Multi-layer circuit board film pasting equipment
By designing an automatic dust removal mechanism, using sealed boxes, air intake pipes, air collection boxes and blower nozzles, the problem of dust being sealed in the film during circuit board filming in the prior art is solved, and automatic dust removal and continuous film coating are realized. Reduced staff burden and equipment costs.
Patent Information
- Application Number
- CN202420179211.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-25
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-01-25
AI Technical Summary
The existing circuit board film patching device needs to be dusted through the fan in advance when in use, resulting in dust being sealed in the membrane, increasing the workload and production costs of staff.
A multi-layer circuit board filming equipment is designed, including an operating table and a dust removal mechanism. The dust removal mechanism consists of a sealed box, an intake pipe, an air collecting box, a blower nozzle, an electric push rod, a mounting plate, a connecting rod and a movable plug, through which The combination of components can automatically remove dust during the film pasting process to prevent dust from being sealed in the film.
Automatic dust removal during film pasting is achieved, the packaging quality of the circuit board is ensured, the workload of staff and the cost of equipment is reduced, and continuous film pasting is achieved through the cooperation of transmission rollers and conveyor belts.
Smart Images

Figure CN222147924U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board film pasting, in particular to a multi-layer circuit board film pasting device. Background Art
[0002] A circuit board film pasting device with publication number CN216373347U comprises a bottom plate, a mounting rod is fixedly installed on the left side of the upper surface of the bottom plate, a support ring is fixedly installed on the top of the mounting rod, a motor is fixedly installed inside the support ring, a rotating drum is installed in the middle of the motor, a film is wound on the rotating drum, a second mold is installed in the middle of the upper surface of the bottom plate, a connecting frame is fixedly installed in the middle of the side surface of the bottom plate, a support rod is fixedly installed on the upper side of the connecting frame, a rubber sleeve is fixedly installed on the upper surface of the support rod, a slip ring is arranged outside the rubber sleeve, a fastening screw is installed between the slip ring and the rubber sleeve, and a pressure plate is fixedly connected behind the slip ring. The utility model facilitates the smooth film pasting operation on the surface of the circuit board through the cooperation of the first mold and the second mold, and at the same time, using the insertion rod to pierce holes in the film also facilitates ventilation of the circuit board, prevents moisture, and protects the circuit board.
[0003] When the above-mentioned circuit board film pasting device is in use, the surface of the circuit board needs to be dusted in advance by a fan, otherwise the dust attached to the circuit board is easily sealed in the film, which increases the workload of the staff and increases the production cost of the circuit board film pasting process. Utility Model Content
[0004] The purpose of the utility model is to provide a multi-layer circuit board film pasting device, which can solve the problem that when the above-mentioned circuit board film pasting device is used, the surface of the circuit board needs to be dusted in advance by a fan, otherwise it is easy to cause the dust attached to the circuit board to be sealed in the film, which increases the workload of the staff and increases the production cost of the circuit board film pasting process.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a multi-layer circuit board film pasting equipment, including an operating table and a dust removal mechanism, a support frame is fixedly installed on the top of the operating table, and a strip opening is opened on the rear side of the support frame; the dust removal mechanism is arranged above the operating table, and the dust removal mechanism includes a sealing box, an air intake pipe, an air gathering box and an air blowing nozzle, the top of the operating table is fixedly connected to the bottom of the air gathering box through a support plate, a plurality of groups of equidistantly distributed air blowing nozzles are fixedly installed on the bottom of the air gathering box, an air intake pipe is fixedly installed on the bottom of the air gathering box, one end of the air intake pipe extends to the interior of the air gathering box, and the other end of the air intake pipe is fixedly connected and communicated with one side of the sealing box.
[0006] Preferably, the rear side of the operating table is fixedly connected to the front side of the sealing box, an electric push rod is fixedly installed on the top of the support frame, the free end of the electric push rod is fixedly connected to the top of the mounting plate, the rear side of the mounting plate passes through the strip opening and the two sides of the mounting plate are slidably connected to the strip opening, the bottom of the mounting plate is fixedly connected to one end of the connecting rod, the other end of the connecting rod passes through the sealing box and extends to the interior of the sealing box and is fixedly connected to the top of the movable plug, the movable plug fits with the inner wall of the sealing box but is not connected, and the surface of the circuit board is dusted while the film is being applied to prevent dust attached to the circuit board from being sealed in the film, thereby ensuring the quality and appearance of the circuit board after packaging, and eliminating the need for staff to operate the fan alone, thereby reducing the workload of staff and reducing the equipment use cost during the circuit board film application process.
[0007] Preferably, an air intake pipe is fixedly installed at the bottom of the sealing box, and one end of the air intake pipe is threadedly connected to a dustproof mesh cover.
