Heat dissipation film and display device

Abstract

The invention provides a heat dissipation film and a display device. The heat dissipation film comprises a heat conduction layer, a first sub-buffer layer and a second sub-buffer layer. Wherein the first sub-buffer layer is located on one side of the heat conduction layer, and the density of the first sub-buffer layer is smaller than that of the heat conduction layer. The second sub-buffer layer is located on the side, away from the heat conduction layer, of the first sub-buffer layer. The tensile modulus of the first sub-buffer layer is smaller than that of the heat conducting layer and larger than that of the second sub-buffer layer. The heat dissipation film has good heat conduction performance, and heat on one side of the second sub-buffer layer can be conducted out through the heat conduction layer, so that the internal temperature of the display device is reduced, and local overheating of the display device is prevented. In addition, the heat dissipation film further has good impact resistance and die mark resistance, meanwhile, the heat dissipation film has good strength and low weight, the overall weight of the display device can be reduced, and the portability and use comfort of the display device can be improved.

Description

Heat dissipation film and display device Technical Field

[0001] This application relates to the field of display technology, and more particularly to a heat dissipation film and a display device. Background Technology

[0002] Heat dissipation films can conduct heat generated by the display device to the outside environment, thereby effectively reducing the operating temperature of the display device. Heat dissipation films also provide mechanical protection for the display device, preventing deformation or damage under external forces.

[0003] The existing heat dissipation film is relatively heavy, which increases the overall weight of the display device and affects the user's carrying experience. Summary of the Invention

[0004] This application provides a heat dissipation film and a display device.

[0005] A first aspect of this application provides a heat dissipation film, the heat dissipation film comprising:

[0006] Thermal conductive layer;

[0007] The first sub-buffer layer is located on one side of the heat-conducting layer; the density of the first sub-buffer layer is less than the density of the heat-conducting layer.

[0008] The second sub-buffer layer is located on the side of the first sub-buffer layer away from the heat-conducting layer; the tensile modulus of the first sub-buffer layer is less than the tensile modulus of the heat-conducting layer and greater than the tensile modulus of the second sub-buffer layer.

[0009] In one embodiment, the thickness of the second sub-buffer layer is greater than the thickness of the first sub-buffer layer.

[0010] In one embodiment, the second sub-buffer layer is viscous.

[0011] In one embodiment, the heat dissipation film further includes an adhesive layer located on the side of the first sub-buffer layer facing the thermally conductive layer, wherein the tensile modulus of the adhesive layer is less than that of the thermally conductive layer.

[0012] In one embodiment, the material of the adhesive layer is the same as the material of the second sub-buffer layer.

[0013] In one embodiment, the thickness of both the adhesive layer and the second sub-buffer layer is greater than the thickness of the first sub-buffer layer.

[0014] In one embodiment, the heat dissipation film includes two or more first sub-buffer layers located between the thermally conductive layer and the second sub-buffer layer, and each first sub-buffer layer has the adhesive layer on the side facing the thermally conductive layer.

[0015] In one embodiment, the tensile modulus of the first sub-buffer layer is greater than 5 GPa; the tensile modulus of the second sub-buffer layer ranges from 15 KPa to 30 KPa.

[0016] In one embodiment, the first sub-buffer layer is a polyimide buffer layer or a polyethylene terephthalate buffer layer; the second sub-buffer layer is a silicone gel buffer layer.

[0017] In one embodiment, the thickness of the first sub-buffer layer ranges from 20 μm to 30 μm; the thickness of the second sub-buffer layer ranges from 120 μm to 135 μm.

[0018] In one embodiment, the tensile modulus of the thermally conductive layer is greater than 90 GPa.

[0019] In one embodiment, the thickness of the thermally conductive layer ranges from 15 μm to 30 μm.

[0020] A second aspect of this application provides a display device, the display device including a display panel and the aforementioned heat dissipation film, the heat dissipation film being attached to the side of the display panel away from the light-emitting surface, and a second sub-buffer layer being located between the display panel and the first sub-buffer layer.

