Power device assembly and electronic device
The power device assembly addresses the challenge of heat dissipation by using a heat conductor and heat sink configuration to enhance heat transfer and maintain compactness, achieving efficient heat dissipation with reduced space occupation.
Patent Information
- Application Number
- CN202420686758.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-03
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-04-03
AI Technical Summary
Existing power device components face challenges in achieving effective heat dissipation without significantly increasing the occupied space, as increasing the contact area of the metal plate with the substrate leads to a larger volume.
A power device assembly is designed with a heat conductor wrapped around the power device, connected to a heat sink, which enhances heat transfer and dissipation through a combination of heat-conducting materials and structural features like grooves and fins, ensuring efficient heat dissipation while minimizing space occupation.
The solution significantly improves heat dissipation performance by increasing the contact area and facilitating rapid heat transfer to the outside, maintaining compactness and stability of the power device assembly.
Smart Images
Figure CN222148092U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the utility model relate to the technical field of electronic equipment, and in particular to a power device component and an electronic equipment. Background Art
[0002] The heat dissipation performance of the power device component determines the stability of the electronic device. The power device component includes a substrate, a metal plate and a power device. The metal plate is located between the substrate and the power device, and the metal plate is set on the substrate. The power device is set on the metal plate. When the power device generates heat during operation, the heat generated by the power device is transferred to the metal plate, and then diffused to the substrate through the metal plate, thereby achieving heat dissipation.
[0003] However, in the process of implementing the embodiments of the utility model, the inventors found that when the power of the power device increases, the heat generated by the power device also increases. In the prior art, in order to achieve a good heat dissipation effect, the contact area of the metal plate projected onto the substrate is usually increased, resulting in the metal plate occupying a large space. Utility Model Content
[0004] An embodiment of the utility model provides a power device component, which has good heat dissipation performance.
[0005] In order to solve the above technical problems, a technical solution adopted by the utility model is: to provide a power device assembly, including a plate body; a power device, which is arranged on the plate body; a heat conductor, which is arranged on the power device and wrapped around the power device; a heat sink, which is arranged on the heat conductor, and the heat conductor is used to conduct the heat of the power device to the heat sink, and the heat sink is used to dissipate the heat conducted by the heat conductor to the outside.
[0006] Optionally, the heat conductor has a first surface and a second surface that are arranged opposite to each other, a portion of the first surface is recessed toward the second surface, and a groove is formed on the first surface. The power device is accommodated in the groove, and the top surface of the power device is attached to the bottom surface of the groove away from the plate body, and the side surface of the power device is attached to the side arm of the groove.
[0007] Optionally, part of the first surface is recessed toward the second surface, forming a convex portion on the second surface; the heat sink is provided with a receiving groove, the convex portion is received in the receiving groove, and the convex portion is in contact with the inner surface of the receiving groove.
[0008] Optionally, the heat sink includes a heat sink, the heat sink includes an abutment portion and a plurality of heat sink fins, the heat sink fins are arranged on the abutment portion, and the plurality of heat sink fins are arranged at intervals, and the receiving groove is arranged on a surface of the abutment portion away from the heat sink fins.
[0009] Optionally, the plate body is provided with a through hole; the abutting portion is provided with a screw hole; the heat sink further comprises a bolt, and the bolt passes through the through hole and the heat conducting member in sequence and is then screwed to the screw hole.
[0010] Optionally, the plate body is provided with a positioning hole; the heat sink further includes a positioning column, one end of the positioning column is connected to the abutment portion, and the other end of the positioning column is inserted into the positioning hole.
[0011] Optionally, a first limiting portion and a second limiting portion are extended from the surface of the abutment portion away from the heat dissipation fin, the first limiting portion and the second limiting portion are arranged relatively spaced apart, the abutment portion, the first limiting portion and the second limiting portion jointly enclose a limited space, and the heat conductor is arranged in the limited space.
[0012] Optionally, the heat conducting member is made of heat-conducting silicon mud.
[0013] Optionally, the heat conducting member abuts against the plate body.
