Thermal bridge node structure of outer wall floor slab
The exterior wall and floor thermal bridge node structure addresses fast heat conduction by using an embedded insulation pad and multi-layered insulation system, achieving improved thermal insulation and stability at the connection point.
Patent Information
- Application Number
- CN202420451815.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-08
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-03-08
AI Technical Summary
Existing exterior wall and floor thermal bridge nodes experience fast heat conduction due to indoor and outdoor temperature differences, leading to significant heat loss and instability at the connection point.
The structure incorporates an insulation pad embedded in the floor slab with inorganic insulation interface layers, inner and outer insulation boards connected via connectors, and an outer insulation layer, reducing heat conduction and enhancing stability through a multi-layered insulation system.
The solution effectively isolates indoor and outdoor temperatures, reduces heat conduction, enhances thermal insulation performance, and improves the stability and waterproofing of the node connection, thereby minimizing heat loss and improving overall insulation efficiency.
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Figure CN222161642U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of building construction, in particular to an external wall floor thermal bridge node structure. Background Art
[0002] The exterior wall and floor thermal bridge node is a building construction method used to reduce heat conduction and prevent heat loss. It is an important part of building energy conservation. Through reasonable thermal bridge node design and construction, it can effectively reduce heat loss and improve the thermal insulation performance of the building. It is widely used in current energy-saving buildings.
[0003] The Chinese patent with the publication number CN218479352U discloses an exterior wall floor node structure, comprising a vertical exterior wall and a horizontal floor, wherein the floor is vertically connected to the exterior wall, and an insulation pad is arranged at the connection between the floor and the exterior wall, and an insulation board is arranged on the vertical surface of the exterior wall close to the floor; the insulation pad is embedded in the floor, and the insulation pad is butt-jointed with the insulation board. The exterior wall floor node structure is provided with an insulation pad at the connection, and the insulation pad is embedded in the floor, so as to ensure that the insulation pad is consistent with the durability of the floor. Compared with the traditional post-attached insulation board, the exterior wall floor node structure can not only play the role of thermal bridge insulation and heat insulation to prevent indoor condensation, but also no longer need a secondary insulation construction process, avoid uneven floor, and shorten the construction period. However, due to the indoor and outdoor temperature difference, the indoor and outdoor temperature difference at the node position is easy to be conducted at the node position, and the heat conduction efficiency is fast, which is easy to cause the problem of heat loss. Utility Model Content
[0004] The embodiment of the utility model provides an exterior wall floor thermal bridge node structure to achieve the technical effects of isolating indoor and outdoor temperatures, reducing convection of heat conduction, increasing thermal insulation performance, reducing convection of heat conduction, increasing thermal insulation performance, and improving the stability of node use.
[0005] One aspect of the implementation of the utility model provides an exterior wall and floor thermal bridge node structure, including an exterior wall and a floor, a groove is provided on the inner side of the exterior wall corresponding to the installation position of the floor, one end of the floor extends into the groove on the inner side of the exterior wall, and an insulation pad is provided at the position where the floor is connected to the inner side of the exterior wall; inner insulation boards are respectively provided on the inner side of the exterior wall and on the upper and lower sides of the floor, and connecting parts are provided on the inner insulation board and the inner side of the exterior wall, an interior decoration layer is provided on the inner side of the inner insulation board, and an outer insulation layer is provided on the outer side of the exterior wall.
[0006] Compared with the prior art, the beneficial effects of the utility model are:
[0007] The utility model connects the floor slab by extending the floor slab to the inside of the exterior wall, and reduces the contact effect between the exterior wall and the upper and lower sides of the floor slab through the thermal insulation pad during the connection, thereby reducing the heat conduction between the exterior wall and the floor slab, reduces the indoor temperature through the internal thermal insulation board to conduct heat to the node position on the floor slab, improves the thermal insulation performance of the indoor node position, reduces the effect of the outdoor temperature penetrating into the exterior wall through the external thermal insulation layer, and achieves the effect of reducing the conduction between the exterior wall and the floor slab due to the temperature difference between indoor and outdoor.
