Cooling device for cloud computer

Abstract

The utility model relates to the technical field of heat dissipation, and discloses a heat dissipation device for a cloud computer, which comprises a heat dissipation mechanism fixedly mounted at the upper end of a base mechanism; the base mechanism comprises a base, the front end and the rear end of the base are open, a fixed rear plate is detachably and fixedly installed at the open position of the rear end of the base, a cold water tank is fixedly installed on the front end face of the fixed rear plate and located in the base, cold water is arranged in the cold water tank, and a semiconductor chilling plate is fixedly installed at the right end of the cold water tank. The refrigerating end of the left end of the semiconductor chilling plate penetrates through the right end of the cold water tank, extends into the cold water tank and is in contact with cold water, and the heating end of the right end of the semiconductor chilling plate is located outside the cold water tank; the heat dissipation mechanism comprises a heat dissipation shell. The all-in-one machine can be automatically and continuously cooled conveniently, the cooling effect is better, the all-in-one machine has an automatic detection function, rapid maintenance is further facilitated, personal belongings can be conveniently stored, and practicability is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, and in particular to a heat dissipation device for a cloud computer. Background Art

[0002] Nowadays, desktop computers are abandoned by some users because the main chassis takes up a lot of space, and laptops are also abandoned by some users because of their small screens, so all-in-one computers came into being. In addition, people now use cloud computing when using computers. Cloud computing is a model for increasing, using and delivering related services based on the Internet, usually involving the provision of dynamic, scalable and often virtualized resources through the Internet. Cloud computing can make our data storage more convenient, thus giving rise to big data cloud computing all-in-one computers.

[0003] However, since the big data cloud computing all-in-one machine has high requirements on the running speed, data processing capabilities, etc., it also has high requirements on the hardware configuration of the big data cloud computing all-in-one machine itself. The existing big data cloud computing all-in-one machine has poor heat dissipation performance, which affects the overall performance of the big data cloud computing all-in-one machine, resulting in its running speed cannot meet people's requirements.

[0004] The authorized patent with application number: 202320930656.8 includes: an all-in-one body and a support frame, the support frame includes a fixing groove, and the all-in-one body is connected to the support frame through the fixing groove; a main heat sink is arranged in the fixing groove, and a cooling water tank is arranged on the side of the main heat sink away from the all-in-one body; a heat exchange tube is arranged on the support frame, and the heat exchange tube is arranged on the other side of the cooling water tank; an air inlet pipe and an air outlet pipe are respectively arranged at both ends of the heat exchange tube, and fans are arranged in the air inlet pipe and the air outlet pipe.

[0005] The above patent documents have the following problems:

[0006] The cooling water tank cannot cool itself down. After continuous use, the temperature of the cold water in the cooling water tank will become lower and lower, which will cause its cooling effect to become worse and worse. If the water is changed manually, the workload will be greatly increased.

[0007] Furthermore, a heat dissipation device for a cloud computer is proposed. Utility Model Content

[0008] The heat dissipation device for a cloud computer proposed by the utility model solves the problems in the background technology.

[0009] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0010] A heat dissipation device for a cloud computer, comprising a heat dissipation mechanism, wherein the heat dissipation mechanism is fixedly mounted on the upper end of a base mechanism;

[0011] The base mechanism includes a base, the front and rear ends of the base are both open, and a fixed rear plate is detachably fixedly installed at the rear end of the base, a cold water tank is fixedly installed on the front end surface of the fixed rear plate and located inside the base, cold water is arranged inside the cold water tank, a semiconductor refrigeration plate is fixedly installed at the right end of the cold water tank, and the cooling end of the left end of the semiconductor refrigeration plate penetrates the right end of the cold water tank and extends to the inside of the cold water tank and contacts with the cold water, and the heating end of the right end of the semiconductor refrigeration plate is located outside the cold water tank;

[0012] The heat dissipation mechanism includes a heat dissipation shell, the front end and the bottom end of the heat dissipation shell are both open, a first heat dissipation fan is fixedly installed in the middle of the rear end of the heat dissipation shell, and the front end of the first heat dissipation fan passes through the heat dissipation shell and extends into the heat dissipation shell, a cold water pipe is fixedly installed inside the heat dissipation shell and in front of the first heat dissipation fan, both ends of the cold water pipe are connected to the cold water tank, and a temperature conducting baffle is fixedly installed inside the heat dissipation shell and in front of the cold water pipe.

