cabinets 100 may be placed in a computer room, and the server cabinets 100 are also referred to as racks. Multiple servers 101 may be arranged in the server cabinets 100, and the server cabinets 100 provide physical protection and organization for the servers 101, and help manage cables, ventilation, and power distribution, etc.

[0044] During operation, the server 101 generates a large amount of heat. A heat dissipation system may be provided in the computer room, and the heat dissipation system may maintain the temperature of the computer room within a suitable range to ensure that the server 101 operates under suitable temperature conditions. The heat dissipation system may be an air conditioning system, a fan and air circulation system, an underfloor air supply system, etc.

[0045] See also Figure 1 There are 8 servers 101 in the server cabinet 100, where ①-⑧ are used to indicate the 8 servers 101 respectively. The cold air of the heat dissipation system of the computer room can enter the server cabinet 100 through the air inlet channel, and the cold air can enter the machine cavity corresponding to each server 101. After the cold air blows to the hot server 101, it can take away the heat of the server 101 and accelerate the heat dissipation of the server 101. The cold air can leave the server cabinet 100 from the return air channel.

[0046] Since different servers 101 have different processing tasks and generate different amounts of heat, the heat dissipation requirements of the servers 101 are different. In the related art, in the heat dissipation space corresponding to the same heat dissipation system, the amount of cold air entering the machine cavity of each server 101 is the same, and the servers 101 that generate more heat and the servers 101 that generate less heat are subjected to the same heat dissipation, so that the heat dissipation efficiency of the servers that generate more heat is lower.

[0047] In the embodiments of this application, please refer to Figure 1 A first air guide plate is provided on the outside of each server 101. The first air guide plate can be connected to the outside of the server 101 through a first deformation spring. The contraction of the first deformation spring can be controlled by adjusting the temperature of the first deformation spring, thereby controlling the opening and closing angle of the first air guide plate. When the temperature of the server 101 is high, the opening and closing angle of the first air guide plate can be controlled to increase, so that the amount of cold air entering the server 101 increases, thereby improving the heat dissipation efficiency of the server that generates more heat. At the same time, there is no need for a complex transmission mechanism, and the first air guide plate is directly controlled, which reduces the occupied area of ​​the server.

[0048] Next, combine Figure 2A and Figure 2B , the installation structure of the first air guide plate provided in an embodiment of the present application is described.

[0049] Figure 2A This is a structural side view of a first air guide plate provided in an embodiment of the present application. Figure 2A , including a first deformation spring, a first air guide plate and a first hinge. One end of the first air guide plate is hinged to the outside of the server through the first hinge, one end of the first deformation spring is connected to the outside of the server, and the other end of the first deformation spring is connected to the first air guide plate. The first deformation spring can support the first air guide plate. The deformation of the first deformation spring can drive the first air guide plate to rotate around the hinge. In addition, a first angle sensor is integrated at the hinge, and the first angle sensor is used to obtain the first current angle of the first air guide plate.

[0050] In some possible embodiments, when one end of the first air guide plate is hinged to the outside of the server through the first hinge, the first air guide plate can be supported by the first torsion spring, and the first air guide plate is driven to rotate around the hinge through the interaction between the first deformation spring and the first torsion spring. Figure 2B , Figure 2B A top view of the structure of a first air guide plate provided in an embodiment of the present application.

[0051] The height of the first air guide plate can be determined according to the size of the server. For example, for common 1U, 2U and 4U server models, the height of the first air guide plate can be designed to be 4 cm, 8 cm and 16 cm.

[0052] In some possible embodiments, an air deflector frame may be provided, the size of which matches the size of the server cabinet, and a first air deflector corresponding to each server may be provided on the air deflector frame, the first air deflector being hinged to the air deflector frame through a hinge structure, and the first air deflector interacts with the first torsion spring and the first deformation spring to drive the first air deflector to rotate around the first hinge. Figure 3 , Figure 3 A schematic structural diagram of an air guide plate frame provided in an embodiment of the present application.

[0053] In some possible embodiments, for any server, a second air guide plate can be set inside the server, one end of the second air guide plate is hinged to a first preset position inside the server, and the second air guide plate is also connected to the second preset position inside the server through a second deformation spring, and the second deformation spring can be used to control the direction of the second air guide plate.

[0054] See also Figure 4 , Figure 4 A schematic diagram of the installation of the second air guide plate provided in the embodiment of the present application. The server is a dual-channel server, and two processors are mounted on the mainboard of the server, namely processor 1 and processor 2. When the processors are running, due to the different processing tasks of processor 1 and processor 2, the heat generated by processor 1 and processor 2 is different. A second air guide plate is set in front of processor 1 and processor 2. The second air guide plate can rotate around the rotation axis through the second torsion spring and the second deformation spring to change the area where processor 1 and processor 2 receive cold air.

[0055] See also Figure 5 , Figure 5 A schematic diagram of the installation of a second air deflector provided in an embodiment of the present application. For any server, a second air deflector is set inside the target server, one end of the second air deflector is hinged to a first preset position inside the server, and the second air deflector is also connected to the second preset position inside the server through a second deformation spring, and the second deformation spring can be used to control the direction of the second air deflector. In addition, the hinge position at the first preset position can be hinged through a second torsion spring, and a second target angle sensor is integrated at the first preset position, and the second target angle sensor can be used to detect the second current angle of the second air deflector.