[0014] In order to solve the above technical problem, a technical solution adopted by the present invention is: to provide an electronic device, including the above power device assembly.
[0015] The beneficial effect of the embodiments of the present application is that, compared with the prior art, by wrapping the heat conductive member around the power device, the contact area of the power device is increased, so that the heat of the power device is quickly transferred to the outside, further improving the heat dissipation performance of the power device assembly. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the drawings without paying creative work.
[0017] Figure 1 This is a view of a power device assembly of a conventional structure provided by the utility model;
[0018] Figure 2 This is a view of a power device assembly provided by an embodiment of the utility model;
[0019] Figure 3 It is an exploded view of a power device assembly provided by an embodiment of the utility model;
[0020] Figure 4 is another exploded view of a power device assembly provided by an embodiment of the utility model;
[0021] Figure 5 This is a view of a radiator provided by an embodiment of the utility model.
[0022] Reference numerals:
[0023] 100. Power device components;
[0024] 10, radiator; 11, heat sink; 12, bolt; 10a, receiving groove; 111, abutment portion; 112, heat dissipation fin; 113, positioning column; 114, first limiting portion; 115, second limiting portion; 11a, limiting space; 111a, screw hole;
[0025] 20, heat conducting member; 20a, first surface; 20b, second surface; 20c, groove; 201, convex portion;
[0026] 30, power device; 40, plate body; 40a, through hole; 40b, positioning hole;
[0027] 401. Substrate; 402. Metal plate. DETAILED DESCRIPTION
[0028] In order to facilitate the understanding of the utility model, the utility model is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are for illustrative purposes only.
[0029] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by technicians in the technical field of the present invention. The terms used in this specification are only for the purpose of describing specific embodiments and are not used to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.
[0030] See also Figure 1 , Figure 1A power device assembly 100 of a conventional structure is shown, and the power device assembly 100 includes a substrate 401, a metal plate 402, and a power device 30. The substrate 401 is roughly in the shape of a thin plate, the metal plate 402 is arranged on the substrate 401, and the power device 30 is arranged on the metal plate 402. When the power device 30 is powered on, the heat generated by the power device 30 is conducted to the substrate 401 through the metal plate 402, and part of the heat of the power device 30 is dissipated to the outside through the metal plate 402, and the other part of the heat is dissipated to the outside through the substrate 401 and the power device 30. In the conventional structure, when the power of the power device 30 increases, the heat generated by the power device 30 increases accordingly. In order to solve the problem of good heat dissipation of the power device 30, the contact area of the projection of the metal plate 402 toward the substrate 401 is usually increased, so that the heat dissipation area of the metal plate 402 is increased, and this solution easily causes the metal plate 402 to occupy a large space, so that the volume of the power device assembly 100 is large.
[0031] See also Figure 2-Figure 3 The power device assembly 100 includes a heat sink 10, a heat conductor 20, a power device 30 and a plate 40. The power device 30 is arranged on the plate 40, the heat conductor 20 is arranged on the power device 30, and the heat conductor 20 is wrapped around the power device 30, and the heat sink 10 is arranged on the heat conductor 20. When the power device 30 generates heat during operation, the heat of the power device 30 is conducted to the heat sink 10 through the heat conductor 20, and the heat sink 10 dissipates the heat conducted by the heat conductor 20 to the outside, thereby achieving heat dissipation. Compared with the prior art, by wrapping the heat conductor 20 around the power device 30, the contact area of the power device 30 is increased, so that the heat of the power device 30 can be quickly conducted to the outside.
[0032] For the above heat sink 10, see Figure 3-Figure 4 The heat sink 10 includes a heat sink 11 and a bolt 12, and the heat sink 11 is fixedly connected to the plate body 40 by the bolt 12. Specifically, the plate body 40 is provided with a through hole 40a, and the heat sink 11 is provided with a screw hole 111a. The bolt 12 passes through the through hole 40a and the heat conducting member 20 in sequence and is screwed to the screw hole 111a, so that the heat sink 11 is fixed relative to the plate body 40.
