Inter-line withstand voltage testing device and inter-layer withstand voltage testing device for multilayer circuit board

Abstract

The utility model relates to the field of testing devices, in particular to an inter-line voltage withstand testing device and an inter-layer voltage withstand testing device for a multilayer circuit board. The multilayer circuit board inter-line withstand voltage test device comprises an inter-line test pattern and an inter-line test clamp. The inter-line test pattern comprises a first pattern arranged on the multilayer circuit board and a second pattern arranged on the inter-line test clamp; the multi-layer circuit board comprises N plates. Any plate is provided with N first polarity contact points and N second polarity contact points which are opposite in position, one first polarity contact point is connected with a first polarity lead, one second polarity contact point is connected with a second polarity lead, and the first polarity lead and the second polarity lead are spaced by a preset distance; the inter-line test clamp is provided with N first polarity electrifying contacts which are correspondingly connected with the N first polarity contact points of each plate; and the inter-line test clamp is provided with N second polarity electrifying contacts which are correspondingly connected with the N second polarity contact points of each plate.

Description

Technical Field

[0001] The present application relates to the field of testing devices, and in particular to a line-to-line withstand voltage testing device and an inter-layer withstand voltage testing device for a multi-layer circuit board. Background Art

[0002] With the development of energy and communication technology, more and more electronic products, including communication base stations, automotive electronics and other products, use circuit boards with more layers, denser design spacing and higher voltage designs. As the current and voltage used increase, the requirements for the circuit design spacing within the circuit board layer, the dielectric material used between layers and the thickness of the insulation performance are getting higher and higher.

[0003] After the design and trial production of various products, the finished board will be subjected to the withstand voltage design of the lines within each layer and between layers. Normally, a group of adjacent wires in the board is randomly selected for the withstand voltage test between the lines within the layer, and the grounding copper foil between the layers is used for the withstand voltage test between the layers. However, each test requires welding wires for testing, and only one position can be tested at a time. Utility Model Content

[0004] The purpose of the present application is to provide a multi-layer circuit board line-to-line withstand voltage test device and an inter-layer withstand voltage test device, which are used to simultaneously perform line-to-line withstand voltage tests on each layer of the multi-layer circuit board and simultaneously perform inter-layer withstand voltage tests on each layer of the multi-layer circuit board.

[0005] The present application provides a multi-layer circuit board line-to-line withstand voltage test device, including a line-to-line test pattern and a line-to-line test fixture;

[0006] The line-to-line test pattern includes a first pattern arranged on the multi-layer circuit board and a second pattern arranged on the line-to-line test fixture;

[0007] The multilayer circuit board includes a plurality of panels, the number of layers of the panels is N, and N is an integer greater than 1; any of the panels is provided with N first polarity contact points and N second polarity contact points that are relatively located, and the first polarity contact points of the N panels are connected in a one-to-one correspondence, and the second polarity contact points of the N panels are connected in a one-to-one correspondence;

[0008] On any of the plates, one of the first polarity contact points is connected to a first polarity lead, one of the second polarity contact points is connected to a second polarity lead, and the first polarity lead is spaced a preset distance from the second polarity lead; the first polarity contact points of N plates connected to the first polarity lead are non-correspondingly connected first polarity contact points, and the second polarity contact points of N plates connected to the second polarity lead are non-correspondingly connected second polarity contact points;

[0009] The line-to-line test fixture is provided with N first polarity power contacts, the N first polarity power contacts are electrically connected through a first conductive wire, and the N first polarity power contacts are connected one-to-one with the N first polarity contact points of each of the plates; the line-to-line test fixture is provided with N second polarity power contacts, the N second polarity power contacts are electrically connected through a second conductive wire, and the N second polarity power contacts are connected correspondingly with the N second polarity contact points of each of the plates.

[0010] In the above technical solution, further, the line-to-line test fixture includes a fixture plate and a plurality of conductive posts;

[0011] The fixture plate is provided with N first polarity power contacts and N second polarity power contacts electrically connected to the withstand voltage tester;

[0012] The conductive column is installed at both the first polarity power contact and the second polarity power contact; the conductive column is elastic so that the side of the conductive column away from the clamp plate abuts against the corresponding N first polarity contact points and N second polarity contact points of the plate located on the outer layer of the multi-layer circuit board.

[0013] In the above technical solution, further, the conductive column includes a conductive elastic member and a conductive ball;

[0014] One end of the electroelastic member is connected to the first polarity electrical contact or the second polarity electrical contact of the fixture plate, and the conductive ball is connected to the other end of the electroelastic member.

[0015] In the above technical solution, further, the line-to-line test fixture also includes a plurality of support columns arranged at the corners of the fixture plate, the support columns are used to connect the multi-layer circuit board, and the height of the support columns is less than the height of the conductive columns.

[0016] In the above technical solution, further, the line-to-line test fixture also includes a first polarity connection post and a second polarity connection post;

[0017] The first polarity connection post and the second polarity connection post are used to connect the positive electrode and the negative electrode of the withstand voltage test device respectively;

[0018] The first polarity connecting post is installed on the fixture plate, and the first polarity connecting post is electrically connected to N first polarity power contacts; the second polarity connecting post is installed on the fixture plate, and the second polarity connecting post is electrically connected to N second polarity power contacts.

