Wafer carrying platform convenient for size adjustment

Abstract

The utility model discloses a wafer carrying table convenient for size adjustment, which comprises a base, a supporting table is arranged in the middle of the upper end surface of the base, an adaptive assembly is arranged on the upper end surface of the base and positioned on the outer side of the supporting table, and a positioning assembly for fixing a wafer is arranged on the adaptive assembly; the platform deck is simple in structure and reasonable in design, wafers of various sizes can be effectively limited on the same platform deck, adaptability and flexibility of the platform deck are improved, frequent replacement of the platform deck in the production process is avoided, equipment cost and wafer replacement time are reduced, production efficiency is improved, marks cannot be left on the wafers, and production efficiency is improved. The wafer positioning device is simple in structure and high in reliability, the flatness is good, meanwhile, the matching assembly is matched according to the size of a wafer to rapidly position the wafer in the vertical direction, the overall structure is simple, the reliability is high, and the stability and the overall production efficiency in the wafer machining process are further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer carrier equipment, in particular to a wafer carrier which is convenient for size adjustment. Background Art

[0002] In the field of chip manufacturing, the handling and processing of wafers is one of the core steps. These wafers are usually made of silicon or other semiconductor materials and are used to manufacture integrated circuits and other microelectronic devices. With the advancement of technology, the diameter of the wafers is constantly changing. This size change has also put forward higher requirements for wafer processing equipment, especially the stage used for precise positioning during wafer production or testing.

[0003] Deficiencies of existing technology:

[0004] Currently, common wafer carriers mainly adopt a fixed-size design, and mainly use the principle of vacuum adsorption to position the upper wafer. However, the common wafer sizes are generally 6 inches, 8 inches and 12 inches. In the actual production and processing process, the carrier cannot flexibly adapt to wafers of different sizes. This means that when processing wafers of different sizes, in order to ensure the positioning effect, the carrier needs to be replaced, which increases the equipment cost and wafer replacement time. In addition, the vacuum adsorption method may also leave marks on the back of the wafer, affecting the flatness during later photolithography, thereby reducing product quality. Therefore, traditional wafer carriers can no longer meet current actual usage needs. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer carrier that is easy to adjust in size, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer carrier that is easy to adjust in size, comprising a base, a support platform is centrally arranged on the upper end surface of the base, an anti-slip layer is arranged on the upper end surface of the support platform, an adapter component is arranged on the upper end surface of the base and located outside the support platform, and a positioning component for fixing the wafer is arranged on the adapter component;

[0007] The adapter component includes:

[0008] A first telescopic rod, wherein the first telescopic rod is symmetrically arranged on the upper end surface of the base, the upper end of the first telescopic rod is slidably connected to a first limiting ring, and the lower end of the first limiting ring is located outside the first telescopic rod and movably arranged with a first spring;

[0009] A second telescopic rod, the second telescopic rod is symmetrically arranged on the upper end surface of the base and is located outside the first telescopic rod, the upper end of the second telescopic rod is slidably connected to a second limiting ring, the inner wall of the second limiting ring is slidably connected to the outer wall of the first limiting ring, and the lower end of the second limiting ring is located outside the second telescopic rod and is movably provided with a second spring;

[0010] The sleeve ring is arranged on the upper end surface of the base, and the inner wall of the sleeve ring is slidably connected with the outer wall of the second limiting ring.

[0011] Preferably, the positioning component includes:

[0012] A sliding groove, wherein the sliding groove is symmetrically arranged on the inner sides of the first limiting ring, the second limiting ring and the sleeve ring;

[0013] A positioning slider, wherein the positioning slider is slidably connected in the sliding groove;

[0014] The electromagnet is arranged on the inner side of the sliding groove, and a permanent magnet matching the electromagnet is arranged on one side of the positioning slide block located in the sliding groove.

[0015] Preferably, the height of the lower end surface of the positioning slider matches the height of the wafer placed on the support platform.

[0016] Preferably, a pressure sensor is provided on the upper end surface of the support platform (the model of the pressure sensor is: RP-C18.3-ST)

[0017] Preferably, the inner diameter of the first limiting ring is 15 cm, the inner diameter of the second limiting ring is 20 cm, and the inner diameter of the sleeve ring is 30 cm.

[0018] Preferably, slide bars are vertically arranged on the outer sides of the support platform, the first limiting ring and the second limiting ring, and the slide bars match the vertical slide grooves on the inner sides of the first limiting ring, the second limiting ring and the sleeve ring.

[0019] Preferably, an air passage is provided through the upper ends of the internal cavities of the first limiting ring and the second limiting ring.

