Wafer conveying mechanism and grinding device
By designing the wafer conveying mechanism, using air pipes and adsorbents to fix and transport small square wafers, the problems of low wafer positioning and grinding efficiency are solved, and efficient automatic grinding processing on the side of the wafer is achieved.
Patent Information
- Application Number
- CN202323577095.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2033-12-26
AI Technical Summary
The prior art is difficult to effectively fix and position small square wafers, resulting in low efficiency in the side grinding of wafers, and usually requires hand-held sandpaper or grinding wheels.
A wafer conveying mechanism is designed, including a tracheal tube and an adsorption member. The wafer adsorption is fixed on the bearing surface through the air pipe suction, and the adsorption member is driven to move in the horizontal direction through the conveying assembly to realize the positioning and conveying of the wafer to the grinding mechanism to ensure that the The side of the wafer can directly contact the grinding mechanism.
The fixed positioning and automated conveying of the wafer are realized, which improves the efficiency of side grinding of the wafer and avoids inefficiency in handheld operations.
Smart Images
Figure CN222134533U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer conveying mechanism and a grinding device. Background Art
[0002] The six sides of the square wafer are all coated. In some cases, it is necessary to grind and remove the coating on the four sides of the wafer while retaining the coating on the upper and lower surfaces. Due to the small size of the wafer (5mm×5mm×1mm, 5mm×5mm×2.5mm, 6mm×8mm×2mm, etc.) and different specifications, it is difficult to clamp and fix the wafer in a clamping manner to achieve the positioning of the wafer, and it is also impossible to transport the positioned wafer to the grinding mechanism to achieve the grinding of the side of the wafer. Therefore, most of the wafers are currently ground on sandpaper or a grinding wheel by hand, which reduces the processing efficiency of the wafer. Utility Model Content
[0003] Aiming to solve at least one of the technical problems existing in the prior art, the utility model provides a wafer conveying mechanism and a grinding device including the wafer conveying mechanism, wherein the wafer conveying mechanism can realize the integration and automation of fixed positioning and conveying of the wafer, thereby improving the processing efficiency of the wafer.
[0004] In order to achieve the above-mentioned purpose, the utility model provides a chip conveying mechanism, including a conveying component and a fixing component; the fixing component includes an air pipe and a suction component, the suction component is connected to the conveying component and is located above the conveying component, the conveying component can drive the suction component to move along a first horizontal direction, the upper end of the suction component has a bearing surface for bearing the chip, the bearing surface is provided with a first air vent that passes through the suction component from top to bottom, the air pipe is connected to the suction component and communicates with the first air vent; wherein the bottom surface area of the chip is larger than the area of the bearing surface, and when the center line of the chip coincides with the center line of the bearing surface, the projection of the chip at least covers the bearing surface along the extension direction of the center line of the chip.
[0005] In some embodiments, the fixing assembly further includes an air pipe connector, through which the air pipe is connected to the adsorption component and communicates with the first ventilation hole.
[0006] In some embodiments, the conveying component 1 is a linear module, which includes a module body and a slider, the adsorption component is connected to the slider, the module body and the slider are connected and can drive the slider to move along the first horizontal direction to drive the adsorption component to move along the first horizontal direction.
[0007] In some embodiments, a protective telescopic cover is also included, which includes a first elastic cover body, a rigid cover body and a second elastic cover body, the first elastic cover body has a first cavity, the rigid cover body has a second cavity, the second elastic cover body has a third cavity, the first elastic cover body and the second elastic cover body are respectively connected to the two ends of the rigid cover body in the first horizontal direction, the first cavity, the second cavity and the third cavity are interconnected to form a first accommodating cavity; the linear module is arranged in the first accommodating cavity, the slider is connected to the inner wall of the rigid cover body, and the adsorbent is connected to the outer wall of the rigid cover body.
[0008] In some embodiments, the rigid cover body includes a shell portion and a cover portion, the upper end of the shell portion is open to form a first opening, the cover portion is connected to the shell portion and covers the first opening, and the adsorption member is connected to the outer wall of the cover portion.
[0009] In some embodiments, a rotary drive member is further included, and the adsorption member is connected to the conveying assembly through the rotary drive member, and the rotary drive member can drive the adsorption member to rotate around the center line of the adsorption member.
