Stacked power supply design in card-based computing device

Abstract

According to various embodiments, a processing subsystem includes a first printed circuit board (PCB); a processor directly mounted on a first side of the first PCB; and one or more power supply components. One or more power supply components are coupled to the second side of the first PCB and electrically coupled to the processor, wherein the first side of the first PCB is opposite the second side of the first PCB.

Description

Technical Field

[0001] Various embodiments relate generally to computer architecture and electronic devices, and more particularly, to stacked power designs in card-based computing devices. Background Art

[0002] Many types of computers are designed to include one or more expansion cards that provide additional functionality to the computer, such as enhanced video or gaming performance, accelerated video capture, the ability to connect to a network, and / or the ability to connect to a musical instrument, to name a few. An expansion card, also known as an adapter card, add-in card, or expansion board, is a card-based processing subsystem that typically includes a printed circuit board (PCB) that is adapted to connect to an expansion slot on a given computer's motherboard.

[0003] In order to provide appropriate power supply voltage and current to the microprocessor, memory and other components of the chipset of the card-based processing subsystem, the power components of the card-based processing subsystem are usually mounted directly on the PCB portion of the card-based processing subsystem. For example, large capacitors, inductors and power MOSFETs (metal oxide semiconductor field effect transistors) are usually mounted near the processor and memory chips on the PCB portion of the processing subsystem. Power is then delivered from these power components to the microprocessor, memory and other components of the chipset through a power distribution network, which is composed of conductive interconnects formed on the surface and within the PCB layers, such as metal traces, plated vias, and power and ground planes.

[0004] One drawback of conventional card-based processing subsystems is that it has proven quite difficult to adjust these subsystems to consume more power in order to meet the ever-increasing performance demands of computing and gaming applications. First, in order to provide the increased power to the microprocessor, memory, and other elements of the chipset of the higher performance card-based processing subsystem, a greater number of larger power components must be mounted on the PCB, which results in these power components being mounted farther away from the microprocessor, memory, and other elements of the chipset. The increased distance results in longer current paths, which reduces the overall efficiency of the power distribution network, resulting in more overall power consumption and heat generation on the PCB, and increases the signal-to-interference ratio of the processing subsystem. Second, in order to accommodate the additional larger power components, the size of the PCB generally needs to be increased, which increases the size, complexity, and overall cost of the card-based processing subsystem. Third, as more power components are mounted on the PCB, effective heat dissipation becomes more difficult because the additional power components generate more heat, but there is less available space for thermal solutions to dissipate the additional heat.

[0005] As previously stated, what is needed in the art are more efficient techniques for incorporating power supply components into card-based processing subsystems. Summary of the invention

[0006] According to various embodiments, the processing subsystem includes: a first printed circuit board (PCB); a processor directly mounted on a first side of the first PCB; and one or more power supply components coupled to a second side of the first PCB and electrically coupled to the processor; wherein the first side of the first PCB is opposite to the second side of the first PCB.

[0007] At least one technical advantage of the disclosed design over the prior art is that the disclosed design enables the power supply assembly of the card-based processing subsystem to be positioned closer to the microprocessor, memory, and other elements of the chipset of the processing subsystem. The relative current path between the power supply assembly and the microprocessor, memory, and other elements of the chipset is shorter, which improves the overall efficiency of the power distribution network of the card-based processing subsystem, consumes less overall power, generates less overall heat, and improves the overall signal-to-interference ratio of the processing subsystem. In addition, the size of the printed circuit board of the card-based processing subsystem can be reduced, which reduces the requirements of the processing subsystem in terms of size, cost, and complexity, and helps to include a more effective thermal solution in the card-based processing subsystem. These technical advantages provide one or more technical advances over prior art methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to be able to understand the above-mentioned features of various embodiments in detail, the inventive concepts briefly summarized above may be described in more detail with reference to various embodiments, some of which are shown in the accompanying drawings. However, it should be noted that the drawings only illustrate typical embodiments of the inventive concept and are therefore not to be construed as limiting the scope in any way, and there are other equally effective embodiments.

[0009] Figure 1 is a conceptual diagram of a computer system configured to implement one or more aspects of various embodiments;

[0010] Figure 2 According to various embodiments Figure 1 A more detailed diagram of a computer system;

[0011] Figure 3 According to various embodiments Figure 2 A more detailed illustration of the card-based processing subsystem;

[0012] Figure 4 According to various other embodiments Figure 2 A more detailed diagram of the card-based processing subsystem

[0013] Figure 5A is a schematic diagram of a portion of a motherboard that may receive a card-based processing subsystem according to various embodiments;

[0014] Figure 5B is a schematic diagram of a portion of a motherboard on which a card-based processing subsystem is mounted according to various embodiments;

[0015] Figure 5C is a schematic diagram of a portion of a motherboard on which a card-based processing subsystem is mounted according to various other embodiments; and

[0016] Figure 6 According to various other embodiments Figure 2 A more detailed illustration of the card-based processing subsystem.