[0020] Compared with the prior art, the beneficial effects of the utility model are:

[0021] The wafer carrier that is easy to adjust in size is provided with an adaptor assembly, which includes a first telescopic rod, a first limiting ring, a first spring, a second telescopic rod, a second limiting ring, a second spring and a sleeve ring, so that wafers of various sizes can be effectively limited on the same carrier, thereby improving the adaptability and flexibility of the carrier, avoiding frequent replacement of the carrier in the production process, reducing equipment costs and wafer replacement time, improving production efficiency, and leaving no marks on the wafer, with good flatness;

[0022] The wafer carrier which is easy to adjust in size is provided with a positioning component, which includes a sliding groove, a positioning slider, an electromagnet and a permanent magnet. At the same time, the matching component can be matched according to the size of the wafer to quickly position the wafer in the vertical direction. The overall structure is simple and the reliability is high, which further improves the stability and overall production efficiency during the wafer processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the internal structure of the utility model;

[0024] Figure 2 It is a side view schematic diagram of the internal structure of the utility model;

[0025] Figure 3 It is a top view schematic diagram of the internal structure of the utility model;

[0026] Figure 4 This is a schematic diagram of the installation of discs of different sizes according to the utility model;

[0027] Figure 5 For the utility model Figure 2 An enlarged schematic diagram at A in FIG.

[0028] Figure 6 For the utility model Figure 3 A magnified schematic diagram at B in FIG.

[0029] In the figure: 1. base; 2. support platform; 3. adapter assembly; 301. first telescopic rod; 302. first limit ring; 303. first spring; 304. second telescopic rod; 305. second limit ring; 306. second spring; 307. collar; 4. positioning assembly; 401. sliding groove; 402. positioning slider; 403. electromagnet; 404. permanent magnet; 5. pressure sensor; 6. slide bar; 7. airway. Implementation

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0032] In the description of this patent, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "setting" should be understood in a broad sense, for example, it can be fixed connection, setting, or detachable connection, setting, or integrated connection, setting. For ordinary technicians in this field, the specific meanings of the above terms in this patent can be understood according to specific circumstances.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "several" is two or more, unless otherwise clearly and specifically defined. Example

[0034] See also Figure 1-6As shown, the utility model provides a technical solution for a wafer carrier that is easy to adjust in size: a wafer carrier that is easy to adjust in size, comprising a base 1, a support platform 2 is centrally installed on the upper end surface of the base 1, an anti-slip layer is arranged on the upper end surface of the support platform 2, an adapter component 3 is installed on the upper end surface of the base 1 and located on the outer side of the support platform 2, a positioning component 4 for fixing the wafer is installed on the adapter component 3; the adapter component 3 comprises a first telescopic rod 301, a second telescopic rod 304 and a collar 307, the first telescopic rod 301 is symmetrically installed on the upper end surface of the base 1, the upper end of the first telescopic rod 301 is slidably connected to a first limiting ring 302, the lower end of the first limiting ring 302 is located The first spring 303 is movably installed on the outer side of the first telescopic rod 301, the second telescopic rod 304 is symmetrically installed on the upper end surface of the base 1 and is located on the outer side of the first telescopic rod 301, the upper end of the second telescopic rod 304 is slidably connected with the second limiting ring 305, the inner wall of the second limiting ring 305 is slidably connected to the outer wall of the first limiting ring 302, the lower end of the second limiting ring 305 is located on the outer side of the second telescopic rod 304 and is movably installed with a second spring 306, the collar 307 is installed on the upper end surface of the base 1, the inner wall of the collar 307 is slidably connected to the outer wall of the second limiting ring 305, when the 6-inch wafer needs to be positioned, the external conveying mechanism moves the wafer along the first limiting ring 302 The inner wall of the second limiting ring 305 is placed on the support table 2, and then the positioning component 4 in the first limiting ring 302 is started to position the wafer. The inner wall of the first limiting ring 302 limits the wafer in the horizontal direction, and the positioning component 4 limits the wafer in the vertical direction. When an 8-inch wafer needs to be positioned, the external conveying mechanism puts the wafer in along the inner wall of the second limiting ring 305, and overcomes the elastic force of the first spring 303 to press the first limiting ring 302 down until the wafer is placed on the support table 2, and the positioning component 4 is started. At this time, the inner wall of the second limiting ring 305 limits the wafer in the horizontal direction, and the positioning component 4 limits the wafer in the vertical direction. When a 12-inch wafer needs to be positioned, The external conveying mechanism places the wafer along the inner wall of the ring 307, and overcomes the elastic force of the first spring 303 and the second spring 306 to press the first limit ring 302 downward until the wafer is placed on the support table 2, and the positioning component 4 is started. At this time, the inner wall of the ring 307 limits the wafer in the horizontal direction, and the positioning component 4 limits the wafer in the vertical direction. Through the adapter component 3, wafers of various sizes can be effectively limited on the same carrier, which improves the adaptability and flexibility of the carrier, avoids frequent replacement of the carrier during the production process, reduces equipment costs and wafer replacement time, improves production efficiency, and does not leave marks on the wafer, with good flatness.

