Multimedia storage card and storage device with same
Through the design of multimedia memory card injection molding with plastic material, the problem of existing memory cards being difficult to achieve waterproof, dustproof and pressureproof is solved, reducing production costs, and improving the overall performance and stability of the equipment.
Patent Information
- Application Number
- CN202420900364.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-04-24
AI Technical Summary
Existing memory cards are difficult to meet the requirements of waterproof, dustproof and pressureproof, and the cost of making memory cards is high.
The multimedia memory card design is designed with plastic injection molding. By injection molding the outer shell into an integrated structure, the sealing is enhanced, and the structural stability and reliability of the external contact points are improved through step-by-step injection molding and through-hole settings, reducing production costs.
It improves the waterproof, dustproof and pressure-proof performance of multimedia memory cards, reduces production costs, ensures the integrity of the shell and integrated circuit module and the stability of the external contact points, and meets more scenario needs.
Smart Images
Figure CN222145800U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of storage cards, and in particular to a multimedia storage card and a storage device having the multimedia storage card. Background Art
[0002] In recent years, memory cards have been widely used in high-performance mobile digital products, such as digital cameras, video cameras, and drones. The memory card includes a housing and an integrated circuit module. In existing memory cards, the housing is usually assembled or ultrasonically pressed to the outside of the integrated circuit module.
[0003] However, for storage cards manufactured by assembling the shell, the shell and the integrated circuit module in the storage card are relatively loose, making it difficult to meet the requirements of waterproof, dustproof and pressure-proof; for storage cards manufactured by ultrasonic pressing, the equipment is expensive, which increases the production cost of the storage card. Utility Model Content
[0004] In view of this, it is necessary to provide a multimedia storage card to improve the technical problems that the existing storage cards are difficult to meet the requirements of waterproof, dustproof and pressure-proof, and the production cost of the storage cards is high.
[0005] The first aspect of the present application provides a multimedia storage card, which includes an integrated circuit module and a shell, wherein the integrated circuit module is provided with a plurality of external contact points; the shell is configured to be injection molded from a plastic material and is coated on the integrated circuit module; and the plurality of external contact points are exposed on the shell.
[0006] The above multimedia storage card adopts the method of forming an integrated structure by injection molding the shell. On the one hand, it can improve the sealing of the shell, thereby improving the waterproof, dustproof and pressure-proof performance of the multimedia storage card, so that the multimedia storage card can meet the needs of more scenarios; on the other hand, it can reduce the production cost of the multimedia storage card by eliminating the need for operators to purchase expensive ultrasonic pressing equipment.
[0007] In at least one embodiment, the housing is injection molded on the integrated circuit module.
[0008] In the above embodiment, by injection molding the housing on the integrated circuit module, the housing and the integrated circuit module can form an integral structure, which helps to ensure that the housing will not loosen or separate during use, thereby effectively protecting the internal integrated circuit module and other components.
[0009] In at least one embodiment, the housing includes a first shell and a second shell. The first shell and the second shell are respectively injection molded on the integrated circuit module and jointly cover the outside of the integrated circuit module.
[0010] In the above embodiment, by adopting the manufacturing method of step-by-step injection molding of the first shell and the second shell, it is beneficial to ensure the structural stability and consistency of the first shell and the second shell. Specifically, by step-by-step injection molding of the first shell and the second shell, the molding process of each part can be better controlled, reducing the risk of uneven shell structure or deformation caused by one-time injection molding.
[0011] In at least one embodiment, the first shell or the second shell is provided with a plurality of through holes, and the plurality of through holes are arranged at intervals; the plurality of external contact points correspond to the plurality of through holes one by one, so as to be exposed to the outer shell respectively.
[0012] In the above embodiment, the provision of the through hole can, on the one hand, enable the external contact points in the multimedia storage card to be connected to the external device conveniently and quickly, and on the other hand, can effectively reduce the risk of short circuit or interference between two adjacent external contact points.
[0013] In at least one embodiment, the integrated circuit module includes a substrate, a packaging layer and multiple electronic components, the multiple electronic components are mounted on the substrate and have the above-mentioned external contact points; the packaging layer covers the substrate and the electronic components, and the external contact points are exposed on the packaging layer; and the outer shell covers the packaging layer.
[0014] In the above embodiments, the arrangement of the substrate, the packaging layer and the housing can not only achieve protection and packaging of the electronic components, but also facilitate the usability and stability of the external contacts, thus providing a good foundation and guarantee for the normal operation of the multimedia storage card.
[0015] In at least one embodiment, the first shell is injection molded on the packaging layer, and the second shell is injection molded on the packaging layer and the first shell; or, the second shell is injection molded on the packaging layer, and the first shell is injection molded on the packaging layer and the second shell.
