An appearance defect inspection apparatus for a chip package substrate

Abstract

The application relates to a chip packaging substrate appearance defect detection device and relates to the technical field of semiconductor detection, which comprises a device main body, a conveying belt, a defect detection mechanism, a first camera and a first light source device, a first mounting rack, a first through hole and a first direction.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor detection, in particular to a chip packaging substrate appearance defect detection equipment. BACKGROUND

[0002] In the chip manufacturing industry, the quality control of chip packaging substrates is crucial. Appearance defect detection of chip packaging substrates is a key link to ensure their quality. Accurate and efficient detection can timely discover scratches, cracks, impurities and other problems on the surface of the substrate, avoid defective substrates from entering the subsequent production process, thereby improving the yield of chips, reducing production costs, and promoting the stable development of the entire chip industry.

[0003] Under the related technology, for appearance defect detection of chip packaging substrates that have not yet been mounted with chips, the industry usually adopts a single-side detection method. Specifically, the detection equipment usually only has the function of detecting one side of the substrate. During the detection process, one side of the substrate is first placed in the detection area, and a camera and a light source device are used to collect and analyze images of the side to identify possible appearance defects. After completing the detection of one side, the substrate needs to be turned over manually or with the help of other equipment, and the same detection operation is performed on the other side.

[0004] For the related technology in the above, the single-side detection method of the prior art has obvious defects. On the one hand, the detection efficiency is low, as the substrate needs to be turned over, increasing the time cost of detection and reducing the number of detections per unit time. On the other hand, the detection accuracy is also low, as the information of both sides of the substrate cannot be obtained at the same time, which may cause some hidden defects to be missed, thereby affecting the quality detection effect of the chip packaging substrate. SUMMARY

[0005] In order to realize detection of defects on the front and back of the product, the present application provides a chip packaging substrate appearance defect detection equipment.

[0006] The chip packaging substrate appearance defect detection equipment provided by the present application adopts the following technical solution:

[0007] A chip packaging substrate appearance defect detection equipment, comprising

[0008] a device main body;

[0009] a conveyor belt, which is slidably connected to the device main body in a first direction, for conveying products, one end of the conveyor belt being an inlet and the other end being an outlet;

[0010] A defect detection mechanism is symmetrically arranged on both sides of the conveyor belt along a second direction. The defect detection mechanism includes a first camera and a first light source device. The first camera and the first light source device are mounted on the main body of the equipment via a first mounting bracket. The first mounting bracket is mounted on the main body of the equipment. The lens of the first camera is positioned closer to the side of the conveyor belt. The first camera is used to detect product defects. A first through hole is provided on the top wall of the main body of the equipment for one of the first cameras and the first light source device to pass through.

[0011] By adopting the above technical solution, and by setting two defect detection mechanisms along the second direction, when the product is transported to the defect detection mechanism by the conveyor belt, under the illumination of the first light source device, the two first cameras simultaneously detect defects such as scratches on the upper and lower surfaces of the product on the conveyor belt, thus improving the efficiency of product defect detection.

[0012] Optionally, the first camera is rotatably connected to the first mounting bracket, and the first camera is parallel to a third direction along the rotation axis of the first mounting bracket.

[0013] By adopting the above technical solution, and by setting the first camera to rotate and connect to the first mounting bracket in a third direction, the angle of the first camera can be adjusted according to the size and position of the product to adapt to the defect detection of different types of products.

[0014] Optionally, it also includes a first drive assembly for driving the first camera to rotate. The first drive assembly includes a first motor and a first rotating shaft. The first rotating shaft is rotatably connected to the first mounting bracket. The axis of the first rotating shaft and the axis of rotation are both parallel to a third direction. A first mounting base is installed on one side of the first camera. The first mounting base is fixedly connected to the first rotating shaft. The output shaft of the first motor is coaxially fixedly connected to the first rotating shaft.

[0015] By adopting the above technical solution, the first motor drives the first rotating shaft to rotate, which in turn drives the first camera to rotate in a third direction.

