High and low temperature multi-channel function test module

Abstract

The utility model aims to provide the high and low temperature multi-channel function test module which can test battery protection boards in batches and is convenient and reliable to operate. The device comprises a temperature control box, an upper computer and a plurality of groups of product carriers arranged in the temperature control box, and each product carrier is provided with a substrate, a plurality of switching units, a power supply unit, a temperature detection unit and a plurality of groups of product connectors. The plurality of product connectors are in one-to-one correspondence and are in electric signal connection with the substrate through the plurality of switching units, the substrate and the temperature detection unit are both in communication connection with the upper computer, and the power supply unit supplies power to a to-be-detected product through the product connectors. The utility model is applied to the technical field of battery structure testing.

Description

Technical Field

[0001] The utility model is applied to the technical field of battery structure testing, and particularly relates to a high and low temperature multi-channel functional testing module. Background Art

[0002] Consumer electronic products basically have their own power supply structure, which can operate independently without relying on the wiring harness to connect the power supply. In order to ensure the stable operation of the power supply structure, a battery protection board is usually set up for battery driving and charge and discharge management. Due to different geographical locations, the temperature is also different. For example, in the low temperature environment or extremely high temperature environment in the north, the battery and the battery protection board will show different working conditions due to the influence of the external temperature environment. In order to ensure that consumers can get a better user experience in different environments, it is necessary to test the working state of the power supply structure under different temperature environments. In existing tests, the battery pack is usually tested under different temperature environments to obtain its performance parameters at the corresponding temperature. It is usually a batch test before assembly, and the connection device is used to connect and test a large number of battery packs. After completing the battery pack test, the battery protection board is usually not tested separately or after assembly. In this way, the working state of the battery protection board under different temperature environments cannot be obtained, and its performance under the corresponding conditions cannot be known. Since high temperature or low temperature environment testing requires an independent temperature environment, it is not convenient for operators to test directly on the production line, because without this temperature environment, the authenticity of the data collected by the tester is greatly deviated, and it is easy to misjudge the function. Utility Model Content

[0003] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a high and low temperature multi-channel functional test module which can test battery protection boards in batches and is easy to operate and reliable.

[0004] The technical solution adopted by the utility model is: the utility model includes a temperature control box, a host computer and several groups of product carriers arranged in the temperature control box, the product carriers are provided with a substrate, several switching units, a power supply unit, a temperature detection unit and several groups of product connectors, the several product connectors are connected to the substrate by electrical signals through several switching units in a one-to-one correspondence, the substrate and the temperature detection units are both communicatively connected to the host computer, and the power supply unit supplies power to the product to be tested through the product connector.

[0005] It can be seen from the above scheme that the temperature control box provides a temperature environment to provide a low temperature, normal temperature and high temperature test environment with a temperature range of -20°C to 60°C. Multiple groups of product carriers are used to carry multiple groups of products for testing at the same time. Each group of product carriers is connected to a carrier structure, and several product connectors on the product carrier and the products to be tested on the carrier structure are connected in batches. By setting a switching unit, one group of several products to be tested is tested with the basic connection during the test time, thereby saving the number of test instruments. Only one substrate is needed to test multiple groups of products, reducing the instrument cost and wiring harness cost.

[0006] A preferred solution is that the power supply unit is connected to the product connector for power supply through a protection module, the protection module includes a first operational amplifier and an adjustable resistor, the positive input terminal of the first operational amplifier is connected to the power supply unit, the active end of the adjustable resistor is connected to the positive input terminal of the first operational amplifier, the fixed end of the adjustable resistor is respectively connected to a 3.3V power supply and a ground wire, and the output end of the first operational amplifier is connected to the power terminal of the product connector.

[0007] A preferred solution is that the switching unit includes a plurality of the relays, the plurality of relays conduct the product connector and the substrate, a collection module is provided on the substrate, and the host computer reads the electrical signal data acquired by the collection module.