[0056] In some possible embodiments, the first deformation spring and the second deformation spring may be shape memory alloy (Shape Memory Alloys, SMA) springs, and a temperature sensor may be integrated on the SMA spring. The temperature sensor may transmit the temperature signal to a thermostat in the server. The thermostat may control the temperature of the first deformation spring and the temperature of the second deformation spring, thereby controlling the first air guide plate and the second air guide plate. The thermostat may be a microcontroller unit (Microcontroller Unit, MCU) or a baseboard management controller (Baseboard Management Controller, BMC).

[0057] SMA springs are in the martensite phase at low temperatures and in the austenite phase at high temperatures.

[0058] The martensite phase is usually a low-symmetry structure. In shape memory alloys, the martensite phase is usually a stable phase at low temperatures, has high deformability, and can be reversibly deformed under external force. At low temperatures, the SMA spring is in the martensite phase and can be deformed by applying an external force (torsion spring in the embodiment of the present application). When the temperature rises to a certain level, the deformation can be restored by phase change.

[0059] The austenite phase is usually a cubic structure with high symmetry. In shape memory alloys, the austenite phase is usually a stable phase at high temperatures, with high strength and elastic modulus. At high temperatures, the SMA spring is in the austenite phase and can return to its original shape. This is because the structure of the austenite phase is more stable and can "remember" the original shape of the material.

[0060] The principle of controlling the opening and closing of the first air guide plate by the interaction between the first deformation spring and the first torsion spring is the same as the principle of controlling the turning of the second air guide plate by the interaction between the second deformation spring and the second torsion spring. Figure 6 , the principle of interaction between the deformation spring and the torsion spring provided in the embodiment of the present application is explained.

[0061] Figure 6 A torque diagram of a deformable spring and a torsion spring provided in an embodiment of the present application. Figure 6 , point a is the fixed connection position between one end of the deformation spring and the inside of the server, and point b is the fixed connection position of the other end of the deformation spring on the air guide plate. Point b is the rotation center of the air guide plate. Among them, ab=bc=L, that is, triangle abc is an isosceles triangle, and the angle formed by the intersection of the bc side and the extension of the ab side is θ, then

[0062] ∠bac=∠acb=

[0063] Deformation spring contraction force The relationship between the axial tensile length is:

[0064]

[0065] in, is the spring contraction force of the deformation spring; G is the shear modulus; is the wire diameter of the deformation spring; is the diameter of the deformation spring; is the number of turns of the deformation spring; λs is the axial stretching length.

[0066] The axial tensile length λs can be expressed as the following function:

[0067]

[0068] in, is the target angle at the target moment, is the current angle at the current moment.

[0069] The length of the arm of the deformation spring contraction force is L, so the moment of the deformation spring is It can be expressed as the following formula:

[0070]

[0071] The spring contraction force of the deformation spring , axial tensile length Substituting into the above formula, we get Torque of the deformation spring It can be expressed as:

[0072]

[0073] The torsion spring plays a role of reset. The interaction between the torsion spring and the deformation spring can control the rotation of the air guide plate. The torque of the torsion spring With twist angle and the torsion spring rate The relationship is as follows:

[0074]

[0075] Spring constant It can be expressed as:

[0076]

[0077] Where E is the elastic modulus of the torsion spring material, is the torsion spring wire diameter, is the spring mean diameter, is the effective number of turns of the torsion spring, then It can be expressed as follows:

[0078]

[0079] The torque balance condition of the torsion spring and the deformation spring is:

[0080]

[0081] but,

[0082]

[0083] Among them, the arm length L, the deformation spring wire diameter , deformation spring diameter , Deformation spring turns , Torsion spring wire diameter , Spring median diameter , the effective number of turns of the torsion spring , E is the elastic modulus of the torsion spring material, both of which are known parameters. The current angle at the current moment can be detected by an angle sensor and recorded in a register, which is also a known item; the corresponding relationship between the stiffness parameter G of the deformation spring and the temperature can be obtained by looking up the properties of the deformation material used or the test data.

[0084] Therefore, the stiffness parameter G of the deformation spring can be changed by changing the temperature of the deformation spring at the target time, so that the angle of the air guide plate at the target time is adjusted to the target angle. , thereby achieving the purpose of controlling the angle of the air guide plate.

[0085] Next, for any server, combined Figure 7-9 , the execution process of heat dissipation of the target server provided in the embodiment of the present application is specifically described.

[0086] Figure 7 This is a flow chart of a method for controlling heat dissipation of a server provided in an embodiment of the present application. Figure 7 , the method may include:

[0087] S701. Obtain a server temperature of a target server and a processor temperature of each processor in the target server.

[0088] The execution subject of the embodiment of the present application may be a server, or a server heat dissipation control device arranged in the server. The server heat dissipation control device may be implemented by software, or by a combination of software and hardware.

[0089] In some possible embodiments, a temperature sensor is installed on each server casing of the server cabinet, and the monitoring device can obtain the server temperature of the server through the temperature sensor. The monitoring device can send the server temperature of each server to the target server.

[0090] In some possible embodiments, the device temperature of each heating device in the target server may be obtained, and the server temperature of the target server may be determined according to the device temperature of the heating device. Figure 8 , the execution process of determining the server temperature is specifically described.

