X-ray flat panel detector and core assembly thereof, and packaging method of core assembly

Abstract

The invention relates to the technical field of X-ray flat panel detector manufacturing, in particular to an X-ray flat panel detector, a core assembly thereof and a packaging method of the core assembly, and the method comprises the steps: S1, arranging a detection chip on the upper end surface of a substrate, carrying out the conventional coupling, carrying out the routing processing, and pasting a bottom vacuum film on the bottom end surface of the substrate through a sealant; s2, sequentially arranging a scintillator and an upper vacuum film or sequentially arranging an optical fiber panel, the scintillator and the upper vacuum film on the upper end surface of the detection chip, and then carrying out edge sealing treatment on the upper vacuum film and the bottom vacuum film to form a cavity between the upper vacuum film and the bottom vacuum film; and S3, carrying out vacuumizing treatment on the formed cavity to enable the vacuum degree in the cavity to be in a range of 50 kPa to 100 kPa, and then, carrying out sealing treatment to complete packaging of the core assembly. According to the packaging method, the coupling performance and the coupling convenience of the core component can be well considered; the problems in the prior art are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing X-ray flat panel detectors, and in particular to an X-ray flat panel detector and a core component thereof, and a packaging method for the core component. Background Art

[0002] With the rapid development of medical equipment, the demand for photoelectric scanning devices has gradually increased, such as CT imaging equipment. X-ray detectors are devices that use specific photoelectric conversion media to convert "X-ray" energy that is invisible to the naked eye into electrical signals that can be recorded. They are the core of CT imaging equipment. X-ray detectors include X-ray flat panel detectors, charge coupled device (CCD) detectors, etc. Among them, X-ray flat panel detectors are precise and expensive equipment that play a decisive role in the imaging quality of CT imaging equipment.

[0003] The core components of X-ray flat panel detectors mainly include detection chips, scintillators, and optical fiber panels that need to be used in some scenarios; the packaging process of the above core components has a crucial impact on the performance, cost, and maintainability of X-ray flat panel detectors. At present, there are three main commonly used packaging methods: scintillators are directly evaporated on the detection chip, scintillators and detection chips are bonded by coupling glue, and scintillators and detection chips are pressed by elastic foam and other materials. However, although the direct evaporation of scintillators on the detection chip has the least impact on the imaging performance of X-ray flat panel detectors, not all detection chips are suitable for direct evaporation. In addition, poor evaporation will directly lead to the overall scrapping of the core components of the detector, and the scintillators after evaporation cannot be removed and replaced, which is not conducive to subsequent maintenance. The manufacturing process of the scintillator and the detection chip by coupling glue is difficult, and the coupling of large-area detection chips is prone to problems such as bubbles and uneven coupling thickness, which will have a great impact on the imaging performance of the X-ray flat panel detector; similarly, the scintillator cannot be removed or replaced. Although the method of pressing the scintillator and the detection chip together by applying external force through elastic foam and other materials is relatively easy in terms of manufacturing process and scintillator removal and replacement, this pressing method cannot guarantee that the coupling between the scintillator and the detection chip reaches the ideal design state; and as the foam and other materials age, the coupling performance will continue to decline, which will directly affect the image quality. At the same time, if the X-ray flat-panel detector needs to use a fiber optic panel, the disadvantages of the above three packaging methods will be further expanded, and none of them can take into account both coupling performance and coupling convenience.

[0004] The present invention provides an X-ray flat panel detector and a core component thereof, and a packaging method for the core component, so as to solve the problems existing in the prior art that the existing packaging method cannot take into account both the coupling performance and the coupling convenience of the core component. Summary of the invention

[0005] The purpose of the present invention is to provide an X-ray flat panel detector and its core components, and a packaging method for the core components, so as to solve the problems existing in the prior art that the existing packaging method cannot take into account the coupling performance and coupling convenience of the core components.