[0035] The positioning assembly 4 includes a sliding groove 401, a positioning slider 402 and an electromagnet 403. The sliding groove 401 is symmetrically arranged on the inner sides of the first limiting ring 302, the second limiting ring 305 and the sleeve ring 307. The positioning slider 402 is slidably connected in the sliding groove 401, and the electromagnet 403 is fixedly installed on the inner side of the sliding groove 401. A permanent magnet 404 matching the electromagnet 403 is installed on one side of the positioning slider 402 located in the sliding groove 401. When the lower end surface of the wafer contacts the support platform 2, the external control system controls all the electromagnets 403 to be energized to generate a repulsive force on the permanent magnet 404, thereby applying a thrust to the positioning slider 402 in the direction away from the electromagnet 403. If the wafer is 6 inches, the positioning slider 402 on the first limiting ring 302 slides out of the sliding groove 401 and presses on the upper end surface of the wafer. , completing the vertical limit of the 6-inch wafer, and the remaining positioning sliders 402 cannot slide out due to the blocking of the exit of the sliding groove 401. If the wafer is 8 inches, the positioning slider 402 on the second limiting ring 305 slides out of the sliding groove 401 and presses on the upper end surface of the wafer, completing the vertical limit of the 8-inch wafer, and the remaining positioning sliders 402 cannot slide out. If the wafer is 12 inches, the positioning slider 402 on the sleeve ring 307 slides out of the sliding groove 401 and presses on the upper end surface of the wafer, completing the vertical limit of the 12-inch wafer, and the remaining positioning sliders 402 cannot slide out. Through the positioning component 4, the matching component 3 is matched according to the size of the wafer to quickly position the wafer in the vertical direction. The overall structure is simple and reliable, which further improves the stability and overall production efficiency during the wafer processing.

[0036] The height of the lower end surface of the positioning slider 402 matches the height of the disc placed on the support table 2. When the disc is placed on the support table 2, the positioning slider 402 slides inward to press the disc downward to achieve vertical limiting. If the height of the positioning slider 402 is too high, the limiting effect is lost. If the height is too low, it will collide with the disc.

[0037] A pressure sensor 5 is installed on the upper end surface of the support platform 2. When the wafer contacts the pressure sensor 5, the pressure sensor 5 is triggered to transmit an electrical signal to the external control system, and the external control system then controls the electromagnet 403 to be energized.

[0038] The inner diameter of the first limiting ring 302 is 15 cm, which matches the common 6-inch round wafer. The inner diameter of the second limiting ring 305 is 20 cm, which matches the common 8-inch round wafer. The inner diameter of the sleeve ring 307 is 30 cm, which matches the common 12-inch round wafer.

[0039] The outer sides of the support platform 2, the first limiting ring 302 and the second limiting ring 305 are vertically provided with sliding bars 6, which are slidably connected with the vertical sliding grooves on the inner sides of the first limiting ring 302, the second limiting ring 305 and the sleeve 307 to ensure that the first limiting ring 302 and the second limiting ring 305 will not tilt when making vertical movements.

[0040] An air passage 7 is provided through the upper ends of the internal cavities of the first limiting ring 302 and the second limiting ring 305 . The air passage 7 is conducive to the discharge of internal air and is more convenient for the first telescopic rod 301 and the second telescopic rod 304 to enter.

[0041] The working principle of the utility model is as follows:

[0042] When a wafer carrier that is easy to adjust in size is used in this embodiment, if a 6-inch wafer needs to be positioned, the external conveying mechanism places the wafer on the support table 2 along the inner wall of the first limiting ring 302. After the wafer touches the pressure sensor 5, the external control system receives a signal to control all electromagnets 403 to be energized to generate a repulsive force on the permanent magnet 404, thereby applying a thrust to the positioning slider 402 away from the electromagnet 403. The positioning slider 402 on the first limiting ring 302 slides out of the sliding groove 401 and presses on the upper end surface of the wafer, completing the vertical limitation of the 6-inch wafer. The remaining positioning sliders 402 cannot slide out because the exit of the sliding groove 401 is blocked. When an 8-inch wafer needs to be positioned When the wafer is placed along the inner wall of the second limiting ring 305, the external conveying mechanism presses the first limiting ring 302 downward to overcome the elastic force of the first spring 303 until the wafer is placed on the support table 2 and touches the pressure sensor 5. The external control system receives the signal and controls all the electromagnets 403 to be energized to generate a repulsive force on the permanent magnet 404, thereby applying a thrust to the positioning slider 402 away from the electromagnet 403. The positioning slider 402 on the second limiting ring 305 slides out of the sliding groove 401 and presses on the upper end surface of the wafer, completing the vertical limitation of the 8-inch wafer. The remaining positioning sliders 402 cannot slide out. When the 12-inch wafer needs to be positioned, the external conveying mechanism puts the wafer along the inner wall of the second limiting ring 305, and overcomes the elastic force of the first spring 303 to press the first limiting ring 302 downward until the wafer is placed on the support table 2 and touches the pressure sensor 5. 7, and overcome the elastic force of the first spring 303 and the second spring 306 to press the first limiting ring 302 downward until the wafer is placed on the support table 2 and contacts the pressure sensor 5. The external control system receives the signal and controls all the electromagnets 403 to be energized to generate a repulsive force on the permanent magnet 404, thereby applying a thrust away from the electromagnet 403 to the positioning slider 402. The positioning slider 402 on the ring 307 slides out of the sliding groove 401 and presses on the upper end surface of the wafer, completing the vertical limit of the 12-inch wafer. The remaining positioning sliders 402 cannot slide out. When the wafer needs to be taken out, the external control system controls the change of the current direction on the electromagnet 403 so that the electromagnet 403 is The permanent magnet 404 generates an attractive force, thereby resetting the positioning slider 402, and the wafer can be taken out upwards; the utility model has a simple structure and a reasonable design. Through the adapter component 3, wafers of various sizes can be effectively limited on the same carrier, thereby improving the adaptability and flexibility of the carrier, avoiding frequent replacement of the carrier during the production process, reducing equipment costs and wafer replacement time, and improving production efficiency. It will not leave any marks on the wafer and has good flatness. At the same time, through the positioning component 4, the vertical direction of the wafer can be quickly positioned according to the size of the wafer by matching the adapter component 3. The overall structure is simple and the reliability is high, further improving the stability and overall production efficiency during the wafer processing process.

[0043] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A wafer carrier that is easy to adjust in size, comprising a base (1), characterized in that: A support platform (2) is centrally arranged on the upper end surface of the base (1), an anti-slip layer is arranged on the upper end surface of the support platform (2), an adapter component (3) is arranged on the upper end surface of the base (1) and located outside the support platform (2), and a positioning component (4) for fixing the disc is arranged on the adapter component (3); The adapter component (3) comprises: A first telescopic rod (301), the first telescopic rod (301) being symmetrically arranged on the upper end surface of the base (1), the upper end of the first telescopic rod (301) being slidably connected to a first limiting ring (302), the lower end of the first limiting ring (302) being located outside the first telescopic rod (301) and movably arranged with a first spring (303); a second telescopic rod (304), the second telescopic rod (304) being symmetrically arranged on the upper end surface of the base (1) and located outside the first telescopic rod (301); the upper end of the second telescopic rod (304) being slidably connected to a second limiting ring (305); the inner wall of the second limiting ring (305) being slidably connected to the outer wall of the first limiting ring (302); the lower end of the second limiting ring (305) being located outside the second telescopic rod (304) and being movably provided with a second spring (306); A collar (307) is arranged on the upper end surface of the base (1), and an inner wall of the collar (307) is slidably connected to an outer wall of the second limiting ring (305).

2. The wafer stage for facilitating size adjustment according to claim 1, characterized in that: The positioning component (4) comprises: A sliding groove (401), wherein the sliding groove (401) is symmetrically arranged on the inner sides of the first limiting ring (302), the second limiting ring (305) and the sleeve ring (307); A positioning slide block (402), wherein the positioning slide block (402) is slidably connected in the sliding groove (401); The electromagnet (403) is arranged on the inner side of the sliding groove (401); a permanent magnet (404) matching the electromagnet (403) is arranged on one side of the positioning slide block (402) located in the sliding groove (401).

3. The wafer stage for facilitating size adjustment according to claim 2, characterized in that: The height of the lower end surface of the positioning slide block (402) matches the height of the wafer placed on the support platform (2).

4. The wafer stage for facilitating size adjustment according to claim 1, characterized in that: A pressure sensor (5) is provided on the upper end surface of the support platform (2).

5. The wafer stage for facilitating size adjustment according to claim 1, characterized in that: The inner diameter of the first limiting ring (302) is 15 centimeters, the inner diameter of the second limiting ring (305) is 20 centimeters, and the inner diameter of the sleeve ring (307) is 30 centimeters.

6. The wafer stage for facilitating size adjustment according to claim 1, characterized in that: Slide bars (6) are vertically arranged on the outer sides of the support platform (2), the first limiting ring (302) and the second limiting ring (305), and the slide bars (6) match the vertical slide grooves on the inner sides of the first limiting ring (302), the second limiting ring (305) and the collar (307).

7. The wafer stage for facilitating size adjustment according to claim 1, characterized in that: An air passage (7) is provided through the upper ends of the internal cavities of the first limiting ring (302) and the second limiting ring (305).

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