[0010] In some embodiments, a protective cover is further included, wherein the protective cover is connected to the conveying assembly, a second accommodating chamber is opened inside the protective cover, the rotating driving member is arranged in the second accommodating chamber, and the upper end of the rotating driving member is connected to the adsorption member.
[0011] In some embodiments, the protective cover includes a shell portion and a cover portion, one end of the shell portion is open to form a second opening communicating with the second accommodating cavity, and the cover portion is connected to the shell portion and covers the second opening.
[0012] In some embodiments, the adsorption member includes a first connecting portion and a bearing portion, the first connecting portion is connected to the conveying component, the bearing portion is connected to the upper end of the first connecting portion, and the bearing surface is arranged at the upper end of the bearing portion.
[0013] The utility model also provides a grinding device, which comprises the wafer described in any one of the above items and also comprises a workbench, and the wafer conveying mechanism is installed on the top of the workbench.
[0014] Compared with the prior art, the wafer conveying mechanism provided by the embodiment of the utility model has the following beneficial effects: by placing the wafer on the carrying surface of the adsorbent, and then sucking air through the first vent hole through the air pipe, the wafer can be adsorbed and fixed on the carrying surface to realize the positioning of the wafer on the adsorbent, and then the adsorbent can be conveyed to the position of the grinding mechanism by driving the adsorbent to move along the first horizontal direction through the conveying component, and at the same time, by limiting the area of the wafer to be larger than the area of the carrying surface, the side of the wafer can be in a protruding state relative to the carrying surface, so that the grinding mechanism can directly approach and contact the side of the wafer to grind the side of the wafer, and there is no need to adjust the position of the wafer on the adsorbent at the position of the grinding mechanism; therefore, the wafer conveying mechanism provided by the utility model can fix and position the wafer on the adsorbent, and can convey the positioned wafer to the grinding mechanism for grinding the side of the wafer, thereby realizing the integration and automation of the fixed positioning and conveying of the wafer, and improving the processing efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a structural schematic diagram of a wafer conveying mechanism provided by an embodiment of the utility model;
[0016] Figure 2 yes Figure 1 A magnified schematic diagram of point A;
[0017] Figure 3 It is an exploded diagram of a wafer conveying mechanism provided by an embodiment of the utility model;
[0018] Figure 4 It is a schematic diagram of the structure of the adsorption member provided in the embodiment of the utility model;
[0019] Figure 5 It is a structural schematic diagram of a trachea joint provided by an embodiment of the utility model;
[0020] Figure 6 It is a cross-sectional view of a protective telescopic cover provided by an embodiment of the utility model;
[0021] Figure 7 It is an exploded view of the protective cover provided by the embodiment of the utility model;
[0022] Figure 8 It is a schematic structural diagram of a grinding device provided in an embodiment of the utility model.
[0023] In the figure, 1, conveying assembly; 11, module body; 12, slider;
[0024] 2. fixing assembly; 21. air pipe; 22. adsorption member; 23. air pipe joint; 221. first connection part; 222. bearing part; 231. joint part; 232. second connection part; 233. third connection part; 234. second vent hole; 2221. bearing surface; 2222. first vent hole;
[0025] 3. Protective telescopic cover; 30. First accommodating cavity; 31. First elastic cover body; 32. Rigid cover body; 33. Second elastic cover body; 301. First cavity; 302. Second cavity; 303. Third cavity; 311. Wire hole; 321. Shell part; 322. Cover part; 3211. Through hole;
[0026] 4. Rotating driving member; 41. Cylinder body; 42. Cylinder fixing plate; 421. Air inlet; 422. Air outlet;
[0027] 5. Protective cover; 50. Second accommodating chamber; 51. Shell portion; 52. Cover portion; 511. Rectangular shell portion; 512. Cylindrical shell portion;
[0028] 6. Protective bottom panel;
[0029] 7. Chip;
[0030] 100, wafer conveying mechanism; 200, workbench; 300, frame; 400, pressing mechanism; 500, grinding mechanism; 501, grinding unit; 600, spraying mechanism;
[0031] Y, first horizontal direction. DETAILED DESCRIPTION
[0032] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0034] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.
