Correction jig suitable for poor pins of semiconductor TF product

Abstract

The utility model belongs to the technical field of semiconductor packaging test auxiliary devices, and particularly relates to a correction jig suitable for poor pins of a product after a TF (Trans-Flash) of a semiconductor, which comprises a manual press, and a mold connecting block, an upper template fixing block, an upper template, a lower template and a lower template fixing block which are sequentially arranged on the manual press from top to bottom, the die connecting block is detachably connected with the manual press, an upper die plate correction module is installed on the upper die plate, a lower die plate correction module is installed on the lower die plate, four springs are arranged between the upper die plate fixing block and the upper die plate, two linear guide rails are arranged on the inner side of the upper die plate fixing block, the inner side of the upper die plate and the inner side of the lower die plate in a penetrating mode, and the two linear guide rails are connected with the upper die plate correction module. Linear bearings are arranged at the connecting positions of the two linear guide rails and the upper die plate fixing block and the upper die plate, a plurality of product feet can be rapidly corrected, the working efficiency is improved, and the product rejection rate and the production cost are reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging test auxiliary devices, and in particular relates to a correction tool suitable for defective pins of semiconductor TF post-products. Background Art

[0002] During the packaging cutting and testing process, the product operation process may occasionally cause slight deformation of the product's external pins due to equipment problems. If the pins are deformed, customers may complain about the defective pins on the board. Therefore, when a product has defective pins, the product must be corrected to prevent defective products from being leaked. The traditional operation method in the industry is to manually operate under a microscope, press the product with your hands, and use tweezers to adjust the defective pins of the product.

[0003] However, the traditional operation method has the following disadvantages: 1. In the traditional operation method, if the external pins are defective, the product will be directly scrapped without affecting the yield rate required by the customer. This will inevitably cause a loss of product yield and lead to a waste of manpower and material resources; 2. The traditional manual operation method is prone to static electricity breakdown of the product, bringing quality risks; 3. The traditional operation method has a relatively slow operation efficiency and wastes the company's manpower costs; 4. In the traditional operation method, products are easily lost, resulting in a low yield rate; 5. The traditional operation method relies entirely on the skills and experience of employees, and there is a risk of defective products leaking; 6. In the traditional operation method, when the product model is small, it is impossible to operate manually, resulting in the product having to be scrapped; 7. The traditional operation method is prone to poor tin plating on the product feet, affecting the solderability of the product; 8. The traditional operation method is extremely inefficient, which will affect the production cycle of the product and the shipment of customer orders. Utility Model Content

[0004] In view of the above-mentioned deficiencies existing in the prior art, the utility model provides a correction tool suitable for defective pins of semiconductor TF products, so as to solve the above-mentioned existing problems.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] A correction jig suitable for defective feet of semiconductor TF rear products, comprising a manual press and a mold connecting block, an upper template fixing block, an upper template, a lower template and a lower template fixing block which are sequentially installed on the manual press from top to bottom, the mold connecting block is detachably connected to the manual press, an upper template correction module is installed on the upper template, a lower template correction module is installed on the lower template, four springs are arranged between the upper template fixing block and the upper template, two linear guide rails are penetrated through the inner sides of the upper template fixing block, the upper template and the lower template, and linear bearings are arranged at the connection between the two linear guide rails and the upper template fixing block and the upper template.

[0007] Furthermore, two limiting buffer columns are fixedly provided on the lower template.

[0008] Furthermore, the lower template fixing block is detachably connected to the manual press.

[0009] Compared with the prior art, the utility model has the following beneficial effects:

[0010] 1. The use of the utility model can basically eliminate the risk of product scrapping, greatly improve the yield loss of products caused by defective external pins, and greatly improve the utilization rate of manpower and material resources;

[0011] 2. The use of this utility model can avoid the risk of static electricity breakdown of products;

[0012] 3. The use of the utility model greatly improves the operating efficiency and further reduces the labor cost;

[0013] 4. The use of the utility model will not cause product loss and loss of yield;

[0014] 5. Using this utility model, the size of the product is within the range specified in the document, and there is no risk of defective products leaking out;

[0015] 6. The utility model can be used regardless of the size of the product, thus solving the problem of limited product size due to manual operation;

[0016] 7. The use of the utility model will not cause the defect of pin tinning, and eliminate the risk of poor product solderability on the client side;

[0017] 8. The use of the utility model greatly improves the operating efficiency, further speeds up the product online process, greatly shortens the product delivery time, and further increases customer satisfaction. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of a correction jig for defective pins of semiconductor TF rear products according to the utility model (viewing angle 1);

