Nozzle and method for wafer metal stripping process

Abstract

The invention provides a nozzle for a wafer metal stripping process. The nozzle comprises a nozzle nut; the spray head support is connected with the spray nozzle nut, and an axial hole is formed in the spray head support in the axial direction; the nut is arranged in the axial hole, and sapphire is arranged at the top end of the nut. Burrs and stubborn metal on the periphery of metal can be effectively removed, the air tightness is good, and the service life of the nozzle can be guaranteed while the yield is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a nozzle and a method for a wafer metal stripping process. Background Art

[0002] The patterned photoresist structure or metal mask (shadow mask) is obtained on the substrate by photolithography, the target coating is plated on the mask by coating, and then the photoresist is dissolved by degumming liquid (also known as stripping liquid) or the metal hard mask is mechanically removed to obtain the target graphic structure consistent with the pattern. We call this the lift-off process. Compared with other graphic transfer methods, the lift-off process is simpler and easier to operate. However, burrs are easily generated in the lift-off process.

[0003] The burr phenomenon occurs because during the deposition process, the side walls of the photoresist are covered by a metal film, so the stripping process can only strip the metal above the photoresist. The metal on the side walls cannot be stripped due to the unconcentrated fan-shaped spray pressure of the current stripping process, resulting in a burr-like structure and resulting in yield loss. Summary of the invention

[0004] In view of this, the present invention provides a nozzle and a method for a metal stripping process to solve the problem that metal burrs cannot be removed in the prior art.

[0005] The present invention provides the following technical solution: a nozzle for a wafer metal stripping process, comprising: a nozzle nut; a nozzle bracket connected to the nozzle nut, the nozzle bracket being provided with an axial hole along the axial direction; a nut being arranged in the axial hole, a sapphire being arranged at the top of the nut.

[0006] Furthermore, the nut is provided with an axial spray hole, the sapphire is provided with a spray hole, and the axial spray hole is coaxial with and connected to the spray hole.

[0007] Furthermore, the diameter of the spray hole ranges from 0.1 to 0.2 mm.

[0008] Furthermore, the sapphire is sealed and connected to the top of the nut via a high temperature resistant organic solvent.

[0009] Furthermore, the axial hole includes an internal thread section, and the outer periphery of the nut is provided with an external thread matching with the internal thread section, and when in the installation position, the nut is matched and connected with the internal thread section.

[0010] Furthermore, the axial hole also includes a stepped light hole section, which includes a large diameter section and a small diameter section, the large diameter section is connected to the internal thread section, and the small diameter section is placed on top of the large diameter section.

[0011] Furthermore, the nozzle used in the wafer metal stripping process also includes a sealing gasket, which is arranged in the large diameter section and abuts against the sapphire.

[0012] Furthermore, the nozzle used for the wafer metal stripping process also includes: a pressure cap, which is threadedly connected to the nozzle bracket and is used to press the nut against the nozzle bracket; a gasket, which is arranged in the nozzle nut and is used to connect with the spray port.

[0013] The present invention also provides a method for wafer metal stripping process, which is carried out using the above-mentioned nozzle for wafer metal stripping process.

[0014] Furthermore, the process method for wafer metal stripping includes:

[0015] Step 1: Soak the wafer;

[0016] Step 2: Pressurize the NMP solution to 400-3000 psi and adjust the temperature of the NMP solution to 60-90°C;

[0017] Step 3: Spray the wafer in a fan shape with the NMP solution prepared in step 2;

[0018] Step 4: After the fan-shaped spraying is completed, needle-shaped spraying is performed through the nozzle used for the wafer metal stripping process, and each point required for spraying is covered by rotating the spray arm.

[0019] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above-mentioned technical solutions adopted by the present invention include at least: the present invention can effectively remove metal peripheral burrs and stubborn metals, has good air tightness, and can ensure the life of the nozzle while improving the yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 is a schematic diagram of an exploded structure of an embodiment of the present invention;

[0022] Figure 2 is a schematic diagram of the overall assembly of an embodiment of the present invention;

[0023] Figure 3 yes Figure 2 Middle AA section view;

[0024] Figure 4 It is a flowchart of an embodiment of the present invention.