[0016] Optionally, the first rotating shaft is connected to the first mounting bracket via a second mounting seat, the first rotating shaft is rotatably connected to the second mounting seat, and the other side of the second mounting seat is slidably connected to the first mounting bracket along a third direction.

[0017] By adopting the above technical solution and setting the second mounting base to slide along the third direction, the position of the first camera along the third direction can be further adjusted, thereby improving the detection range of the first camera and enabling defect detection of products of different types and sizes, making it more applicable.

[0018] Optionally, the second driving assembly is further included, the second driving assembly comprises a second motor and a screw rod, the screw rod is rotationally connected to the first mounting frame, the self-axis and the rotation axis of the screw rod are parallel to the third direction, the second mounting seat is directly or indirectly threadedly connected to the screw rod, the second mounting seat slides along the axis direction of the screw rod, and the output shaft of the second motor is coaxially and fixedly connected to the screw rod.

[0019] By adopting the technical scheme, when the position of the first camera needs to be adjusted, the second motor drives the screw rod to rotate, the screw rod further drives the second mounting seat to slide along the third direction, and the first camera is driven to slide along the third direction.

[0020] Optionally, the first mounting frame is provided with a first sliding groove in the third direction, the screw rod is located in the first sliding groove, one end of the second mounting seat is fixedly connected with a sliding block, and the outer peripheral wall of the sliding block is attached to the peripheral wall of the first sliding groove.

[0021] By adopting the technical scheme, the sliding block is arranged to slide in the first sliding groove, so that the sliding of the second mounting seat along the axis direction of the screw rod is guided.

[0022] Optionally, the first mounting frame is further provided with two second cameras, the second cameras are symmetrically arranged on the two sides of the conveying belt along the third direction, the second cameras are directly or indirectly rotationally connected to the first mounting frame, the second cameras are parallel to the second direction along the rotation axis of the first mounting frame, and the lens shooting direction of the second cameras is arranged close to one side of the conveying belt.

[0023] By adopting the technical scheme, the first cameras arranged on the two sides of the conveying belt can detect defects on the upper surface and the lower surface of the product, but the two sides of the product are uniform stress concentration areas and are also prone to cracks and other defects, and the second cameras are arranged to detect defects on the two sides of the product.

[0024] Optionally, the third driving assembly is further included, the third driving assembly comprises a first bevel gear, a second bevel gear, a second rotating shaft, a third bevel gear and a third rotating shaft, and the two ends of the screw rod are fixedly sleeved with the first bevel gears;

[0025] The second rotating shaft is rotationally connected to the first mounting frame, the self-axis and the rotation axis of the second rotating shaft are parallel to the first direction, the two ends of the second rotating shaft are fixedly sleeved with the second bevel gears, one end of the third rotating shaft is rotationally connected to the first mounting frame, the other end extends to the outside of the first mounting frame, and the self-axis and the rotation axis of the third rotating shaft are parallel to the second direction.

[0026] The third bevel gear is coaxially fixedly connected to the third rotating shaft, the third bevel gear and the second rotating shaft are engaged away from the second bevel gear of the first bevel gear, the third rotating shaft is fixedly sleeved with the third bevel gear, the third bevel gear is engaged with the second bevel gear, and the second camera is fixedly sleeved on the third rotating shaft away from one end of the first mounting frame.

[0027] By adopting the technical scheme, when the angle of the second camera needs to be adjusted, the second motor is started, the second motor drives the screw rod to rotate, the screw rod drives the first bevel gear, the second bevel gear, the third bevel gear and the third rotating shaft to rotate, and thus the second camera is driven to rotate.

[0028] Optionally, the position detection mechanism is further provided, and the position detection mechanism is arranged on the equipment body and located on the side of the defect detection mechanism close to the discharge port.

[0029] By adopting the technical scheme, the position detection mechanism is arranged, and the position detection mechanism detects the position accuracy of the subsequent chip, passive element, pad, alignment mark and through hole of the product for lead bonding.