[0008] A preferred solution is that the power supply unit includes a power interface and a plurality of voltage stabilizing chips, and the voltage stabilizing chips output the converted voltage to the product connector.

[0009] A preferred solution is that the substrate communicates with the temperature detection unit through an I2C module, the temperature detection unit includes a plurality of groups of temperature sensors, and the temperature sensors are temperature sensors of model TMP117. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a system block diagram of the utility model;

[0011] Figure 2 is a circuit schematic diagram of the protection module;

[0012] Figure 3 is a circuit schematic diagram of the switching unit;

[0013] Figure 4 is a circuit schematic diagram of the power supply unit;

[0014] Figure 5 is a connection block diagram of the temperature detection unit and the switching unit;

[0015] Figure 6 is a circuit schematic diagram of the I2C module;

[0016] Figure 7 is a circuit schematic diagram of the IO expander;

[0017] Figure 8 It is the circuit schematic diagram of the connector of the product. DETAILED DESCRIPTION

[0018] like Figures 1 to 8 As shown, in this embodiment, the utility model includes a temperature control box, a host computer 1, and several groups of product carriers 2 arranged in the temperature control box. The product carrier 2 is provided with a substrate 3, several switching units 4, a power supply unit 5, a temperature detection unit 6, and several groups of product connectors 7. Several of the product connectors 7 are connected to the substrate 3 through several of the switching units 4 in a one-to-one correspondence. The substrate 3 and the temperature detection unit 6 are both connected to the host computer 1 in communication, and the power supply unit 5 supplies power to the product to be tested through the product connector 7. In order to test multiple products to be tested at the same time, signal switching and channel switching are performed through the substrate 3, and the substrate 3 switches and transmits product signals input by several of the switching units 4. In this embodiment, one substrate 3 is connected to twelve of the switching units 4, and two groups of product carriers 2 are provided. The two groups of product carriers 2 are distributed in the temperature control box along the longitudinal direction, and twenty-four groups of products are tested through the two groups of product carriers 2. The test signal is connected to the substrate 3 by turning on one of the switching units 4 to connect the corresponding product to be tested. A processor is provided on the substrate 3, and the processor feeds back the acquisition signal to the host computer 1. During the test, the two groups of product carriers 2 are simultaneously loaded with the tray structure full of products to be tested. The temperature control box is closed and the temperature simulation is started. During the temperature simulation, the temperature data in the temperature control box is continuously acquired through the temperature detection unit 6. When the temperature is stable at the specified test temperature, the substrate 3 works, and the twenty-four groups of products to be tested are turned on in turn and their working parameters are collected under the current temperature environment. At the same time, the temperature data of the products to be tested and the surrounding temperature data are collected through the temperature detection unit 6. The above data are fed back to the host computer for summary display.

[0019] The temperature control box includes a test cavity, a refrigerator and a heater, and all the product carriers 2 are arranged in the test cavity.

[0020] like Figure 2As shown, in this embodiment, the power supply unit 5 is connected to the product connector 7 for power supply through a protection module, and the protection module includes a first operational amplifier U110A / U110B of model ADA4522-2ARZ and an adjustable resistor RP1100, the positive input terminal of the first operational amplifier U110A / U110B is connected to the power supply unit 5, the active end of the adjustable resistor RP1100 is connected to the positive input terminal of the first operational amplifier U110A / U110B, the fixed end of the adjustable resistor RP1100 is respectively connected to a 3.3V power supply and a ground line, and the output terminal of the first operational amplifier U110A / U110B is connected to the power terminal of the product connector 7. The first operational amplifier U110A / U110B is used to minimize capacitor leakage and current measurement during shutdown. In this embodiment, the operational amplifier of this type has high electromagnetic interference (EMI) immunity using on-chip filtering, zero drift (very low offset voltage drift: 22 nV / °C maximum), ultra-low noise, low power consumption, an operational amplifier with ground detection input and rail-to-rail output, and is optimized for total accuracy over time, temperature and voltage conditions.