[0008] Further, the preferred solution adopted by the utility model is:
[0009] Inorganic thermal insulation interface layers are respectively arranged between the upper and lower sides of the floor slab and the inner thermal insulation board.
[0010] The insulation pad is embedded in the floor slab, the inorganic insulation interface layer covers the surface of the insulation pad, and the width of the pad is greater than the depth of the floor slab extending into the exterior wall, which reduces the indoor temperature and conducts heat to the floor slab.
[0011] The connector is pre-buried in the exterior wall, and the back side of the inner insulation board is plugged into the connector. The inner insulation board and the connector are plugged into each other, thereby improving the firmness of the connection between the inner insulation board and the exterior wall.
[0012] The connector includes a long strip connecting plate, one side of which is provided with a cylindrical connecting buckle at intervals, a protrusion is provided inside the connecting buckle, a pin is provided on the back side of the insulation board at a position corresponding to the connecting buckle, a groove matching the protrusion is provided on the outer wall of the pin, and the pin is connected to the connecting buckle through the matching of the groove and the protrusion. After the pin is inserted into the connecting buckle, the protrusion is deformed first and connected to the groove to complete the fixation, thereby preventing the inner insulation board from being separated from the outer wall. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The drawings described herein are used to provide a further understanding of the present invention, constitute a part of the present application, and do not constitute a limitation of the present invention. In the drawings:
[0014] Figure 1 It is a schematic diagram of the structure of the utility model;
[0015] Figure 2 It is a partial structural schematic diagram of the utility model;
[0016] Figure 3 This is a schematic diagram of the structure of the utility model after removing one side of the inner insulation board;
[0017] Figure 4 It is a structural schematic diagram of the connecting member in the utility model;
[0018] Figure 5 This is a schematic diagram of the structure of the inner insulation board in the utility model;
[0019] Figure 6 It is a structural schematic diagram of the fixing member in the utility model;
[0020] In the figure: exterior wall 1; floor slab 2; insulation pad 3; inorganic insulation interface layer 4; interior insulation board 5; interior decoration surface layer 6; exterior insulation layer 7; connecting plate 8; connecting buckle 9; pin 10; interface mortar layer 11; fixing piece 12; waterproof coating 13; exterior finishing layer 14. DETAILED DESCRIPTION
[0021] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in combination with the implementation mode and the accompanying drawings. Here, the schematic implementation mode of the utility model and its description are used to explain the utility model, but are not used as a limitation of the utility model.
[0022] like Figures 1 to 6 As shown, an exterior wall-floor thermal bridge node structure is composed of an exterior wall 1 and a floor slab 2, a notch is provided on the inner side of the exterior wall 1 corresponding to the installation position of the floor slab 2, one end of the floor slab 2 connected to the exterior wall 1 extends into the notch on the inner side of the exterior wall 1, and an insulation pad 3 is provided at the position where the floor slab 2 is connected to the inner side of the exterior wall 1; inner insulation boards 5 are respectively installed on the upper and lower sides of the floor slab 2 and the inner side of the exterior wall 1, and the inner side of the inner insulation board 5 is painted with an interior decoration surface layer 6; an outer insulation layer 7 is fixedly installed on the outer side of the exterior wall 1.
[0023] Grooves are respectively provided at the upper and lower ends of the floor 2 connected to the exterior wall 1, and insulation pads 3 are respectively embedded in the grooves on each side, and the width of the insulation pads 3 is greater than the depth of the inner grooves of the exterior wall 1; the upper and lower surfaces of the floor 2 are also coated with inorganic insulation interface layers 4, and the inorganic insulation interface layer 4 is ensured to cover the insulation pads 3, thereby reducing the indoor temperature and conducting heat to the node position on the floor 2, thereby improving the indoor insulation performance at the node position.