[0019] In the above technical solution, further, on any of the plates, N first polarity contact points are arranged at intervals along a first direction to form a first queue, and N second polarity contact points are arranged at intervals along the first direction to form a second queue;

[0020] The first queue and the second queue are spaced apart along a second direction, and the second direction is perpendicular to the first direction; the N first polarity contact points of the first queue correspond one to one with the N second polarity contact points of the second queue.

[0021] In the above technical solution, further, on any of the plates, the first polarity contact point connected to the first polarity lead and the second polarity contact point connected to the second polarity lead are the first polarity contact point and the second polarity contact point arranged one-to-one along the second direction;

[0022] Along the stacking direction of the multiple plates, the multiple first polarity leads of the multiple plates are staggered and connected to the corresponding first polarity contact points in sequence, and the multiple second polarity leads of the multiple plates are staggered and connected to the corresponding second polarity contact points in sequence.

[0023] The present application also provides a multi-layer circuit board interlayer withstand voltage test device, including an interlayer test pattern and an interlayer test fixture;

[0024] The interlayer test pattern includes a first pattern arranged on the multilayer circuit board and a second pattern arranged on the interlayer test fixture;

[0025] The multi-layer circuit board includes a plurality of boards, the number of layers of the boards is N, and N is an integer greater than 1;

[0026] When N is an even number, any of the plates is provided with A first polarity contact point and The first polarity contact points of the N plates are connected one by one, and the second polarity contact points of the N plates are connected one by one;

[0027] Any of the plates is provided with a conductive layer; and on any of the plates, a connecting wire is connected between one of the first polarity contact points and the conductive layer, or a connecting wire is connected between one of the second polarity contact points and the conductive layer; in two adjacent plates, the contact points connected with the connecting wires are contact points of different polarities; among the N plates, the first polarity contact points connected with the connecting wires are non-correspondingly connected first polarity contact points, and the second polarity contact points connected with the connecting wires of the N plates are non-correspondingly connected second polarity contact points;

[0028] When N is an odd number, any of the plates is provided with A first polarity contact point and The first polarity contact points of the N plates are connected one by one, and the second polarity contact points of the N plates are connected one by one;

[0029] Any of the boards is provided with a conductive layer; and on any of the boards, a connecting wire is connected between one of the first polarity contact points and the conductive layer, or a connecting wire is connected between one of the second polarity contact points and the conductive layer; in two adjacent boards, the contact points connected with the connecting wires are contact points of different polarities; among the N boards, the first polarity contact points connected with the connecting wires are non-correspondingly connected first polarity contact points, and the second polarity contact points connected with the connecting wires of the N boards are non-correspondingly connected second polarity contact points; and among the multiple boards of the multi-layer circuit board, the contact points of the first-layer board connected with the connecting wires and the contact points of the last-layer board connected with the connecting wires are both the first polarity contact points;

[0030] The interlayer test fixture is provided with a plurality of electrically connected first polarity power contacts, the plurality of first polarity power contacts are connected by a first wire, and the first polarity power contacts are connected one-to-one with the first polarity contact points; the interlayer test fixture is provided with a plurality of electrically connected second polarity power contacts, the plurality of second polarity power contacts are connected by a second wire, and the second polarity power contacts are connected one-to-one with the second polarity contact points.

[0031] In the above technical solution, further, the interlayer test fixture includes a fixture plate and a plurality of conductive pillars;

[0032] The fixture plate is provided with a plurality of first polarity power contacts and a plurality of second polarity power contacts electrically connected to the withstand voltage tester;

[0033] The conductive posts are installed at both the first polarity power contacts and the second polarity power contacts; the conductive posts are elastic so that the side of the conductive posts away from the fixture plate abuts against the corresponding multiple first polarity contact points and multiple second polarity contact points of the plate located on the outer layer of the multi-layer circuit board.

[0034] In the above technical solution, further, the conductive column includes a conductive elastic member and a conductive ball;

[0035] One end of the electroelastic member is connected to the first polarity electrical contact or the second polarity electrical contact of the fixture plate, and the conductive ball is connected to the other end of the electroelastic member.

[0036] In the above technical solution, further, the interlayer test fixture also includes a first polarity power connection post and a second polarity power connection post;

[0037] The first polarity connection post and the second polarity connection post are used to connect the positive electrode and the negative electrode of the withstand voltage test device respectively;

[0038] The first polarity connecting post is installed on the fixture plate, and the first polarity connecting post is electrically connected to multiple first polarity power contacts; the second polarity connecting post is installed on the fixture plate, and the second polarity connecting post is electrically connected to multiple second polarity power contacts.

[0039] Compared with the prior art, the beneficial effects of this application are:

[0040] The multi-layer circuit board line-to-line withstand voltage test device provided in the present application can perform line-to-line withstand voltage tests on each layer of the multi-layer circuit board at the same time by setting line-to-line test patterns and line-to-line test fixtures, thereby improving the testing efficiency of laboratories or factories and saving labor costs and time costs.

[0041] The present application also provides a device for testing interlayer voltage resistance of a multilayer circuit board. By setting an interlayer test pattern and an interlayer test fixture, the interlayer voltage resistance test can be performed on each layer of the multilayer circuit board at the same time, thereby improving the testing efficiency of the laboratory or factory and saving labor costs and time costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0043] Figure 1 A schematic diagram of the structure of the line-to-line test fixture provided for this application;

[0044] Figure 2 A schematic structural diagram of a first pattern of an inter-line test pattern provided in the present application;

[0045] Figure 3 A schematic diagram of the structure of the interlayer test fixture provided for this application;

[0046] Figure 4 This is a schematic structural diagram of the first graphic of the inter-layer test graphic provided in this application.