[0030] Optionally, the cleaning equipment is further provided, and the cleaning equipment is arranged on the side of the defect detection mechanism close to the feeding port and on the top wall of the conveying belt, so as to clean the product.

[0031] By adopting the technical scheme, the cleaning equipment is arranged, and the cleaning equipment cleans the dirt or foreign matter on the surface of the product.

[0032] In summary, the present application has at least one of the following beneficial technical effects:

[0033] The present application is provided with two defect detection mechanisms along the second direction, so that when the product is transported to the defect detection mechanism by the conveying belt, the two first cameras simultaneously detect the defects such as scratches on the upper surface and the lower surface of the product on the conveying belt under the irradiation of the first light source equipment, synchronous detection is realized, and the efficiency of product defect detection is further improved.

[0034] The first camera is rotationally connected to the first mounting frame along the third direction, the angle of the first camera can be adjusted according to the size and position of the product, and the defect detection of different types of products is adapted.

[0035] The second camera is rotationally connected to the first mounting frame, and the second camera can detect defects on both sides of the product. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 is a schematic diagram of the overall structure of the appearance defect detection equipment of the chip packaging substrate of the present application;

[0037] Figure 2 is a schematic diagram of the structure of the defect detection mechanism and the main body of the equipment of the present application;

[0038] Figure 3 is a schematic diagram of the first driving assembly and the second driving assembly of the present application;

[0039] Figure 4 is a schematic diagram of the third driving assembly of the present application;

[0040] Figure 5 is an enlarged view of part A in the present application Figure 4

[0041] BRIEF DESCRIPTION OF THE DRAWINGS: 1, equipment main body; 11, first through hole; 12, second through hole; 13, third through hole; 14, NG marking mechanism; 15, fourth through hole; 2, conveying belt; 21, feeding port; 22, discharging port; 3, defect detection mechanism; 31, first camera; 32, first light source equipment; 33, first mounting bracket; 331, first sliding groove; 332, mounting groove; 333, second light source equipment; 34, second camera; 4, cleaning equipment; 5, code reading equipment; 6, position degree detection mechanism; 7, first driving assembly; 71, first motor; 72, first rotating shaft; 73, first mounting seat; 74, second mounting seat; 741, sliding block; 8, second driving assembly; 81, second motor; 82, screw rod; 9, third driving assembly; 91, first bevel gear; 92, second bevel gear; 93, second rotating shaft; 94, third bevel gear; 95, third rotating shaft; 96, third mounting seat. DETAILED DESCRIPTION

[0042] The following will be described in detail in combination with the accompanying drawings Figures 1-5 The present application will be further described in detail.

[0043] The embodiment of the present application discloses appearance defect detection equipment of a chip packaging substrate. In order to facilitate description, the present application introduces directional words such as first direction, second direction and third direction to form three-dimensional reference directions, and the directional words used such as "first direction, second direction and third direction" can be specifically referred to the drawings, wherein the first direction is represented as X, the second direction is represented as Y, and the third direction is represented as Z, and the first direction, the second direction and the third direction are perpendicular to each other.

[0044] Referring to Figure 1 and Figure 2 ​The appearance defect detection equipment of the chip packaging substrate comprises an equipment body 1, a conveying belt 2 and a defect detection mechanism 3. The conveying belt 2 is slidably connected to the equipment body 1 in a first direction and is used for conveying products. One end of the conveying belt 2 is an inlet 21, and the other end is an outlet 22. The defect detection mechanism 3 is symmetrically arranged on both sides of the conveying belt 2 in a second direction. The defect detection mechanism 3 comprises a first camera 31 and a first light source device 32. The first camera 31 and the first light source device 32 are installed on the equipment body 1 through a first mounting frame 33. The first mounting frame 33 is arranged on the equipment body 1. The lens of the first camera 31 is vertically downward and is arranged close to one side of the conveying belt 2. The first camera 31 is used for detecting defects of the products. A first through hole 11 is formed in the top wall of the equipment body 1 and is used for the first camera 31 and the first light source device 32 to pass through. The products are transported by the conveying belt 2 and are transported to the vicinity of the first camera 31. The defects of the products are detected by the first camera 31 distributed above and below the conveying belt 2, so that the defects of the front and back of the products are detected at the same time.