[0017] For clarity, where applicable, identical reference numerals are used to designate identical elements that are common between the figures. It is contemplated that features of one embodiment may be incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0018] In the following description, numerous specific details are set forth to provide a more thorough understanding of various embodiments. However, it will be apparent to one skilled in the art that the inventive concept may be practiced without one or more of these specific details.

[0019] System Overview

[0020] Figure 1 1 is a conceptual diagram of a computer system 100 configured to implement one or more aspects of various embodiments. As shown, the system 100 includes a central processing unit (CPU) 102 and a system memory 104 that communicate via a bus path, which may include a memory bridge 105. The CPU 102 includes one or more processing cores, and in operation, the CPU 102 is the main processor of the system 100, controlling and coordinating the operation of other system components. The system memory 104 stores software applications and data for use by the CPU 102. The CPU 102 runs software applications and an optional operating system. The memory bridge 105 can be, for example, a north bridge chip, which is connected to an I / O (input / output) bridge 107 via a bus or other communication path (e.g., a HyperTransport link). The I / O bridge 107 can be, for example, a south bridge chip, which receives user input from one or more user input devices 108 (e.g., a keyboard, a mouse, a joystick, a digitizing tablet, a touch pad, a touch screen, a still camera or a video camera, a motion sensor, and / or a microphone) and forwards the input to the CPU 102 through the memory bridge 105.

[0021] Display processor 112 is coupled to memory bridge 105 via a bus or other communication path (e.g., PCI Express, Accelerated Graphics Port, or HyperTransport link); in one embodiment, display processor 112 is a graphics subsystem including at least one graphics processing unit (GPU) and graphics memory. Graphics memory includes display memory (e.g., frame buffer) for storing pixel data for each pixel of an output image. Graphics memory can be integrated with the GPU in the same device, connected to the GPU as a separate device, and / or implemented within system memory 104.

[0022] The display processor 112 periodically delivers the pixels to a display device 110 (e.g., a screen or a conventional CRT, plasma, OLED, SED, or LCD-based monitor or television). In addition, the display processor 112 may output the pixels to a film recorder suitable for reproducing computer-generated images on photographic film. The display processor 112 may provide analog or digital signals to the display device 110. In various embodiments, a graphical user interface is displayed to one or more users via the display device 110, and the one or more users may input data into the graphical user interface and receive visual output from the graphical user interface.

[0023] System disk 114 is also connected to I / O bridge 107 and may be configured to store content, applications, and data for use by CPU 102 and display processor 112. System disk 114 provides non-volatile storage for applications and data and may include a fixed or removable hard disk drive, flash memory devices, and CD-ROM, DVD-ROM, Blu-ray, HD-DVD, or other magnetic, optical, or solid-state storage devices.

[0024] Switch 116 provides connections between I / O bridge 107 and other components such as network adapter 118 and various add-in cards 120 and 121, which allow system 100 to communicate with other systems via an electronic communications network, and may include wired or wireless communications over local area networks and wide area networks such as the Internet.

[0025] Other components (not shown), including USB or other port connections, film recording devices, etc., may also be connected to I / O bridge 107. For example, an audio processor may be used to generate analog or digital audio output based on instructions and / or data provided by CPU 102, system memory 104, or system disk 114. Figure 1 The communication paths interconnecting the various components in the system may be implemented using any suitable protocol, such as PCI (Peripheral Component Interconnect), PCI Express (PCI-E), AGP (Accelerated Graphics Port), HyperTransport, or any other bus or point-to-point communication protocol, and connections between different devices may use different protocols, as is known in the art.

[0026] In one embodiment, display processor 112 is configured as a processing subsystem that includes circuitry optimized for graphics and video processing, including, for example, video output circuitry, and constitutes a graphics processing unit (GPU). In another embodiment, display processor 112 is configured as a processing subsystem that includes circuitry optimized for general processing. In yet another embodiment, display processor 112 may be integrated with one or more other system elements (such as memory bridge 105, CPU 102, and I / O bridge 107) to form a system on chip (SoC). In other additional embodiments, display processor 112 is omitted and software executed by CPU 102 performs the functions of display processor 112.

[0027] Pixel data may be provided directly from CPU 102 to display processor 112. In some embodiments, instructions and / or data representing a scene are provided to a rendering farm or a set of server computers via network adapter 118 or system disk 114, each of which is similar to system 100. The rendering farm uses the provided instructions and / or data to generate one or more rendered images of the scene. These rendered images may be stored in a digital format on a computer-readable medium and optionally returned to system 100 for display. Similarly, the stereoscopic image pairs processed by display processor 112 may be output to other systems for display, stored in system disk 114, or stored in a digital format on a computer-readable medium.

[0028] Alternatively, the CPU 102 provides data and / or instructions defining the desired output images to the display processor 112, and the display processor 112 generates pixel data for one or more output images based on the data and / or instructions defining the desired output images, including characterizing and / or adjusting the offset between the stereo image pairs. The data and / or instructions defining the desired output images may be stored in the system memory 104 or graphics memory within the display processor 112. In an embodiment, the display processor 112 includes 3D rendering capabilities for generating pixel data for output images based on instructions and data defining the geometry, lighting shading, textures, motion, and / or camera parameters of the scene. The display processor 112 may further include one or more programmable execution units capable of executing shader programs, tone mapping programs, etc.