[0047] In the figure: 101-inter-line test fixture; 102-first polarity contact point; 103-second polarity contact point; 104-first polarity lead; 105-second polarity lead; 106-first polarity power contact; 107-second polarity power contact; 108-first wire; 109-second wire; 110-fixture plate; 111-conductive column; 112-conductive ball; 113-spring; 114-support column; 115-first polarity power column; 116-second polarity Electric post; 117-interlayer test fixture; 118-first polarity contact point; 119-second polarity contact point; 120-connecting wire; 121-first polarity power contact; 122-second polarity power contact; 123-first wire; 124-second wire; 125-fixture plate; 126-conductive post; 127-conductive ball; 128-spring; 129-support post; 130-first polarity power post; 131-second polarity power post; 132-voltage withstand tester. DETAILED DESCRIPTION

[0048] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0049] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0050] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0051] Embodiment 1

[0052] See also Figure 1 and Figure 2As shown, the multi-layer circuit board line withstand voltage test device provided by the present application includes a line test pattern and a line test fixture 101. The line test pattern includes a first pattern set on the multi-layer circuit board and a second pattern set on the line test fixture 101.

[0053] The multilayer circuit board includes multiple boards, the number of layers of the boards is N, and N is an integer greater than 1; any board is provided with N first polarity contact points 102 and N second polarity contact points 103 that are relatively positioned, and the first polarity contact points 102 of the N boards are connected one by one, and the second polarity contact points 103 of the N boards are connected one by one.

[0054] On any plate, one of the first polarity contact points 102 is connected to the first polarity lead 104, and one of the second polarity contact points 103 is connected to the second polarity lead 105, and the first polarity lead 104 and the second polarity lead 105 are spaced apart by a preset distance; the first polarity contact points 102 of N plates connected to the first polarity lead 104 are non-correspondingly connected first polarity contact points 102, and the second polarity contact points 103 of N plates connected to the second polarity lead 105 are non-correspondingly connected second polarity contact points 103.

[0055] The line-to-line test fixture 101 is provided with N electrically connected first polarity power contacts 106, and the N first polarity power contacts 106 are connected one-to-one with the N first polarity contact points 102 of each board; the line-to-line test fixture 101 is provided with N electrically connected second polarity power contacts 107, and the N second polarity power contacts 107 are connected correspondingly with the N second polarity contact points 103 of each board.

[0056] See also Figure 2 As shown, Figure 2 The above scheme is explained by taking the line-to-line withstand voltage test of the 6-layer circuit board (a to f) shown in the figure as an example: the multi-layer circuit board specifically includes 6 stacked plates, each layer of the plate is provided with 6 first polarity contact points 102 (the 6 first polarity contact points 102 are not connected to each other) and 6 second polarity contact points 103 (the 6 second polarity contact points 103 are not connected to each other) in relative positions, and the first polarity contact points 102 of the 6-layer plate are connected one by one along the stacking direction, and the second polarity contact points 103 of the 6-layer plate are connected one by one along the stacking direction. One of the first polarity contact point 102 and the second polarity contact point 103 is used to connect to the positive pole of the test voltage, and the other is used to connect to the negative pole of the test voltage.

[0057] like Figure 2As shown, on the first layer of the board, the first right first polarity contact point 102 is connected to the first polarity lead 104, and the second right second polarity contact point 103 is connected to the second polarity lead 105; on the second layer of the board, the second right first polarity contact point 102 is connected to the first polarity lead 104, and the second right second polarity contact point 103 is connected to the second polarity lead 105... until on the sixth layer of the board, the first left first polarity contact point 102 is connected to the first polarity lead 104, and the second left second polarity contact point 103 is connected to the second polarity lead 105. On each layer of the board, the first polarity lead 104 and the second polarity lead 105 are spaced a preset distance apart.

[0058] That is, the first polarity contact point 102 and the first polarity lead 104 connected to the first polarity contact point 102, the second polarity contact point 103 and the second polarity lead 105 connected to the second polarity contact point 103 provided on the multilayer circuit board form a first pattern. Specifically, the first polarity contact point 102 and the second polarity contact point 103 are annular pads formed on each board, and the first polarity lead 104 and the second polarity lead 105 are welding wires formed on each board.

[0059] The purpose of setting the line test fixture 101 is to apply voltage to the multi-layer circuit board to achieve line withstand voltage testing of multiple panels of the multi-layer circuit board at the same time. Figure 1 As shown, the line test fixture 101 is provided with 6 electrically connected first polarity power contacts 106, the 6 first polarity power contacts 106 are electrically connected through the first wire 108, and the 6 first polarity power contacts 106 are connected one-to-one with the 6 first polarity contact points 102 of each board, so that the 6 first polarity contact points 102 of each board can be powered at the same time. The line test fixture 101 is provided with 6 electrically connected second polarity power contacts 107, the 6 second polarity power contacts 107 are electrically connected through the second wire 109, and the 6 second polarity power contacts 107 are connected one-to-one with the 6 second polarity contact points 103 of each board, so that the 6 second polarity contact points 103 of each board can be powered at the same time.