[0045] In the embodiment, the first camera 31 is an industrial camera, which is prior art in the field. The conveying belt 2 is prior art in the field. The conveying belt 2 is made of a translucent material. The driving structure for driving the conveying belt 2 to slide in the second direction is also prior art. The specific structure and driving structure are not described in detail.

[0046] With reference to Figure 1 In order to improve the recognition effect of the first camera 31 on defects, the first light source device 32 is arranged obliquely. The first light source device 32 is inclined towards the side close to the outlet 22 along the direction close to the equipment body 1, so as to provide better light for the products.

[0047] With reference to Figure 1 Before the defects of the products are detected, the products transported by the conveying belt 2 may be contaminated by foreign matters or dust. In order to reduce the influence on the subsequent image acquisition accuracy, the appearance defect detection equipment of the chip packaging substrate further comprises a cleaning device 4. The cleaning device 4 is arranged on the side close to the inlet 21 of the defect detection mechanism 3 and is located above the conveying belt 2. The products are cleaned by the cleaning device 4. In the embodiment, the cleaning device 4 is a cleaning machine, which is prior art in the field. The dirt or foreign matters on the surface of the products are cleaned by the cleaning device 4.

[0048] With reference to Figure 1The reading code device 5 is installed on the equipment main body 1 and is symmetrically arranged on both sides of the conveying belt 2 along the second direction. A second through hole 12 is formed in the top wall of the equipment main body 1 along the second direction, and one of the reading code devices 5 passes through the second through hole 12. In the embodiment, the reading code device 5 is a two-dimensional code scanner, which reads the two-dimensional code information of the product, obtains the production batch, model, production time and other data of the product, and facilitates the association of subsequent detection data and product information, and realizes product traceability.

[0049] With reference to Figure 1 and Figure 2 It should be noted that the semiconductor material can be a chip packaging substrate, a mobile phone SP bottom plate, etc. Since the semiconductor material (such as a chip packaging substrate) has pads, alignment marks and through holes and other features for subsequent mounting of chips, passive elements and wire bonding, in order to detect the accuracy of the positions of these features, the position detection mechanism 6 is arranged on one side of the discharge port 22 close to the defect detection mechanism 3. The position detection mechanism 6 is at least one, in the embodiment, the position detection mechanism 6 is symmetrically arranged on both sides of the conveying belt 2 along the second direction, and the position detection mechanism 6 is arranged in two along the first direction. A third through hole 13 is formed in the top wall of the equipment main body 1 along the second direction, and one of the position detection mechanisms 6 passes through the third through hole 13. In the embodiment, the position detection mechanism 6 is a prior art in the field, which detects the center positions of the bonded pads, alignment marks and through holes and other features.

[0050] With reference to Figure 2 If unqualified products are detected, in order to facilitate the subsequent sorting link to quickly identify unqualified products, the appearance defect detection device of the chip packaging substrate further comprises an NG marking mechanism 14. The NG marking mechanism 14 is arranged on one side of the position detection mechanism 6 close to the discharge port 22. The NG marking mechanism 14 is installed on the installation equipment main body 1. The NG marking mechanism 14 is symmetrically arranged on both sides of the conveying belt 2 along the second direction. A fourth through hole 15 is formed in the top wall of the equipment main body 1, and one of the NG marking mechanisms 14 passes through the fourth through hole 15. In the embodiment, the NG marking mechanism 14 is a laser marker, which is a prior art in the field, and the specific structure will not be described in detail. The NG marking mechanism 14 can mark “NG” on the specified position (such as the corner of the bottom plate edge) of the product, which facilitates the subsequent sorting link to quickly identify and remove unqualified products, and avoids unqualified products flowing into the next process.

[0051] With reference to Figure 3 In order to detect defects of different types of products, the first camera 31 is rotationally connected to the first mounting frame 33. The first camera 31 is parallel to the third direction along the rotation axis of the first mounting frame 33, that is, the angle of the first camera 31 is adjustable. The angle of the first camera 31 can be adjusted according to the size and position of the product, so as to adapt to the defect detection of different types of products.