[0091] S702: Determine a first target temperature corresponding to the first deformation spring according to the server temperature, and adjust the temperature of the first deformation spring to the first target temperature to control the contraction of the first deformation spring.

[0092] The contraction of the first deformation spring can be used to control the opening and closing angle of the first air guide plate.

[0093] In some possible embodiments, before determining the first target temperature corresponding to the first deformable spring according to the server temperature, it also includes: judging whether to perform air volume adjustment processing on the target server temperature according to the server temperature; if so, determining the first target temperature corresponding to the first deformable spring according to the server temperature.

[0094] In the embodiment of the present application, there are two ways to determine whether to adjust the air volume.

[0095] Method 1: Multiple temperature intervals and the temperature level corresponding to each temperature interval can be obtained; among the multiple temperature intervals, the target temperature interval corresponding to the server temperature is determined, and the temperature level corresponding to the target temperature interval is determined as the target level of the target server; if the target level is greater than the preset level, the first target temperature corresponding to the first deformation spring is determined according to the server temperature.

[0096] If the target level is less than or equal to the preset level, the current angle of the first air guide plate may be maintained.

[0097] For example, assuming that there are three temperature intervals, namely temperature intervals 1-3, as shown in Table 1, the temperature levels corresponding to each temperature interval are temperature level 1, temperature level 2, and temperature level 3. Among them, temperature level 3 is greater than temperature level 2, and temperature level 2 is greater than temperature level 1. Assuming that the preset level is temperature level 1, the server temperature of the target server is 6 degrees Celsius ( ), the air volume of the target server can be adjusted.

[0098] Table 1

[0099]

[0100] Method 2: Determine a first average value of the extreme temperature difference of each server; if the extreme temperature difference of the target server is greater than the first average value, determine a first target temperature corresponding to the first deformation spring according to the server temperature.

[0101] The first mean value of the extreme temperature of each server can be found in the following formula:

[0102]

[0103] Where n is the number of servers in the multiple servers. It is used to indicate the extreme temperature of the i-th server, and M is the sum of the variances of the extreme temperatures of multiple servers.

[0104]

[0105] Where n is the number of servers in the multiple servers. Indicates the first mean of the variance temperature of the n servers.

[0106] If the extreme temperature difference of the target server is less than or equal to the first average value, the current angle of the first air guide plate is maintained.

[0107] When the temperature of the first deformation spring is adjusted to the first target temperature, if the first target temperature is greater than the current temperature of the first deformation spring, heating control can be performed through a pulse width modulation (PWM) control signal. By adjusting the width of the pulse, the average value of the heating power consumption is controlled, thereby achieving temperature control and expansion and contraction control of the deformation spring.

[0108] PWM control signal is a method of controlling power transmission or signal output by changing the duty cycle of the pulse signal (that is, the ratio of the high level time to the entire cycle).

[0109] When the first target temperature is greater than the current temperature, the duty cycle of the PWM control signal can be increased to increase the heating power output, so that the first deformable spring is heated up and the first deformable spring is transformed into the austenite phase. The first deformable spring has stronger rigidity and can support the torsion spring. The angle of the first air guide plate is increased, so that more cold air can enter the cavity of the target server, thereby increasing the heat dissipation of the target server.

[0110] When the first target temperature is lower than the current temperature, the duty cycle of the PWM control signal can be reduced, the first deformation spring transforms into the martensite phase, and the contraction torque of the first deformation spring decreases. When its contraction torque is lower than the contraction torque of the torsion spring, the angle of the first air guide plate decreases, thereby reducing the amount of cold air that can enter the cavity of the target server.

[0111] In some possible embodiments, the heating logic of the first deformable spring includes automatic current limiting and overheating protection functions to ensure the life of components and safe operation.

[0112] The telescopic support of the first deformation spring has a manual adjustment mode to ensure that in special circumstances such as when a system failure of the shape memory alloy occurs or manual adjustment is required, the administrator can directly control the angle of the blade and adjust the air volume through the management interface of the software layer or the manual control button.

[0113] S703: Determine a second target temperature corresponding to the second deformation spring according to the processor temperature of each processor, and adjust the temperature of the second deformation spring to the second target temperature to control the second deformation spring to contract.

[0114] The contraction of the second deformation spring is used to control the direction of the second air guide plate, and the second air guide plate is used to divert the wind of the fan in the target server.

[0115] In some possible embodiments, after adjusting the angle of the first air guide plate, the angle of the second air guide plate can be adjusted at the same time. After increasing the amount of cold air to the target server, the second air guide plate can be adjusted to increase the air volume for devices that generate more heat, thereby improving the heat dissipation efficiency.

[0116] In some possible embodiments, a first temperature difference of processor temperatures of each processor may be determined; when the first temperature difference is greater than a preset threshold, a second target temperature corresponding to the second deformation spring is determined, and the angle of the second air guide plate is adjusted.

[0117] The first temperature difference may be used to indicate a temperature difference between a maximum value and a minimum value among processor temperatures of the plurality of processors.

[0118] When the first temperature difference is greater than the preset threshold, the temperature of the processor is too high. At this time, the processor with too high temperature needs to be cooled down. The angle of the second air guide plate can be adjusted to increase the cold air flowing to the processor with too high temperature.