[0008] Preferably, the dustproof mesh cover is provided with a one-way valve toward the inside of the sealing box, and the air inlet pipe is provided with a one-way valve toward the outside of the air collecting box.
[0009] Preferably, a placement groove is provided on the top of the operating table, and two groups of transmission rollers are rotatably installed on the front and rear inner walls of the placement groove. A reduction motor is fixedly installed on the front side of the operating table, and the output shaft of the reduction motor is fixedly connected to one end of a group of transmission rollers. The two groups of transmission rollers are connected by a conveyor belt, and a supporting plate is provided on the top of the conveyor belt, and anti-slip pads are provided on the top and bottom of the supporting plate.
[0010] Preferably, a laminating machine is fixedly mounted on the bottom of the mounting plate.
[0011] Preferably, a vacuum cleaner is fixedly installed on the top of the operating table.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] The multi-layer circuit board film pasting equipment, through the coordinated use of an electric push rod, a mounting plate, a sealing box, a connecting rod, a movable plug, an air inlet pipe, an air collecting box and an air blowing nozzle, removes dust from the surface of the circuit board while pasting the film, thereby preventing dust attached to the circuit board from being sealed in the film, thereby ensuring the quality and appearance of the circuit board after packaging. There is no need for staff to operate the fan alone, which reduces the workload of staff and the equipment use cost during the circuit board film pasting process. Through the coordinated use of a transmission roller, a conveyor belt and a reduction motor, continuous film pasting operations on the circuit board are facilitated. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The utility model is further described below in conjunction with the accompanying drawings and embodiments:
[0015] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0016] Figure 2 It is a rear-view stereoscopic structural schematic diagram of the utility model;
[0017] Figure 3 It is a schematic diagram of the three-dimensional structure of the sealing box of the utility model.
[0018] Figure numerals: 1. operating table; 2. support frame; 3. dust removal mechanism; 301. electric push rod; 302. mounting plate; 303. sealing box; 304. connecting rod; 305. movable plug; 306. air inlet pipe; 307. air gathering box; 308. air blowing nozzle; 4. air suction pipe; 5. dustproof mesh cover; 6. placement groove; 7. transmission roller; 8. conveyor belt; 9. reduction motor; 10. supporting plate; 11. vacuum cleaner; 12. laminating machine. DETAILED DESCRIPTION
[0019] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.
[0020] See also Figure 1-3 The utility model provides a technical solution: a multi-layer circuit board film pasting device, including an operating table 1 and a dust removal mechanism 3. A support frame 2 is fixedly installed on the top of the operating table 1, and a strip opening is opened on the rear side of the support frame 2; the dust removal mechanism 3 is arranged above the operating table 1, and the dust removal mechanism 3 includes a sealing box 303, an air inlet pipe 306, an air gathering box 307 and an air blowing nozzle 308. The top of the operating table 1 is fixedly connected to the bottom of the air gathering box 307 through a support plate, and a plurality of groups of equidistantly distributed air blowing nozzles 308 are fixedly installed on the bottom of the air gathering box 307. An air inlet pipe 306 is fixedly installed on the bottom of the air gathering box 307, and one end of the air inlet pipe 306 extends to the interior of the air gathering box 307, and the other end of the air inlet pipe 306 is fixedly connected and communicated with one side of the sealing box 303.
[0021] The rear side of the operating table 1 is fixedly connected to the front side of the sealing box 303, and an electric push rod 301 is fixedly installed on the top of the support frame 2. The free end of the electric push rod 301 is fixedly connected to the top of the mounting plate 302. The rear side of the mounting plate 302 passes through the strip opening and the two sides of the mounting plate 302 are slidably connected to the strip opening. The bottom of the mounting plate 302 is fixedly connected to one end of the connecting rod 304, and the other end of the connecting rod 304 passes through the sealing box 303 and extends to the interior of the sealing box 303 and is fixedly connected to the top of the movable plug 305. The movable plug 305 fits with the inner wall of the sealing box 303 but is not connected. While the film is being applied, the surface of the circuit board is dusted to prevent dust attached to the circuit board from being sealed in the film, thereby ensuring the quality and appearance of the circuit board after packaging. There is no need for staff to operate the fan alone, which reduces the workload of staff and reduces the equipment use cost during the circuit board film application process.
[0022] An air intake pipe 4 is fixedly installed at the bottom of the sealing box 303, and a dustproof mesh cover 5 is threadedly connected to one end of the air intake pipe 4.
[0023] The dustproof net cover 5 is provided with a one-way valve toward the inside of the sealing box 303 , and the air inlet pipe 306 is provided with a one-way valve toward the outside of the air collecting box 307 .
