High-thermal-conductivity ceramic substrate

Abstract

The utility model relates to the field of ceramic substrates, discloses a high-heat-conductivity ceramic substrate, and solves the problem of poor heat conduction effect of the conventional ceramic substrate. Through the fixing plate, the first magnet block, the second magnet block, the clamping block and the clamping groove, the multiple sets of air guide pipes distributed at equal intervals are arranged in the cavity formed in the plate body, and the connecting plates are arranged at the two ends of every two adjacent sets of air guide pipes to be fixedly connected with the fixing plate; and one end of the fixing plate is provided with a magnet block I which is fixed with a magnet block II corresponding to the inner wall of the plate body in a heteropole attraction manner, and meanwhile, one end of the fixing plate is also provided with a clamping block which is clamped and fixed with a clamping groove formed in the inner wall of the plate body, so that the air guide pipe is convenient to fix, the operation is convenient, and time and labor are saved.

Description

Technical Field

[0001] The utility model relates to the technical field of ceramic substrates, in particular to a high thermal conductivity ceramic substrate. Background Art

[0002] Ceramic substrates are boards with copper foil bonded to an alumina or aluminum nitride ceramic substrate. Ceramic substrates have high temperature resistance and can remain stable at high temperatures.

[0003] During the operation and use of current ceramic substrates, the heat conduction efficiency inside the ceramic substrates is relatively low, and heat is not easily transferred to the heat dissipation area quickly and effectively, resulting in poor heat dissipation effect. The lack of thermal conductive pipes may cause uneven temperature distribution on the surface of the ceramic substrate, with the temperature in some areas being too high while the temperature in other areas is relatively low, affecting the stability and reliability of the equipment. The lack of thermal conductive pipes limits the diversity of heat dissipation methods, restricts the heat dissipation design, and makes it difficult to meet the heat dissipation needs of high-power equipment. Utility Model Content

[0004] The utility model aims to provide a high thermal conductivity ceramic substrate. The device is used to work, thereby solving the problem of poor thermal conductivity of the existing ceramic substrate.

[0005] To achieve the above object, the utility model provides the following technical solution: a high thermal conductivity ceramic substrate, comprising a plate body, a cavity opened inside the plate body, and an air duct arranged inside the cavity, wherein one end of the air duct is provided with a clamping structure;

[0006] The clamping structure comprises a fixing plate arranged at one end of the air guide pipe, a first magnet block arranged at one end of the fixing plate, and a second magnet block arranged on the inner wall of the plate body.

[0007] Furthermore, a clamping block is provided at one end of the fixing plate, and a clamping groove is provided on the inner wall of the plate body.

[0008] Furthermore, the positions of the magnet block 1 and the magnet block 2 correspond to each other, and the magnet block 1 and the magnet block 2 attract each other with opposite poles.

[0009] Furthermore, a connecting plate is provided at the other end of the air guide duct, and a plurality of connecting plates are provided at equal intervals, a plurality of air guide ducts are provided at equal intervals, and a group of connecting plates is provided between every two groups of air guide ducts.

[0010] Furthermore, heat sinks are arranged on both sides of the plate body, and bolts are arranged at the four corners of the heat sinks.

[0011] Furthermore, an anti-slip structure is arranged outside the bolt, and the anti-slip structure includes a circular plate arranged on one side of the plate body, a notch opened inside the circular plate, and a limit block arranged inside the notch, and the limit block is trapezoidal.

[0012] Furthermore, a spring is provided at one end of the limit block, and one end of the spring is connected to the inner wall of the slot.

[0013] A pull wire is arranged at one end of the limit block, and a pull ring is arranged at one end of the pull wire.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] The utility model proposes a high thermal conductivity ceramic substrate. The existing ceramic substrate has poor thermal conductivity. The utility model uses a fixing plate, a magnet block 1, a magnet block 2, a clamping block and a clamping slot, and opens a cavity inside the plate body to set a plurality of groups of air ducts with equal spacing, and each two adjacent groups of air ducts are provided with a connecting plate and a fixing plate at both ends to connect and fix them, and a magnet block 1 is provided at one end of the fixing plate and a magnet block 2 corresponding to the inner wall of the plate body is fixed by attraction of opposite poles, and a clamping block is also provided at one end of the fixing plate to clamp and fix it with the clamping slot opened on the inner wall of the plate body, so that the air duct is convenient to fix, easy to operate, and time and labor are saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0017] Figure 2 It is a three-dimensional structural schematic diagram of the clamping structure of the utility model;

[0018] Figure 3 It is a three-dimensional structural schematic diagram of the heat sink, bolts and anti-slip structure of the utility model;

[0019] Figure 4 It is a three-dimensional structural schematic diagram of the anti-slip structure of the bolt of the utility model.

[0020] In the figure: 1. plate body; 2. cavity; 3. air duct; 4. connecting plate; 5. clamping structure; 51. fixing plate; 52. magnet block 1; 53. magnet block 2; 54. clamping block; 55. clamping slot; 6. heat sink; 7. bolt; 8. anti-slip structure; 81. round plate; 82. notch; 83. limit block; 84. spring; 85. pull wire; 86. pull ring. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] In order to further understand the content of the utility model, the utility model is described in detail in conjunction with the accompanying drawings.

[0023] Combination Figure 1-Figure 2 A high thermal conductivity ceramic substrate includes a board body 1, a cavity 2 opened inside the board body 1, an air duct 3 arranged inside the cavity 2, and a clamping structure 5 is arranged at one end of the air duct 3.

[0024] The utility model is further described below in conjunction with embodiments.