[0060] That is, the first polarity power contact 106 and the first wire 108 connecting the first polarity power contact 106 , the second polarity power contact 107 and the second wire 109 connecting the second polarity power contact 107 provided on the line test fixture 101 form a second graph.

[0061] When the above-mentioned multi-layer circuit board is subjected to the line withstand voltage test, the line test fixture 101 applies the same voltage between the first polarity contact and the second polarity contact point 103 of each board, and the voltage polarity on the same side of each board is the same, and no interlayer voltage breakdown will occur during the test. Voltage is applied between the first polarity lead 104 and the second polarity lead 105 of each board, so that the line withstand voltage test can be performed on each board of the multi-layer circuit board at the same time. By changing the size of the preset distance between the first polarity lead 104 and the second polarity lead 105, the minimum design gap of the material used can be verified.

[0062] In an optional solution of this embodiment, on any plate, N first polarity contact points 102 are arranged at intervals along the first direction to form a first queue, and N second polarity contact points 103 are arranged at intervals along the first direction to form a second queue. The first queue and the second queue are arranged at intervals along the second direction, and the second direction is perpendicular to the first direction. The N first polarity contact points 102 of the first queue correspond one-to-one to the N second polarity contact points 103 of the second queue.

[0063] Further, on any plate, the first polarity contact point 102 connected to the first polarity lead 104 and the second polarity contact point 103 connected to the second polarity lead 105 are first polarity contact points 102 and second polarity contact points 103 arranged one-to-one along the second direction. Along the stacking direction of the multiple plates, the multiple first polarity leads 104 of the multiple plates are respectively staggered and connected to the corresponding first polarity contact points 102, and the multiple second polarity leads 105 of the multiple plates are respectively staggered and connected to the corresponding second polarity contact points 103.

[0064] In this embodiment, if Figure 2As shown, on each layer of the board, the first polarity contact points 102 located at the top are arranged in a row along the length direction of the board, and the second polarity contact points 103 located at the bottom are arranged in a row along the length direction of the board, and the first polarity contact points 102 and the second polarity contact points 103 correspond one to one along the width direction of the board. Among them, on the first layer of the board, the first polarity contact point 102 on the right is connected to the first polarity lead 104, and the corresponding second polarity contact point 103 on the right below is connected to the second polarity lead 105; on the second layer of the board, the second first polarity contact point 102 on the right is connected to the first polarity lead 104, and the corresponding second second polarity contact point 103 on the right below is connected to the second polarity lead 105... until on the sixth layer of the board, the first polarity contact point 102 on the left is connected to the first polarity lead 104, and the corresponding second polarity contact point 103 on the left below is connected to the second polarity lead 105. That is to say, from the upper layer to the lower layer of the multilayer circuit board, the multilayer circuit board is sequentially connected with the first polarity lead 104 and the second polarity lead 105 from right to left, and the overall wiring arrangement is clearer and more reasonable. If any layer of the board is broken down, it is convenient to check each layer of the board one by one, so as to find the board that failed the test.

[0065] In an optional solution of this embodiment, the line-to-line test fixture 101 includes a fixture plate 110 and a plurality of conductive posts 111. The fixture plate 110 is provided with N first polarity power contacts 106 and N second polarity power contacts 107 electrically connected to the withstand voltage tester, the N first polarity power contacts 106 are connected by a first wire 108, and the N second polarity power contacts 107 are connected by a second wire 109, so that a line-to-line test voltage is applied between any first polarity power contact 106 and any second polarity power contact 107. Specifically, the first polarity power contact 106 and the second polarity power contact 107 are annular pads formed on the fixture plate 110, and the first wire 108 and the second wire 109 are welding wires formed on the fixture plate 110.

[0066] Furthermore, conductive posts 111 are installed at both the first polarity power contact 106 and the second polarity power contact 107. The conductive posts 111 are elastic so that the side of the conductive posts 111 away from the fixture plate 110 abuts against the corresponding N first polarity contact points 102 and N second polarity contact points 103 of the plate located on the outer layer of the multi-layer circuit board, thereby ensuring that the electrical connection between the line-to-line test fixture 101 and the multi-layer circuit board is more reliable.

[0067] Specifically, the conductive column 111 includes a conductive elastic member and a conductive ball 112. One end of the electroelastic member is connected to the first polarity power contact 106 or the second polarity power contact 107 of the fixture plate 110, and the conductive ball 112 is connected to the other end of the electroelastic member. The conductive elastic member can be a spring 113 made of a conductive material. Preferably, the conductive elastic member is a copper spring 113. The bottom end of the spring 113 is connected to the annular pad of the fixture plate 110. The top end of the spring 113 is connected to a copper ball by welding. The copper ball is used to connect to the annular pad of the outermost plate of the multi-layer circuit board.

[0068] In an optional solution of this embodiment, the line-to-line test fixture 101 further includes a plurality of support pillars 114 disposed at the corners of the fixture plate 110, and the height of the support pillars 114 is less than the height of the conductive pillars 111. Figure 1 As shown, the fixture plate 110 shown in the figure is a rectangle, and support columns 114 are arranged at the four corners of the rectangle. When the multi-layer circuit board is subjected to the line-to-line withstand voltage test, the support columns 114 can be respectively connected to the mounting holes arranged at the corresponding positions of the multi-layer circuit board. Since the height of the support columns 114 is less than the height of the conductive columns 111, the multi-layer circuit board can press down the conductive columns 111. The elastic force generated by the pressure on the conductive columns 111 enables the conductive columns 111 to be pressed against the annular pads on the multi-layer circuit board to ensure reliable connection.