[0035] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0036] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0037] like Figure 1-8 As shown, a chip conveying mechanism provided by a preferred embodiment of the utility model includes a conveying component 1 and a fixing component 2, the fixing component 2 includes an air pipe 21 and a suction component 22, the suction component 22 is connected to the conveying component 1 and is located above the conveying component 1, the conveying component 1 can drive the suction component 22 to move along the first horizontal direction Y, the upper end of the suction component 22 has a carrying surface 2221 for carrying the chip 7, the carrying surface 2221 is provided with a first ventilation hole 2222 that passes through the suction component 22 from top to bottom, the air pipe 21 and the suction component 22 are connected and communicated with the first ventilation hole 2222; wherein, the bottom surface area of the chip 7 is larger than the area of the carrying surface 2221, and when the center line of the chip 7 coincides with the center line of the carrying surface 2221, along the extension direction of the center line of the chip 7, the projection of the chip 7 at least covers the carrying surface 2221.
[0038] Based on this technical solution, by placing the wafer 7 on the carrying surface 2221 of the adsorbent 22, and then sucking air from the first vent hole 2222 through the air pipe 21, the wafer 7 can be adsorbed and fixed on the carrying surface 2221, so as to realize the positioning of the wafer 7 on the adsorbent 22, and then the adsorbent 22 can be driven to move along the first horizontal direction Y by the conveying component 1, so that the adsorbent 22 can be conveyed to the position of the grinding mechanism, and at the same time, by limiting the area of the wafer 7 to be larger than the area of the carrying surface 2221, the side surface of the wafer 7 can be made to protrude relative to the carrying surface 2221 (that is, the side surface of the wafer 7 and the carrying surface are not protruding). 2221 do not overlap in the vertical direction), so that the grinding mechanism can directly approach and contact the side of the wafer 7 to grind the side of the wafer 7, and there is no need to adjust the position of the wafer 7 on the suction piece 22 at the position of the grinding mechanism; therefore, the wafer conveying mechanism provided by the utility model can fix the wafer on the suction piece 22 to realize the positioning of the wafer 7, and can convey the positioned wafer 7 to the grinding mechanism to perform the grinding process on the side of the wafer 7, thereby realizing the integration and automation of the fixed positioning and conveying of the wafer 7, and improving the processing efficiency of the wafer.
[0039] In this embodiment, the first horizontal direction Y is the Y-axis direction.
[0040] In some other implementations, the first horizontal direction Y may also be the X-axis direction.
[0041] The wafer 7 is a square wafer, and the shape and size of the top surface of the wafer 7 are substantially consistent with the shape and size of the bottom surface of the wafer 7 .
[0042] In this embodiment, the extension direction of the center line of the wafer 7 is the Z-axis direction.
[0043] In this embodiment, there are multiple fixing components 2 , and the multiple fixing components 2 are sequentially arranged on the conveying component 1 along the first horizontal direction Y at intervals.
[0044] See also Figure 2 The conveying assembly 1 is a linear module, which includes a module body 11 and a slider 12, and the adsorbent 22 is connected to the slider 12. The module body 11 and the slider 12 are connected and can drive the slider 12 to move along the first horizontal direction Y to drive the adsorbent 22 to move along the first horizontal direction Y. The linear module has the advantages of high precision, high speed, compact structure, energy saving and environmental protection, and strong adaptability.
[0045] See also Figure 1 , Figure 3 and Figure 6The wafer conveying mechanism provided by the embodiment of the utility model also includes a protective telescopic cover 3, which includes a first elastic cover body 31, a rigid cover body 32 and a second elastic cover body 33. The first elastic cover body 31 has a first cavity 301, the rigid cover body 32 has a second cavity 302, and the second elastic cover body 33 has a third cavity 303. The first elastic cover body 31 and the second elastic cover body 33 are respectively connected to the two ends of the rigid cover body 32 in the first horizontal direction Y, and the first cavity 301, the second cavity 302 and the third cavity 303 are interconnected to form a first accommodating cavity 30.
[0046] The linear module is arranged in the first accommodating cavity 30, the slider 12 is connected to the inner wall of the rigid cover 32, and the adsorbent 22 is connected to the outer wall of the rigid cover 32. The first elastic cover 31, the rigid cover 32 and the second elastic cover 33 form a protective telescopic cover 3, and the linear module is arranged in the protective telescopic cover 3, so that the linear module can drive the adsorbent 22 to move by driving the rigid cover 32 to move, thereby realizing the conveyance of the wafer 7, and the protective telescopic cover 3 can also be used to protect the linear module from water and dust, thereby avoiding damage to the linear module and extending the service life of the linear module.