[0013] Preferably, a through opening is provided at the right end of the base, located at the heating end of the semiconductor refrigeration plate, and a second heat dissipation fan is fixedly installed at the through opening.

[0014] Preferably, the lower end surface of the left end of the cold water pipe is fixedly connected to a water inlet pipe, and the lower end surface of the right end of the cold water pipe is fixedly connected to a water outlet pipe. The lower ends of the water inlet pipe and the water outlet pipe respectively penetrate the upper end surface of the base and the upper end surface of the cold water tank, and extend to the interior of the cold water tank and contact with the cold water. A water pump is fixedly installed on the water inlet pipe, and the water pump is detachably fixedly connected to the upper end of the cold water tank through a mounting frame.

[0015] Preferably, a detection box is fixedly installed on the left end surface of the cold water tank, and a controller, a temperature sensor and an alarm are fixedly installed inside the detection box;

[0016] The sensing end of the temperature sensor passes through the detection box and the cold water tank in sequence, and extends to the inside of the cold water tank.

[0017] Preferably, the temperature sensor is electrically connected to the controller;

[0018] The controller is electrically connected to the alarm.

[0019] Preferably, a plurality of ventilation holes are provided at both left and right ends of the heat dissipation shell and at the rear side of the thermal conductive baffle;

[0020] There are multiple heat dissipation holes on the left end of the base and the detection box.

[0021] Preferably, a first partition is fixedly mounted on the inner wall of the base and located at the front side of the cold water tank, and a plurality of second partitions are fixedly mounted at equal intervals on the front end surface of the first partition.

[0022] Preferably, the bottom side end of the cold water tank is fixedly installed and connected with a drain pipe, a switch valve is installed on the drain pipe, a water inlet is opened at the upper end of the cold water tank, and a sealing cover plate is installed at the water inlet.

[0023] Preferably, a circular plate is fixedly mounted on the water inlet pipe and the water outlet pipe, and the circular plate is detachably fixedly connected to the upper end surface of the base, and a sealing rubber ring is provided at the connection between the water inlet pipe, the water outlet pipe and the cold water tank.

[0024] The beneficial effects of the utility model are:

[0025] 1. When the heat dissipation device for cloud computers is used, the all-in-one machine can be placed on the upper end surface of the base, and placed inside the heat dissipation shell through the front opening of the heat dissipation shell, and the rear end of the all-in-one machine is in contact with the thermal conductive baffle, and then the first heat dissipation fan is started. The first heat dissipation fan generates airflow, and the airflow passes through the cold water pipe and becomes cold air. The cold air can cool the thermal conductive baffle, and the thermal conductive baffle can dissipate heat, cool and cool the all-in-one machine. Through the above design, automatic heat dissipation processing of the all-in-one machine can be achieved.

[0026] 2. When the heat dissipation device for cloud computers is used, the semiconductor refrigeration sheet is started, and the cooling end of the semiconductor refrigeration sheet can continuously cool the cold water, thereby keeping the cold water at a lower temperature, thereby improving the cooling effect of the cold water. Through the above design, continuous heat dissipation of the all-in-one machine can be achieved, and the heat dissipation effect is better.

[0027] 3. When using the cooling device for cloud computers, first set an extreme value for the controller. The temperature sensor can collect the temperature information of the cold water and transmit the information to the controller. The controller converts the cold water temperature information into data. When the data is greater than or equal to the extreme value, it means that the water temperature of the cold water is too high. The controller will send a cooling signal to the alarm, and the alarm will start to alarm. When the staff hears the alarm sound, it means that the semiconductor refrigeration chip is faulty and needs to be repaired. Through the above design, automatic detection can be achieved, which is convenient for rapid maintenance.

[0028] 4. When used as a heat dissipation device for a cloud computer, personal belongings can be placed in the base through the opening at the front end of the base and placed in front of the first partition. Personal belongings can be classified and stored through multiple second partitions. The above design makes it easier to store personal belongings, which is more practical.

[0029] The utility model can facilitate automatic and continuous heat dissipation of the all-in-one machine, has a better heat dissipation effect, and has an automatic detection function, which is convenient for rapid maintenance and can facilitate the storage of carry-on items, and is more practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a schematic structural diagram of a heat dissipation device for a cloud computer proposed by the utility model.

[0031] Figure 2 The utility model is a schematic diagram of the partial structure of the heat dissipation mechanism in the heat dissipation device for cloud computers.