[0016] In at least one embodiment, the encapsulation layer is configured to be made of an encapsulation material.
[0017] In the above embodiments, the packaging material generally has a certain hardness and flexibility, can effectively absorb external impact force, and protect the internal electronic components from damage. In addition, the packaging material also has good insulation properties, which can prevent short circuits or other electrical problems between electronic components.
[0018] In at least one embodiment, the encapsulation material is epoxy resin.
[0019] In the above embodiment, the encapsulation layer is made of epoxy resin, which can not only provide good mechanical support and protection performance, but also ensure that the electronic components are not damaged during use. At the same time, epoxy resin has high heat resistance and chemical resistance, can remain stable under various environmental conditions, and extend the service life of the product. In addition, since epoxy resin has good fluidity and formability, high precision and complex structural design can be achieved when making the encapsulation layer.
[0020] In at least one embodiment, a side wall of the housing is provided with a hand-grip groove configured for a user to buckle his / her fingers.
[0021] In the above embodiment, when the multimedia storage card needs to be taken out, the operator only needs to put his finger into the finger groove and apply external force. By setting the finger groove, the operator can easily and quickly take out the injection-molded multimedia storage card from the injection mold, or take out the multimedia storage card from the external electronic device.
[0022] A second aspect of the present application provides a storage device, which includes a storage device body and the above-mentioned multimedia storage card, and the multimedia storage card is installed in the storage device body. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 is a schematic diagram of the structure of a multimedia storage card provided in an embodiment of the present application;
[0024] Figure 2 is a structural block diagram of a multimedia storage card provided in an embodiment of the present application;
[0025] Figure 3 It is a structural block diagram of a storage device provided in one embodiment of the present application.
[0026] Main component symbols
[0027] Storage device 1
[0028] Multimedia memory card 100
[0029] Integrated circuit module 110
[0030] Substrate 111
[0031] Electronic components 112
[0032] Encapsulation layer 113
[0033] External contact 114
[0034] Housing 120
[0035] First housing 121
[0036] Second housing 122
[0037] Hand grip slot 123
[0038] Storage device body 200
[0039] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0040] The following specific embodiments illustrate the implementation of the present application, and operators in the field can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this application are limited to the implementation. On the contrary, the purpose of introducing the application in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, the following description will include many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.
[0041] Hereinafter, if used, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more. Positional terms such as "upper", "lower", "left", and "right" are defined relative to the orientation of the components schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts. They are used for description and clarification relative to the components, and may change accordingly according to changes in the orientation of the components placed in the accompanying drawings.
[0042] In this application, if used, unless otherwise expressly specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be fixed connection, detachable connection, or integrated; can be directly connected or indirectly connected through an intermediate medium. The term "and / or" used herein includes any and all combinations of one or more of the relevant listed items.
[0043] When the following embodiments are described in detail in conjunction with schematic diagrams, for ease of explanation, the diagrams showing the local structures of the devices will not be partially enlarged according to the general scale, and the schematic diagrams are only examples and should not limit the scope of protection of this application.
[0044] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.
[0045] The embodiment of the present application provides a multimedia storage card 100, which is installed in an electronic device for storing data information. It should be noted that the electronic device can be a digital camera, a drone, a video camera, etc., which is not limited in the present application, and operators in the field can choose according to actual conditions.
[0046] like Figure 1 and Figure 2 As shown, the multimedia storage card 100 includes an integrated circuit module 110 and a housing 120. The integrated circuit module 110 is provided with a plurality of external contact points 114, and the external contact points 114 are used to achieve connection with external electronic devices and data transmission.
[0047] In one embodiment, the housing 120 is configured to be injection molded from a plastic material and encapsulate the integrated circuit module 110 to protect the integrated circuit module 110 , reduce the risk of damage to the integrated circuit module 110 due to external collision, and ensure the normal operation of the multimedia storage card 100 .
[0048] The plastic material may be selected from the group consisting of polycarbonate (PC), polystyrene (PS) or propylene-butadiene-styrene resin (ABS) or other suitable engineering plastics, which is not limited in the present application and can be selected by operators in the art according to actual conditions.
[0049] It should be noted that the use of the injection molding process can not only make the housing 120 have better integrity and stability, but also reduce the risk of cracks or deformation of the housing 120 during use. At the same time, it can also achieve precise size control of the housing 120, which is conducive to the perfect matching of the housing 120 and the integrated circuit module 110, and improve the overall quality and performance of the multimedia storage card 100, that is, improve the waterproof, dustproof and pressure-proof performance of the multimedia storage card 100.
[0050] In one embodiment, a plurality of external contacts 114 are exposed from the housing 120 , so that the multimedia storage card 100 can be connected to an external electronic device and transmit data.
