Silicon wafer cleaning device for preparing silicon target material

Abstract

The utility model discloses a silicon wafer cleaning device for preparing a silicon target material, which comprises stand column cross supports, a cross support connecting frame is arranged between the stand column cross supports, a driving assembly is arranged at the upper end of the cross support connecting frame, and a silicon wafer placing seat is arranged at the output end of the driving assembly. The silicon wafer placement seat comprises an external frame body, a silicon wafer storage rack, sleeving shafts and a transmission group, the sleeving shafts are arranged at the upper end and the lower end of the silicon wafer storage rack, and the external frame body is sleeved with the two ends of each sleeving shaft. The safe, efficient and environment-friendly silicon wafer cleaning process is achieved, a firm foundation structure is constructed by the stand column transverse support and the transverse support connecting frame, and the stability of the whole device in the working process is guaranteed; the driving assembly drives the silicon wafer storage rack to rotate through the transmission set, it is ensured that the silicon wafers can make uniform contact with cleaning liquid in the cleaning process, and the cleaning efficiency and quality are improved.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer processing, and specifically to a silicon wafer cleaning device for preparing silicon target materials. Background Art

[0002] Silicon wafers need to be cut during the preparation of silicon targets. Diamond cutting is a highly efficient cutting method, but it produces a lot of cutting chips. Traditional silicon wafer cleaning methods often result in uneven cleaning, which leads to insufficient contact between the cleaning liquid and the silicon wafer, affecting the cleaning effect. At the same time, the unstable fixation of the silicon wafer during the cleaning process may also cause the silicon wafer to shift or even fall off during rotation or movement, which has an adverse effect on the quality of the silicon wafer and the yield of the production line. In addition, in terms of environmental protection and energy conservation, many existing devices fail to effectively recycle and reuse cleaning waste liquid, resulting in waste of resources and environmental pollution. Summary of the invention

[0003] The technical problem to be solved by the present application is to overcome the existing defects and provide a silicon wafer cleaning device for preparing silicon target materials, which has an efficient and stable driving system to ensure that the silicon wafer can be evenly contacted with the cleaning liquid; the silicon wafer fixing method is safe and reliable to ensure the stability of the silicon wafer during the cleaning process, and the cleaning waste liquid is effectively recovered and recycled to achieve the purpose of energy saving and environmental protection, which can effectively solve the problems in the background technology.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical solutions: A silicon wafer cleaning device for preparing silicon target material, comprising a column cross brace, a cross brace connecting frame is arranged between the column cross braces, a driving component is arranged at the upper end of the cross brace connecting frame, a silicon wafer placement seat is arranged at the output end of the driving component, the silicon wafer placement seat comprises an external frame, a silicon wafer storage rack, a sleeve shaft and a transmission group, the upper and lower ends of the silicon wafer storage rack are provided with a sleeve shaft, the two ends of the sleeve shaft are sleeved on the external frame, and the upper end of the sleeve shaft (7) is connected to the transmission group, cleaning components are arranged on both sides of the column cross brace, the cleaning components comprise side supports, linear slide rails, a power component, and a cleaning cross brace frame, the side supports are installed with linear slide rails, the linear slide rails are provided with a cleaning cross brace frame, and the driving end of the power component is connected to the cleaning cross brace frame arranged on the linear slide rail.

[0005] As a preferred technical solution of the present application, a pad support group is provided at the lower end of the column cross brace, and the pad support group is connected to the external fixing frame through fasteners.

[0006] As a preferred technical solution of the present application, the output end of the driving component is connected to the transmission group on the silicon wafer placement seat.

[0007] As a preferred technical solution of the present application, the silicon wafer storage rack comprises an external ring and a pressure block, the external ring is provided with a slide groove, and the slide groove is slidably provided with a pressure block.

[0008] As a preferred technical solution of the present application, a cushioning cotton is attached to the inner side of the pressing block.

[0009] As a preferred technical solution of the present application, the end of the pressing block is designed to be inclined.