[0032] Figure 3 The utility model is a schematic structural diagram of the front side of the heat dissipation shell in the heat dissipation device for cloud computers.

[0033] Figure 4 The utility model is a schematic diagram of the structure of the base mechanism in the heat dissipation device for cloud computers.

[0034] Figure 5 A schematic diagram of the partial structure of the base mechanism in the heat dissipation device for cloud computers proposed in the utility model Figure 1 .

[0035] Figure 6 A schematic diagram of the partial structure of the base mechanism in the heat dissipation device for cloud computers proposed in the utility model Figure 2 .

[0036] Figure 7 It is a top and side cross-sectional view of a cold water tank and a detection box in a heat dissipation device for a cloud computer proposed by the utility model.

[0037] Numbers in the figure: 1 heat dissipation mechanism, 2 base mechanism;

[0038] 101 heat dissipation shell, 102 cold water pipe, 103 water inlet pipe, 104 water pump, 105 temperature conducting baffle, 106 water outlet pipe, 107 first heat dissipation fan, 108 vent hole;

[0039] 201 base, 202 heat dissipation hole, 203 first partition, 204 second partition, 205 second heat dissipation fan, 206 cold water tank, 207 semiconductor refrigeration sheet, 208 fixed rear plate, 209 detection box, 210 controller, 211 alarm, 212 temperature sensor. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0041] Reference Figure 1-7 , a heat dissipation device for a cloud computer, comprising a heat dissipation mechanism 1, wherein the heat dissipation mechanism 1 is fixedly mounted on an upper end of a base mechanism 2;

[0042] The base mechanism 2 includes a base 201, the front and rear ends of the base 201 are both open, and a fixed rear plate 208 is detachably fixedly installed at the rear end of the base 201, a cold water tank 206 is fixedly installed on the front end surface of the fixed rear plate 208 and located inside the base 201, cold water is provided inside the cold water tank 206, a semiconductor refrigeration sheet 207 is fixedly installed at the right end of the cold water tank 206, and the cooling end of the left end of the semiconductor refrigeration sheet 207 passes through the right end of the cold water tank 206 and extends to the inside of the cold water tank 206 and contacts with the cold water, and the heating end of the right end of the semiconductor refrigeration sheet 207 is located outside the cold water tank 206;

[0043] The heat dissipation mechanism 1 includes a heat dissipation shell 101, the front end and the bottom end of the heat dissipation shell 101 are both open, a first heat dissipation fan 107 is fixedly installed in the middle of the rear end of the heat dissipation shell 101, and the front end of the first heat dissipation fan 107 passes through the heat dissipation shell 101 and extends to the inside of the heat dissipation shell 101, a cold water pipe 102 is fixedly installed inside the heat dissipation shell 101 and in front of the first heat dissipation fan 107, both ends of the cold water pipe 102 are connected to the cold water tank 206, and a temperature conducting baffle 105 is fixedly installed inside the heat dissipation shell 101 and in front of the cold water pipe 102.

[0044] In this embodiment, refer to Figure 5 A through opening is provided at the right end of the base 201 and located at the heating end of the semiconductor refrigeration plate 207, and a second heat dissipation fan 205 is fixedly installed at the through opening.

[0045] When the semiconductor refrigeration sheet 207 is started, the refrigeration end of the semiconductor refrigeration sheet 207 can continuously refrigerate the cold water, thereby keeping the cold water at a relatively low temperature, thereby improving the refrigeration effect of the cold water;

[0046] When the semiconductor refrigeration plate 207 is working, the heating end of the semiconductor refrigeration plate 207 will dissipate heat. By setting the through hole, the heat dissipation of the heating end of the semiconductor refrigeration plate 207 can be facilitated, and starting the second cooling fan 205 can further improve the heat dissipation effect of the heating end of the semiconductor refrigeration plate 207.

[0047] Reference Figure 2-3 The lower end surface of the left end of the cold water pipe 102 is fixedly connected to a water inlet pipe 103, and the lower end surface of the right end of the cold water pipe 102 is fixedly connected to a water outlet pipe 106. The lower ends of the water inlet pipe 103 and the water outlet pipe 106 respectively penetrate the upper end surface of the base 201 and the upper end surface of the cold water tank 206, and extend to the inside of the cold water tank 206 and contact with the cold water. A water pump 104 is fixedly installed on the water inlet pipe 103, and the water pump 104 is detachably fixedly connected to the upper end of the cold water tank 206 through a mounting frame.