[0119] The angle of the second air guide plate can be controlled by electrically heating the second deformation spring, and the second target temperature corresponding to the second deformation spring can be determined in the following manner: the second target angle of the second air guide plate is determined according to the processor temperature of each processor; the second stiffness parameter of the second deformation spring is determined according to the second target angle of the second air guide plate; and the second temperature corresponding to the second stiffness parameter is determined as the second target temperature.

[0120] Taking the target server where each processor is a first processor and a second processor as an example, the second target angle of the second air guide plate may be determined according to the temperature difference between the first processor and the second processor.

[0121] If the processor temperature of the first processor is greater than the processor temperature of the second processor, the second target angle makes the air volume blowing toward the first processor greater than the air volume blowing toward the second processor.

[0122] In some possible embodiments, a temperature difference level corresponding to the temperature difference value may be determined based on the temperature difference value, and an angle corresponding to the temperature difference level may be determined as the second target angle.

[0123] For example, assuming there are 3 temperature levels, namely temperature difference levels 1-3, each temperature difference level has its corresponding temperature difference interval and corresponding preset angle. If the temperature difference value is within the temperature difference interval corresponding to temperature difference level 1, the preset angle corresponding to temperature difference level 1 is determined as the second target angle.

[0124] In some possible embodiments, the second target angle may be determined according to the processor temperature of each processor. For the specific implementation process, see Fig. 9 In the illustrated embodiment, the execution process of determining the first target angle of the first air guide plate according to the server temperature is not repeated here.

[0125] The server heat dissipation control method provided in the embodiment of the present application can control the opening and closing of the first air guide plate through the first deformation spring, and control the steering of the second air guide plate through the second deformation spring. Without increasing the power of the heat dissipation system, the heat dissipation of servers with higher temperatures can be increased, and the power consumption of server heat dissipation can be reduced; at the same time, the heat dissipation efficiency of the server can be increased.

[0126] Figure 8 A flow chart of determining the server temperature provided in an embodiment of the present application. Figure 8 , the method comprising:

[0127] S801: Obtain the device temperature of each heating device of the target server.

[0128] The heat generating components may include a central processing unit (CPU), a graphics processing unit (GPU), a memory, a hard disk, and the like.

[0129] A temperature sensor may be integrated in the heating device, and the device temperature of each heating device may be acquired through the temperature sensor corresponding to each heating device.

[0130] S802 : Determine a target device among the heat generating devices according to the device temperature of each heat generating device.

[0131] The device temperature of the target device is a heat generating device that has the greatest influence on the server temperature of the target server.

[0132] In some possible embodiments, for any heating device, the difference between the first threshold value of the heating device and the device temperature can be determined as the temperature margin value of the heating device; and the heating device with the smallest temperature margin value is determined as the target device.

[0133] The first threshold is used to indicate the maximum temperature of the heating device. If the temperature of the heating device is greater than the maximum temperature, the working quality and efficiency of the heating device will be affected. Therefore, the temperature of the heating device needs to be controlled below the first threshold. If the temperature margin value is smaller, that is, the current temperature of the heating device is about to reach the first threshold, the heating device needs to be cooled more urgently.

[0134] S803: Determine the server temperature of the target server according to the target device.

[0135] In one possible embodiment, it can be determined that the target server corresponds to multiple servers in a server cabinet, including the target server; the extreme temperature difference of each server is determined according to the target device; and the extreme temperature difference of the target server is determined as the server temperature of the target server.

[0136] When the heat dissipation power of the heat dissipation system is constant, it is necessary to coordinate the temperatures between multiple servers. In the embodiment of the present application, the server temperature of the target server can be determined based on the relative temperatures between the multiple servers. In this way, the air volume that needs to be coordinated for cooling the target server relative to the multiple servers can be judged, which can improve the accuracy of cooling the server.

[0137] The coordinated air volume for cooling can be determined by the opening and closing angle of the first air guide plate. The larger the opening and closing angle, the greater the cooling air volume.

[0138] The extreme temperature difference may be used to indicate the relative temperature between multiple servers. The extreme temperature difference may be a temperature value exceeding the reference temperature, with the minimum device temperature value of the target device in the multiple servers as the reference temperature.

[0139] In one possible embodiment, device temperatures of multiple target devices in multiple servers can be obtained; the minimum value of the device temperatures of the multiple target devices is determined as the reference temperature; and the difference between the device temperature corresponding to the target device of the target server and the reference temperature is determined as the extreme temperature of the target server.

[0140] For example, assuming that the target device is a CPU, there are 4 servers, namely servers 1-4, and assuming that the device temperature of the CPU of server 1 is 50 degrees, the device temperature of the CPU of server 2 is 40 degrees, the device temperature of the CPU of server 3 is 70 degrees, and the device temperature of the CPU of server 4 is 35 degrees. Then the base temperature can be determined to be 35 degrees. Assuming that the target server is server 1, the extreme temperature of the target server can be determined to be 15 degrees.

[0141] In the server heat dissipation control method provided in the embodiment of the present application, the target device can be determined according to the device temperatures of each heating device of the target server. The device temperature of the target device has the greatest impact on the server temperature of the target server. The device temperature of the target device is determined as the server temperature. The heat dissipation of the target server can be controlled according to the devices in the target server that actually need to be cooled, thereby improving the accuracy of heat dissipation control.