[0021] like Figure 3 and Figure 7 As shown, in this embodiment, the switching unit 4 includes a plurality of relays, and the plurality of relays conduct the product connector 7 and the substrate 3. The substrate 3 is provided with an acquisition module that is in communication with the processor, and the acquisition module is an analog-to-digital converter. The host computer 1 reads the electrical signal data processed by the processor. The processor is connected to a plurality of IO expanders through I2C communication, and the processor is connected to the control end of the plurality of relays through the IO expander, thereby controlling the switch state of the corresponding switching unit 4.

[0022] like Figure 4 As shown, the power supply unit 5 includes a power interface J602, a first buck controller with a model of TPS54360DDA, a second buck controller, a first voltage regulator chip with a model of TLY111733CDCYR, a second voltage regulator chip and a switching regulator with a model of MAX764ESA+T. The first buck controller converts the 24V DC voltage input by the power interface J602 into a 12V DC voltage, the second buck controller converts the 12V DC voltage output by the first buck controller into a 5V DC voltage, the first voltage regulator chip converts the 5V DC voltage into a 3.3V DC voltage for each unit module chip to work, and the second voltage regulator chip and the switching regulator convert the 5V DC voltage into a test current and output it to the product connector 7 to simulate the battery output to the product to be tested.

[0023] like Figure 5and Figure 6 As shown, the substrate 3 communicates with the temperature detection unit 6 through the I2C module 8. The temperature detection unit 6 includes several groups of temperature sensors, and the temperature sensors are temperature sensors of model TMP117. The temperature around the product is controlled and read through I2C and fed back to the host computer 1. The temperature sensor is arranged around each product to be tested.

[0024] Although the embodiments of the present invention are described with practical solutions, they do not constitute limitations on the meaning of the present invention. For those skilled in the art, it is obvious to modify the implementation scheme and combine it with other solutions based on this description.

Claims

1. A high and low temperature multi-channel functional test module, which includes a temperature control box, characterized in that: It also includes a host computer (1) and a plurality of groups of product carriers (2) arranged in the temperature control box, wherein the product carriers (2) are provided with a substrate (3), a plurality of switching units (4), a power supply unit (5), a temperature detection unit (6) and a plurality of groups of product connectors (7), wherein the plurality of product connectors (7) are connected to the substrate (3) in a one-to-one correspondence via the plurality of switching units (4) via electrical signals, the substrate (3) and the temperature detection units (6) are both communicatively connected to the host computer (1), and the power supply unit (5) supplies power to the product to be tested via the product connectors (7).

2. A high and low temperature multi-channel functional test module according to claim 1, characterized in that: The power supply unit (5) is connected to the product connector (7) for power supply via a protection module. The protection module comprises a first operational amplifier (U110A / U110B) and an adjustable resistor (RP1100). The positive input terminal of the first operational amplifier (U110A / U110B) is connected to the power supply unit (5). The active end of the adjustable resistor (RP1100) is connected to the positive input terminal of the first operational amplifier (U110A / U110B). The fixed end of the adjustable resistor (RP1100) is respectively connected to a 3.3V power supply and a ground line. The output end of the first operational amplifier (U110A / U110B) is connected to a power terminal of the product connector (7).

3. A high and low temperature multi-channel functional test module according to claim 1, characterized in that: The switching unit (4) comprises a plurality of relays, the plurality of relays conducting between the product connector (7) and the substrate (3), a collection module being arranged on the substrate (3), and the host computer (1) reading the electrical signal data acquired by the collection module.

4. A high and low temperature multi-channel functional test module according to claim 1, characterized in that: The power supply unit (5) comprises a power supply interface (J602) and a plurality of voltage stabilizing chips, and the voltage stabilizing chips output the converted voltage to the product connector (7).

5. The high and low temperature multi-channel functional test module according to claim 1, characterized in that: The substrate (3) communicates with the temperature detection unit (6) via an I2C module (8); the temperature detection unit (6) comprises a plurality of groups of temperature sensors, and the temperature sensors are temperature sensors of model TMP117.

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