[0048] By starting the water pump 104 , the water pump can suck cold water into the cold water pipe through the water inlet pipe 103 and return it to the cold water tank 206 through the water outlet pipe 106 , thereby realizing the recycling of the cold water in the cold water tank 206 .

[0049] Reference Figure 5-7 A detection box 209 is fixedly installed on the left end surface of the cold water tank 206, and a controller 210, a temperature sensor 212 and an alarm 211 are fixedly installed inside the detection box; the sensing end of the temperature sensor 212 passes through the detection box 209 and the cold water tank 206 in sequence, and extends to the inside of the cold water tank 206; the temperature sensor 212 is electrically connected to the controller 210; the controller 210 is electrically connected to the alarm 211.

[0050] First, an extreme value is set for the controller 210. The temperature sensor 212 can collect the temperature information of the cold water and transmit the information to the controller 210. The controller 210 is a SC200 universal controller. The controller 210 converts the cold water temperature information into data. When the data is greater than or equal to the extreme value, it means that the water temperature of the cold water is too high. The controller 210 will send a cooling signal to the alarm 211, and the alarm 211 will start to alarm. When the staff hears the alarm sound of the alarm 211, it means that the semiconductor refrigeration plate 207 is faulty and needs to be repaired.

[0051] Reference Figure 2-3 A plurality of ventilation holes 108 are provided at both ends of the heat dissipation shell 101 and at the rear side of the heat conducting baffle 105;

[0052] By starting the first cooling fan 107, the first cooling fan 107 can blow air to the cold water pipe 102. The airflow passes through the cold water pipe 102 and becomes cold air. The cold air can cool the thermal conductive baffle 105. The thermal conductive baffle 105 can dissipate heat, cool and cool the all-in-one machine, and the cold air can be discharged to the outside of the heat dissipation shell 101 through the vent 108.

[0053] A plurality of heat dissipation holes 202 are provided on the left end of the base 201 and the detection box 209 .

[0054] Reference Figure 4 The detection box 209 can be cooled through the heat dissipation holes 202 , and when the second heat dissipation fan 205 is started, the stability of the internal air pressure of the base 201 can be maintained through the heat dissipation holes 202 .

[0055] A first partition plate 203 is fixedly installed on the inner wall of the base 201 and located in front of the cold water tank 206 , and a plurality of second partition plates 204 are fixedly installed at equal intervals on the front end surface of the first partition plate 203 .

[0056] Personal belongings can be placed in the base 201 through the opening at the front end of the base 201 and placed in front of the first partition 203 . The personal belongings can be classified and stored through the plurality of second partitions 204 .

[0057] The bottom side of the cold water tank 206 is fixedly installed and connected to a drain pipe, on which a switch valve is installed. The upper end of the cold water tank 206 is provided with a water inlet, and a sealing cover is installed at the water inlet.

[0058] The switch valve can be opened to discharge the cold water in the cold water tank 206 , and then the switch valve is closed, and the sealing cover is opened to pour the replaced cold water into the cold water tank 206 through the water filling port, thereby replacing the cold water in the cold water tank 206 .

[0059] A circular plate is fixedly installed on the water inlet pipe 103 and the water outlet pipe 106 , and the circular plate is detachably fixedly connected to the upper end surface of the base 201 . A sealing rubber ring is provided at the connection between the water inlet pipe 103 and the water outlet pipe 106 and the cold water tank 206 .

[0060] By removing the circular plate and the water pump 104, the water inlet pipe 103 and the water outlet pipe 106 can be pulled out from the water tank, and then the fixed rear plate 208 can be removed and the cold water tank 206 can be pulled out from the base 201, thereby facilitating maintenance of the cold water tank 206, the semiconductor refrigeration plate 207 and the detection box 209.

[0061] Working principle: When in use, the all-in-one machine can be placed on the upper end surface of the base 201, and placed inside the heat dissipation shell 101 through the front opening of the heat dissipation shell 101, and the rear end of the all-in-one machine is in contact with the thermal conductive baffle 105, and then the first heat dissipation fan 107 is started. The first heat dissipation fan 107 generates airflow, and the airflow passes through the cold water pipe 102 and becomes cold air. The cold air can cool the thermal conductive baffle 105, and the thermal conductive baffle 105 can dissipate heat, cool and cool the all-in-one machine.