[0047] A wire hole 311 communicating with the first accommodating chamber 30 is formed at one end of the first elastic cover body 31 away from the rigid cover body 32 . Wires such as air pipes, power lines, and signal lines can enter the first accommodating chamber 30 through the wire hole 311 .
[0048] The rigid cover body 32 includes a cover portion 321 and a cover portion 322. The upper end of the cover portion 321 is opened to form a first opening. The cover portion 322 is connected to the cover portion 321 and covers the first opening. The adsorbent 22 is connected to the outer wall of the cover portion 322. The use of the cover portion 321 and the cover portion 322 facilitates the installation of the linear module into the first accommodating cavity 30.
[0049] In some embodiments, the housing portion 321 and the cover portion 322 are detachably connected. The detachable connection facilitates the disassembly and installation of the linear module and the protective telescopic cover.
[0050] See also Figure 1 , Figure 3 and Figure 7 The wafer conveying mechanism provided by the embodiment of the utility model further includes a rotary driving member 4, through which the suction member 22 is connected to the conveying assembly, and the rotary driving member 4 can drive the suction member 22 to rotate around the center line of the suction member 22. The rotary driving member 4 can drive the wafer 7 to rotate, so that the ground side of the wafer 7 is no longer opposite to the grinding wheel, and the side to be ground on the wafer 7 is opposite to the grinding wheel, so that the grinding wheel can grind multiple side surfaces of the wafer 7, thereby improving the grinding efficiency of the wafer 7.
[0051] The wafer conveying mechanism further includes a protective cover 5, which is connected to the conveying assembly 1. A second accommodating chamber 50 is provided inside the protective cover 5. The rotary drive member 4 is disposed in the second accommodating chamber 50. The upper end of the rotary drive member 4 is connected to the adsorption member 22. The protective cover 5 is used to provide waterproof and dustproof protection for the rotary drive member 4, thereby preventing damage to the rotary drive member 4 and extending the service life of the rotary drive member 4.
[0052] Optionally, the upper end of the rotary drive member 4 passes through the second accommodating cavity 50 from the inside to the outside to connect with the adsorption member 22, or the lower end of the adsorption member 22 extends from the outside to the inside of the second accommodating cavity 50 to connect with the lower end of the rotary drive member 4.
[0053] In this embodiment, the rotating driving member 4 is a hollow rotating cylinder, which includes a cylinder body 41 and a cylinder fixing plate 42. The cylinder fixing plate 42 is provided with an air inlet hole 421 and an exhaust hole 422. The exhaust hole 422 is located at the center of the cylinder fixing plate 42 and passes through the upper and lower surfaces of the cylinder fixing plate 42. The air inlet hole 421 is an arc-shaped cross-section. The air inlet hole 421 is opened on one side of the cylinder fixing plate 42 and extends to the interior of the cylinder fixing plate 42 to intersect with the air inlet hole 421.
[0054] In some other embodiments, the driving component may also be any device such as a rotary motor or a rotary motor that can drive the adsorption component 22 to rotate.
[0055] In this embodiment, the housing portion 321 defines a through hole 3211 which is in communication with the first accommodating chamber 30 and through which the air pipe 21 can pass.
[0056] The protective bottom enclosure plate 6 is also included. The protective bottom enclosure plate 6 is connected to the top of the housing portion 321 and encloses an installation area. The through hole 3211 is provided in the installation area. The cylinder fixing plate 42 is connected to the protective bottom enclosure plate 6 and closes the installation area. The protective bottom enclosure plate 6 and the cylinder fixing plate 42 form a closed area to provide waterproof protection for the through hole 3211, so as to prevent water outside the protective telescopic cover from entering the first accommodation chamber through the through hole 3211.
[0057] Specifically, the protective bottom enclosure plate 6 is a hollow rectangular parallelepiped with closed sides and no upper and lower bottom surfaces.
[0058] In this embodiment, one end of the air pipe 21 is connected to the air pipe joint 23, and the other end passes through the protective cover 5, the cylinder body 41, the cylinder fixing plate 42 and the cover shell 321 in sequence.