[0021] The heat dissipation film provided in this application embodiment has excellent thermal conductivity, which can conduct heat from the second sub-buffer layer through the heat-conducting layer, thereby reducing the internal temperature of the display device and preventing local overheating. The heat dissipation film also has good impact resistance and anti-molding properties, while having good strength and low weight, which can reduce the overall weight of the display device and improve its portability and user comfort.

[0022] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0024] Figure 1 is a schematic diagram of the structure of a heat dissipation film provided in an embodiment of this application;

[0025] Figure 2 is a schematic diagram of the structure of a heat dissipation film provided in another embodiment of this application;

[0026] Figure 3 is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0027] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0028] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0029] The heat dissipation film and display device of the present application embodiments will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features of the following embodiments and implementations can complement or combine with each other.

[0030] This application provides a heat dissipation film. As shown in FIG1, the heat dissipation film 100 includes a thermally conductive layer 10, a first sub-buffer layer 11, and a second sub-buffer layer 12.

[0031] The first sub-buffer layer 11 is located on one side of the heat-conducting layer 10, and the density of the first sub-buffer layer 11 is less than the density of the heat-conducting layer 10. The second sub-buffer layer 12 is located on the side of the first sub-buffer layer 11 away from the heat-conducting layer 10, and the tensile modulus of the first sub-buffer layer 11 is less than the tensile modulus of the heat-conducting layer 10 and greater than the tensile modulus of the second sub-buffer layer 12.

[0032] The thermally conductive layer 10 is used to conduct heat to the outside. At the same time, the thermally conductive layer 10 has a high density and tensile modulus, which can improve the anti-mold performance of the heat dissipation film 100. The second sub-buffer layer 12 has a low tensile modulus and greater flexibility, which can absorb more impact energy and improve the impact resistance of the heat dissipation film 100.

[0033] To achieve a lightweight design for the heat dissipation film 100, the thickness of the thermally conductive layer 10 needs to be designed to be relatively thin. However, a thinner thermally conductive layer would reduce the strength of the heat dissipation film. Therefore, to ensure that the heat dissipation film is lightweight while maintaining sufficient strength, a first sub-buffer layer 11 is provided between the thermally conductive layer 10 and the second sub-buffer layer 12. The tensile modulus of the first sub-buffer layer 11 is between that of the thermally conductive layer 10 and the second sub-buffer layer 12. Therefore, the first sub-buffer layer 11 helps to enhance the strength of the heat dissipation film 100, thereby allowing the thickness of the stronger thermally conductive layer 10 to be set smaller while ensuring the strength of the heat dissipation film 100. Since the density of the first sub-buffer layer 11 is less than that of the thermally conductive layer 10, it helps to reduce the overall weight of the heat dissipation film 100. Furthermore, the first sub-buffer layer 11 also helps to increase the impact resistance of the heat dissipation film 100.

[0034] The heat dissipation film 100 of this application has good thermal conductivity, which can conduct heat from one side of the second sub-buffer layer 12 through the heat-conducting layer 10, thereby reducing the internal temperature of the display device and preventing local overheating. The heat dissipation film 100 also has good impact resistance and anti-molding properties, while having good strength and low weight, which can reduce the overall weight of the display device and improve its portability and user comfort.

[0035] In one embodiment, the tensile modulus of the thermally conductive layer 10 is greater than 90 GPa. When the thermally conductive layer 10 has a high tensile modulus, it is less likely to develop indentations under external forces, which is beneficial to improving the anti-imprinting performance of the heat dissipation film 100.

[0036] In one embodiment, the thermally conductive layer 10 may be a copper foil layer, which has good thermal conductivity and high strength, thus improving the heat dissipation performance and anti-molding ability of the heat dissipation film 100.

[0037] In one embodiment, the thickness of the thermally conductive layer 10 ranges from 15 μm to 30 μm. This configuration ensures that the thermally conductive layer 10 not only possesses sufficient thermal conductivity and mechanical strength but also has a relatively light weight, which is beneficial for achieving a lightweight design of the heat dissipation film 100. In some embodiments, the thickness of the thermally conductive layer 10 can be 15 μm, 20 μm, 25 μm, 30 μm, etc.

