Keyboard device

By using circuit layers stacked under the substrate in the keyboard device, combining the design of pressure sensing parts and elastic reset parts, the problems of increased thickness and high manufacturing costs of existing keyboard devices are solved, and a thinner and economical design is achieved.

CN119650340APending Publication Date: 2025-03-18CHICONY ELECTRONICS CO LTD
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Patent Information

Application Number
CN202311192199.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-09-15
Publication Date
2025-03-18

AI Technical Summary

Technical Problem

Due to the stacking structure of the multi-layer trigger circuit board, the existing keyboard device increases the thickness of the keyboard, and holes need to be set up to connect other components, which affects the development trend of lightweighting and manufacturing costs.

Method used

The structure of a substrate, a circuit layer, a pressure sensing element and a key assembly is adopted. The circuit layer is stacked below the substrate, and the pressure sensing element is arranged on the surface of the circuit layer. The key assembly includes a key cap and an elastic reset member. Through the cooperation of the elastic reset member and the pressure sensing member, press sensing is achieved, avoiding the use of traditional multi-layer trigger circuit boards.

Benefits of technology

Reduces the overall thickness of the keyboard device, reduces manufacturing costs, and improves the convenience of replacement and repair of circuit layers.

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Abstract

A keyboard device comprises a substrate, a circuit layer, a pressure sensing piece and a key assembly. The substrate is provided with a top surface and a bottom surface, the top surface is provided with an assembling area, the assembling area is provided with a through hole, and the through hole penetrates through the top surface and the bottom surface. The circuit layer is stacked below the bottom surface, and the surface of the circuit layer is provided with a conductive circuit. The pressure sensing member is located between the bottom surface and the circuit layer, the pressure sensing member is connected to the conductive circuit, and the position of the pressure sensing member corresponds to the through hole. The key assembly is arranged above the assembly area, the key assembly comprises a key cap and an elastic reset piece, the elastic reset piece is located between the key cap and the substrate, the elastic reset piece is provided with a top and a bottom, the top is in contact with the key cap, and the bottom corresponds to the pressure sensing piece.
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