[0069] In an optional solution of this embodiment, the line-to-line test fixture 101 also includes a first polarity connection post 115 and a second polarity connection post 116. The first polarity connection post 115 and the second polarity connection post 116 are used to respectively connect the positive pole and the negative pole of the withstand voltage test device. The first polarity connection post 115 is mounted on the fixture plate 110, and the first polarity connection post 115 is electrically connected to the N first polarity power contacts 106. The second polarity connection post 116 is mounted on the fixture plate 110, and the second polarity connection post 116 is electrically connected to the N second polarity power contacts 107. Optionally, the first polarity connection post 115 and the second polarity connection post 116 are both copper posts, which have good electrical conductivity.

[0070] Embodiment 2

[0071] See also Figure 3 and Figure 4 As shown, the multilayer circuit board interlayer withstand voltage test device provided by the present application includes an interlayer test pattern and an interlayer test fixture 117. The interlayer test pattern includes a first pattern set on the multilayer circuit board and a second pattern set on the interlayer test fixture 117.

[0072] A multi-layer circuit board includes multiple boards, and the number of layers of the boards is N, where N is an integer greater than 1. According to the number of layers of boards actually set in the multi-layer circuit board, there are two cases:

[0073] Case 1: When N is an even number, any plate is provided with A first polarity contact point 118 and The second polarity contact points 119 of the N plates are connected in a one-to-one correspondence, and the first polarity contact points 118 of the N plates are connected in a one-to-one correspondence.

[0074] Any plate is provided with a conductive layer; and on any plate, a connecting wire 120 is connected between one of the first polarity contact points 118 and the conductive layer, or a connecting wire 120 is connected between one of the second polarity contact points 119 and the conductive layer; in two adjacent plates, the contact points connected with the connecting wire 120 are contact points of different polarities; among N plates, the first polarity contact point 118 connected with the connecting wire 120 is a non-corresponding first polarity contact point 118, and the second polarity contact points 119 of the N plates connected with the connecting wire 120 are non-corresponding second polarity contact points 119.

[0075] like Figure 4 As shown, the above scheme is explained by taking the interlayer withstand voltage test of the 6-layer circuit board shown in the figure as an example: the multi-layer circuit board specifically includes 6 stacked plates, and each layer of the plate is provided with 6 first polarity contact points 118 (the 6 first polarity contact points 118 are not connected to each other) and 6 second polarity contact points 119 (the 6 second polarity contact points 119 are not connected to each other) in relative positions, and the first polarity contact points 118 of the 6-layer plate are connected one by one along the stacking direction, and the second polarity contact points 119 of the 6-layer plate are connected one by one along the stacking direction. One of the first polarity contact point 118 and the second polarity contact point 119 is used to connect to the positive pole of the test voltage, and the other is used to connect to the negative pole of the test voltage.

[0076] Since the interlayer withstand voltage test applies the test voltage on two adjacent layers of boards, the polarities on adjacent boards are different, that is, the two adjacent boards are connected to the positive and negative poles of the test voltage respectively. Figure 4 As shown, on the first layer of the board, a connecting wire 120 is connected between the right first polarity contact point 118 and the conductive layer; on the second layer of the board, a connecting wire 120 is connected between the right second polarity contact point 119 and the conductive layer... until on the sixth layer of the board, a connecting wire 120 is connected between the left second polarity contact point 119 and the conductive layer. In this way, the polarities of the charges on adjacent boards can be different.

[0077] For a six-layer board, only three of the first polarity contact points 118 need to be connected to the conductive layer, and only three of the second polarity contact points 119 need to be connected to the conductive layer. The reason why six first polarity contact points 118 and six second polarity contact points 119 are provided in the illustration of the present application is based on the same purpose as the multi-layer circuit board structure used for line-to-line testing, which is convenient for manufacturing.

[0078] Among the multiple boards, the first polarity contact point 118 connected to the connecting wire 120 is a non-corresponding first polarity contact point 118, and the second polarity contact point 119 connected to the connecting wire 120 is a non-corresponding second polarity contact point 119. If any layer of the board breaks down, it is convenient to check each layer of the board one by one to find the board that failed the test.

[0079] When N is an odd number, any plate is provided with A first polarity contact point 118 and The second polarity contact points 119 of the N plates are connected in a one-to-one correspondence, and the first polarity contact points 118 of the N plates are connected in a one-to-one correspondence.

[0080] Any board is provided with a conductive layer; and on any board, a connecting wire 120 is connected between one of the first polarity contact points 118 and the conductive layer, or a connecting wire 120 is connected between one of the second polarity contact points 119 and the conductive layer; in two adjacent boards, the contact points connected with the connecting wire 120 are contact points of different polarities; among N boards, the first polarity contact point 118 connected with the connecting wire 120 is a non-corresponding first polarity contact point 118, and the second polarity contact points 119 connected with the connecting wire 120 of N boards are non-corresponding second polarity contact points 119; and among multiple boards of a multi-layer circuit board, the contact point of the first-layer board connected with the connecting wire 120 and the contact point of the last-layer board connected with the connecting wire 120 are the first polarity contact points 118.