[0006] The technical solution of the present invention is: a packaging method for a core component of an X-ray flat panel detector, the packaging steps comprising:

[0007] S1. The detection chip is arranged on the upper end surface of the substrate, and conventional coupling and wire bonding are performed. After that, the bottom vacuum film is adhered to the bottom end surface of the substrate by using a sealant; wherein a wire outlet area is reserved on the substrate; and a wire outlet hole is arranged at a position on the bottom vacuum film corresponding to the wire outlet area on the substrate;

[0008] S2, sequentially arranging a scintillator and an upper vacuum film on the upper end surface of the detection chip or sequentially arranging an optical fiber panel, a scintillator and an upper vacuum film, and then performing edge sealing treatment on the upper vacuum film and the bottom vacuum film to form a cavity between the upper vacuum film and the bottom vacuum film;

[0009] S3. The cavity formed above is subjected to a vacuum treatment to make the vacuum degree in the cavity within the range of 50 kPa-100 kPa, and then a sealing treatment is performed to complete the packaging of the core components.

[0010] Preferably, the wire bonding process includes the following steps: a. setting one end of the connecting wire on the upper end surface of the detection chip; b. printing the other end of the connecting wire on the upper end surface of the substrate, and extending it through the wire output area of ​​the substrate to the outside of the core component for connection with the subsequent processing circuit.

[0011] Preferably, the upper vacuum film and the bottom vacuum film are both made of any one of polymer film materials, plastic film materials, silicone film materials, and composite film materials;

[0012] The upper vacuum membrane and the bottom vacuum membrane are made of the same material or different materials.

[0013] Preferably, the polymer film material includes polyurethane, polytetrafluoroethylene, polyvinylidene chloride, ethylene-vinyl alcohol copolymer, polymethyl methacrylate;

[0014] The plastic film material includes polyvinyl chloride, polyethylene, polypropylene, polyethylene terephthalate, and polystyrene.

[0015] Preferably, the upper vacuum film and the bottom vacuum film are both made of any one of polyurethane, polymethyl methacrylate, polyimide and silicone film materials.

[0016] Preferably, the upper vacuum membrane and the bottom vacuum membrane are made of the same material.

[0017] The present invention also provides a core component of an X-ray flat panel detector, comprising a detection chip and a scintillator; wherein the core component is packaged using the above-mentioned packaging method.

[0018] The present invention also provides an X-ray flat panel detector, which includes the above core component.

[0019] Compared with the prior art, the advantages of the present invention are:

[0020] (1) The present invention provides an X-ray flat panel detector and its core components, and a packaging method for the core components; the packaging method uses vacuum pressing technology to package the core components of the X-ray flat panel detector, which can not only simply and reliably couple components such as scintillators and detection chips, but also well balance the coupling performance and coupling convenience of the core components; it can also accurately control the coupling state of the core components by using vacuum film materials with different properties and flexibly adjusting the vacuum degree of the cavity, so that the coupling gap between the components approaches or reaches the design value, thereby enabling the X-ray flat panel detector to achieve the designed performance; at the same time, the packaging method is simple to operate, can achieve lossless repeated packaging, greatly improve the packaging yield, and reduce production; and the core components packaged by the packaging method can be losslessly separated from the scintillator, optical fiber panel and detection chip by simply destroying the vacuum film, which is very convenient for later maintenance and can effectively reduce the maintenance cost of the X-ray flat panel detector; it solves the problem that the existing packaging method in the prior art cannot balance the coupling performance and coupling convenience of the core components. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0022] Figure 1 This is a schematic diagram of the structure of the bottom vacuum film coupled with the substrate according to Example 1 of the present invention;

[0023] Figure 2 This is a structural schematic diagram of the wire bonding process between the detection chip and the substrate according to Embodiment 1 of the present invention;

[0024] Figure 3 This is a structural schematic diagram of the wire bonding process between the detection chip and the substrate described in Example 3 of the present invention;

[0025] Figure 4This is a schematic diagram of the structure of the core components of Embodiment 3 of the present invention;

[0026] Among them: 1. substrate; 2. detection chip; 3. optical fiber panel; 4. scintillator; 5. upper vacuum film; 6. bottom vacuum film; 7. connecting wire; 8. appearance area; 9. wire outlet hole. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below in conjunction with specific embodiments:

[0028] A packaging method for a core component of an X-ray flat panel detector, wherein the core component includes components such as a detection chip and a scintillator; the packaging steps of the core component include:

[0029] S1. Set the detection chip on the upper end surface of the substrate, perform conventional coupling, and perform wire bonding. After that, use sealant to stick the bottom vacuum film on the bottom end surface of the substrate; wherein, a wire outlet area is reserved on the substrate; and a wire outlet hole is provided at a position on the bottom vacuum film corresponding to the wire outlet area on the substrate. The specific steps of wire bonding include: firstly set one end of the connecting wire on the upper end surface of the detection chip; then print the other end of the connecting wire on the upper end surface of the substrate, and make the other end of the connecting wire pass through the wire outlet area on the substrate and extend to the outside of the core component to connect with the subsequent processing circuit.

[0030] S2. A scintillator and an upper vacuum film are sequentially arranged on the upper end surface of the detection chip, and then the upper vacuum film and the bottom vacuum film are edge-sealed to form a cavity between the upper vacuum film and the bottom vacuum film. In order to meet the actual use requirements, the core component may also need to include an optical fiber panel, that is, the core component includes components such as a detection chip, a scintillator and an optical fiber panel; and the optical fiber panel is arranged between the detection chip and the scintillator; at this time, the optical fiber panel needs to be installed on the upper end surface of the detection chip first, and then the scintillator and the upper vacuum film are installed in sequence; at the same time, in order to ensure that the core component has good coupling performance, positioning is required in the process of sequentially installing the scintillator, the upper vacuum film and other components on the upper end surface of the detection chip to ensure the accuracy of the relative positions between the detection chip, the scintillator and other components. The upper vacuum film and the bottom vacuum film can be made of any one of polymer film materials, plastic film materials, silicone film materials, composite film materials and the like; and the upper vacuum film and the bottom vacuum film can be made of the same material or different materials. In actual production and use, the polymer film materials commonly used in the vacuum pressing and packaging process of core components include polyurethane (PU), polytetrafluoroethylene (PTFE), polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), polymethyl methacrylate (PMMA), polyimide (PI), etc.; commonly used plastic film materials include chemically synthesized polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), polystyrene (PS) and other resins.

[0031] S3. The cavity formed above is evacuated to make the vacuum degree in the cavity within the range of 50 kPa-100 kPa. After reaching the target vacuum degree, sealing is performed to complete the packaging of the core components.

[0032] Example 1

[0033] The core components of the X-ray flat panel detector include a detection chip and a scintillator; wherein the packaging steps of the core components include:

[0034] S1, placing the detection chip 2 on the upper end surface of the substrate 1 and performing conventional coupling; Figure 1 As shown, a wire outlet area 8 is reserved on the bottom surface of the substrate 1; then, as shown Figure 2As shown, wire bonding is performed between the upper end surface of the detection chip 2 and the upper end surface of the substrate 1, that is, one end of the connecting wire 7 is set on the upper end surface of the detection chip 2, and is set at a position close to one of the four side surfaces of the detection chip 2, and then the other end of the connecting wire 7 is printed on the upper end surface of the substrate 1, and it is extended to the outside of the core component after passing through the outlet area 8 on the substrate 1, and connected with the subsequent processing circuit; then, the bottom vacuum film 6 is pasted on the bottom end surface of the substrate 1 with a sealant; a wire outlet hole 9 is set at a position on the bottom vacuum film 6 corresponding to the outlet area 8 on the substrate 1, and the shape and size of the wire outlet hole 9 match the shape and size of the outlet area 8 on the substrate 1, so that the bottom vacuum film 6 is tightly fitted with the bottom end surface of the substrate 1. Among them, the bottom vacuum film 6 is a thin film made of polyurethane material.

[0035] S2, sequentially arrange the scintillator 4 and the upper vacuum film 5 on the upper end surface of the detection chip 2, and then perform edge sealing treatment on the upper vacuum film 5 and the bottom vacuum film 6 to form a cavity between the upper vacuum film 5 and the bottom vacuum film 6. The upper vacuum film 5 is also made of polyurethane material to form a thin film.