[0019] Figure 2 This is a three-dimensional structural schematic diagram of an embodiment of a correction jig for defective pins of semiconductor TF rear products according to the utility model (viewing angle 2);

[0020] Figure 3 It is an exploded view of an embodiment of a correction jig for defective pins of semiconductor TF products according to the utility model;

[0021] The reference numerals in the drawings of the specification include:

[0022] Manual press 1, mold connecting block 2, upper template fixing block 3, upper template 4, upper template correction module 41, lower template 5, lower template correction module 51, lower template fixing block 6, linear guide rail 7, spring 8, limit buffer column 9. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the present invention, the technical solution of the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0024] Among them, the drawings are only used for illustrative explanations, and they only represent schematic diagrams rather than actual pictures, and should not be understood as limitations on this patent; in order to better illustrate the embodiments of the utility model, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0025] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0026] In the description of the present invention, unless otherwise clearly specified and limited, if the term "connection" or the like appears to indicate the connection relationship between components, the term should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] Example:

[0028] like Figure 1-Figure 3As shown, the utility model is a correction jig suitable for defective feet of semiconductor TF rear products, including a manual press 1 and a mold connecting block 2, an upper template fixing block 3, an upper template 4, a lower template 5 and a lower template fixing block 6 which are installed on the manual press 1 from top to bottom in sequence, the mold connecting block 2 is detachably connected to the manual press 1, an upper template correction module 41 is installed on the upper template 4, and a lower template correction module 51 is installed on the lower template 5, four springs 8 are arranged between the upper template fixing block 3 and the upper template 4, two linear guide rails 7 are penetrated on the inner sides of the upper template fixing block 3, the upper template 4 and the lower template 5, linear bearings are provided at the connection between the two linear guide rails 7 and the upper template fixing block 3 and the upper template 4, two limiting buffer columns 9 are also fixed on the lower template 5, and the lower template fixing block 6 is detachably connected to the manual press 1.

[0029] Specifically, when in use, the operating steps are as follows: 1. The operator places the product to be processed into the lower template correction module 51 and fixes the product to be processed; 2. The operator manually pulls the handle of the multifunctional manual press, and the stroke column of the manual press drives the upper template fixing block 3, the upper template 4, and the upper template correction module 41 to move downward through the mold connecting block 2; 3. The product to be processed is squeezed through the upper template correction module 41 and the lower template correction module 51 to correct the deformed pins of the product; 4. The operator releases the handle of the multifunctional manual press, and the manual press spring drives the stroke column through the mold connecting block 2 to drive the upper template fixing block 3, the upper template 4, and the upper template correction module 41 to move upward; 5. The operator takes out the processed product; 6. After one cycle is completed, repeat the above actions. The fixture mainly uses a multifunctional manual press to extrude the product foot correction mold downward to correct the foot deformation of the product; the fixture is equipped with a limit buffer column to prevent excessive squeezing of the product pins; the fixture can hold multiple products for correction at the same time; the fixture is designed with independent upper and lower correction modules, which can be replaced to achieve universal correction of multiple models of products; the fixture can effectively reduce employee workload, reduce product scrapping, and improve product quality.

[0030] The above are only embodiments of the utility model. The common sense such as the known specific structures and characteristics in the scheme is not described in detail here. The ordinary technicians in the relevant field know all the common technical knowledge in the technical field to which the utility model belongs before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply the conventional experimental means before that date. The ordinary technicians in the relevant field can improve and implement the scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for the ordinary technicians in the relevant field to implement this application. It should be pointed out that for the technicians in this field, without departing from the structure of the utility model, several deformations and improvements can be made, which should also be regarded as the protection scope of the utility model, and these will not affect the effect of the implementation of the utility model and the practicality of the patent.

Claims

1. A correction jig suitable for semiconductor TF post-product foot defects, characterized by: It includes a manual press and a mold connecting block, an upper template fixing block, an upper template, a lower template and a lower template fixing block which are installed on the manual press in sequence from top to bottom. The mold connecting block is detachably connected to the manual press. An upper template correction module is installed on the upper template, and a lower template correction module is installed on the lower template. Four springs are arranged between the upper template fixing block and the upper template. Two linear guide rails are penetrated through the inner sides of the upper template fixing block, the upper template and the lower template. Linear bearings are arranged at the connection between the two linear guide rails and the upper template fixing block and the upper template.

2. A correction jig for defective semiconductor TF products as claimed in claim 1, characterized in that: Two limiting buffer columns are also fixedly provided on the lower template.

3. A correction jig for defective semiconductor TF product as claimed in claim 2, characterized in that: The lower template fixing block is detachably connected to the manual press.

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