[0062] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0063] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0064] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A heat dissipation device for a cloud computer, comprising a heat dissipation mechanism (1), characterized in that: The heat dissipation mechanism (1) is fixedly mounted on the upper end of the base mechanism (2); The base mechanism (2) comprises a base (201), the front and rear ends of the base (201) are both open, and a fixed rear plate (208) is detachably fixedly installed at the rear end of the base (201), a cold water tank (206) is fixedly installed at the front end surface of the fixed rear plate (208) and located inside the base (201), cold water is provided inside the cold water tank (206), a semiconductor cooling plate (207) is fixedly installed at the right end of the cold water tank (206), and a cooling end at the left end of the semiconductor cooling plate (207) penetrates the right end of the cold water tank (206) and extends to the inside of the cold water tank (206) and contacts the cold water, and a heating end at the right end of the semiconductor cooling plate (207) is located outside the cold water tank (206); The heat dissipation mechanism (1) comprises a heat dissipation shell (101), the front end and the bottom end of the heat dissipation shell (101) are both open, a first heat dissipation fan (107) is fixedly installed at a middle position of the rear end inside the heat dissipation shell (101), and the front end of the first heat dissipation fan (107) passes through the heat dissipation shell (101) and extends into the heat dissipation shell (101), a cold water pipe (102) is fixedly installed inside the heat dissipation shell (101) and in front of the first heat dissipation fan (107), both ends of the cold water pipe (102) are connected to the cold water tank (206), and a temperature conducting baffle (105) is fixedly installed inside the heat dissipation shell (101) and in front of the cold water pipe (102).

2. The heat dissipation device for a cloud computer according to claim 1, characterized in that: A through opening is provided at the right end of the base (201) and located at the heating end of the semiconductor refrigeration plate (207), and a second heat dissipation fan (205) is fixedly installed at the through opening.

3. The heat dissipation device for a cloud computer according to claim 2, characterized in that: The lower end surface of the left end of the cold water pipe (102) is fixedly connected to a water inlet pipe (103), and the lower end surface of the right end of the cold water pipe (102) is fixedly connected to a water outlet pipe (106). The lower ends of the water inlet pipe (103) and the water outlet pipe (106) are respectively passed through the upper end surface of the base (201) and the upper end surface of the cold water tank (206), and extend to the inside of the cold water tank (206) and contact the cold water. A water pump (104) is fixedly installed on the water inlet pipe (103), and the water pump (104) is detachably fixedly connected to the upper end of the cold water tank (206) via a mounting frame.

4. The heat dissipation device for a cloud computer according to claim 3, characterized in that: A detection box (209) is fixedly installed on the left end surface of the cold water tank (206), and a controller (210), a temperature sensor (212) and an alarm (211) are fixedly installed inside the detection box; The sensing end of the temperature sensor (212) passes through the detection box (209) and the cold water tank (206) in sequence, and extends into the interior of the cold water tank (206).

5. The heat dissipation device for cloud computers according to claim 4, characterized in that: The temperature sensor (212) is electrically connected to the controller (210); The controller (210) is electrically connected to the alarm (211).

6. The heat dissipation device for a cloud computer according to claim 5, characterized in that: A plurality of ventilation holes (108) are provided at both left and right ends of the heat dissipation shell (101) and at positions located behind the thermal conductive baffle (105); A plurality of heat dissipation holes (202) are provided on the left end of the base (201) and the detection box (209).

7. The heat dissipation device for a cloud computer according to claim 6, characterized in that: A first partition plate (203) is fixedly mounted on the inner wall of the base (201) and located in front of the cold water tank (206), and a plurality of second partition plates (204) are fixedly mounted at equal intervals on the front end surface of the first partition plate (203).

8. The heat dissipation device for a cloud computer according to claim 7, characterized in that: The bottom side end of the cold water tank (206) is fixedly installed and connected to a drainage pipe, on which a switch valve is installed. The upper end of the cold water tank (206) is provided with a water inlet, and a sealing cover plate is installed at the water inlet.

9. The heat dissipation device for a cloud computer according to claim 8, characterized in that: A circular plate is fixedly mounted on the water inlet pipe (103) and the water outlet pipe (106), and the circular plate is detachably fixedly connected to the upper end surface of the base (201). A sealing rubber ring is provided at the connection between the water inlet pipe (103) and the water outlet pipe (106) and the cold water tank (206).

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