[0051] In summary, the multimedia storage card 100 in the present application has at least the following beneficial effects: on the one hand, compared with the existing storage card assembly shell method, the multimedia storage card 100 in the present application adopts the method of injection molding the shell 120 to form an integrated structure, which can improve the sealing of the shell 120, thereby improving the waterproof, dustproof and pressure-proof performance of the multimedia storage card 100, so that the multimedia storage card 100 can meet the needs of more scenarios.
[0052] On the other hand, compared with the existing ultrasonic pressing method, the multimedia storage card 100 in the present application adopts the method of injection molding the shell 120 to form an integrated structure. The operator does not need to purchase expensive ultrasonic pressing equipment, which greatly reduces the production cost of the multimedia storage card 100.
[0053] In one embodiment, the housing 120 is injection molded on the integrated circuit module 110 to solve the problem of looseness between the housing 120 and the integrated circuit module 11. It can be understood that by injection molding the housing 120 on the integrated circuit module 110, the housing 120 and the integrated circuit module 110 can form an integral structure, which is conducive to ensuring that the housing 120 will not loosen or separate during use, and effectively protecting the integrated circuit module 110 and other components inside.
[0054] In one embodiment, if Figure 2 As shown, the housing 120 includes a first housing 121 and a second housing 122 . The first housing 121 and the second housing 122 are respectively injection molded on the integrated circuit module 110 and cover the integrated circuit module 110 together.
[0055] It can be understood that by adopting the manufacturing method of step-by-step injection molding of the first shell 121 and the second shell 122, it is helpful to ensure the structural stability and consistency of the first shell 121 and the second shell 122. Specifically, by step-by-step injection molding of the first shell 121 and the second shell 122, the molding process of each part can be better controlled, reducing the risk of uneven structure or deformation of the housing 120 caused by one-time injection molding.
[0056] In one embodiment, the first housing 121 or the second housing 122 is provided with a plurality of through holes (not shown), and the plurality of through holes are arranged at intervals. The plurality of external contact points 114 correspond to the plurality of through holes one by one, so as to be exposed to the housing 120 respectively. Through the arrangement of the through holes, the external contact points 114 in the multimedia storage card 100 can be conveniently and quickly connected to external devices; secondly, the risk of short circuit or interference between two adjacent external contact points 114 can be effectively reduced.
[0057] In one embodiment, if Figure 1 and Figure 2 As shown, the integrated circuit module 110 includes a substrate 111, a packaging layer 113 and a plurality of electronic components 112. The plurality of electronic components 112 are mounted on the substrate 111 and are provided with the external contact points 114. The packaging layer 113 is coated on the substrate 111 and the electronic components 112 to ensure the safety and stability of the electronic components 112, and the packaging layer 113 plays an insulating and protective role.
[0058] In one embodiment, the external contact points 114 are exposed on the surface of the packaging layer 113 to facilitate the connection between the multimedia storage card 100 and the electronic device and data transmission. The housing 120 is coated on the packaging layer 113 to provide additional protection for the entire integrated circuit module 110 and enhance the stability and durability of the multimedia storage card 100.
[0059] It should be noted that the arrangement of the substrate 111, the packaging layer 113 and the housing 120 can not only achieve protection and packaging of the electronic components 112, but also facilitate the usability and stability of the external contact points 114, providing a good foundation and guarantee for the normal operation of the multimedia storage card 100.
[0060] In one embodiment, the first housing 121 is injection molded on the packaging layer 113, and the second housing 122 is injection molded on the packaging layer 113 and the first housing 121. Specifically, the operator firstly injection molds the first housing 121 on one side of the packaging layer 113. Then, the operator then injection molds the second housing 122 on the other side of the packaging layer 113, and combines it with the molded first housing 121. In this way, the housing 120 can be completely covered on the integrated circuit module 110.
[0061] Alternatively, in another embodiment, the second housing 122 is injection molded on the packaging layer 113, and the first housing 121 is injection molded on the packaging layer 113 and the second housing 122. Specifically, the operator firstly injection molds the second housing 122 on one side of the packaging layer 113. Then, the operator injects the first housing 121 on the other side of the packaging layer 113 and combines it with the molded second housing 122, thereby completing the housing 120 being entirely covered on the integrated circuit module 110.
[0062] Exemplarily, the process of injection molding the housing 120 on the integrated circuit module 110 in the present application is as follows: the operator first places the packaged integrated circuit module 110 into the mold, and then injection molds the plastic material on one side of the integrated circuit module 110 to form a first housing 121. Then, the operator turns the integrated circuit module 110 including the first housing 121 over, and injection molds the plastic material on the other side of the integrated circuit to form a second housing 122, and the second housing 122 is combined with the first housing 121. In this way, a complete housing 120 can be formed outside the integrated circuit module 110.