[0036] S3. The cavity formed above is evacuated to make the vacuum degree in the cavity reach 50 kPa. After reaching the target vacuum degree, sealing is performed to complete the packaging of the core components.

[0037] The packaged core components are applied to an X-ray flat panel detector, and the imaging quality of the X-ray flat panel detector is tested.

[0038] Example 2

[0039] The core components of the X-ray flat panel detector include a detection chip, a scintillator, and an optical fiber panel; wherein the packaging steps of the core components include:

[0040] S1. Set the detection chip on the upper end face of the substrate for conventional coupling; a wire outlet area is reserved on the bottom end face of the substrate; then, wire bonding is performed between the upper end face of the detection chip and the upper end face of the substrate, and one end of the connecting wire is set on the upper end face of the detection chip and at a position close to one of the four side faces of the detection chip, and then the other end of the connecting wire is printed on the upper end face of the substrate, and it is extended to the outside of the core component after passing through the wire outlet area on the substrate, and connected to the subsequent processing circuit; then, the bottom vacuum film is pasted on the bottom end face of the substrate with a sealant; a wire outlet hole is set at a position on the bottom vacuum film corresponding to the wire outlet area on the substrate, and the shape and size of the wire outlet hole match the shape and size of the wire outlet area on the substrate, so that the bottom vacuum film fits tightly with the bottom end face of the substrate, and it is necessary to ensure that there is no air gap between the substrate and the bottom vacuum film. Among them, the bottom vacuum film is a thin film made of polyurethane material.

[0041] S2. Arrange the optical fiber panel, scintillator, and upper vacuum film on the upper end surface of the detection chip in sequence, and then perform edge sealing treatment on the upper vacuum film and the bottom vacuum film to form a cavity between the upper vacuum film and the bottom vacuum film. The upper vacuum film is also made of polyurethane material to form a thin film. In this embodiment and other embodiments, positioning treatment is required when installing the optical fiber panel on the upper end surface of the detection chip to ensure the accuracy of the relative position between the detection chip and the optical fiber panel; similarly, positioning is also required in the process of installing the scintillator on the upper end surface of the optical fiber panel and installing the upper vacuum film on the upper end surface of the scintillator.

[0042] S3. The cavity formed above is evacuated to make the vacuum degree in the cavity reach 60 kPa. After reaching the target vacuum degree, sealing is performed to complete the packaging of the core components.

[0043] The packaged core components are applied to an X-ray flat panel detector, and the imaging quality of the X-ray flat panel detector is tested.

[0044] Example 3

[0045] The core components of the X-ray flat panel detector include a detection chip, a scintillator, and an optical fiber panel; wherein the packaging steps of the core components include:

[0046] S1. Place the detection chip on the upper end surface of the substrate for conventional coupling; a wire outlet area is reserved on the bottom end surface of the substrate; then, Figure 3As shown, one end of one of the connecting wires is set on the upper end surface of the detection chip and is set at a position close to the right side of the detection chip, and then the other end of the connecting wire is printed on the upper end surface of the substrate, and it is extended to the outside of the core component after passing through the outlet area on the substrate, and connected to the subsequent processing circuit; secondly, one end of another connecting wire is set on the upper end surface of the detection chip and is set at a position close to the left side of the detection chip, and the other end of the connecting wire is printed on the upper end surface of the substrate, and it is extended to the outside of the core component after passing through the outlet area on the substrate, and connected to the subsequent processing circuit; then, the bottom vacuum film is pasted on the bottom end surface of the substrate with a sealant; a wire outlet hole is set at a position on the bottom vacuum film corresponding to the outlet area on the substrate, and the shape and size of the wire outlet hole match the shape and size of the outlet area on the substrate, so that the bottom vacuum film is tightly fitted with the bottom end surface of the substrate. Among them, the bottom vacuum film is made of silicone film material. In this embodiment, the connecting line is printed on the upper end surface of the detection chip and is close to the left and right sides; in other embodiments, the connecting line is printed on the upper end surface of the detection chip and is close to any two sides of the left, right, front and rear sides.