[0010] Compared with the prior art: the present application has efficient cleaning performance, flexible workpiece positioning function and good protection for silicon wafers, realizing the safety, efficiency and environmental protection of the silicon wafer cleaning process. The column cross brace and the cross brace connecting frame construct a solid basic structure to ensure the stability of the entire device during operation; the driving assembly drives the silicon wafer rack to rotate through the transmission group to ensure that the silicon wafer can evenly contact the cleaning liquid during the cleaning process, thereby improving the cleaning efficiency and quality. The cleaning assembly is equipped with a linear slide rail and a power assembly, so that the cleaning cross brace can be accurately adjusted according to the position and angle of the silicon wafer, thereby realizing all-round and uniform cleaning of the silicon wafer; the adjustable nozzle design on the cleaning cross brace can adapt to silicon wafers of different shapes and sizes, further enhancing the targeted and comprehensive nature of the cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic diagram of the structure of this application;

[0012] Figure 2 This is the main view of this application;

[0013] Figure 3 Schematic diagram of the silicon wafer rack structure.

[0014] In the figure: 1 column cross brace, 2 cross brace connecting frame, 3 drive assembly, 4 silicon wafer placement seat, 5 external frame, 6 silicon wafer storage rack, 7 sleeve shaft, 8 transmission group, 9 cleaning assembly, 10 side support, 11 linear slide rail, 12 power assembly, 13 cleaning cross brace, 14 cushion support group, 15 external ring, 16 external fixing frame, 17 slide groove, 18 pressure block, 19 buffer cotton. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application (for the convenience of description and understanding, the following is Figure 2 All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0016] See also Figure 1-3The present application provides a technical solution: a silicon wafer cleaning device for preparing silicon target material, comprising a column cross brace 1, a cross brace connecting frame 2 is arranged between the column cross brace 1, and a driving component 3 is arranged at the upper end of the cross brace connecting frame 2.

[0017] The column cross brace 1 supports the structure of the entire device to ensure its stability and firmness. The cross brace connecting frame 2 connects the column cross brace 1 to increase the rigidity and strength of the device. The driving component 3 provides power to drive the silicon wafer rack 6 in the silicon wafer placement seat 4 to rotate, so that the silicon wafer can evenly contact the cleaning liquid during the cleaning process.

[0018] The output end of the driving assembly 3 is provided with a silicon wafer placement seat 4, and the silicon wafer placement seat 4 includes an external frame 5, a silicon wafer storage rack 6, a sleeve shaft 7 and a transmission group 8. The upper and lower ends of the silicon wafer storage rack 6 are provided with a sleeve shaft 7, and the two ends of the sleeve shaft 7 are sleeved on the external frame 5, and the upper end of the sleeve shaft (7) is connected to the transmission group 8.

[0019] The wafer placement seat 4 is used to place silicon wafers, and the external frame 5 fixes the silicon wafer rack 6 to provide a mounting position for the installation of various components; the silicon wafer rack 6 is used to fix silicon wafers, and the sleeve shaft 7 connects the silicon wafer rack 6 and the external frame 5, so that the silicon wafer rack 6 can rotate in the external frame 5. The transmission group 8 connects the sleeve shaft 7 and the driving component 3 to transmit power, so that the silicon wafer rack 6 can rotate with the rotation of the driving component 3.

[0020] Cleaning components 9 are arranged on both sides of the column cross brace 1, and the cleaning components 9 include side supports 10, linear slide rails 11, power components 12, and cleaning cross brace frames 13. The linear slide rails 11 are installed on the side supports 10, and the cleaning cross brace frames 13 are arranged on the linear slide rails 11. The driving end of the power component 12 is connected to the cleaning cross brace frame 13 arranged on the linear slide rails 11.

[0021] The cleaning assembly 9 is used to clean silicon wafers, and the side supports 10 support the cleaning assembly 9 so that it can move on both sides of the column cross brace 1. The linear slide rail 11 is installed on the side support 10 to provide a smooth moving track so that the cleaning cross brace frame 13 can move horizontally on the linear slide rail 11. The power assembly 12 provides power to drive the cleaning cross brace frame 13 to move on the linear slide rail 11, so that the cleaning cross brace frame 13 can be adjusted according to the position and angle of the silicon wafer to achieve the best cleaning effect. The cleaning cross brace frame 13 is installed on the linear slide rail 11 and is used to spray cleaning liquid to clean the silicon wafer. The cleaning cross brace frame 13 is provided with multiple nozzles, which can be adjusted according to the shape and size of the silicon wafer to achieve uniform and comprehensive cleaning.