[0081] For a multi-layer circuit board with an odd number of layers, the difference is that the number of the first polarity power contacts 121 and the number of the second polarity power contacts 122 on each board are different, that is, the number of the first polarity power contacts 121 is one more than the number of the second polarity power contacts 122. At this time, on the first layer of boards, a connecting wire 120 is set between the first polarity power contact 121 and the conductive layer, and on the second layer of boards, a connecting wire 120 is set between the second polarity power contact 122 and the conductive layer... until on the last layer of boards, a connecting wire 120 is set between the first polarity power contact 121 and the conductive layer, so that the polarities of the electricity of adjacent boards can be different. It should be noted that whether the first polarity power contact 121 is connected to the positive or negative pole of the power supply can be set according to actual conditions.

[0082] That is, the conductive layer, the first polarity contact point 118 and the connecting wire 120 connecting the first polarity contact point 118 and the conductive layer, the second polarity contact point 119 and the connecting wire 120 connecting the second polarity contact point 119 and the conductive layer provided on the multilayer circuit board constitute a first pattern. Specifically, the first polarity contact point 118 and the second polarity contact point 119 are annular pads formed on each board, the first polarity lead wire and the second polarity lead wire are welding wires formed on each board, and the conductive layer is a square pad provided on the board.

[0083] The interlayer test fixture 117 is provided with a plurality of electrically connected first polarity power contacts 121, the plurality of first polarity power contacts 121 are connected through a first wire 123, and the first polarity power contacts 121 are connected one-to-one with the first polarity contact points 118; the interlayer test fixture 117 is provided with a plurality of electrically connected second polarity power contacts 122, the plurality of second polarity power contacts 122 are connected through a second wire 124, and the second polarity power contacts 122 are connected one-to-one with the second polarity contact points 119. The spacing between the first wire 123 and the second wire 124 is large enough, and the problem of line withstand voltage breakdown will not occur. The interlayer test fixture 117 can supply power to the first polarity contact points 118 and the second polarity contact points 119 of the plurality of boards, so that the interlayer withstand voltage test of the multi-layer circuit board can be carried out simultaneously.

[0084] That is, the first polarity power contact 121 and the first wire 123 connecting the first polarity power contact 121 , the second polarity power contact 122 and the second wire 124 connecting the second polarity power contact 122 provided on the interlayer test fixture 117 form a second pattern.

[0085] In an optional scheme of this embodiment, on any plate, a plurality of first polarity contact points 118 are arranged at intervals along a first direction to form a first queue, and a plurality of second polarity contact points 119 are arranged at intervals along the first direction to form a second queue; the first queue and the second queue are arranged at intervals along the second direction, and the second direction is perpendicular to the first direction.

[0086] In this embodiment, if Figure 4 As shown, on each layer of the board, the first polarity contact points 118 located at the top are arranged in a row along the length direction of the board, and the second polarity contact points 119 located at the bottom are arranged in a row along the length direction of the board. The first polarity contact points 118 and the second polarity contact points 119 correspond to each other along the width direction of the board. The overall wiring arrangement is clearer and more reasonable. If any layer of the board breaks down, it is convenient to check each layer of the board one by one to find the board that failed the test.

[0087] In an optional solution of this embodiment, the interlayer test fixture 117 includes a fixture plate 125 and a plurality of conductive pillars 126. The fixture plate 125 is provided with a plurality of first polarity power contacts 121 and a plurality of second polarity power contacts 122 electrically connected to the withstand voltage tester 132. The plurality of first polarity power contacts 121 are connected by a first wire 123, and the plurality of second polarity power contacts 122 are connected by a second wire 124, so that the interlayer test voltage is applied between any first polarity power contact 121 and any second polarity power contact 122. Specifically, the first polarity power contact 121 and the second polarity power contact 122 are annular pads formed on the fixture plate 125, and the first wire 123 and the second wire 124 are welding wires formed on the fixture plate 125.

[0088] Furthermore, conductive posts 126 are installed at both the first polarity power contact 121 and the second polarity power contact 122; the conductive posts 126 are elastic so that the side of the conductive posts 126 away from the fixture plate 125 abuts against the corresponding multiple first polarity contact points 118 and multiple second polarity contact points 119 of the plate located on the outer layer of the multi-layer circuit board, thereby ensuring that the electrical connection between the interlayer test fixture 117 and the multi-layer circuit board is more reliable.

[0089] In an optional solution of this embodiment, the conductive column 126 includes a conductive elastic member and a conductive ball 127. One end of the electroelastic member is connected to the first polarity power contact 121 or the second polarity power contact 122 of the fixture plate 125, and the conductive ball 127 is connected to the other end of the electroelastic member. The conductive elastic member can be a spring 128 made of a conductive material. Preferably, the conductive elastic member is a copper spring 128, the bottom end of the spring 128 is connected to the annular pad of the fixture plate 125, and the top end of the spring 128 is connected to a copper ball by welding, and the copper ball is used to connect to the annular pad of the outermost plate of the multi-layer circuit board.