[0047] S2, such as Figure 4 As shown, the optical fiber panel 3, the scintillator, and the upper vacuum film are sequentially arranged on the upper end surface of the detection chip, and then the upper vacuum film and the bottom vacuum film are edge-sealed to form a cavity between the upper vacuum film and the bottom vacuum film. Among them, the upper vacuum film is also made of silicone film material.

[0048] S3. The cavity formed above is evacuated to make the vacuum degree in the cavity reach 60 kPa. After reaching the target vacuum degree, sealing is performed to complete the packaging of the core components.

[0049] The packaged core components are applied to an X-ray flat panel detector, and the imaging quality of the X-ray flat panel detector is tested.

[0050] Example 4

[0051] The core components of the X-ray flat panel detector include a detection chip, a scintillator, and an optical fiber panel; wherein the packaging steps of the core components include:

[0052] S1. Set the detection chip on the upper end face of the substrate for conventional coupling; a wire outlet area is reserved on the bottom end face of the substrate; then, wire bonding is performed between the upper end face of the detection chip and the upper end face of the substrate, that is, one end of the connecting wire is set on the upper end face of the detection chip and at a position close to one of the four side faces of the detection chip, and then the other end of the connecting wire is printed on the upper end face of the substrate, and it is extended to the outside of the core component after passing through the wire outlet area on the substrate, and connected to the subsequent processing circuit; then, the bottom vacuum film is pasted on the bottom end face of the substrate with sealant; a wire outlet hole is set at a position on the bottom vacuum film corresponding to the wire outlet area on the substrate, and the shape and size of the wire outlet hole match the shape and size of the wire outlet area on the substrate, so that the bottom vacuum film is tightly fitted with the bottom end face of the substrate. Among them, the bottom vacuum film is a thin film made of polyurethane material.

[0053] S2. An optical fiber panel, a scintillator, and an upper vacuum film are sequentially arranged on the upper end surface of the detection chip, and then the upper vacuum film and the bottom vacuum film are edge-sealed to form a cavity between the upper vacuum film and the bottom vacuum film. The upper vacuum film is also made of polymethyl methacrylate material to form a thin film.

[0054] S3. The cavity formed above is evacuated to make the vacuum degree in the cavity reach 60 kPa. After reaching the target vacuum degree, sealing is performed to complete the packaging of the core components.

[0055] The packaged core components are applied to an X-ray flat panel detector, and the imaging quality of the X-ray flat panel detector is tested.

[0056] Comparative Example 1

[0057] The core components of the X-ray flat panel detector include detection chips, scintillators, and optical fiber panels. After the detection chips, optical fiber panels, and scintillators are wrapped with elastic foam, they are packaged by applying external force and pressing. The packaged core components are applied to the X-ray flat panel detector, and the imaging quality of the X-ray flat panel detector is tested.

[0058] In order to evaluate the performance of the X-ray flat panel detector including the core components packaged in the above-mentioned embodiments 1-4 and the X-ray flat panel detector including the core components packaged in comparative example 1; the imaging qualities of the above-mentioned X-ray flat panel detectors were tested respectively; at the same time, in order to reduce the detection error, 5 core components were assembled at the same time under the conditions of the same embodiment, and all of them were applied to the X-ray flat panel detectors, and the performance of the X-ray flat panel detectors was tested respectively, and the imaging quality results were averaged; the test results are shown in Table 1.

[0059] Table 1. Performance test results of X-ray flat panel detectors corresponding to Examples 1-5 and Comparative Example 1

[0060] Example Average MTF value Example 1 0.78 Example 2 0.85 Example 3 0.83 Example 4 0.80 Comparative Example 1 0.55