[0022] Furthermore, a cushion support group 14 is provided at the lower end of the column cross brace 1, and the cushion support group 14 is connected to the external fixing frame 16 through fasteners.

[0023] The pad support group 14 is arranged at the lower end of the column cross support 1, and is used to raise the whole device, so that it keeps a certain distance from the ground, and is convenient for the discharge and recovery of the cleaning liquid. The external fixing frame 16 is used to fix the whole device to prevent it from shaking or tilting during the cleaning process.

[0024] Furthermore, the output end of the driving component 3 is connected to the transmission group 8 on the silicon wafer placement seat 4.

[0025] Furthermore, the silicon wafer storage rack 6 is composed of an external ring 15 and a pressing block 18 . The external ring 15 is provided with a sliding groove 17 . The sliding groove 17 is slidably provided with the pressing block 18 .

[0026] The outer ring 15 forms a circular space for placing the silicon wafer. The pressing block 18 is used to press the silicon wafer to prevent it from falling off or shifting during the rotation process.

[0027] Furthermore, a cushioning cotton 19 is attached to the inner side of the pressing block 18 .

[0028] A cushioning cotton 19 is attached to the inner side of the pressing block 18 to reduce the wear and scratches on the silicon wafer.

[0029] Furthermore, the end of the pressing block 18 is designed to be inclined.

[0030] The end of the pressing block 18 is inclined, so that the pressing block 18 can better adapt to the silicon wafer and ensure the pressing effect.

[0031] When in use: place the silicon wafer in the external ring 15, adjust the position of the pressing block 18 so that it fits tightly with the silicon wafer, press the silicon wafer and fix it on the silicon wafer rack 6. Start the drive assembly 3 to make the silicon wafer rack 6 start to rotate, and start the power assembly 12 at the same time to move the cleaning cross support frame 13 on the linear slide rail 11 to clean the silicon wafer. After cleaning, stop the drive assembly 3 and the power assembly 12, release the pressing block 18, take out the silicon wafer, and the cleaning liquid can be discharged through the drain port below the external fixing frame 16, or it can be recycled and reused through the recycling system.

[0032] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cleaning device for preparing silicon target material, comprising a column and a cross brace (1), wherein a cross brace connecting frame (2) is arranged between the column and the cross brace (1), Features: A driving assembly (3) is arranged at the upper end of the cross-bracing connecting frame (2); a silicon wafer placement seat (4) is arranged at the output end of the driving assembly (3); the silicon wafer placement seat (4) comprises an external frame (5), a silicon wafer storage rack (6), a sleeve shaft (7) and a transmission group (8); sleeve shafts (7) are arranged at the upper and lower ends of the silicon wafer storage rack (6); the two ends of the sleeve shaft (7) are sleeved on the external frame (5), and the upper end of the sleeve shaft (7) is connected to the transmission group (8); Cleaning components (9) are arranged on both sides of the upright cross brace (1), and the cleaning component (9) comprises a side support (10), a linear slide rail (11), a power component (12), and a cleaning cross brace frame (13). The linear slide rail (11) is installed on the side support (10), and the cleaning cross brace frame (13) is arranged on the linear slide rail (11). The driving end of the power component (12) is connected to the cleaning cross brace frame (13) arranged on the linear slide rail (11).

2. A silicon wafer cleaning device for preparing silicon target material according to claim 1, Features: A cushion support group (14) is provided at the lower end of the upright column cross brace (1), and the cushion support group (14) is connected to an external fixing frame (16) via a fastener.

3. A silicon wafer cleaning device for preparing silicon target material according to claim 1, Features: The output end of the driving component (3) is connected to the transmission group (8) on the silicon wafer placement seat (4).

4. A silicon wafer cleaning device for preparing silicon target material according to claim 1, Features: The silicon wafer storage rack (6) comprises an external ring (15) and a pressing block (18); a sliding groove (17) is provided on the external ring (15); and a pressing block (18) is slidably provided on the sliding groove (17).

5. A silicon wafer cleaning device for preparing silicon target material according to claim 4, Features: The inner side of the pressing block (18) is provided with a cushioning cotton (19) attached to the inner side.

6. A silicon wafer cleaning device for preparing silicon target material according to claim 4, Features: The end of the pressing block (18) is designed to be inclined.

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