[0029] In addition, in other embodiments, the CPU 102 or the display processor 112 may be replaced or supplemented by any technically feasible processing device configured to process data and execute program code. Such a processing device may be, for example, a central processing unit (CPU), a graphics processing unit (GPU), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), etc. In various embodiments, any operations and / or functions described herein may be performed by the CPU 102, the display processor 112, or one or more other processing devices or any combination of these different processors.

[0030] The CPU 102, render farm and / or display processor 112 may employ any surface or volume rendering technique known in the art to create one or more rendered images based on the provided data and instructions, including rasterization, scanline rendering REYES or micropolygon rendering, ray casting, ray tracing, image-based rendering techniques and / or combinations of these techniques and any other rendering or image processing techniques known in the art.

[0031] In other contemplated embodiments, system 100 may or may not include Figure 1The system memory 104 and / or other memory units or devices in the system 100 may include instructions that, when executed, cause the robot or robotic device represented by the system 100 to perform one or more operations, steps, tasks, etc.

[0032] It should be understood that the system shown herein is illustrative and variations and modifications are possible. The connection topology, including the number and arrangement of bridges, can be modified as needed. For example, in some embodiments, the system memory 104 is directly connected to the CPU 102 instead of through a bridge, and other devices communicate with the system memory 104 through the memory bridge 105 and the CPU 102. In other alternative topologies, the display processor 112 is connected to the I / O bridge 107 or directly to the CPU 102, rather than being connected to the memory bridge 105. In other embodiments, the I / O bridge 107 and the memory bridge 105 can be integrated into a single chip. The specific components shown herein are optional; for example, any number of add-in cards or peripheral devices can be supported. In some embodiments, the switch 116 is eliminated, and the network adapter 118 and the add-in cards 120, 121 are directly connected to the I / O bridge 107.

[0033] Figure 2 is a more detailed illustration of a computer system 100 according to an embodiment. As shown, the computer system 100 includes a chassis 201 (also referred to as a "chassis" or "housing"), on which one or more system cooling fans 202 are mounted, and one or more cooling inlets 203 are formed therein. The cooling fans 202 are configured to draw cooling air into the chassis 201, for example, via the cooling inlets 203, to remove heat generated by various electronic components of the computer system 100. The computer system 100 further includes a power supply 204 mounted within the chassis 201, a plurality of chassis expansion slots 205 typically located on a rear surface of the chassis 201, and a motherboard 206 disposed within the chassis 201.

[0034] The computer system 100 further includes various external connections (omitted for clarity) mounted or disposed on the rear and / or front surfaces of the chassis 201, such as a power connection, a universal serial bus (USB) connection, an audio input jack, an audio output jack, one or more video output connections, and / or other connections. In some embodiments, one or more of such external connections are associated with the motherboard 206 and / or one or more expansion cards such as a card-based processing subsystem 220 coupled to the motherboard 206 and installed in the chassis expansion slots 205.

[0035] exist Figure 2In the illustrated embodiment, the motherboard 206 is configured with a central processing unit (CPU) and one or more card edge connectors, such as a peripheral component interconnect express (PCIe) slot, each of which is positioned to correspond to a different chassis expansion slot 205. For clarity, Figure 2 The CPU and card edge connector of the motherboard 206 are omitted. Typically, the computer system 100 is configured with one or more expansion cards or other card-based processing subsystems, each of which is installed in a different chassis expansion slot 205 and communicatively coupled to the motherboard 206 via a corresponding card edge connector. Examples of such card-based processing subsystems include a card-based processor subsystem 220, such as Figure 1 A wireless adapter, a sound card, a graphics card, a network adapter 118, an add-on card 120, 121 or a display processor 112, etc. Figure 2 In the illustrated embodiment, a single card-based processing subsystem 220 is coupled to the motherboard 206 , but in other embodiments, multiple card-based processing subsystems 220 may be coupled to the motherboard 206 .

[0036] In some embodiments, the computer system 100 further includes one or more peripheral devices (not shown) that are communicatively coupled to the motherboard 206 and / or to specific expansion cards coupled to the motherboard 206. For example, in some embodiments, the computer system 100 includes one or more of a keyboard, a mouse, a joystick, a digitizing tablet, a touch pad, a touch screen, a display device, an external hard drive, a still or video camera, a motion sensor, a microphone, etc.

[0037] exist Figure 2 In the illustrated embodiment, computer system 100 is described as a desktop computer system in a tower configuration. In other embodiments, computer system 100 may have any configuration that may include a card-based processing subsystem, such as a tower server computer system, a blade server computer system, a rack server computer system, a laptop computer, etc.

[0038] Card-based processing subsystem

[0039] Figure 3 is a more detailed illustration of the card-based processing subsystem 220 according to various embodiments. Specifically, Figure 3 is a side view of a card-based processing subsystem 220 that includes a printed circuit board (PCB) 310 coupled to a backplane bracket 320 .

[0040] PCB 310 is configured to communicatively couple card-based processing subsystem 220 to a card edge connector, such as a PCIe slot included on motherboard 206 of computer system 100. To this end, PCB 310 includes a plurality of edge connectors (not shown) formed on an edge of PCB 310.