[0038] In one embodiment, the tensile modulus of the first sub-buffer layer 11 is greater than 5 GPa. The first sub-buffer layer 11 possesses a certain mechanical strength as well as a certain degree of flexibility and cushioning, which is beneficial to improving the anti-molding performance and impact resistance of the heat dissipation film 100.

[0039] In one embodiment, the first sub-buffer layer 11 is a polyimide buffer layer or a polyethylene terephthalate buffer layer. That is, the material of the first sub-buffer layer 11 is polyimide or polyethylene terephthalate. The polyimide buffer layer or the polyethylene terephthalate buffer layer has a certain strength and flexibility, and also has high thermal stability, which is beneficial to improving the overall performance of the heat dissipation film.

[0040] In one embodiment, the thickness of the first sub-buffer layer 11 ranges from 20 μm to 30 μm. This setting avoids the first sub-buffer layer 11 being too thin, which would be detrimental to improving the strength of the heat dissipation film, and also avoids the first sub-buffer layer 11 being too thick, which would result in a large thickness of the heat dissipation film. Within the above-mentioned numerical range, the first sub-buffer layer 11 can possess a certain strength and flexibility, while allowing the heat dissipation film 100 to have a relatively thin thickness. In some embodiments, the thickness of the first sub-buffer layer 11 can be 20 μm, 23 μm, 27 μm, 30 μm, etc.

[0041] In one embodiment, the tensile modulus of the second sub-buffer layer 12 ranges from 15 kPa to 30 kPa. This configuration provides the second buffer layer 12 with good flexibility and cushioning performance, effectively absorbing external impacts and vibrations, and improving the impact resistance of the heat dissipation film 100. In some embodiments, the tensile modulus of the second sub-buffer layer 12 can be 15 kPa, 20 kPa, 25 kPa, 30 kPa, etc.

[0042] In one embodiment, the second sub-buffer layer 12 is adhesive. One side of the second sub-buffer layer 12 is bonded to the side of the first sub-buffer layer 11 away from the heat-conducting layer 10, and the other side is bonded to the display panel of the display device, thereby ensuring that the heat dissipation film 100 is tightly attached to the display panel and improving heat dissipation efficiency.

[0043] In one embodiment, the second sub-buffer layer 12 is a silicone gel buffer layer. That is, the material of the second sub-buffer layer 12 is silicone gel. The silicone gel buffer layer has good flexibility and can effectively absorb the energy generated by external impacts, improving the impact resistance of the heat dissipation film. The silicone gel buffer layer also has adhesiveness, which can ensure a tight fit between the heat dissipation film 100 and the display panel. At the same time, the silicone gel buffer layer has good thermal stability and is suitable for high-temperature environments.

[0044] In one embodiment, the thickness of the second sub-buffer layer 12 is greater than the thickness of the first sub-buffer layer 11. The thicker second sub-buffer layer 12 provides better buffering performance, absorbing more impact energy and reducing the impact of external impacts on the display device. The thinner first sub-buffer layer 11 can improve the overall strength of the heat dissipation film without significantly increasing its weight, and it also facilitates rapid heat conduction.

[0045] In one embodiment, the thickness of the second sub-buffer layer 12 ranges from 120 μm to 135 μm. A thicker second sub-buffer layer 12 provides better buffering performance, preventing damage to the display device under external forces. Furthermore, a thicker second sub-buffer layer 12 can adapt to uneven surfaces, allowing for a tighter fit between the heat dissipation film and the display panel. When the second sub-buffer layer 12 is adhesive, a thicker layer can maintain good adhesion even after prolonged use, preventing detachment or peeling. In some embodiments, the thickness of the second sub-buffer layer 12 can be 120 μm, 125 μm, 130 μm, 135 μm, etc.