[0052] With reference to Figure 3 , in order to drive the first camera 31 to rotate along the third direction, the chip packaging substrate appearance defect detection device further comprises a first driving assembly 7 for driving the first camera 31 to rotate, the first driving assembly 7 comprising a first motor 71 and a first rotating shaft 72, the first rotating shaft 72 being rotatably connected to the first mounting frame 33, the first rotating shaft 72 having its own axis and rotation axis both parallel to the third direction, the first camera 31 being mounted with a first mounting seat 73 on one side, the first mounting seat 73 being fixedly connected to the first rotating shaft 72, and the output shaft of the first motor 71 being coaxially fixedly connected to the first rotating shaft 72; the first motor 71 drives the first rotating shaft 72 to rotate, thereby driving the first camera 31 to rotate.

[0053] With reference to Figure 3 , in order to connect the first rotating shaft 72 with the first mounting frame 33, the first rotating shaft 72 is connected with the first mounting frame 33 through a second mounting seat 74, the first rotating shaft 72 being rotatably connected to the second mounting seat 74, and the other side of the second mounting seat 74 being connected to the first mounting frame 33.

[0054] With reference to Figure 3 , in order to further improve the detection range of the first camera 31 on different types of product defects, the second mounting seat 74 is slidingly connected to the first mounting frame 33 along the third direction, thereby further realizing the position adjustment of the first camera 31 along the third direction, and realizing the defect detection on different types and different sizes of products, so as to be more applicable.

[0055] With reference to Figure 3 , in order to drive the second mounting seat 74 to slide along the third direction, the chip packaging substrate appearance defect detection device further comprises a second driving assembly 8, the second driving assembly 8 comprising a second motor 81 and a lead screw 82, the lead screw 82 being rotatably connected to the first mounting frame 33, the lead screw 82 having its own axis and rotation axis both parallel to the third direction, the second mounting seat 74 being directly or indirectly threadedly connected to the lead screw 82, the second mounting seat 74 sliding along the axis direction of the lead screw 82, the output shaft of the second motor 81 being coaxially fixedly connected to the lead screw 82, the second motor 81 driving the lead screw 82 to rotate, the lead screw 82 further driving the second mounting seat 74 to slide along the third direction, thereby driving the first camera 31 to slide along the third direction.

[0056] With reference to Figure 3 , in order to guide the sliding of the second mounting seat 74 along the lead screw 82, the first mounting frame 33 is provided with a first sliding groove 331 along the third direction, the lead screw 82 being located in the first sliding groove 331, one end of the second mounting seat 74 being fixedly connected with a sliding block 741, the sliding block 741 being threadedly connected to the lead screw 82, the outer peripheral wall of the sliding block 741 being fitted with the groove peripheral wall of the first sliding groove 331, and the lead screw 82 being rotatable to drive the sliding block 741 to slide along the third direction.

[0057] Referring to Figure 4 The first camera 31 arranged on both sides of the conveying belt 2 can detect defects on the upper and lower surfaces of the product, but the two sides of the product are uniform stress concentration areas and are also prone to defects such as cracks. In order to detect defects on the two sides of the product, the first mounting frame 33 is further provided with a second camera 34. The second camera 34 is arranged in two along the third direction, and is rotationally connected to the first mounting frame 33. The second camera 34 is parallel to the second direction along the rotation axis of the first mounting frame 33. The lens of the second camera 34 is arranged close to one side of the conveying belt 2, so that the second camera 34 detects defects on the two sides of the product. In this embodiment, the second camera 34 is an industrial camera, which is prior art in the field.