[0041] The backplane bracket 320 couples the card-based processing subsystem 220 to the surface of the chassis of the computing device. Figure 3 In the illustrated embodiment, the backplane support 320 and the card-based processing subsystem 220 are configured to have a single chassis expansion slot 205 (eg, Figure 2 321 of the backplane bracket 320 is approximately 20 mm. In other embodiments, the card-based processing subsystem 220 can be configured to occupy a space close to the motherboard 206 (such as Figure 2 205, the backplane bracket 320 may have a width of approximately 40 mm, 60 mm, or 80 mm, respectively. In some embodiments, the card-based processing subsystem 220 also includes a housing that contains most or all of the components of the card-based processor subsystem 220. For clarity, the backplane bracket 320 may have a width of approximately 40 mm, 60 mm, or 80 mm, respectively. Figure 3 Only the outline 301 (dashed line) of such a housing is depicted.

[0042] The card-based computing processing subsystem 220 further includes a processor 331, one or more memory chips 332, a chipset 333 of one or more integrated circuits, and a plurality of power supply components 340. In an embodiment where the card-based processing subsystem 220 is configured as a graphics card, the processor 331 is a graphics processing unit (GPU), and some or all of the memory chips 332 are graphics memory chips associated with the GPU. Therefore, the memory chips 332 are mounted as close to the processor 331 as possible to reduce signal delays and improve the signal-to-interference ratio (S / I) of the PCB 310.

[0043] The power supply assembly 340 includes electronic devices mounted on the PCB, and the electronic devices provide appropriate power supply voltage and current for the processor 331, the memory chip 332, and the chipset 333. For example, in some embodiments, the power supply assembly 340 includes one or more capacitors, inductors, voltage controllers, and / or power switching devices coupled to the primary side 311 of the PCB 310 or the secondary side 312 of the PCB 310. Figure 3In the illustrated embodiment, the power supply assembly 340 includes a capacitor 344, an inductor 345, and a power switch device 346 (such as a field effect transistor and / or a metal oxide semiconductor field effect transistor) mounted on the primary side 311 of the PCB 310, and a capacitor 341, an inductor 342, and a power switch device 343 mounted on the secondary side 312 of the PCB 310. In some embodiments, the power supply assembly 340 includes some or all elements of a voltage regulator module or VRM that performs direct current (DC) to DC conversion to various operating voltages associated with the processor 331, the memory chip 332, and / or the chipset 333. Thus, in such embodiments, some or all of the power supply assembly 340 provides a constant DC output voltage and required current to the processor 331, the memory chip 332, and / or the chipset 333. For example, in some embodiments, power assembly 340 provides such voltages and currents to processor 331, memory chip 332, and / or chipset 333 through a power distribution network (not shown) formed as part of PCB 310. In such embodiments, the power distribution network typically includes conductive interconnects such as metal traces, plated through holes, and power and ground planes formed on a surface of PCB 310 and within layers of PCB 310.

[0044] According to various embodiments, at least one secondary side group 350 of the power supply assembly 340 is mounted on the secondary side 312 of the PCB 310, while the processor 331, one or more memory chips 332, and one or more integrated circuits 333 are mounted on the primary side 311 of the PCB 310. In some embodiments, at least one primary side group 360 of the power supply assembly 340 is also mounted on the primary side 311 of the PCB 310. Figure 3 In the illustrated embodiment, the secondary side group 350 of the power component 340 includes a capacitor 341 , an inductor 342 , and a power switch device 343 , and the primary side group 360 of the power component 340 includes a capacitor 344 , an inductor 345 , and a power switch device 346 .

[0045] As shown, the two secondary side groups 350 of the power supply assembly 340 are mounted on a different side of the PCB 310 from the processor 331, one or more memory chips 332, the integrated circuit 333, and the two primary side groups 360 of the power supply assembly 340. It is worth noting that in a conventional card-based processing subsystem, all power supply assemblies and most or all load devices of the card-based processing subsystem (such as processors, memory chips, and integrated circuits of chipsets) are mounted on the primary side of the PCB. In contrast, according to various embodiments, the two secondary side groups 350 of the power supply assembly 340 are mounted on the secondary side 312. As shown, the two secondary side groups 350 of the power supply assembly 340 are arranged together with the primary side group 360 of the power supply assembly 340 closer to the load devices (such as processors 331, memory chips 332, and / or integrated circuits 333) of the card-based processing subsystem 220 than when mounted on the primary side 311 of the PCB 310. Therefore, in the power distribution network of the card-based processing subsystem 220, the current path between the power components 340 of the secondary side group 350 and the load devices in the card-based processor subsystem 220 is shorter. Therefore, the power distribution network of the card-based processing subsystem 220 consumes less power, generates less additional heat, and operates at a reduced S / I.