[0059] The protective cover 5 includes a shell portion 51 and a cover portion 52 . One end of the shell portion 51 is open to form a second opening communicating with the second accommodating cavity 50 . The cover portion 52 is connected to the shell portion 51 and covers the second opening.
[0060] In this embodiment, the shell portion 51 includes a rectangular shell portion 511 and a cylindrical shell portion 512. The cylindrical shell portion 512 is connected to the top of the rectangular shell portion 511. The upper end of the cylindrical shell portion 512 is opened to form a third opening. The rotating drive member 4 is connected to the adsorption member 22 through the third opening.
[0061] See also Figure 2-Figure 5 The fixing assembly 2 provided in the embodiment of the utility model further includes an air pipe joint 23 , and the air pipe 21 is connected to the adsorption member 22 through the air pipe joint 23 and communicates with the first vent hole 2222 .
[0062] The adsorption member 22 includes a first connection portion 221 and a bearing portion 222 . The first connection portion 221 is connected to the conveying assembly 1 . The bearing portion 222 is connected to the upper end of the first connection portion 221 . The bearing surface 2221 is disposed at the upper end of the bearing portion 222 .
[0063] In this embodiment, the air pipe 21 is a hose.
[0064] In this embodiment, the first connection portion 221 is a disc-shaped structure.
[0065] Specifically, the first connecting portion 221 is connected to the cylindrical shell portion and covers the third opening.
[0066] In this embodiment, the supporting portion 222 is a cylindrical structure.
[0067] In some other embodiments, the supporting portion 222 may also be in a rectangular parallelepiped shape.
[0068] In this embodiment, there are multiple first ventilation holes 2222 , and the multiple first ventilation holes 2222 are sequentially spaced apart and distributed around the axis of the carrying portion 222 .
[0069] In this embodiment, the trachea connector 23 includes a connector portion 231, a second connector portion 232 and a third connector portion 233. The connector portion 231 is connected to the trachea 21, the second connector portion 232 is connected to the upper end of the connector portion 231, the third connector portion 233 is connected to the upper end of the second connector portion 232, and the first connector portion 221 is connected to the upper end of the third connector portion 233.
[0070] The joint part 231, the second connection part 232 and the third connection part 233 are all cylindrical structures. The outer diameter of the second connection part 232 is larger than the outer diameter of the joint part 231. The joint part 231 is arranged in the upper end of the cylinder body 41, and the lower end of the second connection part 232 is connected to the upper end of the cylinder body 41. The air pipe joint 23 is provided with a second air hole 234 that passes through the third connection part 233, the second connection part 232 and the joint part 231 from top to bottom in sequence. The air pipe 21 is connected to the first air hole 2222 through the second air hole 234.
[0071] See also Figure 8 The utility model also provides a grinding device, which includes any one of the above-mentioned wafers and a workbench 200 , and the wafer conveying mechanism 100 is installed on the top of the workbench 200 .
[0072] The grinding device also includes a frame 300, a pressing mechanism 400, a grinding mechanism 500 and a spraying mechanism 600. The frame 300 is connected to the workbench 200. The pressing mechanism 400 is connected to the top of the workbench 200 and is located above the wafer conveying mechanism 100. The grinding mechanism 500 includes a grinding unit 501. The grinding unit 501 is connected to the top of the workbench 200 and is located on one side of the wafer conveying mechanism 100. The spraying mechanism 600 is connected to the pressing mechanism 400 and is located above the wafer conveying mechanism 100.
[0073] The working process of the grinding device is as follows: placing the wafer 7 on the carrying surface 2221 of the adsorbent 22 to load the wafer 7 onto the carrying surface 2221, and then suctioning the first vent hole 2222 through the air pipe 21 to adsorb and fix the wafer 7 on the carrying surface 2221 to achieve the positioning of the wafer 7 on the adsorbent 22, and then driving the adsorbent 22 to move along the first horizontal direction Y through the conveying component 1 to convey the adsorbent 22 to the position of the grinding mechanism 500, and then driving the pressing plate to descend through the pressing mechanism 400 to press and fix the wafer 7, and the grinding unit 501 drives the grinding wheel to approach and contact the side of the wafer 7 to grind the side of the wafer 7, and after the grinding is completed, the pressing mechanism 400 and the grinding wheel return to their original positions. , the conveying component 1 drives the adsorption part 22 to return to its original position along the first horizontal direction Y, the air pipe 21 stops sucking air, and then the wafer 7 is removed from the adsorption part 22; during the side grinding process of the wafer 7, the spraying mechanism 600 sprays water on the wafer 7. The water spraying can not only lubricate the wafer 7 to improve the grinding efficiency of the wafer 7, but also take away the debris generated during the grinding process of the wafer 7 to keep the adsorption part 22 clean. Therefore, the grinding device provided by the utility model can realize the integration and automation of loading, fixed positioning, conveying, pressing, grinding, spraying and unloading of the wafer 7 through the wafer conveying mechanism 100, the pressing mechanism 400, the grinding mechanism 500 and the spraying mechanism 600, thereby improving the grinding efficiency and grinding effect of the wafer 7.