[0061] As can be seen from Table 1, by using the packaging method provided by the present application to package the core component, and applying the core component to an X-ray flat panel detector, the image MTF value of the corresponding X-ray flat panel detector is significantly higher, that is, the imaging quality of the X-ray flat panel detector is higher; this further indicates that by using the packaging method provided by the present application to package the core component, the coupling performance of the core component is better, and the performance of the detector can be effectively improved. Comparing Example 1, Example 2, Example 3 and Example 4, it can be seen that the performance of the vacuum film material and the control of the vacuum degree will affect the coupling performance of the encapsulated core component. For example, the tensile strength, ductility, and aging resistance of the vacuum film material will affect the stress size of the coupling edge in the core component. If the performance of the vacuum film material does not match the stress size of the coupling edge, the edge of the coupled core component will be damaged, thereby affecting the coupling performance of the core component. Comparing Example 2 with Example 4, it can be seen that although the upper vacuum film and the lower vacuum are made of different materials, the core component obtained by encapsulation also has a high coupling performance; however, when the upper vacuum film and the lower vacuum film are made of the same material, the coupling performance of the core component obtained by encapsulation is more excellent; therefore, the upper vacuum film and the bottom vacuum film are preferably made of the same material; at the same time, after a large number of experimental investigations, it is found that when the upper vacuum film and the bottom vacuum film are made of any one of polyurethane, polymethyl methacrylate, polyimide, and silicone film materials, the coupling performance of the encapsulated core component is more excellent. In addition, the core component is encapsulated by the encapsulation method provided by the present application, and the operation is simpler, and the coupling performance and coupling convenience of the core component can be taken into account; it can effectively reduce the phenomenon of overall scrapping of the core component of the detector due to improper operation; at the same time, it can also improve the packaging efficiency and save the packaging cost; and, only the vacuum film needs to be destroyed to non-destructively separate the scintillator, the optical fiber panel and the detection chip, which is very convenient for later maintenance; thereby improving the imaging quality and maintainability of the X-ray flat panel detector.

[0062] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the scope of protection of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present invention.

Claims

1. A packaging method for a core component of an X-ray flat panel detector, characterized in that: The packaging steps include: S1. The detection chip is arranged on the upper end surface of the substrate, and conventional coupling and wire bonding are performed. After that, the bottom vacuum film is adhered to the bottom end surface of the substrate by using a sealant; wherein a wire outlet area is reserved on the substrate; and a wire outlet hole is arranged at a position on the bottom vacuum film corresponding to the wire outlet area on the substrate; S2, sequentially arranging a scintillator and an upper vacuum film on the upper end surface of the detection chip or sequentially arranging an optical fiber panel, a scintillator and an upper vacuum film, and then performing edge sealing treatment on the upper vacuum film and the bottom vacuum film to form a cavity between the upper vacuum film and the bottom vacuum film; S3. The cavity formed above is subjected to a vacuum treatment to make the vacuum degree in the cavity within the range of 50 kPa-100 kPa, and then a sealing treatment is performed to complete the packaging of the core components.

2. The packaging method of a core component of an X-ray flat panel detector according to claim 1, characterized in that: The wire bonding process includes the following steps: a. setting one end of the connecting wire on the upper end surface of the detection chip; b. printing the other end of the connecting wire on the upper end surface of the substrate, and extending it through the wire output area of ​​the substrate to the outside of the core component for connection with the subsequent processing circuit.

3. The packaging method of a core component of an X-ray flat panel detector according to claim 1, characterized in that: The upper vacuum film and the bottom vacuum film are both made of any one of polymer film materials, plastic film materials, silicone film materials, and composite film materials.

4. The packaging method of a core component of an X-ray flat panel detector according to claim 3, characterized in that: The polymer film material includes polyurethane, polytetrafluoroethylene, polyvinylidene chloride, ethylene-vinyl alcohol copolymer, and polymethyl methacrylate; The plastic film material includes polyvinyl chloride, polyethylene, polypropylene, polyethylene terephthalate, and polystyrene.

5. The packaging method of a core component of an X-ray flat panel detector according to claim 4, characterized in that: The upper vacuum film and the bottom vacuum film are both made of any one of polyurethane, polymethyl methacrylate, polyimide and silicone film materials.

6. The packaging method of a core component of an X-ray flat panel detector according to claim 4, characterized in that: The upper vacuum membrane and the bottom vacuum membrane are made of the same material.

7. A core component of an X-ray flat panel detector, comprising a detection chip and a scintillator; characterized in that: The core component is packaged using the packaging method described in any one of claims 1-6.

8. An X-ray flat panel detector, characterized in that: Includes the core component described in claim 7.

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