[0046] exist Figure 3In the illustrated embodiment, certain power components 340 of the secondary side group 350 are aligned in a “mirror” configuration with similar power components 340 of the primary side group 360. For example, some or all of the capacitors 341 in the secondary side group 350 are aligned with corresponding capacitors 344 in the primary side group 360, some or all of the inductors 342 in the secondary side group 350 are aligned with corresponding inductors 345 in the primary side group 360, and / or some or all of the power switch devices 343 in the secondary side group 350 are aligned with corresponding power switch devices 346 in the primary side group 360. In such an embodiment, capacitor 341 and capacitor 344 may each be electrically coupled to the same element of the power distribution network of the card-based computing processing subsystem 220, inductor 342 and inductor 345 may each be electrically coupled to the same element of the power distribution network of the card-based computing processing subsystem 220, and / or power switch device 343 and power switch device 346 may each be electrically coupled to the same element of the power distribution network of the card-based computing processing subsystem 220. In such an embodiment, the element of the power distribution network may be a specific power plane formed within PCB 310, a specific ground plane within PCB 310, a through hole formed through PCB 310, etc. Therefore, in such an embodiment, the manufacture of PCB 310 may be simplified, the current path between power supply component 340 and the load device of card-based processing subsystem 220 may be shortened, and the S / I in card-based processing subsystem 220 may be improved.

[0047] exist Figure 3 In the illustrated embodiment, the stacked configuration of the secondary side group 350 and the primary side group 360 of the power assembly 340 enables the length 313 of the PCB 310 to be less than the length of a conventional PCB on which the secondary side group 350 and the primary side group 360 of the power assembly 340 are mounted. For reference, a conventional PCB 390 (dashed line) is shown, with all power assemblies and load devices of the conventional PCB 390 mounted on a single side thereof. As shown, the length 393 of the conventional PCB 390 significantly exceeds the length 313 of the PCB 310. Because the PCB 310 is shorter than the PCB of a conventional card-based processing subsystem, the card-based processing subsystem 220 can include an enhanced thermal solution in an area not occupied by a full-length PCB. An embodiment of such an enhanced thermal solution is described below.

[0048] Card-based processing subsystem with enhanced thermal solution

[0049] In a card-based processing subsystem, integrated circuits, power components, and power distribution networks generate a lot of heat during operation. In order for the integrated circuits and processing subsystems to operate efficiently, this heat needs to be removed from the computing device. For example, a single high-power chip (such as a CPU or GPU) can generate hundreds of watts of heat during operation. If this heat is not removed from the computing device, the temperature of the chip may rise to a point where the chip may be permanently damaged. In order to prevent thermal damage during operation, in addition to implementing traditional cooling systems, many computing devices also implement clock-speed throttling when the operating temperature of the processor exceeds a certain threshold. Therefore, in these computing devices, the processing speed of the high-power chip is limited by the effectiveness of removing heat from the chip.

[0050] For many card-based processing subsystems, such as graphics cards with high-power chips or GPUs, the size limitations of the card-based processor subsystem may hinder the efficient removal of heat generated by the chip. For example, in order to prevent a graphics card installed in one of the Peripheral Component Interconnect Express (PCIe) slots located on the motherboard of a computing device from blocking most or all of the remaining PCIe slots located on the motherboard, the thickness of the graphics card is typically limited to the width of one, two, or occasionally up to three case expansion slots of the computer chassis. That is, all components of the graphics card, including the PCB on which the GPU is mounted and various components of the thermal solution, are arranged within an assembly with a thickness limit of 20 mm, 40 mm, or 60 mm. According to various embodiments, the stacked configuration of the power components in the card-based processing subsystem and the shortened PCB of the card-based processing subsystem enable an enhanced thermal solution to be included in the card-based processing subsystem. The following is in conjunction with Figure 4 Embodiments of such enhanced thermal solutions are described.

[0051] Figure 4 is a more detailed illustration of a card-based processing subsystem 420 according to various other embodiments. The card-based processing subsystem 420 is similar to Figure 2 The card-based processing subsystem 220 further includes an enhanced thermal solution 400. Figure 4In the illustrated embodiment, the enhanced thermal solution 400 includes a first thermal solution 410, a second thermal solution 430, and a cooling fan 440. As shown, the first thermal solution 410 is mounted on and thermally coupled to the primary side 311 of the PCB 310, and the second thermal solution 430 is mounted on and thermally coupled to the secondary side 312 of the PCB 310. In some embodiments, the first thermal solution 410 is oriented substantially parallel to the PCB 310 and extends through the PCB 310. Alternatively or additionally, in some embodiments, the second thermal solution 430 is oriented substantially parallel to the PCB 310 and extends through the PCB 310.

[0052] In some embodiments, the first thermal solution 410 includes a heat transfer plate 411 and a heat transfer device 412. In some embodiments, the heat transfer plate 411 (cross-hatched) is a reinforcing member that provides structural rigidity to the card-based processing subsystem 420. In addition, in some embodiments, the heat transfer plate 411 is configured to contact one or more power supply components 340 so that the heat generated by the power supply components 340 can be distributed over a large heat distribution surface of the heat transfer plate 411. In such an embodiment, the heat distribution surface contacts the surface of the heat transfer device 412 so that the heat absorbed by the heat transfer plate 411 is transferred to the heat transfer device 412. The heat transfer device 412 can be any technically feasible device for transferring heat from the card-based processing subsystem 420, for example, via a cooling fan 440. For example, in some embodiments, the heat transfer device 412 includes one or more of a vapor chamber, a heat pipe, a cold plate, or a heat sink with heat sink fins.