[0142] In some possible embodiments, the principle of controlling the opening and closing of the first air guide plate by the first deformation spring is the same as the principle of controlling the turning of the second air guide plate by the second deformation spring. Fig. 9 , taking the first air guide plate as an example, the execution process of determining the target temperature of the deformation spring provided in the embodiment of the present application is further explained.

[0143] Fig. 9 A schematic diagram of a process for determining a first target temperature provided in an embodiment of the present application. Fig. 9 , the method may include:

[0144] S901. Determine an angle adjustment ratio of a target server according to the server temperature.

[0145] The angle adjustment ratio may be an angle increase ratio or an angle decrease ratio.

[0146] In some possible embodiments, the average temperature of multiple servers may be determined; the difference between the server temperature and the average temperature may be determined as the temperature deviation value of the target server; and the angle adjustment ratio may be determined based on the temperature deviation value of the target server.

[0147] The temperature deviation value may be a positive deviation value or a negative deviation value; if the temperature difference deviation value of the target server is a positive deviation value, the angle adjustment ratio is determined to be an angle increase ratio according to the temperature difference deviation value of the target server. If the temperature difference deviation value of the target server is a negative deviation value, the angle adjustment ratio is determined to be an angle decrease ratio according to the temperature difference deviation value of the target server.

[0148] Specifically, the angle increase ratio can be determined according to the following method: determine multiple first servers among multiple servers, including a target server, and the temperature deviation value of the first server is a positive deviation value; determine the total deviation value of the temperature deviation values ​​of the multiple first servers; and determine the ratio of the temperature deviation value of the target server to the total deviation value of the multiple first servers as the angle adjustment ratio, and the angle adjustment ratio is the angle increase ratio.

[0149] The formula for determining the temperature average of the server temperatures of a plurality of servers may be seen as follows:

[0150]

[0151] Wherein, n is the number of servers of the plurality of servers; is the server temperature of the ith server, is the average temperature of multiple servers, and i is an integer greater than or equal to 1.

[0152] If the server temperature of the target server is greater than the average temperature, the temperature deviation value is a positive deviation value, which can be seen from the following formula:

[0153]

[0154] in, It is used to indicate the temperature deviation value of the i-th server. The temperature deviation value is a positive deviation value. Used to indicate the server temperature of the i-th server, Used to indicate the average temperature of multiple servers. i is an integer greater than or equal to 1 and less than or equal to n.

[0155] If the server temperature of the target server is lower than the average temperature, the temperature deviation is a positive deviation, which can be found in the following formula:

[0156]

[0157] in, It is used to indicate the temperature deviation value of the i-th server. The temperature deviation value is a negative deviation value. Used to indicate the server temperature of the i-th server, Used to indicate the average temperature of multiple servers. i is an integer greater than or equal to 1 and less than or equal to n.

[0158] If the temperature difference deviation value is a positive deviation value, the formula for determining the angle adjustment ratio of each server can be found as follows:

[0159]

[0160] in, The number of servers for multiple servers; A positive deviation value for indicating the i-th first server; Used to indicate the angle adjustment ratio of the i-th server.

[0161] Specifically, the angle reduction ratio can be determined according to the following method: determine multiple second servers among multiple servers, the multiple second servers include a target server, and the temperature deviation value of the second servers is a negative deviation value; determine the total deviation value of the temperature deviation values ​​of the multiple second servers; and determine the ratio of the temperature deviation value of the target server to the total deviation value of the multiple first servers as the angle adjustment ratio, and the angle adjustment ratio is the angle reduction ratio.

[0162] If the temperature difference deviation value is a negative deviation value, the formula for determining the angle adjustment ratio of each server can be found as follows:

[0163]

[0164] Wherein, n is the number of servers of the plurality of servers; Used to indicate the negative deviation value of the i-th server; Used to indicate the angle adjustment ratio of the i-th server.

[0165] In some possible embodiments, the target server may send the server temperature to the monitoring device, and the monitoring device may thereby obtain the server temperature of each server, and the monitoring device may adjust the heat dissipation control of multiple servers.

[0166] If the temperature difference deviation value of the target server is a negative deviation value, the current angle of the first air guide plate is maintained.

[0167] In some possible embodiments, after adjusting the air volume of multiple first servers, the monitoring device detects that the fan blades of the first server have rotated to the maximum angle of 90°, and the extreme temperature difference of the first server is still greater than the first average value, then the monitoring device can send a control instruction to the target server, and the target server determines the angle reduction ratio according to the temperature difference deviation value of the target server. After reducing the angle of the first air guide plate of the target server, the air volume of the cavity of the target server is reduced, and the air volume entering the cavity of the first server is increased, which can accelerate the heat dissipation of the first server.

[0168] S902: Determine the product of the angle adjustment ratio and the first current angle of the first air guide plate as a first adjustment angle.

[0169] The first adjustment angle can be determined according to the following formula:

[0170]

[0171] in, Used to indicate the first adjustment angle of the i-th server, Used to indicate the angle adjustment ratio, Used to indicate the current angle of the first air guide plate, the current moment is moment t-1, and the target moment is moment t.

[0172] S903: Determine a first target angle according to the first adjustment angle and the first current angle.

[0173] In some possible embodiments, if the angle adjustment ratio is an angle increase ratio, the sum of the first adjustment angle and the first current angle is determined as the first target angle; if the angle adjustment ratio is an angle decrease ratio, the difference between the first current angle and the first adjustment angle is determined as the first target angle.