[0025] Embodiment 1:

[0026] See also Figure 1-Figure 2 The clamping structure 5 includes a fixing plate 51 arranged at one end of the air duct 3, a magnet block 52 arranged at one end of the fixing plate 51, a magnet block 53 arranged on the inner wall of the plate body 1, a clamping block 54 is arranged at one end of the fixing plate 51, a clamping groove 55 is opened on the inner wall of the plate body 1, the positions of the magnet block 52 and the magnet block 53 correspond to each other, and the magnet block 52 and the magnet block 53 are attracted to each other with opposite poles, and a connecting plate 4 is arranged at the other end of the air duct 3, and a plurality of connecting plates 4 are arranged at equal intervals, and a plurality of air ducts 3 are arranged at equal intervals, and a group of connecting plates 4 is arranged between every two groups of air ducts 3, so that the air ducts 3 are convenient to fix and operate.

[0027] Specifically, a plurality of groups of air ducts 3 are arranged inside a cavity 2 opened inside the plate body 1 and are evenly spaced, and connecting plates 4 and fixing plates 51 are provided at both ends of each two adjacent groups of air ducts 3 to connect and fix them, and a magnet block 1 52 is provided at one end of the fixing plate 51 and is fixed with a magnet block 2 53 corresponding to the inner wall of the plate body 1 by attraction of opposite poles, and a clamping block 54 is also provided at one end of the fixing plate 51 and is clamped and fixed with a clamping groove 55 opened on the inner wall of the plate body 1, so that the air ducts 3 can be easily fixed, the operation is convenient, and time and effort are saved.

[0028] Embodiment 2:

[0029] Please refer to Figure 3-Figure 4 , heat sinks 6 are arranged on both sides of the plate body 1, bolts 7 are arranged at the four corners of the heat sink 6, and an anti-slip structure 8 is arranged outside the bolt 7. The anti-slip structure 8 includes a circular plate 81 arranged on one side of the plate body 1, a notch 82 opened inside the circular plate 81, and a limit block 83 arranged inside the notch 82. The limit block 83 is trapezoidal, and a spring 84 is arranged at one end of the limit block 83. One end of the spring 84 is connected to the inner wall of the notch 82, and a pull wire 85 is arranged at one end of the limit block 83. A pull ring 86 is arranged at one end of the pull wire 85 for easy disassembly and maintenance.

[0030] Specifically, heat sinks 6 are provided on both sides of the plate body 1, and the four corners of the heat sink 6 are fixed to the plate body 1 by multiple groups of bolts 7. In order to prevent the bolts 7 from loosening after long-term use, a circular plate 81 is provided on the surface of the plate body 1, and two groups of notches 82 are symmetrically opened inside the surface of the circular plate 81. The inside of the notch 82 is connected with a trapezoidal limit block 83 through a spring 84. The two groups of limit blocks 83 are clamped between the threads to limit the bolt 7 to prevent the bolt 7 from falling off. When the bolt 7 needs to be removed, the pull rings 86 at both ends of the circular plate 81 are pulled, and the pull ring 86 drives the pull wire 85 to be pulled outward, and the other end of the pull wire 85 drives the limit block 83 to move away from the bolt 7 to both ends inside the notch 82, and the limit block 83 compresses the spring 84 to release the limit on the bolt 7, which is convenient for disassembly and maintenance.

[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high thermal conductivity ceramic substrate, comprising a plate body (1), a cavity (2) provided inside the plate body (1), and an air guide duct (3) arranged inside the cavity (2), characterized in that: One end of the air guide pipe (3) is provided with a clamping structure (5); The clamping structure (5) comprises a fixing plate (51) arranged at one end of the air guide tube (3), a first magnet block (52) arranged at one end of the fixing plate (51), and a second magnet block (53) arranged on the inner wall of the plate body (1).

2. The high thermal conductivity ceramic substrate according to claim 1, characterized in that: A clamping block (54) is provided at one end of the fixing plate (51), and a clamping groove (55) is provided on the inner wall of the plate body (1).

3. A high thermal conductivity ceramic substrate according to claim 2, characterized in that: The positions of the magnet block 1 (52) and the magnet block 2 (53) correspond to each other, and the magnet block 1 (52) and the magnet block 2 (53) have opposite poles that attract each other.

4. The high thermal conductivity ceramic substrate according to claim 1, characterized in that: A connecting plate (4) is provided at the other end of the air guide duct (3), a plurality of connecting plates (4) are provided at equal intervals, a plurality of air guide ducts (3) are provided at equal intervals, and a group of connecting plates (4) is provided between every two groups of air guide ducts (3).

5. The high thermal conductivity ceramic substrate according to claim 4, characterized in that: Heat sinks (6) are arranged on both sides of the plate body (1), and bolts (7) are arranged at the four corners of the heat sink (6).

6. The high thermal conductivity ceramic substrate according to claim 5, characterized in that: An anti-slip structure (8) is arranged outside the bolt (7), and the anti-slip structure (8) comprises a circular plate (81) arranged on one side of the plate body (1), a notch (82) provided inside the circular plate (81), and a limit block (83) arranged inside the notch (82), wherein the limit block (83) is trapezoidal.

7. The high thermal conductivity ceramic substrate according to claim 6, characterized in that: A spring (84) is provided at one end of the limit block (83), and one end of the spring (84) is connected to the inner wall of the notch (82).

8. The high thermal conductivity ceramic substrate according to claim 7, characterized in that: A pull wire (85) is disposed at one end of the limit block (83), and a pull ring (86) is disposed at one end of the pull wire (85).

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