[0053] In some embodiments, second thermal solution 430 includes heat transfer plate 431 and heat transfer device 432. In some embodiments, heat transfer plate 431 (cross-hatched) is similar in configuration and operation to heat transfer plate 411, and heat transfer device 432 is similar in configuration and operation to heat transfer device 412.

[0054] The cooling fan 440 forces cooling air through or across the heat transfer device 412 and the heat transfer device 432. Figure 4 In the illustrated embodiment, the cooling fan 440 is disposed in an area of ​​the card-based processing subsystem 420 that does not include the PCB 310. That is, since the PCB 310 can be shortened, there is more room for the cooling fan 440 within the card-based processing subsystem 420. As a result, a greater airflow can be achieved with the cooling fan 440, which improves heat transfer from the card-based processing subsystem 420. In addition, Figure 4In the illustrated embodiment, cooling fan 440 is oriented to force cooling air over or through heat transfer device 412 and heat transfer device 432. In other embodiments, heat transfer device 412 and heat transfer device 432 may each include one or more cooling fans (not shown).

[0055] exist Figure 4 In the illustrated embodiment, the card-based processing subsystem 420 is configured with a width 421 corresponding to two chassis expansion slots of the motherboard. In other embodiments, the card-based processing subsystem may have a width corresponding to three additional chassis expansion slots. FIG. 5A to FIG. 5C These embodiments are described.

[0056] Positioning of card-based processing subsystems in computing devices

[0057] Figure 5A is an illustration of a portion of a motherboard 505 that may receive a card-based processing subsystem according to various embodiments. Motherboard 505 may be provided, for example, Figure 1 and Figure 2 As shown, the motherboard 505 includes a plurality of expansion card slots 501-504, such as PCIe slots, which are arranged near a panel 506 of the computer system chassis. Typically, the expansion card slots 501-504 are separated by a distance 507, which limits the width of the card-based processing subsystem installed on the motherboard 505.

[0058] Figure 5B 5 is an illustration of a portion of a motherboard 505 having a card-based processing subsystem 520 mounted thereon in accordance with various embodiments. As shown, the card-based processing subsystem 520 has a width 521 sufficient to prevent use of an adjacent PCIe slot. For example, the card-based processing subsystem 520 may include a first thermal solution 522 on a first side of a PCB (not shown) and a second thermal solution 523 on a second side of the PCB, such that the card-based processing subsystem 520 extends a substantial distance from the PCB in both directions. Thus, in Figure 5B In the illustrated embodiment, the card-based processing subsystem 520 is installed in PCIe slot 503, but also blocks PCIe slot 502. However, PCIe slot 501 and PCIe slot 504 are still available for installing other card-based processing subsystems. Figure 5B In the illustrated embodiment, the card-based processing subsystem 520 utilizes space adjacent to the motherboard 505 to implement one or more enhanced thermal solutions that can significantly improve heat transfer from the card-based processor subsystem 520 power components and load devices.

[0059] Figure 5Cis an illustration of a portion of a motherboard 505 having a card-based processing subsystem 540 mounted thereon in accordance with various embodiments. As shown, the width 541 of the card-based processing subsystem 540 is sufficient to prevent the use of one adjacent PCIe slot on one side and the use of two PCIe slots on the other side. For example, the card-based processing subsystem 540 may include a first thermal solution 543 located on a first side of a PCB (not shown) that causes the card-based processor subsystem 540 to block PCIe slot 504, and a second, larger thermal solution 542 located on a second side of the PCB that causes the card-based processor subsystem 540 to block PCIe slot 501 and PCIe slot 502. Thus, in Figure 5C In the illustrated embodiment, the card-based processing subsystem 540 is installed in the PCIe slot 503 and utilizes the space near the motherboard 505 for one or more enhanced thermal solutions. The one or more enhanced thermal solutions can significantly improve the heat transfer from the power components and load devices of the card-based processing subsystem 540.

[0060] Card-based processing subsystem formed with multiple PCBs

[0061] In some embodiments, the card-based processing subsystem includes a stacked configuration of power components, the stacked configuration including multiple PCBs. In such an embodiment, the load device of the card-based processing subsystem is mounted on a first PCB, and some or all of the power components of the card-based processing subsystem are mounted on a second PCB. Figure 6 One such embodiment is described.

[0062] Figure 6 is a more detailed illustration of a card-based processing subsystem 620 according to various other embodiments. Specifically, Figure 6 2 is a side view of a card-based processing subsystem 220, which includes a first PCB 610 coupled to a backplane bracket 320 and a second PCB 630 coupled to and / or mounted on the first PCB 610. For example, in some embodiments, the second PCB 630 is communicatively coupled to the first PCB 610 via a plurality of solder balls 631, pin connections (not shown), or other conductive connectors. Figure 6In the illustrated embodiment, the power supply assembly 340 is mounted on the second PCB 630, while the load devices (such as the processor 331, the memory chip 332, and / or the integrated circuit 333) of the card-based processing subsystem 620 are mounted on the first PCB 610. Therefore, the power supply assembly 340 is coupled to the first PCB 610 via the second PCB 630. Therefore, the PCB 610 is much shorter than the PCB of the conventional card-based processing subsystem, and the power distribution network of the card-based processing subsystem 620 includes a shorter current path.