[0063] In one embodiment, the packaging layer 113 is configured to be made of packaging material. It should be noted that the packaging material usually has a certain hardness and flexibility, can effectively absorb external impact force, and protect the internal electronic components 112 from damage. In addition, the packaging material also has good insulation performance, which can prevent short circuits or other electrical problems between the electronic components 112.
[0064] In one embodiment, the encapsulation material is epoxy resin. It is worth noting that the encapsulation layer 113 is made of epoxy resin, which can not only provide good mechanical support and protection performance, but also ensure that the electronic component 112 is not damaged during use. At the same time, epoxy resin has high heat resistance and chemical resistance, can remain stable under various environmental conditions, and extend the service life of the product. In addition, since epoxy resin has good fluidity and formability, high precision and complex structural design can be achieved when making the encapsulation layer 113.
[0065] In one embodiment, if Figure 1 As shown, the side wall of the housing 120 is provided with a finger-grip groove 123, which is configured for the user to buckle in with his / her finger. It can be understood that when the multimedia storage card 100 needs to be taken out, the user only needs to buckle his / her finger into the finger-grip groove 123 and apply external force. By providing the finger-grip groove 123, the operator can conveniently and quickly take out the multimedia storage card 100 after injection molding from the injection mold, or take out the multimedia storage card 100 from the electronic device.
[0066] A second aspect of the present application provides a storage device 1, such as Figure 3 As shown, the storage device 1 includes a storage device body 200 and the multimedia storage card 100, and the multimedia storage card 100 is installed in the storage device body 200. The multimedia storage card 100 includes an integrated circuit module 110 and a shell 120. The integrated circuit module 110 is provided with a plurality of external contact points 114, and the shell 120 is configured to be formed by injection molding of a plastic material and is coated on the integrated circuit module 110, and the plurality of external contact points 114 are exposed from the shell 120.
[0067] The storage device 1 in the present application adopts the multimedia storage card 100 described above, and the housing 120 in the multimedia storage card 100 is configured to be made of injection-molded plastic material and covers the integrated circuit module 110 in the multimedia storage card 100. On the one hand, the sealing performance of the housing 120 can be improved, thereby improving the waterproof, dustproof and pressure-proof performance of the multimedia storage card 100, so that the multimedia storage card 100 can meet the needs of more scenarios; on the other hand, the operator does not need to purchase expensive ultrasonic pressing equipment, which greatly reduces the production cost of the multimedia storage card 100.
[0068] The above description is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the disclosure scope of the present application.
Claims
1. A multimedia storage card, characterized in that: The multimedia storage card comprises: An integrated circuit module, wherein the integrated circuit module is provided with a plurality of external contact points; The shell is configured to be formed by injection molding of a plastic material and is coated on the integrated circuit module; and the plurality of external contact points are exposed on the shell.
2. The multimedia storage card according to claim 1, wherein: The housing is injection molded on the integrated circuit module.
3. The multimedia storage card according to claim 2, characterized in that: The housing includes a first shell and a second shell. The first shell and the second shell are respectively injection-molded on the integrated circuit module and together cover the outside of the integrated circuit module.
4. The multimedia storage card according to claim 3, characterized in that: The first shell or the second shell is provided with a plurality of through holes, and the plurality of through holes are arranged at intervals; the plurality of external contact points pass through the plurality of through holes in a one-to-one correspondence to be exposed to the outer shell respectively.
5. The multimedia storage card according to claim 3 or 4, characterized in that: The integrated circuit module comprises: substrate; A plurality of electronic components, each of which is mounted on the substrate and has the external contact points; A packaging layer, wherein the packaging layer covers the substrate and the electronic element, and the external contact point is exposed on the packaging layer; The shell is coated on the packaging layer.
6. The multimedia storage card according to claim 5, characterized in that: The first shell is formed on the packaging layer by injection molding, and the second shell is formed on the packaging layer and the first shell by injection molding; Alternatively, the second shell is formed on the packaging layer by injection molding, and the first shell is formed on the packaging layer and the second shell by injection molding.
7. The multimedia storage card according to claim 5, characterized in that: The packaging layer is configured to be made of packaging material.
8. The multimedia storage card according to claim 7, characterized in that: The packaging material is epoxy resin.
9. The multimedia storage card according to any one of claims 1 to 4, 6 to 8, characterized in that: The side wall of the housing is provided with a hand-grip groove, and the hand-grip groove is configured for a user to buckle his finger.
10. A storage device, characterized in that: The storage device comprises a storage device body and a multimedia storage card as claimed in any one of claims 1 to 9, wherein the multimedia storage card is installed in the storage device body.