[0033] For the above heat sink 11, see Figure 3-Figure 4, the heat sink 11 includes an abutment portion 111 and a plurality of heat sink fins 112. The screw hole 111a is provided on the abutment portion 111, the heat sink fin 112 is provided on the abutment portion 111, and the plurality of heat sink fins 112 are arranged at intervals, and a heat dissipation channel is enclosed between any two adjacent heat sink fins 112 and the abutment portion 111. The plurality of heat sink fins 112 directly increase the heat dissipation area of the heat sink 11, so that the heat sink 11 achieves good heat dissipation performance, and the heat of the power device 30 is conducted to the heat sink 11 through the heat conductive member 20, so that the power device 30 is well dissipated. Preferably, the shape of the heat sink fin 112 is flat. In some embodiments, the travel of the heat sink fin 112 is S-shaped or wavy. Exemplarily, the wavy heat sink fin 112 can increase the contact area with the external gas, so that the heat sink fin 112 achieves better heat dissipation performance. In some embodiments, there is also an alignment structure between the plate body 40 and the heat sink 11, so that the plate body 40 and the heat sink 11 are quickly aligned. Specifically, see Figure 3 Combination Figure 4 and Figure 5 , the plate body 40 is provided with a positioning hole 40b; the heat sink 11 further includes a positioning column 113, one end of which is connected to the abutment portion 111; when the plate body 40 and the heat sink 11 are pre-aligned, the other end of the positioning column 113 is plugged into the positioning hole 40b, thereby achieving alignment between the plate body 40 and the heat sink 11. In this embodiment, along the axial direction of the positioning column 11, the cross-section of the positioning column 11 is circular, and the positioning column 11 is adapted to the positioning hole 40b. In some embodiments, along the axial direction of the positioning column 11, the cross-section of the positioning column 11 is square or triangular, and the shape of the positioning column 11 is adapted to the positioning hole 40b. When the positioning column 11 is plugged into the positioning hole 40b, the heat sink 11 is not allowed to rotate relative to the plate body 40, thereby achieving a one-time alignment of the plate body 40 and the heat sink 11, while reducing the risk of the heat sink 11 being offset relative to 40. Exemplarily, the cross-section of the positioning column 11 is an isosceles triangle.
[0034] For the above-mentioned heat conducting member 20, please refer to Figure 1 The heat conducting member 20 has a first surface 20a and a second surface 20b that are arranged opposite to each other. A portion of the first surface 20a is recessed toward the second surface 20b, forming a groove (not shown) on the first surface 20a. The power device 30 is accommodated in the groove, and the top surface of the power device 30 facing away from the plate body 40 is attached to the bottom surface of the groove, and the side surface of the power device 30 is attached to the side arm of the groove, thereby increasing the contact area of the power device 30. It can be understood that the heat dissipation area of the power device 30 is increased.
[0035] In some embodiments, the heat sink 10 further includes a fan, which is disposed on the heat sink 11, and is used to assist the heat sink 11 to accelerate the heat dissipation of the heat sink 11. Specifically, the fan is fixed to the abutment portion 111 by bolts, and the air inlet or air outlet of the fan corresponds to the heat dissipation channel. When the fan is working, the heat in the heat dissipation channel is accelerated to be discharged to the outside, thereby increasing the heat dissipation performance of the heat sink 10.
[0036] In some embodiments, the heat conductor 20 and the heat sink 10 are provided with a limiting structure, so that the heat conductor 20 is not allowed to deviate relative to the heat sink 10. Specifically, a portion of the first surface 20a of the heat conductor 20 is recessed toward the second surface 20b of the heat conductor 20, and a convex portion is formed on the second surface 20b (not shown); the heat sink 10 is provided with a receiving groove 10a, and the convex portion is received in the receiving groove 10a, and the convex portion is in contact with the inner surface of the receiving groove 10a. When the heat conductor 20 is subjected to external force, the convex portion of the heat conductor 20 abuts against the wall surface of the receiving groove 10a of the heat sink 10, and the heat conductor 20 is not allowed to deviate relative to the heat sink 10. In some embodiments, the receiving groove 10a is provided on the surface of the abutting portion 111 away from the heat sink fin 112.