[0046] In one embodiment, as shown in FIG1, the heat dissipation film 100 further includes an adhesive layer 13 located on the side of the first sub-buffer layer 11 facing the thermally conductive layer 10. The tensile modulus of the adhesive layer 13 is less than that of the thermally conductive layer 10. The adhesive layer 13 can ensure that the thermally conductive layer 10 is tightly bonded to the first sub-buffer layer 11, reducing the risk of delamination of the heat dissipation film. Furthermore, the lower tensile modulus of the adhesive layer 13 allows it to better adapt to deformation under external forces, reducing stress concentration in the heat dissipation film.

[0047] In one embodiment, the material of the adhesive layer 13 is the same as that of the second sub-buffer layer 12. This makes the bonding effect between the adhesive layer 13 and the first sub-buffer layer 11 basically the same as that between the second sub-buffer layer 12 and the first sub-buffer layer 11, thereby ensuring that the peeling force on both sides of the first sub-buffer layer 11 is basically the same, which can prevent the heat dissipation film from delaminating or peeling.

[0048] In one embodiment, the thickness of both the adhesive layer 13 and the second sub-buffer layer 12 is greater than the thickness of the first sub-buffer layer 11. This improves the adhesion between the first sub-buffer layer 11 and the thermally conductive layer 10, as well as the adhesion between the first sub-buffer layer 11 and the display panel, preventing the heat dissipation film from delaminating or detaching from the display panel.

[0049] In one embodiment, as shown in FIG2, the heat dissipation film 100 includes two or more first sub-buffer layers 11 located between the thermally conductive layer 10 and the second sub-buffer layer 12. Each first sub-buffer layer 11 has an adhesive layer 13 on its side facing the thermally conductive layer 10. The multiple first sub-buffer layers 11 are connected by the adhesive layers 13. The first sub-buffer layer 11 closest to the thermally conductive layer 10 is bonded to the thermally conductive layer 10 through an adhesive layer, while the first sub-buffer layer 11 furthest from the thermally conductive layer 10 is bonded to the display panel of the display device through the second sub-buffer layer 12. By providing multiple first sub-buffer layers 11, the mechanical strength of the heat dissipation film 100 can be increased without significantly increasing its weight, which is beneficial for achieving a lightweight heat dissipation film.

[0050] This application tested multiple first sub-buffer layers, and the results of the material, thickness and measured tensile modulus of the first sub-buffer layers are shown in Table 1.

[0051] Table 1

[0052] Serial Number ABCD Thickness / μm 25±5 25±5 25±5 25±5 Material PET PET PI PET Tensile Modulus / Gpa 1.5 5.1 9 8.5 6.7 surface

[0053] In Table 1, the material of the first sub-buffer layer with serial numbers A, B, and D is PET (Polyethylene Terephthalate); the material of the first sub-buffer layer with serial number C is PI (Polyimide).

[0054] This application tested four different heat dissipation films, and the materials, thicknesses, and anti-film-printing capabilities of each layer of the four heat dissipation films are shown in Table 2. The adhesive layer and the second sub-buffer layer of the four heat dissipation films are made of SEPA (silicone gel).

[0055] Table 2

[0056]

[0057]

[0058] As shown in Table 2, in all four types of heat dissipation films, the thermally conductive layer is made of copper and has a thickness of 18 micrometers; the adhesive layer is made of silicone gel and has a thickness of 40 micrometers; the second sub-buffer layer is made of silicone gel and has a thickness of 100 micrometers; and the total thickness of the heat dissipation film is 183 micrometers. The first sub-buffer layer in the four types of heat dissipation films corresponds to the four first sub-buffer layers numbered A to D in Table 1. Table 2 shows that when the tensile modulus of the first sub-buffer layer is greater than 5 GPa, the heat dissipation film exhibits good anti-mold printing ability.

[0059] The embodiments of this application also conducted a performance comparison test between the heat dissipation film in the related technology and the heat dissipation film of this application, and the test results are shown in Table 3.

[0060] Table 3

[0061]

[0062]

[0063] As shown in Table 3, the heat dissipation film in the related technologies only includes a thermally conductive layer made of copper and a second sub-buffer layer made of silicone gel. Compared with the heat dissipation film in the related technologies, the thermally conductive layer of this application is thinner, and the total weight of the heat dissipation film of this application is 2.62 grams lighter than that of the heat dissipation film in the related technologies. The test values ​​of the anti-mold and drop ball resistance of the heat dissipation film of this application are both greater than those of the heat dissipation film in the related technologies, indicating that the heat dissipation film of this application is not only lighter but also has excellent anti-mold and impact resistance.