[0025] Reference numerals in the figure: 1. nozzle nut; 2. nozzle bracket; 3. nut; 4. sealing gasket; 5. pressure cover; 6. gasket. DETAILED DESCRIPTION

[0026] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0027] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0028] like Figures 1 to 3 As shown, an embodiment of the present invention provides a nozzle for a wafer metal stripping process, comprising a nozzle nut 1, a nozzle bracket 2 and a nut 3. The nozzle bracket 2 is connected to the nozzle nut 1, and the nozzle bracket 2 is provided with an axial hole along the axial direction; the nut 3 is arranged in the axial hole, and a sapphire is arranged on the top of the nut 3.

[0029] The invention can effectively remove metal peripheral burrs and stubborn metal, has good air tightness, and can ensure the life of the nozzle while improving the yield.

[0030] The nut 3 is provided with an axial spray hole, and the sapphire is provided with a spray hole, and the axial spray hole is coaxial with and connected to the spray hole. This structural design enables the liquid medicine to be sprayed in an axial straight line to form a precise needle-shaped spray, which effectively improves the accuracy and efficiency of the wafer metal stripping process, helps to remove metal burrs and reduce yield loss.

[0031] Preferably, the diameter of the spray hole is in the range of 0.1-0.2 mm.

[0032] In the embodiment of the present invention, the sapphire is sealed and connected to the top of the nut 3 by a high temperature resistant organic solvent (glue). However, organic solvents that react with NMP solution (N-methylpyrrolidone) should be avoided.

[0033] The axial hole includes an internal thread section, and the outer periphery of the nut 3 is provided with an external thread that matches the internal thread section, and when in the installation position, the nut 3 is matched and connected with the internal thread section. This thread matching design enables the nut 3 to be accurately connected with the internal thread section during installation, ensuring the structural stability and sealing of the nozzle assembly, thereby providing accurate and reliable spray control in the wafer metal stripping process, and enhancing the durability of the nozzle and the convenience of operation.

[0034] It should be noted that when the nut 3 is installed on the nozzle bracket 2, the sapphire should face upward to prevent the sapphire from being sprayed off the nut 3 by high pressure.

[0035] The axial hole also includes a stepped light hole section, which includes a large diameter section and a small diameter section, the large diameter section is connected to the internal thread section, and the small diameter section is placed on top of the large diameter section. The nozzle used for the wafer metal stripping process also includes a sealing gasket 4, which is arranged in the large diameter section and abuts against the sapphire.

[0036] The stepped light hole structure can realize the rapid loading and positioning of the sealing gasket 4, thereby ensuring the structural strength of the overall device. The sealing gasket 4 is arranged in the large diameter section and contacts the sapphire to ensure the airtightness of the nozzle under the high-pressure working environment, prevent gas from mixing and affecting the spraying effect, thereby providing more accurate and efficient spraying in the wafer metal stripping process, helping to improve the stripping quality and reduce the generation of burrs.

[0037] The sealing gasket may be made of PFA.

[0038] The nozzle for wafer metal stripping process also includes a pressure cap 5 and a gasket 6. The pressure cap 5 is threadedly connected to the nozzle bracket 2 and is used to press the nut 3 against the nozzle bracket 2; the gasket 6 is arranged in the nozzle nut 1 and is used to connect with the spray port.

[0039] The gland 5 is connected to the nozzle bracket 2 by threads, and its main function is to fasten the nut 3 to the nozzle bracket 2 to ensure the stability and sealing of the entire nozzle structure. This threaded connection method not only provides a firm fixation, but also can maintain the integrity of the nozzle in a high-pressure working environment, prevent liquid leakage, and thus ensure the continuity and reliability of the stripping process.

[0040] The gasket 6 is set in the nozzle nut 1, and its function is to form a sealed connection with the spray port, further enhancing the sealing performance of the nozzle. The presence of the gasket 6 ensures the accuracy and uniformity of the liquid medicine when spraying under high pressure, and avoids side leakage during the liquid medicine spraying process, which is crucial to improving the efficiency and yield of the wafer metal stripping process. Through the synergistic effect of these two components, the nozzle can provide a more stable and precise spraying effect during the metal stripping process, effectively improving the performance of the entire process.

[0041] In the embodiment of the present invention, the nut 3 uses NPT threads to increase the sealing performance, and the gland 5 can use general threads. The nozzle thread of the nozzle nut 1 is NPT, and the nozzle nut 1 and the nozzle bracket 2 can be processed separately or integrated.