[0063] exist Figure 6 In the illustrated embodiment, the first PCB 610 generally carries high-speed signals between the processor 331, the memory chip 332, and / or the integrated circuit 333. In contrast, the second PCB 630 generally does not carry high-speed signals. This is because there are no integrated circuits or load devices that transmit or receive high-speed signals mounted on the second PCB 630, and there is no need to route these signals through the second PCB 630. Figure 6 In the illustrated embodiment, only the power supply assembly 340 is mounted on the second PCB 630. In such an embodiment, the second PCB 630 can be formed of a different material than the first PCB 610. For example, to reduce conduction and dielectric losses associated with high-speed signals, the first PCB 610 can include a medium-loss or low-loss laminate material compared to the laminate material included in the second PCB 630. As a result, the PCB 630 can be formed of a significantly lower cost PCB material than the first PCB 610. Examples of medium-loss or low-loss laminate materials suitable for the first PCB 610 include: IT150-GS, EM528K, NPG-170D.

[0064] In summary, various embodiments shown and provided herein describe techniques for incorporating power supply components in a card-based processing subsystem, such as a graphics card. Specifically, in an embodiment, the power supply components of the card-based processing subsystem are arranged in a stacked configuration, wherein the processor, memory, and other load devices of the card-based processing subsystem are mounted on one side of a PCB, and at least a portion of the power supply devices of the card-based processing subsystem are coupled to the opposite side of the PCB. In some embodiments, some or all of the power supply devices are mounted on a second PCB, which is coupled to the PCB on which the load devices are mounted.

[0065] At least one technical advantage of the disclosed design over the prior art is that the disclosed design enables the power supply assembly of the card-based processing subsystem to be positioned closer to the microprocessor, memory, and other elements of the chipset of the processing subsystem. The relative current path between the power supply assembly and the microprocessor, memory, and other elements of the chipset is shorter, which improves the overall efficiency of the power distribution network of the card-based processing subsystem, consumes less overall power, generates less overall heat, and improves the overall signal-to-interference ratio of the processing subsystem. In addition, the size of the printed circuit board of the card-based processing subsystem can be reduced, which reduces the size, cost, and complexity of the processing subsystem, and helps to include a more efficient thermal solution in the card-based processing subsystem. These technical advantages provide one or more technical advances over prior art methods.

[0066] 1. In some embodiments, a processing subsystem comprises: a first printed circuit board (PCB); a processor, the processor being directly mounted on a first side of the first PCB; and one or more power supply components, the one or more power supply components being coupled to a second side of the first PCB and electrically coupled to the processor; wherein the first side of the first PCB is opposite to the second side of the first PCB.

[0067] 2. The processing subsystem of clause 1, further comprising a first thermal solution coupled to the processor and a second thermal solution coupled to the one or more power components.

[0068] 3. The processing subsystem of clause 1 or 2, further comprising a cooling fan oriented to blow cooling air through the first thermal solution and the second thermal solution.

[0069] 4. The processing subsystem of any of clauses 1-3, wherein the first thermal solution comprises at least one of a cold plate, a heat sink, a cooling fan, a heat pipe, or a vapor chamber.

[0070] 5. The processing subsystem of any of clauses 1-4, wherein the first thermal solution is oriented parallel to and extends through the first PCB.

[0071] 6. The processing subsystem of any of clauses 1-5, further comprising one or more other power components mounted directly on the first side of the first PCB.

[0072] 7. The processing subsystem of any of clauses 1-6, wherein the one or more power components are mounted directly on the second side of the first PCB and arranged on the second side of the first PCB to mirror the one or more other power components.

[0073] 8. A processing subsystem according to any one of clauses 1-7, wherein a first power supply component included in the one or more power supply components is aligned with a second power supply component included in the one or more other power supply components, and each of the first power supply component and the second power supply component is electrically coupled to a first power plane or a first ground plane.

[0074] 9. A processing subsystem according to any one of clauses 1-8, wherein a first power supply component included in the one or more power supply components is aligned with a second power supply component included in the one or more other power supply components, and each of the first power supply component and the second power supply component is electrically coupled to a first through hole formed through the first PCB.

[0075] 10. The processing subsystem of any of clauses 1-9, wherein the one or more power supply components are mounted directly on the second side of the first PCB.

[0076] 11. The processing subsystem of any of clauses 1-10, wherein the one or more power supply components include at least one of a capacitor, an inductor, a voltage controller, or a power switching device.

[0077] 12. The processing subsystem of any of clauses 1-11, further comprising a second PCB coupled to the first PCB, wherein the one or more power components are mounted directly on a first side of the second PCB.

[0078] 13. The processing subsystem of any of clauses 1-12, wherein the second side of the second PCB is directly attached to the first side of the first PCB.