[0074] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.
Claims
1. A wafer conveying mechanism, characterized in that: include: Conveying components; A fixing assembly, the fixing assembly comprising an air pipe and an adsorbent, the adsorbent being connected to the conveying assembly and being located above the conveying assembly, the conveying assembly being capable of driving the adsorbent to move along a first horizontal direction, the upper end of the adsorbent having a bearing surface for bearing a wafer, the bearing surface being provided with a first vent hole penetrating the adsorbent from top to bottom, the air pipe being connected to the adsorbent and communicating with the first vent hole; The bottom surface area of the chip is larger than the area of the carrying surface, and when the center line of the chip coincides with the center line of the carrying surface, the projection of the chip at least covers the carrying surface along the extension direction of the center line of the chip.
2. The wafer conveying mechanism according to claim 1, characterized in that: The fixing assembly further comprises an air pipe joint, through which the air pipe is connected to the adsorption component and communicated with the first vent hole.
3. The wafer conveying mechanism according to claim 1, characterized in that: The conveying assembly is a linear module, which includes a module body and a slider. The adsorption member is connected to the slider. The module body and the slider are connected and can drive the slider to move along the first horizontal direction to drive the adsorption member to move along the first horizontal direction.
4. The wafer conveying mechanism according to claim 3, characterized in that: Also included is a protective telescopic cover, the protective telescopic cover includes a first elastic cover body, a rigid cover body and a second elastic cover body, the first elastic cover body has a first cavity, the rigid cover body has a second cavity, the second elastic cover body has a third cavity, the first elastic cover body and the second elastic cover body are respectively connected to two ends of the rigid cover body in the first horizontal direction, and the first cavity, the second cavity and the third cavity are interconnected to form a first accommodating cavity; The linear module is arranged in the first accommodating cavity, the sliding block is connected to the inner wall of the rigid cover, and the adsorbing member is connected to the outer wall of the rigid cover.
5. The wafer conveying mechanism according to claim 4, characterized in that: The rigid cover body comprises a cover shell portion and a cover cover portion, the upper end of the cover shell portion is opened to form a first opening, the cover cover portion is connected to the cover shell portion and covers the first opening, and the adsorption member is connected to the outer wall of the cover cover portion.
6. The wafer conveying mechanism according to claim 1, characterized in that: It also includes a rotary driving member, through which the adsorption member is connected to the conveying assembly, and the rotary driving member can drive the adsorption member to rotate around the center line of the adsorption member.
7. The wafer conveying mechanism according to claim 6, characterized in that: It also includes a protective cover, which is connected to the conveying component. A second accommodating chamber is opened inside the protective cover. The rotating drive component is arranged in the second accommodating chamber, and the upper end of the rotating drive component is connected to the adsorption component.
8. The wafer conveying mechanism according to claim 7, characterized in that: The protective cover comprises a shell part and a cover part. One end of the shell part is open to form a second opening communicating with the second accommodating cavity. The cover part is connected to the shell part and covers the second opening.
9. The wafer conveying mechanism according to any one of claims 1 to 8, characterized in that: The adsorption component includes a first connecting portion and a bearing portion, the first connecting portion is connected to the conveying assembly, the bearing portion is connected to the upper end of the first connecting portion, and the bearing surface is arranged at the upper end of the bearing portion.
10. A grinding device, characterized in that: It comprises the wafer conveying mechanism according to any one of claims 1 to 9, and also comprises a workbench, wherein the wafer conveying mechanism is installed on the top of the workbench.