[0024] The inner side of the outer wall 1 and the inorganic thermal insulation interface layer 4 on the upper and lower sides of the floor 2 are respectively installed with inner thermal insulation boards 5, and the inner thermal insulation boards 5 are connected to the outer wall 1 through connectors. In this embodiment, connectors are pre-buried inside the outer wall 1, and the connectors include a long strip of connecting plates 8, and a plurality of cylindrical connecting buckles 9 are installed at intervals on the side of the connecting plates 8 facing the floor 2, and a protrusion is arranged inside the connecting buckle 9; a pin rod 10 corresponding to the connecting buckle 9 is arranged on the back side of the inner thermal insulation board 5 at a position corresponding to the connecting buckle 9, and a groove matching the protrusion is arranged on the outer wall of the pin rod 10, and the pin rod 10 is connected to the connecting buckle 9 through the cooperation of the groove and the protrusion to avoid separation between the inner thermal insulation board 5 and the outer wall 1.
[0025] The outer side of the exterior wall 1 is coated with an interface mortar layer 11, and the external thermal insulation layer 7 is fixedly installed on the outer side of the interface mortar layer 1; the external thermal insulation layer 7 is also fixed to the inside of the exterior wall 1 through a fixing member 12, and the fixing member 12 is a T-shaped structure, and one side of the fixing member 12 is a disc structure. The disc structure on the fixing member 12 is pressed against one side of the external thermal insulation layer 7, and the fixing member 12 passes through the external thermal insulation layer 7 and is fixed inside the exterior wall, so as to achieve the effect of fixing the external thermal insulation layer 7 to the exterior wall 1, so as to improve the firmness of the connection between the external thermal insulation layer 7 and the exterior wall 7.
[0026] The outer insulation layer 7 in this embodiment can be made of asbestos board. After fixing, a waterproof coating 13 is coated on the outside of the outer insulation layer 7. The waterproof coating 13 is roughened and then coated with an outer finishing layer 14 on the outside, thereby improving the outdoor waterproof performance while improving the building insulation effect.
[0027] The utility model isolates the indoor and outdoor temperatures by adopting an inner insulation board and an outer insulation layer, reduces the transmission of heat conduction between the outer wall and the floor slab, improves the insulation performance, and improves the installation stability of the inner insulation board by adopting connecting parts, which is easy to use; through the inorganic insulation interface layer, the heat transmission between the indoor temperature and the floor slab is further reduced, thereby improving the indoor insulation effect.
[0028] The above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
Claims
1. An exterior wall and floor thermal bridge node structure, comprising an exterior wall and a floor, characterized in that: A groove is provided on the inner side of the outer wall corresponding to the installation position of the floor slab, one end of the floor slab extends into the groove on the inner side of the outer wall, and an insulation pad is provided at the position where the floor slab is connected to the inner side of the outer wall; inner insulation boards are provided on the inner side of the outer wall and on the upper and lower sides of the floor slab, and connecting parts are provided between the inner insulation board and the inner side of the outer wall, an interior decoration surface layer is provided on the inner side of the inner insulation board, and an outer insulation layer is provided on the outer side of the outer wall.
2. The exterior wall floor thermal bridge node structure according to claim 1, characterized in that: Inorganic thermal insulation interface layers are respectively arranged between the upper and lower sides of the floor slab and the inner thermal insulation board.
3. The exterior wall floor thermal bridge node structure according to claim 2, characterized in that: The thermal insulation pad is embedded in the floor slab, the inorganic thermal insulation interface layer covers the surface of the thermal insulation pad, and the width of the pad is greater than the depth of the floor slab extending into the exterior wall.
4. The exterior wall floor thermal bridge node structure according to claim 1, characterized in that: The connecting piece is pre-buried in the outer wall, and the back side of the inner insulation board is plugged into the connecting piece.
5. The exterior wall floor thermal bridge node structure according to claim 4, characterized in that: The connecting piece includes a long strip of connecting plate, one side of which is provided with a cylindrical connecting buckle at intervals, a protrusion is provided inside the connecting buckle, a pin rod is provided on the back side of the insulation board at a position corresponding to the connecting buckle, and a groove matching the protrusion is provided on the outer wall of the pin rod, and the pin rod is connected to the connecting buckle through the cooperation of the groove and the protrusion.
Citation Information
Patent Citations
Outer wall floor node structure
CN218479352U