[0037] In some embodiments, the material of the heat conductive member 20 is heat conductive silica mud. Heat conductive silica mud is a material used for heat conductive medium, and also has the property of insulation. Heat conductive silica mud has good stability and high temperature resistance. Specifically, the heat conductive silica mud includes silica gel powder and heat conductive filler, and the silica gel powder and the heat conductive filler are mixed with an additive to form heat conductive silica mud. Preferably, the silica gel powder is an organic silicon material, and the heat conductive filler is aluminum oxide or silicon oxide, and aluminum oxide or silicon oxide has the property of insulation. Preferably, the heat conductive member 20 is located between the heat sink 11 and the plate body 40. When the heat conductive member 20 is assembled, the heat conductive member 20 is placed between the heat sink 11 and the plate body 40, and the bolt 12 is rotated so that the heat sink 11 and the plate body 40 jointly clamp the heat conductive member 20, and the heat conductive member 20 is deformed toward the plate body 40, and the heat conductive member 20 is wrapped around the power device 30, and the heat conductive member 20 is formed with a groove adapted to the power device 30. Preferably, the receiving groove 10a is arranged at one end of the supporting portion close to the plate body 40. During the pressing process of the radiator 10, the heat conductor 20 is deformed to form a convex portion toward the receiving groove 10a. The receiving groove 10a of the radiator 10 and the convex portion of the heat conductor 20 form a limiting structure, and the contact area between the heat conductor 20 and the limiting component is increased, so that the heat conduction between the heat conductor 20 and the limiting component achieves a good effect.
[0038] In some embodiments, a first limiting portion 114 and a second limiting portion 115 are extended from the surface of the abutment portion 111 away from the heat sink fin 112, and the first limiting portion 114 and the second limiting portion 115 are arranged at a relative interval. The abutment portion 111, the first limiting portion 114 and the second limiting portion 115 jointly enclose a limited space 11a, and the heat conductor 20 is arranged in the limited space 11a, which not only reduces the risk of the heat conductor 20 being offset, but also reduces the overflow of the heat conductor 20 relative to the heat sink 11 when the heat sink 11 presses the heat conductor 20, so that the heat conductor 20 is deformed and fills the limited space 11a, ensuring that the heat conductor 20 has a preset thickness and achieves a good heat conduction effect.
[0039] Along the direction perpendicular to the first limiting portion 114 toward the second limiting portion 115, the heat-conducting space 11a has a first overflow port and a second overflow port at opposite ends. When the heat-conducting component 20 is assembled, the heat-conducting component 20 is placed between the heat sink 11 and the plate body 40. By rotating the bolt 12, the heat-conducting component 20 is clamped together by the heat sink 11 and the plate body 40, allowing part of the heat-conducting component 20 to overflow from the first overflow port and the second overflow port, thereby reducing the risk of the power device 30 being crushed by the heat-conducting component 20.
[0040] For the above-mentioned power device 30, by energizing the power device 30, the power device 30 can convert part of the electrical energy into an electronic component of internal energy, and the power device 30 includes a transistor, a thyristor, a rectifier diode, an insulated gate bipolar transistor or a central processing unit. The power device 30 has the characteristics of withstand voltage, withstand current, and withstand temperature. However, the power device 30 plays a key role in the electronic equipment, and the power device 30 with good heat dissipation performance enables the electronic equipment to operate stably.
[0041] In some embodiments, there are four power devices 30, and the four power devices 30 are arranged at intervals. When assembling the heat conductive member 20, the heat conductive member 20 is placed between the heat sink 11 and the plate 40, and the bolt 12 is rotated so that the heat sink 11 and the plate 40 clamp the heat conductive member 20 together, and the heat conductive member 20 is deformed toward the plate 40, and the heat conductive member 20 is wrapped around the four power devices 30 to form four grooves adapted to the power devices 30.
