FPC circuit board convenient for heat dissipation

Abstract

The utility model relates to the field of FPC circuit boards, in particular to an FPC circuit board convenient for heat dissipation, which comprises an FPC circuit board, a plurality of groups of heat dissipation channels are arranged on the side wall of the FPC circuit board, a heat dissipation device is arranged on the FPC circuit board, the heat dissipation device comprises two groups of fixing frames, a connecting frame and a heat dissipation fan, and the fixing frames are connected with the connecting frame. Two groups of connecting frames are fixedly connected between the two groups of fixing frames, when the cooling fan blows air to dissipate heat, blown air flow blows to the FPC circuit board to dissipate heat of the FPC circuit board, the air flow blows to the FPC circuit board and diffuses to two sides, one side of the air flow blows to a guide plate, the air flow is guided by the guide plate, the air flow enters a heat dissipation channel, and the heat dissipation efficiency of the FPC circuit board is improved. When the air flow flows in the heat dissipation channel, heat dissipation can be further carried out on the FPC circuit board, the structure can carry out active heat dissipation, and heat accumulated on the FPC circuit board can be efficiently dissipated.

Description

Technical Field

[0001] The utility model relates to the field of FPC circuit boards, in particular to an FPC circuit board which is convenient for heat dissipation. Background Art

[0002] FPC, also known as flexible printed circuit board, is popular for its excellent properties such as light weight, thin thickness, and free bending and folding. However, if too much heat accumulates during use, the FPC circuit board is prone to damage, so it needs to be solved. Utility Model Content

[0003] 1. Technical issues to be resolved

[0004] In view of the deficiencies of the prior art, the utility model provides an FPC circuit board which is convenient for heat dissipation.

[0005] (II) Technical solution

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an FPC circuit board that is easy to dissipate heat, comprising an FPC circuit board, a plurality of heat dissipation channels are arranged on the side wall of the FPC circuit board, a heat dissipation device is arranged on the FPC circuit board, the heat dissipation device comprises a fixing frame, a connecting frame and a heat dissipation fan, two groups of the fixing frames are arranged, two groups of connecting frames are fixedly connected between the two groups of the fixing frames, a plurality of heat dissipation fans are fixedly arranged between the connecting frames on both sides, the fixing frames on both sides are respectively clamped on the front and rear sides of the FPC circuit board, the heat dissipation device is located on the right side of the bottom of the FPC circuit board, a guide plate is fixedly arranged on the right side of the connecting frame on the right side, and the guide plate cooperates with the heat dissipation channel.

[0007] In order to facilitate fixing of the fixing frame, the utility model has the following improvements: screws are screwed onto the bottom of the fixing frame, the screws are in contact with the FPC circuit board, and the screws are made of plastic.

[0008] Preferably, an improvement of the utility model is that the fixing frame and the connecting frame are both made of insulating materials.

[0009] (III) Beneficial effects

[0010] Compared with the prior art, the utility model provides an FPC circuit board that is easy to dissipate heat and has the following beneficial effects:

[0011] The FPC circuit board that is easy to dissipate heat, when the heat dissipation fan is blowing air to dissipate heat, the airflow blown out is blown toward the FPC circuit board, and the FPC circuit board can be cooled. The airflow is blown toward the FPC circuit board and diffused to both sides. One side of the airflow is blown toward the guide plate, and the airflow is guided by the guide plate to enter the heat dissipation channel. When the airflow flows in the heat dissipation channel, the FPC circuit board can be further cooled. This structure can actively dissipate heat, and the heat accumulated on the FPC circuit board can be efficiently cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of the utility model;

[0013] Figure 2 For this utility model Figure 1 Another perspective structural diagram;

[0014] Figure 3 For this utility model Figure 2 Another perspective structural diagram;

[0015] Figure 4 This is a schematic diagram of the front view of the structure of the utility model;

[0016] In the figure: 1. FPC circuit board; 2. fixing frame; 3. connecting frame; 4. cooling fan; 5. screws; 6. guide plate. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-4 , an FPC circuit board that is easy to dissipate heat, including an FPC circuit board 1, a plurality of heat dissipation channels are arranged on the side wall of the FPC circuit board 1, a heat dissipation device is arranged on the FPC circuit board 1, and the heat dissipation device includes a fixing frame 2, a connecting frame 3 and a heat dissipation fan 4, the fixing frame 2 is provided with two groups, two groups of connecting frames 3 are fixedly connected between the two groups of the fixing frames 2, a plurality of heat dissipation fans 4 are fixedly arranged between the connecting frames 3 on both sides, the fixing frames 2 on both sides are respectively clamped on the front and rear sides of the FPC circuit board 1, the heat dissipation device is located on the right side of the bottom of the FPC circuit board 1, and a guide plate 6 is fixedly arranged on the right side of the connecting frame 3 on the right side, and the guide plate 6 cooperates with the heat dissipation channel.

[0019] When the cooling fan 4 is blowing air to dissipate heat, the airflow blown out is blown toward the FPC circuit board 1, which can dissipate heat for the FPC circuit board 1. The airflow blows toward the FPC circuit board 1 and diffuses to both sides. One side of the airflow will blow toward the guide plate 6, and the airflow is guided by the guide plate 6 to enter the heat dissipation channel. When the airflow flows in the heat dissipation channel, the FPC circuit board 1 can be further cooled. This structure can actively dissipate heat and can efficiently dissipate the heat accumulated on the FPC circuit board 1.

[0020] The fixing frame 2 of the above structure is prone to shaking when in use. In order to solve the above problem, screws 5 are screwed on the bottom of the fixing frame 2. The screws 5 are in contact with the FPC circuit board 1 and are made of plastic.

[0021] In this embodiment, the fixing frame 2 and the connecting frame 3 are both made of insulating materials.

[0022] In the description of this article, it should be noted that relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0023] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An FPC circuit board that is easy to dissipate heat, comprising an FPC circuit board (1), characterized in that: A plurality of heat dissipation channels are arranged on the side wall of the FPC circuit board (1). A heat dissipation device is arranged on the FPC circuit board (1). The heat dissipation device comprises a fixing frame (2), a connecting frame (3) and a heat dissipation fan (4). Two fixing frames (2) are arranged. Two connecting frames (3) are fixedly connected between the two fixing frames (2). A plurality of heat dissipation fans (4) are fixedly arranged between the connecting frames (3) on both sides. The fixing frames (2) on both sides are respectively clamped on the front and rear sides of the FPC circuit board (1). The heat dissipation device is located on the right side of the bottom of the FPC circuit board (1). A guide plate (6) is fixedly arranged on the right side of the connecting frame (3) on the right side. The guide plate (6) cooperates with the heat dissipation channel.

2. The FPC circuit board for heat dissipation according to claim 1, characterized in that: The bottom of the fixing frame (2) is screwed with a screw (5), the screw (5) is in contact with the FPC circuit board (1), and the screw (5) is made of plastic.

3. The FPC circuit board for heat dissipation according to claim 2, characterized in that: The fixing frame (2) and the connecting frame (3) are both made of insulating materials.

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