[0064] This application also provides a display device, as shown in FIG3. The display device includes a display panel 200 and the aforementioned heat dissipation film 100, wherein the heat dissipation film 100 is attached to the side of the display panel 200 away from the light-emitting surface. A second sub-buffer layer is located between the display panel and the first sub-buffer layer. The heat dissipation film 100 can conduct and dissipate the heat generated by the display panel during operation through a thermally conductive layer.

[0065] In one embodiment, as shown in FIG3, a flexible circuit board 600 is provided on the side of the heat dissipation film 100 of the display device away from the display panel 200, and a polarizer 300, an optical adhesive layer 400 and a cover plate 500 are sequentially stacked on the side of the display panel 200 away from the heat dissipation film 100.

[0066] This application does not impose specific limitations on the application of display devices, which can be any product or component with display function, such as televisions, laptops, tablets, wearable display devices, mobile phones, in-vehicle displays, navigation systems, e-books, digital photo frames, and advertising light boxes.

[0067] It should be noted that the technical solutions or features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A heat dissipation film, characterized in that, The heat dissipation film includes: a thermally conductive layer; a first sub-buffer layer located on one side of the thermally conductive layer; the density of the first sub-buffer layer is less than the density of the thermally conductive layer; a second sub-buffer layer located on the side of the first sub-buffer layer away from the thermally conductive layer; the tensile modulus of the first sub-buffer layer is less than the tensile modulus of the thermally conductive layer and greater than the tensile modulus of the second sub-buffer layer.

2. The heat dissipation film according to claim 1, characterized in that, The thickness of the second sub-buffer layer is greater than the thickness of the first sub-buffer layer.

3. The heat dissipation film according to claim 1, characterized in that, The second sub-buffer layer is viscous.

4. The heat dissipation film according to claim 1, characterized in that, The heat dissipation film also includes an adhesive layer located on the side of the first sub-buffer layer facing the heat-conducting layer, wherein the tensile modulus of the adhesive layer is less than that of the heat-conducting layer.

5. The heat dissipation film according to claim 4, characterized in that, The adhesive layer is made of the same material as the second sub-buffer layer.

6. The heat dissipation film according to claim 5, characterized in that, The thickness of both the adhesive layer and the second sub-buffer layer is greater than the thickness of the first sub-buffer layer.

7. The heat dissipation film according to claim 4, characterized in that, The heat dissipation film includes two or more first sub-buffer layers located between the heat-conducting layer and the second sub-buffer layer, and each first sub-buffer layer has the adhesive layer on the side facing the heat-conducting layer.

8. The heat dissipation film according to claim 1, characterized in that, The tensile modulus of the first sub-buffer layer is greater than 5 GPa; the tensile modulus of the second sub-buffer layer ranges from 15 KPa to 30 KPa.

9. The heat dissipation film according to claim 1, characterized in that, The first sub-buffer layer is a polyimide buffer layer or a polyethylene terephthalate buffer layer; the second sub-buffer layer is a silicone gel buffer layer.

10. The heat dissipation film according to claim 1, characterized in that, The thickness of the first sub-buffer layer ranges from 20 μm to 30 μm; the thickness of the second sub-buffer layer ranges from 120 μm to 135 μm.

11. The heat dissipation film according to claim 1, characterized in that, The tensile modulus of the thermally conductive layer is greater than 90 GPa.

12. The heat dissipation film according to claim 1, characterized in that, The thickness of the heat-conducting layer ranges from 15μm to 30μm.

13. A display device, characterized in that, The display device includes a display panel and a heat dissipation film as described in any one of claims 1 to 12, wherein the heat dissipation film is attached to the side of the display panel away from the light-emitting surface, and the second sub-buffer layer is located between the display panel and the first sub-buffer layer.

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