[0058] Referring to Figure 4 and Figure 5 In order to drive the second camera 34 to rotate along the second direction, the appearance defect detection device of the chip packaging substrate further comprises a third driving assembly 9. The third driving assembly 9 comprises a first bevel gear 91, a second bevel gear 92, a second rotating shaft 93, a third bevel gear 94 and a third rotating shaft 95. The first bevel gear 91 is fixedly sleeved on both ends of the lead screw 82. The second rotating shaft 93 is rotationally connected to the first mounting frame 33. The second rotating shaft 93 is parallel to the first direction along its own axis and rotation axis. The second bevel gear 92 is fixedly sleeved on both ends of the second rotating shaft 93. One end of the third rotating shaft 95 is rotationally connected to the first mounting frame 33, and the other end extends to the outside of the first mounting frame 33. The third rotating shaft 95 is parallel to the second direction along its own axis and rotation axis. The third bevel gear 94 is coaxially fixedly connected to the third rotating shaft 95. The third bevel gear 94 and the second bevel gear 92 away from the first bevel gear 91 are engaged. The third bevel gear 94 is fixedly sleeved on the third rotating shaft 95. The third bevel gear 94 is engaged with the second bevel gear 92. The second camera 34 is fixedly connected to one end of the third rotating shaft 95 away from the first mounting frame 33 through the third mounting seat 96. The first mounting frame 33 has a mounting groove 332 for accommodating the second bevel gear 92 and the third bevel gear 94. When it is necessary to adjust the angle of the second camera 34, the second motor 81 is started to drive the lead screw 82 to rotate, and the lead screw 82 drives the first bevel gear 91, the second bevel gear 92, the third bevel gear 94 and the third rotating shaft 95 to rotate, thereby driving the second camera 34 to rotate.

[0059] Referring to Figure 4 In order to make the light source on both sides of the product more sufficient, the first mounting frame 33 is further provided with a second light source device 333. The second light source device 333 is arranged in two along the third direction. The second light source device 333 is arranged obliquely upward along the direction close to the conveying belt 2. The second light source device 333 is located below the second camera 34, and irradiates the two sides of the product by the second light source device 333.

[0060] The implementation principle of the appearance defect detection equipment of the chip packaging substrate is as follows: a plurality of products are transported by a conveying belt 2, the products first pass through a cleaning equipment 4 for cleaning, then a code reading equipment 5 obtains the production batch and model information of the products, the products are transported to the vicinity of a first camera 31, a first motor 71 drives the first camera 31 to rotate along a second direction, and the first camera 31 detects the defects on the upper surface and the lower surface of the products, when it is necessary to detect the defects on the two sides of the products, a second motor 81 drives a lead screw 82 to rotate, drives a second rotating shaft 93 to rotate, and further drives a second camera 34 to rotate, so as to facilitate the second camera 34 to detect the defects on the side wall of the product, and simultaneously drives a second mounting seat 74 to slide along a third direction, so as to facilitate the adjustment of the position of the first camera 31 along the third direction, so as to improve the detection range of the first camera 31, after the detection is completed, the products are transported between two position degree detection mechanisms 6, the position degrees of the left side and the right side of the products are detected by the position degree detection mechanisms 6, and finally unqualified products are marked by an NG marking mechanism 14.