[0174] The first target angle may be used to indicate an angle after the first wind guide plate is adjusted.

[0175] S904: Determine a first stiffness parameter of the first deformation spring according to the first target angle.

[0176] In some possible embodiments, multiple first parameters of the first deformation spring and multiple second parameters of the first torsion spring are obtained; data processing is performed on the multiple first parameters, the multiple second parameters, the first current angle of the first air guide plate, and the first target angle to obtain a first stiffness parameter.

[0177] The plurality of first parameters may include a moment arm length, a spring wire diameter, a spring diameter, and a number of S-spring turns of the first deformation spring.

[0178] The plurality of second parameters may include a torsion spring wire diameter of the first torsion spring, a spring intermediate diameter, an effective number of turns of the torsion spring, and an elastic modulus of the torsion spring material.

[0179] When data processing is performed on the multiple first parameters, the multiple second parameters, the first current angle of the first air guide plate, and the first target angle, the torsion spring torque of the first torsion spring can be determined according to the multiple second parameters and the first current angle of the first air guide plate; the first stiffness parameter can be determined according to the multiple first parameters, the first target angle, and the torsion spring torque. For the specific calculation process, please refer to the above Figure 6 The formula derivation process of the moment diagram of the deformation spring and the torsion spring is provided to obtain the first stiffness parameter, which will not be repeated here.

[0180] S905. Determine the temperature corresponding to the first stiffness parameter as the first target temperature.

[0181] A correspondence table between the stiffness parameters and temperatures corresponding to the first deformation spring can be obtained, the correspondence table including multiple stiffness parameters and the temperature corresponding to each stiffness parameter; the temperature corresponding to the first stiffness parameter can be determined in the correspondence table, and the temperature corresponding to the first stiffness parameter can be determined as the first target temperature.

[0182] The corresponding relationship table can be obtained by looking up the material properties of the first deformation spring or test data.

[0183] The server heat dissipation control method provided in the embodiment of the present application can determine the first target angle of the first air guide plate according to the server temperature, determine the first stiffness parameter of the first deformation spring according to the first target angle, and determine the temperature corresponding to the first stiffness parameter as the first target temperature. The temperature of the first deformation spring can be accurately determined by the server temperature, and then the first air guide plate can be controlled to improve the effectiveness of heat dissipation.

[0184] In some possible embodiments, the heat dissipation of multiple servers can be controlled by a monitoring device. For any target server among the multiple servers, the monitoring device can send a control instruction to the target server to execute the server heat dissipation control method in the above embodiment.

[0185] Fig.10 This is a signal interaction diagram of a method for controlling server heat dissipation provided in an embodiment of the present application. Fig.10 For any target server among multiple servers, the target server can obtain the device temperature, power consumption information of each heating device, and the temperature information of the second deformation spring. The target server can control the power of the second deformation spring according to the device temperature, power consumption information of each heating device, and the temperature information of the second deformation spring, and then adjust the temperature of the second deformation spring to control the direction of the second air guide plate.

[0186] The monitoring device can obtain the device temperature, power consumption information and temperature information of the first deformation spring of each heating device of the target server, and control the power of the first deformation spring according to the device temperature, power consumption information and temperature information of the first deformation spring, thereby adjusting the temperature of the first deformation spring to control the opening and closing angle of the first air guide plate.

[0187] The monitoring device may send a first control signal to the target server, and the target server adjusts the temperature of the second deformable spring according to the first control signal. The target server may send second control information to the monitoring device, and the second control information is used to instruct the monitoring device to adjust the temperature of the first deformable spring.

[0188] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method.

[0189] Fig.11 This is a schematic diagram of the structure of the control device for server heat dissipation provided in an embodiment of the present application. Fig.11 As shown, the server heat dissipation control device 10 includes an acquisition module 11, a first determination module 12, a first adjustment module 13, a second determination module 14 and a second adjustment module 15:

[0190] The acquisition module 11 is used to acquire the server temperature of the target server and the processor temperature of each processor in the target server;

[0191] The first determination module 12 is used to determine a first target temperature corresponding to the first deformation spring according to the server temperature;

[0192] The first adjustment module 13 is used to adjust the temperature of the first deformation spring to a first target temperature to control the contraction of the first deformation spring, and the contraction of the first deformation spring is used to control the opening and closing angle of the first air guide plate;

[0193] The second determination module 14 is used to determine the second target temperature corresponding to the second deformation spring according to the processor temperature of each processor;

[0194] The second regulating module 15 is used to regulate the temperature of the second deformable spring to a second target temperature to control the contraction of the second deformable spring. The contraction of the second deformable spring is used to control the direction of the second air guide plate. The second air guide plate is used to divert the wind of the fan in the target server.

[0195] The server heat dissipation control device provided in this embodiment can execute the method provided in the above embodiment. Its implementation principle and technical effect are similar, and this embodiment will not be described in detail here.

[0196] In a possible embodiment, the first determining module 12 is specifically configured to:

[0197] Determining a first target angle of the first air guide plate according to the server temperature;

[0198] Determining a first stiffness parameter of a first deformation spring according to a first target angle;

[0199] The temperature corresponding to the first stiffness parameter is determined as the first target temperature.