[0090] In an optional solution of this embodiment, the interlayer test fixture 117 further includes a plurality of support pillars 129 disposed at the corners of the fixture plate 125, and the height of the support pillars 129 is less than the height of the conductive pillars 126. Figure 3 As shown, the fixture plate 125 shown in the figure is a rectangle, and support columns 129 are provided at the four corners of the rectangle. When the multi-layer circuit board is subjected to an interlayer voltage withstand test, the support columns 129 can be respectively connected to the mounting holes provided at the corresponding positions of the multi-layer circuit board. Since the height of the support columns 129 is less than the height of the conductive columns 126, the multi-layer circuit board can press down the conductive columns 126. The elastic force generated by the pressure on the conductive columns 126 enables the conductive columns 126 to be against the annular pads on the multi-layer circuit board to ensure reliable connection.

[0091] In an optional solution of this embodiment, the interlayer test fixture 117 also includes a first polarity connection post 130 and a first polarity connection post 130. The first polarity connection post 130 and the first polarity connection post 130 are used to respectively connect the positive pole and the negative pole of the withstand voltage test device. The first polarity connection post 130 is mounted on the fixture plate 125, and the first polarity connection post 130 is electrically connected to a plurality of first polarity power contacts 121. The second polarity connection post 131 is mounted on the fixture plate 125, and the second polarity connection post 131 is electrically connected to a plurality of second polarity power contacts 122. Optionally, the first polarity connection post 130 and the second polarity connection post 131 are both copper posts, which have good electrical conductivity.

[0092] Embodiment 3

[0093] Embodiment 3 of the present application provides a test process that can be applied to the multi-layer circuit board line-to-line withstand voltage test device of embodiment 1 and the multi-layer circuit board layer-to-layer withstand voltage test device of embodiment 2.

[0094] The test process is as follows:

[0095] 1. Turn on the withstand voltage tester and preheat it, and connect the withstand voltage tester to the corresponding test fixture through wires;

[0096] 2. Set the boost rate and target voltage, set the leakage current, set the time, etc.

[0097] 3. Before placing the multi-layer circuit board sample in the test fixture, start the voltage tester for a preliminary test to see if the test fixture breaks down. If not, the test can be performed. If it does, the test fixture needs to be replaced.

[0098] 4. Place the sample on the test fixture and fix it with the four corner screws. Check whether the copper ball on each spring is against the pad of the test sample. If not, check whether the spring force meets the test requirements.

[0099] 5. After the multi-layer circuit board samples are placed, start the voltage tester for testing.

[0100] 6. After the test is completed, confirm whether the multi-layer circuit board has breakdown; if breakdown occurs, it is necessary to check each layer in turn; if the multi-layer circuit board has not broken down, replace it with a new multi-layer circuit board sample for a new round of testing.

[0101] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application. In addition, a person skilled in the art can understand that although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments means being within the scope of the present application and forming different embodiments.

Claims

1. A multi-layer circuit board line withstand voltage test device, characterized in that: Including line-to-line test pattern and line-to-line test fixture; The line-to-line test pattern includes a first pattern arranged on the multi-layer circuit board and a second pattern arranged on the line-to-line test fixture; The multilayer circuit board includes a plurality of panels, the number of layers of the panels is N, and N is an integer greater than 1; any of the panels is provided with N first polarity contact points and N second polarity contact points that are relatively located, and the first polarity contact points of the N panels are connected in a one-to-one correspondence, and the second polarity contact points of the N panels are connected in a one-to-one correspondence; On any of the plates, one of the first polarity contact points is connected to a first polarity lead, one of the second polarity contact points is connected to a second polarity lead, and the first polarity lead is spaced a preset distance from the second polarity lead; the first polarity contact points of N plates connected to the first polarity lead are non-correspondingly connected first polarity contact points, and the second polarity contact points of N plates connected to the second polarity lead are non-correspondingly connected second polarity contact points; The line-to-line test fixture is provided with N first polarity power contacts, the N first polarity power contacts are electrically connected through a first conductive wire, and the N first polarity power contacts are connected one-to-one with the N first polarity contact points of each of the plates; the line-to-line test fixture is provided with N second polarity power contacts, the N second polarity power contacts are electrically connected through a second conductive wire, and the N second polarity power contacts are connected correspondingly with the N second polarity contact points of each of the plates.

2. The device for testing line-to-line withstand voltage of a multi-layer circuit board according to claim 1, characterized in that: The line-to-line test fixture includes a fixture plate and a plurality of conductive posts; The fixture plate is provided with N first polarity power contacts and N second polarity power contacts electrically connected to the withstand voltage tester; The conductive column is installed at both the first polarity power contact and the second polarity power contact; the conductive column is elastic so that the side of the conductive column away from the clamp plate abuts against the corresponding N first polarity contact points and N second polarity contact points of the plate located on the outer layer of the multi-layer circuit board.

3. The multi-layer circuit board line withstand voltage test device according to claim 2, characterized in that: The conductive column includes a conductive elastic member and a conductive ball; One end of the electroelastic member is connected to the first polarity electrical contact or the second polarity electrical contact of the fixture plate, and the conductive ball is connected to the other end of the electroelastic member.

4. The device for testing line-to-line withstand voltage of a multi-layer circuit board according to claim 2, characterized in that: The line-to-line test fixture further includes a plurality of support columns arranged at the corners of the fixture plate, the support columns are used to connect the multi-layer circuit board, and the height of the support columns is smaller than the height of the conductive columns.