[0042] The diameter of the bottom channel of the thread of the gland 5 must be at least 4 mm smaller than the diameter of the bottom channel of the nut 3; the outer diameter of the gasket 6 is at least 5 mm smaller than the inner thread of the nut 3, and the inner diameter of the gasket 6 is larger than the diameter of the spray port.

[0043] like Figure 4As shown, the present invention also provides a method for wafer metal stripping process, which is performed using the nozzle for wafer metal stripping process, and the method for wafer metal stripping process includes:

[0044] Step 1: Soak the wafer;

[0045] Step 2: Pressurize the NMP solution to 400-3000 psi and adjust the temperature of the NMP solution to 60-90°C;

[0046] Step 3: Spray the wafer in a fan shape with the NMP solution prepared in step 2;

[0047] Step 4: After the fan-shaped spraying is completed, needle-shaped spraying is performed through the nozzle used for the wafer metal stripping process, and each point required for spraying is covered by the rotation operation of the spray arm to remove the metal burrs.

[0048] The present invention can significantly improve the yield and efficiency of the wafer metal stripping process, and through precise control and optimization of the entire process, the stripping process is made more reliable, and wafer damage caused by incomplete or excessive stripping is reduced.

[0049] The above is only a specific embodiment of the present invention, and cannot be used to limit the scope of the invention. Therefore, the replacement of equivalent components, or equivalent changes and modifications made according to the scope of protection of the patent of the present invention, should still fall within the scope of this patent. In addition, the technical features of the present invention can be freely combined with each other, with each other, and with each other.

Claims

1. A nozzle for a wafer metal stripping process, characterized in that: include: Nozzle nut (1); A nozzle bracket (2) is connected to the nozzle nut (1), and an axial hole is arranged along the axial direction of the nozzle bracket (2); A nut (3) is arranged in the axial hole, and a sapphire is arranged on the top of the nut (3).

2. The nozzle for wafer metal stripping process according to claim 1, characterized in that: The nut (3) is provided with an axial spray hole, the sapphire is provided with a spray hole, and the axial spray hole is coaxial with and connected to the spray hole.

3. The nozzle for wafer metal stripping process according to claim 2, characterized in that: The diameter of the spray hole is in the range of 0.1-0.2 mm.

4. The nozzle for wafer metal stripping process according to claim 1, characterized in that: The sapphire is sealed and connected to the top of the nut (3) via a high temperature resistant organic solvent.

5. The nozzle for wafer metal stripping process according to claim 1, characterized in that: The axial hole comprises an internal thread section, and the outer periphery of the nut (3) is provided with an external thread matching the internal thread section, and when in the installation position, the nut (3) is matched and connected with the internal thread section.

6. The nozzle for wafer metal stripping process according to claim 5, characterized in that: The axial hole also includes a stepped light hole section, which includes a large diameter section and a small diameter section. The large diameter section is connected to the internal thread section, and the small diameter section is placed on the top of the large diameter section.

7. The nozzle for wafer metal stripping process according to claim 6, characterized in that: The nozzle for the wafer metal stripping process also includes a sealing gasket (4) which is arranged in the large diameter section and abuts against the sapphire.

8. The nozzle for wafer metal stripping process according to claim 1, characterized in that: The nozzle for the wafer metal stripping process also includes: A pressure cap (5) is threadedly connected to the nozzle bracket (2) and is used to press the nut (3) against the nozzle bracket (2); A gasket (6) is arranged in the nozzle nut (1) and is used for connecting with the spray port.

9. A method for wafer metal stripping, using a nozzle for wafer metal stripping, characterized in that: The nozzle for wafer metal stripping process is the nozzle for wafer metal stripping process according to any one of claims 1 to 8.

10. The method for wafer metal stripping according to claim 9, characterized in that: The method for wafer metal stripping comprises: Step 1: Soak the wafer; Step 2: Pressurize the NMP solution to 400-3000 psi and adjust the temperature of the NMP solution to 60-90°C; Step 3, spraying the wafer in a fan shape with the NMP solution in step 2; Step 4: After the fan-shaped spraying is completed, needle-shaped spraying is performed through the nozzle used for the wafer metal stripping process, and each point required for spraying is covered by the rotation operation of the spray arm.

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