[0200] In a possible embodiment, the first determining module 12 is specifically configured to:

[0201] Determine an angle adjustment ratio of the target server according to the server temperature, where the angle adjustment ratio is an angle increase ratio or an angle decrease ratio;

[0202] The product of the angle adjustment ratio and the first current angle of the first air guide plate is determined as a first adjustment angle;

[0203] A first target angle is determined according to the first adjustment angle and the first current angle.

[0204] In a possible embodiment, the first determining module 12 is specifically configured to:

[0205] If the angle adjustment ratio is an angle increase ratio, the sum of the first adjustment angle and the first current angle is determined as the first target angle;

[0206] If the angle adjustment ratio is an angle reduction ratio, the difference between the first current angle and the first adjustment angle is determined as the first target angle.

[0207] In a possible embodiment, one end of the first air guide plate is further hinged to the outer side of the target server through a first torsion spring; the first determining module 12 is specifically used for:

[0208] Acquire a plurality of first parameters of the first deformation spring and a plurality of second parameters of the first torsion spring;

[0209] Data processing is performed on the plurality of first parameters, the plurality of second parameters, the first current angle of the first air guide plate, and the first target angle to obtain a first stiffness parameter.

[0210] In a possible embodiment, the first determining module 12 is specifically configured to:

[0211] determining a torsion spring torque of the first torsion spring according to the plurality of second parameters and a first current angle of the first air guide plate;

[0212] A first stiffness parameter is determined based on the plurality of first parameters, the first target angle, and the torsion spring torque.

[0213] In a possible embodiment, the first determining module 12 is specifically configured to:

[0214] Determine a temperature average of a plurality of servers, the plurality of servers including a target server;

[0215] The difference between the server temperature and the average temperature is determined as the temperature deviation value of the target server;

[0216] Determine the angle adjustment ratio based on the temperature deviation value of the target server.

[0217] In a possible embodiment, the acquisition module 11 is specifically used for:

[0218] Obtaining the device temperature of each heating device of the target server;

[0219] According to the device temperature of each heating device, a target device is determined among the heating devices, and the device temperature of the target device has the greatest influence on the server temperature of the target server;

[0220] Based on the target device, determine the server temperature of the target server.

[0221] In a possible embodiment, the acquisition module 11 is specifically used for:

[0222] Determine that the target server corresponds to multiple servers in a server cabinet, wherein the multiple servers include the target server;

[0223] Determine the extreme temperature difference of the target server based on multiple servers and target devices;

[0224] The extreme temperature difference of the target server is determined as the server temperature of the target server.

[0225] In a possible embodiment, the acquisition module 11 is specifically used for:

[0226] Obtain device temperatures of multiple target devices in multiple servers;

[0227] Determine a minimum value of device temperatures of a plurality of target devices as a reference temperature;

[0228] The difference between the device temperature corresponding to the target device of the target server and the reference temperature is determined as the extreme temperature difference of the target server.

[0229] In a possible embodiment, the second determining module 14 is specifically configured to:

[0230] determining a first temperature difference of processor temperatures of each processor;

[0231] If the first temperature difference is greater than a preset threshold, a second target temperature corresponding to the second deformable spring is determined.

[0232] In a possible embodiment, the second determining module 14 is specifically configured to:

[0233] determining a second target angle of the second air guide plate according to the processor temperature of each processor;

[0234] determining a second stiffness parameter of the second deformation spring according to a second target angle of the second air guide plate;

[0235] A second temperature corresponding to the second stiffness parameter is determined as a second target temperature.

[0236] The server heat dissipation control device provided in this embodiment can execute the method provided in the above embodiment. Its implementation principle and technical effect are similar, and this embodiment will not be described in detail here.

[0237] Fig.12 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Fig.12 The electronic device 20 may include a processor 21 and a memory 22. Exemplarily, the processor 21 and the memory 22 are interconnected via a bus 23.

[0238] The memory 22 stores computer executable instructions;

[0239] The processor 21 executes the computer execution instructions stored in the memory 22, so that the processor 21 executes the control method for heat dissipation of the server as shown in the above embodiment.

[0240] In the above embodiments, it should be understood that the processor may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), etc. A general-purpose processor may be a microprocessor or any conventional processor, etc. The steps of the method disclosed in the application may be directly implemented as being executed by a hardware processor, or may be executed by a combination of hardware and software modules in the processor.

[0241] The memory may include a high-speed memory (Random Access Memory, RAM), and may also include a non-volatile memory (NVM), such as at least one disk storage.

[0242] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, the bus in the drawings of this application is not limited to only one bus or one type of bus.

[0243] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above-mentioned server heat dissipation control method embodiments when running.

[0244] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.

[0245] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps in any of the above-mentioned server heat dissipation control method embodiments are implemented.

[0246] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium, the non-volatile computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, the steps in any of the above-mentioned server heat dissipation control method embodiments are implemented.

[0247] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0248] The above is a detailed introduction to a control method for server heat dissipation and a server provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A method for controlling heat dissipation of a server, characterized in that: Applied to a target server, a first air guide plate is arranged outside the target server, the first air guide plate is connected to the outside of the target server through a first deformation spring, a second air guide plate is arranged inside the target server, the second air guide plate is connected to a preset position through a second deformation spring, and the method includes: Acquire the server temperature of the target server and the processor temperature of each processor in the target server; Determining a first target temperature corresponding to the first deformable spring according to the server temperature, and adjusting the temperature of the first deformable spring to the first target temperature to control the contraction of the first deformable spring, wherein the contraction of the first deformable spring is used to control the opening and closing angle of the first air guide plate; The second target temperature corresponding to the second deformation spring is determined according to the processor temperature of each processor, and the temperature of the second deformation spring is adjusted to the second target temperature to control the contraction of the second deformation spring. The contraction of the second deformation spring is used to control the direction of the second air guide plate, and the second air guide plate is used to divert the wind of the fan in the target server.