[0024] A placement groove 6 is provided at the top of the operating table 1, and two groups of transmission rollers 7 are rotatably installed on the front and rear inner walls of the placement groove 6. A reduction motor 9 is fixedly installed on the front side of the operating table 1, and the output shaft of the reduction motor 9 is fixedly connected to one end of a group of transmission rollers 7. The two groups of transmission rollers 7 are connected by a conveyor belt 8. A supporting plate 10 is provided on the top of the conveyor belt 8, and anti-slip pads are provided on the top and bottom of the supporting plate 10.
[0025] The laminator 12 is fixedly mounted on the bottom of the mounting plate 302 .
[0026] A dust collector 11 is fixedly mounted on the top of the operating platform 1 .
[0027] Working principle: When the device is in use, the multi-layer circuit board is placed on the support plate 10, and then the support plate 10 is placed on the conveyor belt 8, the reduction motor 9 is turned on to drive the transmission roller 7 to rotate, and the support plate 10 is driven by the conveyor belt 8 to move to the bottom of the laminating machine 12, and then another set of support plates 10 with circuit boards placed on them are placed under the gas collection box 307, and the electric push rod 301 is turned on to drive the mounting plate 302 to move downward, so that the laminating machine 12 laminates the circuit board on the support plate 10, and the mounting plate 302 drives the connecting rod 30 when it moves. 4 moves downward, so that the movable plug 305 moves inside the sealed box 303, and the air in the sealed box 303 is squeezed into the air collecting box 307 through the air inlet pipe 306, and then blown out to another group of circuit boards through the air blowing nozzle 308 to blow away the dust on the circuit boards, and the vacuum cleaner 11 is turned on to absorb the blown dust. When the mounting plate 302 moves upward, it drives the movable plug 305 to move upward, and the outside air is filtered by the dustproof net cover 5 and then sucked into the sealed box 303 through the air suction pipe 4, and the circuit boards are continuously coated in this way.
[0028] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.
Claims
1. A multi-layer circuit board film laminating device, characterized in that: include: An operating table (1), a support frame (2) is fixedly mounted on the top of the operating table (1), and a strip-shaped opening is provided on the rear side of the support frame (2); The dust removal mechanism (3) is arranged above the operating table (1), and comprises a sealing box (303), an air intake pipe (306), an air gathering box (307) and an air blowing nozzle (308). The top of the operating table (1) is fixedly connected to the bottom of the air gathering box (307) via a support plate, and a plurality of groups of air blowing nozzles (308) are fixedly installed at the bottom of the air gathering box (307) at equal intervals. The bottom of the air gathering box (307) is fixedly installed with an air intake pipe (306), one end of which extends to the interior of the air gathering box (307), and the other end of which is fixedly connected to and communicates with one side of the sealing box (303).
2. A multi-layer circuit board laminating device according to claim 1, characterized in that: The rear side of the operating table (1) is fixedly connected to the front side of the sealing box (303); an electric push rod (301) is fixedly installed on the top of the support frame (2); the free end of the electric push rod (301) is fixedly connected to the top of the mounting plate (302); the rear side of the mounting plate (302) passes through the strip opening and the two sides of the mounting plate (302) are slidably connected to the strip opening; the bottom of the mounting plate (302) is fixedly connected to one end of a connecting rod (304); the other end of the connecting rod (304) passes through the sealing box (303) and extends to the inside of the sealing box (303) and is fixedly connected to the top of a movable plug (305); the movable plug (305) is in contact with the inner wall of the sealing box (303) but is not connected.
3. A multi-layer circuit board laminating device according to claim 2, characterized in that: An air intake pipe (4) is fixedly mounted on the bottom of the sealing box (303), and one end of the air intake pipe (4) is threadedly connected to a dustproof mesh cover (5).
4. A multi-layer circuit board laminating device according to claim 3, characterized in that: The dustproof mesh cover (5) is provided with a one-way valve toward the inside of the sealing box (303), and the air inlet pipe (306) is provided with a one-way valve toward the outside of the air gathering box (307).
5. A multi-layer circuit board laminating device according to claim 4, characterized in that: The top of the operating table (1) is provided with a placement groove (6), and two groups of transmission rollers (7) are rotatably mounted on the front and rear inner walls of the placement groove (6). A reduction motor (9) is fixedly mounted on the front side of the operating table (1), and the output shaft of the reduction motor (9) is fixedly connected to one end of a group of transmission rollers (7). The two groups of transmission rollers (7) are connected via a conveyor belt (8), and a support plate (10) is arranged on the top of the conveyor belt (8), and anti-slip pads are arranged on the top and bottom of the support plate (10).
6. A multi-layer circuit board laminating device according to claim 5, characterized in that: A laminating machine (12) is fixedly mounted on the bottom of the mounting plate (302).
7. A multi-layer circuit board laminating device according to claim 6, characterized in that: A dust collector (11) is fixedly mounted on the top of the operating table (1).
Citation Information
Cited By
Foam board surface film pasting device
CN120383046A