5. The device for testing line-to-line voltage resistance of a multi-layer circuit board according to claim 2, characterized in that: The line-to-line test fixture further includes a first polarity connection post and a second polarity connection post; The first polarity connection post and the second polarity connection post are used to connect the positive electrode and the negative electrode of the withstand voltage test device respectively; The first polarity connecting post is installed on the fixture plate, and the first polarity connecting post is electrically connected to N first polarity power contacts; the second polarity connecting post is installed on the fixture plate, and the second polarity connecting post is electrically connected to N second polarity power contacts.

6. The device for testing line-to-line withstand voltage of a multi-layer circuit board according to claim 1, characterized in that: On any of the plates, N first polarity contact points are arranged at intervals along a first direction to form a first queue, and N second polarity contact points are arranged at intervals along the first direction to form a second queue; The first queue and the second queue are spaced apart along a second direction, and the second direction is perpendicular to the first direction; the N first polarity contact points of the first queue correspond one to one with the N second polarity contact points of the second queue.

7. The device for testing line-to-line voltage resistance of a multi-layer circuit board according to claim 6, characterized in that: On any of the plates, the first polarity contact point connected to the first polarity lead and the second polarity contact point connected to the second polarity lead are the first polarity contact point and the second polarity contact point arranged in a one-to-one correspondence along the second direction; Along the stacking direction of the multiple plates, the multiple first polarity leads of the multiple plates are staggered and connected to the corresponding first polarity contact points in sequence, and the multiple second polarity leads of the multiple plates are staggered and connected to the corresponding second polarity contact points in sequence.

8. A device for testing the interlayer withstand voltage of a multi-layer circuit board, characterized in that: Including inter-layer test patterns and inter-layer test fixtures; The interlayer test pattern includes a first pattern arranged on the multilayer circuit board and a second pattern arranged on the interlayer test fixture; The multi-layer circuit board includes a plurality of boards, the number of layers of the boards is N, and N is an integer greater than 1; When N is an even number, any of the plates is provided with A first polarity contact point and The first polarity contact points of the N plates are connected one by one, and the second polarity contact points of the N plates are connected one by one; Any of the plates is provided with a conductive layer; and on any of the plates, a connecting wire is connected between one of the first polarity contact points and the conductive layer, or a connecting wire is connected between one of the second polarity contact points and the conductive layer; in two adjacent plates, the contact points connected with the connecting wires are contact points of different polarities; among the N plates, the first polarity contact points connected with the connecting wires are non-correspondingly connected first polarity contact points, and the second polarity contact points connected with the connecting wires of the N plates are non-correspondingly connected second polarity contact points; When N is an odd number, any of the plates is provided with A first polarity contact point and The first polarity contact points of the N plates are connected one by one, and the second polarity contact points of the N plates are connected one by one; Any of the boards is provided with a conductive layer; and on any of the boards, a connecting wire is connected between one of the first polarity contact points and the conductive layer, or a connecting wire is connected between one of the second polarity contact points and the conductive layer; in two adjacent boards, the contact points connected with the connecting wires are contact points of different polarities; among the N boards, the first polarity contact points connected with the connecting wires are non-correspondingly connected first polarity contact points, and the second polarity contact points connected with the connecting wires of the N boards are non-correspondingly connected second polarity contact points; and among the multiple boards of the multi-layer circuit board, the contact points of the first-layer board connected with the connecting wires and the contact points of the last-layer board connected with the connecting wires are both the first polarity contact points; The interlayer test fixture is provided with a plurality of electrically connected first polarity power contacts, the plurality of first polarity power contacts are connected by a first wire, and the first polarity power contacts are connected one-to-one with the first polarity contact points; the interlayer test fixture is provided with a plurality of electrically connected second polarity power contacts, the plurality of second polarity power contacts are connected by a second wire, and the second polarity power contacts are connected one-to-one with the second polarity contact points.

9. The device for testing the interlayer withstand voltage of a multi-layer circuit board according to claim 8, characterized in that: The interlayer test fixture includes a fixture plate and a plurality of conductive posts; The fixture plate is provided with a plurality of first polarity power contacts and a plurality of second polarity power contacts electrically connected to the withstand voltage tester; The conductive posts are installed at both the first polarity power contacts and the second polarity power contacts; the conductive posts are elastic so that the side of the conductive posts away from the fixture plate abuts against the corresponding multiple first polarity contact points and multiple second polarity contact points of the plate located on the outer layer of the multi-layer circuit board.

10. The device for testing the interlayer withstand voltage of a multi-layer circuit board according to claim 9, characterized in that: The conductive column includes a conductive elastic member and a conductive ball; One end of the electroelastic member is connected to the first polarity electrical contact or the second polarity electrical contact of the fixture plate, and the conductive ball is connected to the other end of the electroelastic member.

11. The device for testing the interlayer withstand voltage of a multi-layer circuit board according to claim 9, characterized in that: The interlayer test fixture also includes a first polarity power connection post and a second polarity power connection post; The first polarity connection post and the second polarity connection post are used to connect the positive electrode and the negative electrode of the withstand voltage test device respectively; The first polarity connecting post is installed on the fixture plate, and the first polarity connecting post is electrically connected to multiple first polarity power contacts; the second polarity connecting post is installed on the fixture plate, and the second polarity connecting post is electrically connected to multiple second polarity power contacts.

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