2. The method according to claim 1, characterized in that Determining a first target temperature corresponding to the first deformable spring according to the server temperature includes: determining a first target angle of the first air guide plate according to the server temperature; determining a first stiffness parameter of the first deformation spring according to the first target angle; The temperature corresponding to the first stiffness parameter is determined as the first target temperature.

3. The method according to claim 2, characterized in that Determining a first target angle of the first air guide plate according to the server temperature includes: Determining an angle adjustment ratio of the target server according to the server temperature, wherein the angle adjustment ratio is an angle increase ratio or an angle decrease ratio; multiplying the angle adjustment ratio by a first current angle of the first air guide plate to determine a first adjustment angle; The first target angle is determined according to the first adjustment angle and the first current angle.

4. The method according to claim 3, characterized in that Determining the first target angle according to the first adjustment angle and the first current angle includes: If the angle adjustment ratio is the angle increase ratio, determining the sum of the first adjustment angle and the first current angle as the first target angle; If the angle adjustment ratio is the angle reduction ratio, the difference between the first current angle and the first adjustment angle is determined as the first target angle.

5. The method according to claim 2, characterized in that: One end of the first air guide plate is also hinged to the outer side of the target server through a first torsion spring; and according to a first target angle of the first air guide plate, a first stiffness parameter of the first deformation spring is determined, including: Acquire a plurality of first parameters of the first deformation spring and a plurality of second parameters of the first torsion spring; The first stiffness parameter is obtained by performing data processing on the multiple first parameters, the multiple second parameters, the first current angle of the first air guide plate, and the first target angle.

6. The method according to claim 5, characterized in that Performing data processing on the multiple first parameters, the multiple second parameters, the first current angle of the first air guide plate, and the first target angle to obtain the first stiffness parameter includes: determining a torsion spring torque of the first torsion spring according to the plurality of second parameters and a first current angle of the first air guide plate; The first stiffness parameter is determined based on the plurality of first parameters, the first target angle, and the torsion spring torque.

7. The method according to claim 2, characterized in that: Determining an angle adjustment ratio of the target server according to the server temperature includes: Determining a temperature average of a plurality of servers, wherein the plurality of servers include the target server; Determine the difference between the server temperature and the temperature mean as the temperature deviation value of the target server; The angle adjustment ratio is determined according to the temperature deviation value of the target server.

8. The method according to any one of claims 1 to 7, characterized in that: Obtaining the server temperature of the target server includes: Obtaining the device temperature of each heating device of the target server; Determine a target device among the heat-generating devices according to the device temperatures of the heat-generating devices, wherein the device temperature of the target device has the greatest influence on the server temperature of the target server; A server temperature of the target server is determined according to the target device.

9. The method according to claim 8, characterized in that Determining a server temperature of the target server according to the target device includes: Determine that the target server corresponds to a plurality of servers in a server cabinet, wherein the plurality of servers include the target server; Determining the extreme temperature difference of the target server according to the plurality of servers and the target device; The extreme temperature difference of the target server is determined as the server temperature of the target server.

10. The method according to claim 9, characterized in that Determining the extreme temperature difference of the target server according to the target device includes: Acquiring device temperatures of a plurality of target devices in the plurality of servers; Determining a minimum value of the device temperatures of the plurality of target devices as a reference temperature; The difference between the device temperature corresponding to the target device of the target server and the reference temperature is determined as the extreme temperature difference of the target server.

11. The method according to any one of claims 1 to 7, characterized in that: Determining a second target temperature corresponding to the second deformation spring according to the temperatures of each processor includes: Determining a first temperature difference of processor temperatures of each of the processors; If the first temperature difference is greater than a preset threshold, a second target temperature corresponding to the second deformable spring is determined.

12. The method according to claim 11, characterized in that Determining a second target temperature corresponding to the second deformable spring includes: determining a second target angle of the second air guide plate according to the processor temperature of each processor; determining a second stiffness parameter of the second deformation spring according to a second target angle of the second air guide plate; A second temperature corresponding to the second stiffness parameter is determined as the second target temperature.

13. A server, characterized in that: The server includes a first air guide plate, a second air guide plate and a temperature controller, wherein: The first air guide plate is hinged to the outer side of the server, and the first air guide plate is also connected to the outer side of the server through a first deformation spring; The second air guide plate is hinged to a first preset position inside the server, and the second air guide plate is also connected to the second preset position inside the server via a second deformation spring; The temperature controller is used to execute computer instructions to control the first air guide plate and the second air guide plate, so as to implement the control method for heat dissipation of the server as described in any one of claims 1 to 12.

14. The server according to claim 13, characterized in that: One end of the first air guide plate is hinged to the outer side of the server through a first torsion spring; and / or, One end of the second air guide plate is hinged to a preset position through a second torsion spring.

15. A server cabinet, characterized in that: The server cabinet comprises a plurality of servers according to claim 13 or claim 14.

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