[0042] For the plate body 40, the heat conducting member 20 abuts against the plate body 40. Figure 3 and Figure 4 The plate body 40 includes a substrate 401 and a metal plate 402. The metal plate 402 is located between the substrate 401 and the power device 30. The substrate 401 is disposed on the metal plate 402, and the power device 30 is disposed on the metal plate 402. Part of the heat generated by the power device 30 is conducted to the outside through the metal plate 402 and the substrate 401. In this embodiment, the metal plate 402 is made of copper. On the one hand, the copper material has good thermal conductivity. On the other hand, the metal plate 402 made of copper is low in cost.
[0043] The above-mentioned substrate 401 and metal plate 402 are both in the shape of thin plates. A first contact plane is provided at one end of the substrate 401 facing the metal plate 402, and a second contact plane is provided at one end of the metal plate 402 facing the substrate 401. The first contact plane and the second contact plane are overlapped, so that the substrate 401 and the metal plate 402 have good heat conduction.
[0044] The utility model also provides an electronic device embodiment, the electronic device includes the power device assembly 100 described above, and the specific structure and function of the power device assembly 100 can be referred to the above embodiment, which will not be described in detail here.
[0045] It should be noted that the preferred embodiments of the utility model are given in the specification and drawings of the utility model, but the utility model can be implemented in many different forms and is not limited to the embodiments described in the specification. These embodiments are not used as additional restrictions on the content of the utility model. The purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. In addition, the above-mentioned technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as the scope of the description of the utility model; further, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should belong to the scope of protection of the claims attached to the utility model.
Claims
1. A power device assembly, characterized in that: include: plate body; A power device, arranged on the plate body; A heat conducting member is disposed on the power device, and the heat conducting member is wrapped around the power device; The heat sink is arranged on the heat conducting member, the heat conducting member is used to conduct the heat of the power device to the heat sink, and the heat sink is used to dissipate the heat conducted by the heat conducting member to the outside.
2. The power device assembly according to claim 1, characterized in that: The heat conductor has a first surface and a second surface arranged opposite to each other, a portion of the first surface is recessed toward the second surface, and a groove is formed on the first surface. The power device is accommodated in the groove, and the top surface of the power device facing away from the plate body is attached to the bottom surface of the groove, and the side surface of the power device is attached to the side arm of the groove.
3. The power device assembly according to claim 2, characterized in that: A portion of the first surface is recessed toward the second surface, forming a convex portion on the second surface; The heat sink is provided with a receiving groove, the convex portion is received in the receiving groove, and the convex portion is in contact with the inner surface of the receiving groove.
4. The power device assembly according to claim 3, characterized in that: The heat sink comprises a heat sink, which comprises an abutting portion and a plurality of heat sink fins. The heat sink fins are arranged on the abutting portion and the plurality of heat sink fins are arranged at intervals. The receiving groove is arranged on a surface of the abutting portion away from the heat sink fins.
5. The power device assembly according to claim 4, characterized in that: The plate body is provided with a through hole; The abutting portion is provided with a screw hole; The heat sink further comprises a bolt, which passes through the through hole and the heat conducting member in sequence and is then screwed into the screw hole.
6. The power device assembly according to claim 5, characterized in that: The plate body is provided with a positioning hole; The heat sink also includes a positioning column, one end of which is connected to the abutment portion, and the other end of which is inserted into the positioning hole.
7. The power device assembly according to claim 4, characterized in that: A first limiting portion and a second limiting portion are extended from the surface of the abutting portion away from the heat dissipating fin, the first limiting portion and the second limiting portion are arranged relatively spaced apart, the abutting portion, the first limiting portion and the second limiting portion jointly enclose a limited space, and the heat conducting member is arranged in the limited space.
8. The power device assembly according to claim 1, characterized in that: The material of the heat conducting member is heat conducting silicon mud.
9. The power device assembly according to any one of claims 1 to 8, characterized in that: The heat conducting member abuts against the plate body.
10. An electronic device, characterized in that: Comprising a power device assembly as described in any one of claims 1-9.