[0079] 14. In some embodiments, a computer system includes: a chassis; a power supply, which is disposed in the chassis; a motherboard, which is disposed in the chassis and electrically coupled to the power supply; and a processing subsystem, which is disposed in the chassis and communicatively coupled to the motherboard, the processing subsystem including: a first printed circuit board (PCB); a processor, which is directly mounted on a first side of the first PCB; and one or more power supply components, which are coupled to a second side of the first PCB and electrically coupled to the processor; wherein the first side of the first PCB is opposite to the second side of the first PCB.

[0080] 15. The computer subsystem of clause 14, further comprising a first thermal solution coupled to the processor and a second thermal solution coupled to the one or more power components.

[0081] 16. The computer subsystem of clause 14 or 15, further comprising a cooling fan oriented to blow cooling air through the first thermal solution and the second thermal solution.

[0082] 17. The computer subsystem of any of clauses 14-16, wherein the first thermal solution comprises at least one of a cold plate, a heat sink, a cooling fan, a heat pipe, or a vapor chamber.

[0083] 18. The computer subsystem of any of clauses 14-17, wherein the first thermal solution is oriented parallel to and extends through the first PCB.

[0084] 19. The computer subsystem of any of clauses 14-18, further comprising one or more other power components mounted directly on the first side of the first PCB.

[0085] 20. A computer subsystem as described in any of clauses 14-19, wherein the one or more power supply components are directly mounted on the second side of the first PCB and arranged on the second side of the first PCB to mirror the one or more other power supply components.

[0086] Any and all combinations of any claim elements recited in any claim and / or any elements described in this application, in any manner, are within the intended scope of the invention and protection.

[0087] The description of the various embodiments is presented for purposes of illustration, but is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.

[0088] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope of the present disclosure is determined by the claims that follow.

Claims

1. A processing subsystem, comprising: a first printed circuit board (PCB); a processor mounted directly on the first side of the first PCB; as well as one or more power components coupled to the second side of the first PCB and electrically coupled to the processor; The first side of the first PCB is opposite to the second side of the first PCB.

2. The processing subsystem of claim 1, further comprising a first thermal solution coupled to the processor and a second thermal solution coupled to the one or more power components.

3. The processing subsystem of claim 2, further comprising a cooling fan oriented to blow cooling air through the first thermal solution and the second thermal solution.

4. The processing subsystem of claim 2, wherein the first thermal solution comprises at least one of a cold plate, a heat sink, a cooling fan, a heat pipe, or a vapor chamber.

5. The processing subsystem of claim 1, wherein the first thermal solution is oriented parallel to and extends through the first PCB.

6. The processing subsystem of claim 1, further comprising one or more other power components mounted directly on the first side of the first PCB.

7. The processing subsystem of claim 6, wherein the one or more power components are mounted directly on the second side of the first PCB and arranged on the second side of the first PCB to mirror the one or more other power components.

8. A processing subsystem as described in claim 6, wherein a first power supply component included in the one or more power supply components is aligned with a second power supply component included in the one or more other power supply components, and each of the first power supply component and the second power supply component is electrically coupled to a first power plane or a first ground plane.

9. A processing subsystem as described in claim 6, wherein a first power supply component included in the one or more power supply components is aligned with a second power supply component included in the one or more other power supply components, and each of the first power supply component and the second power supply component is electrically coupled to a first through hole formed through the first PCB.

10. The processing subsystem of claim 1, wherein the one or more power components are mounted directly on the second side of the first PCB.

11. The processing subsystem of claim 1, wherein the one or more power supply components include at least one of a capacitor, an inductor, a voltage controller, or a power switching device.

12. The processing subsystem of claim 1, further comprising a second PCB coupled to the first PCB, wherein the one or more power components are mounted directly on the first side of the second PCB.

13. The processing subsystem of claim 1, wherein the second side of the second PCB is directly attached to the first side of the first PCB.

14. A computer system comprising: Chassis; A power supply, the power supply being arranged in the chassis; a mainboard, the mainboard being disposed within the chassis and electrically coupled to the power supply; as well as A processing subsystem, the processing subsystem being disposed within the chassis and communicatively coupled to the mainboard, the processing subsystem comprising: a first printed circuit board (PCB); a processor mounted directly on the first side of the first PCB; and one or more power components coupled to the second side of the first PCB and electrically coupled to the processor; The first side of the first PCB is opposite to the second side of the first PCB.

15. The computer subsystem of claim 1, further comprising a first thermal solution coupled to the processor and a second thermal solution coupled to the one or more power components.

16. The computer subsystem of claim 15, further comprising a cooling fan oriented to blow cooling air across the first thermal solution and the second thermal solution.

17. The computer subsystem of claim 15, wherein the first thermal solution comprises at least one of a cold plate, a heat sink, a cooling fan, a heat pipe, or a vapor chamber.

18. The computer subsystem of claim 1, wherein the first thermal solution is oriented parallel to and extends through the first PCB.

19. The computer subsystem of claim 1, further comprising one or more other power components mounted directly on the first side of the first PCB.

20. The computer subsystem of claim 18, wherein the one or more power components are mounted directly on the second side of the first PCB and arranged on the second side of the first PCB to mirror the one or more other power components.

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