[0061] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application, therefore: all equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. An appearance defect inspection apparatus of a chip package substrate, characterized by comprising: Comprising The device body (1); The conveying belt (2) is slidably connected to the device body (1) in the first direction for conveying products, one end of the conveying belt (2) is the feeding port (21), and the other end is the discharging port (22); The defect detection mechanism (3) is symmetrically arranged on both sides of the conveying belt (2) in the second direction, the defect detection mechanism (3) comprises a first camera (31) and a first light source device (32), the first camera (31) and the first light source device (32) are installed on the device body (1) through a first mounting frame (33), the first mounting frame (33) is arranged on the device body (1), the lens of the first camera (31) is arranged close to one side of the conveying belt (2), the first camera (31) is used for detecting product defects, and a first through hole (11) is formed in the top wall of the device body (1) for the first camera (31) and the first light source device (32) to pass through; The first camera (31) is rotatably connected to the first mounting frame (33), and the first camera (31) is parallel to the third direction along the rotation axis of the first mounting frame (33); Further comprising a first driving assembly (7) for driving the rotation of the first camera (31), the first driving assembly (7) comprises a first motor (71) and a first rotating shaft (72); the first rotating shaft (72) is connected to the first mounting frame (33) through a second mounting seat (74), the first rotating shaft (72) is rotatably connected to the second mounting seat (74), and the other side of the second mounting seat (74) is slidably connected to the first mounting frame (33) in the third direction Further comprising a second driving assembly (8), the second driving assembly (8) comprises a second motor (81) and a lead screw (82), the lead screw (82) is rotatably connected to the first mounting frame (33), the axis of the lead screw (82) and the rotation axis are both parallel to the third direction, the second mounting seat (74) is directly or indirectly threadedly connected to the lead screw (82), the second mounting seat (74) slides along the axis direction of the lead screw (82), and the output shaft of the second motor (81) is coaxially fixedly connected to the lead screw (82); The first mounting frame (33) is further provided with two second cameras (34), the second cameras (34) are symmetrically arranged on both sides of the conveying belt (2) in the third direction, the second cameras (34) are directly or indirectly rotatably connected to the first mounting frame (33), the second cameras (34) are parallel to the second direction along the rotation axis of the first mounting frame (33), and the lens of the second camera (34) is arranged close to one side of the conveying belt (2); Further comprising a third driving assembly (9), the third driving assembly (9) comprises a first bevel gear (91), a second bevel gear (92), a second rotating shaft (93), a third bevel gear (94) and a third rotating shaft (95); The lead screw (82) is fixedly sleeved with a first bevel gear (91) at both ends, the second rotating shaft (93) is rotationally connected to the first mounting frame (33), the second rotating shaft (93) has both its own axis and rotation axis parallel to the first direction, the second rotating shaft (93) is fixedly sleeved with a second bevel gear (92) at both ends, and the third rotating shaft (95) is rotationally connected to the first mounting frame (33) at one end and extends to the outside of the first mounting frame (33) at the other end, and the third rotating shaft (95) has both its own axis and rotation axis parallel to the second direction; The third bevel gear (94) is coaxially and fixedly connected to the third rotating shaft (95), the third bevel gear (94) is engaged with the second bevel gear (92) away from the first bevel gear (91), the third rotating shaft (95) is fixedly sleeved with the third bevel gear (94), the third bevel gear (94) is engaged with the second bevel gear (92), and the second camera (34) is fixedly sleeved on the third rotating shaft (95) away from the first mounting frame (33) through a third mounting seat (96).

2. The appearance defect inspection apparatus of a chip package substrate according to claim 1, characterized by: The first rotating shaft (72) is rotationally connected to the first mounting frame (33), the first rotating shaft (72) has both its own axis and rotation axis parallel to the third direction, one side of the first camera (31) is provided with a first mounting seat (73), the first mounting seat (73) is fixedly connected to the first rotating shaft (72), and the output shaft of the first motor (71) is coaxially and fixedly connected to the first rotating shaft (72).

3. The appearance defect inspection apparatus of a chip package substrate according to claim 2, characterized by: The first mounting frame (33) is provided with a first sliding groove (331) in the third direction, the lead screw (82) is located in the first sliding groove (331), one end of the second mounting seat (74) is fixedly connected with a sliding block (741), the sliding block (741) is threadedly connected to the lead screw (82), and the outer peripheral wall of the sliding block (741) is attached to the peripheral wall of the first sliding groove (331).

4. The appearance defect inspection apparatus of a chip package substrate according to claim 1, characterized by: The position degree detection mechanism (6) is further provided, at least one position degree detection mechanism (6) is arranged, the position degree detection mechanism (6) is installed on the equipment body (1) and located on one side of the defect detection mechanism (3) close to the discharge port (22).

5. The appearance defect inspection apparatus of a chip package substrate according to claim 1, characterized by: The cleaning device (4) is further provided, the cleaning device (4) is arranged on one side of the defect detection mechanism (3) close to the feeding port (21) and on the top wall of the conveying belt (2) to clean the products.

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